Chip mounter centering platform deck and chip mounter with same

Abstract

The utility model provides a chip mounter centering platform deck and a chip mounter with the same, relates to the technical field of silicon wafer production, and aims to solve the problems that silicon wafers are displaced in the center clamping process of the conventional chip mounter, the surfaces of the silicon wafers are scratched by the surfaces of the silicon wafers during centering displacement due to foreign matters or damages on the platform deck, and the production efficiency is high. The device solves the technical problems of poor product quality, silicon wafer and carrying platform adsorption, silicon wafer centering failure, equipment abnormal shutdown and influence on production efficiency in the prior art, and comprises a carrying platform main body and a supporting structure, and a groove is formed in the outer edge of the carrying platform main body; the supporting structure is arranged in the groove, and the highest point plane of the supporting structure is higher than the upper surface of the carrying table body. The beneficial effects of the utility model are that the problems of wearing of the carrying platform and damage of the silicon wafer caused by contact between the silicon wafer and the carrying platform main body and the problem of adsorption between the carrying platform and the silicon wafer are solved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer production technology, and in particular to a placement machine centering stage and a placement machine having the stage. Background Technology

[0002] Silicon wafers are an important material in the optoelectronics and semiconductor industries. Due to their high light transmittance, low temperature coefficient, and high stability, they are widely used in solar cells, LEDs, and biochips. Wafer mounting is a crucial step in the manufacturing process and a key factor affecting manufacturing efficiency and quality.

[0003] Current chip mounters experience wafer displacement during the centering process. Foreign objects or damage on the mount can cause the wafer surface to be scratched during centering displacement, resulting in product defects. Furthermore, traditional mounts, including stainless steel with Teflon coating, can wear down over time due to friction between the mount and the wafer, creating a smooth surface and a vacuum between the mount and the wafer. Even after the vacuum is broken before centering, the wafer and the mount still have a strong adsorption force, which can cause wafer centering failure, leading to abnormal equipment shutdown and reduced production efficiency. Utility Model Content

[0004] The purpose of this utility model is to provide a centering stage for a chip mounter and a chip mounter with the same stage, to solve the technical problems existing in current chip mounters. These problems include wafer displacement during centering and clamping, foreign objects or damage on the stage causing scratches on the wafer surface during centering displacement, resulting in product defects. Furthermore, traditional stages, including stainless steel with Teflon coatings, suffer wear from prolonged friction with the wafer, leading to a smooth surface and a vacuum on the wafer. Even after the vacuum is broken before centering, the wafer and stage still have strong adhesion, causing centering failure, equipment downtime, and reduced production efficiency. The preferred technical solutions provided by this utility model offer numerous technical advantages, which are detailed below.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] This utility model provides a centering platform for a chip mounter, comprising a platform body and a support structure, wherein:

[0007] A groove is formed on the outer edge of the main body of the platform;

[0008] The support structure is disposed within the groove, and the highest point of the support structure is higher than the upper surface of the platform body.

[0009] Preferably, the support structure includes an "O" ring and a protective layer covering the outside of the "O" ring, the protective layer being made of polytetrafluoroethylene.

[0010] Preferably, the cross-section of the groove is configured to be inclined towards the inside of the platform body along the edge of the platform body.

[0011] Preferably, the angle between the cut surface and the edge line of the platform body is set to 8°-15°.

[0012] Preferably, the angle between the cut surface and the edge line of the platform body is set to 10°.

[0013] Preferably, the depth of the groove is 5%-10% of the thickness of the platform body.

[0014] Preferably, the edges of the groove and the edges of the support structure are rounded.

[0015] A pick and place machine includes a pick and place machine body and the aforementioned pick and place machine alignment stage, wherein the pick and place machine alignment stage is mounted on the pick and place machine body.

[0016] This utility model provides a placement machine alignment stage and a placement machine with the stage. By creating a groove on the outer edge of the stage body and installing a support structure within the groove, with the highest point of the support structure higher than the upper surface of the stage body, the silicon wafer is supported by the support structure during placement when it is transferred onto the stage for alignment. Other parts of the stage body do not contact the wafer, effectively solving the problem of stage wear and wafer damage caused by contact between the wafer and the stage body. Furthermore, the wafer completes the alignment movement on the support structure, eliminating alignment failures caused by wafer adhesion and reducing downtime due to abnormal wafer alignment. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of an embodiment of the placement machine centering stage of this utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the main body of the intermediate stage of the chip mounter of this utility model;

[0020] Figure 3 yes Figure 2Schematic diagram of the sectional structure of the middle AA section;

[0021] Figure 4 This is a cross-sectional view of the support structure of the intermediate loading platform of the chip mounter of this utility model;

[0022] Figure 5 yes Figure 3 A magnified structural diagram of point A in the middle.

[0023] In the picture:

[0024] 1. Main body of the platform; 10. Groove; 101. Cross-section; 102. Angle;

[0025] 2. Support structure; 21. "O" ring; 22. Protective layer. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0027] Figure 1 This is a structural schematic diagram of this embodiment, as shown below. Figure 1 As shown, this embodiment provides a placement machine centering stage, including a stage body 1 and a support structure 2.

[0028] in, Figure 2 This is a schematic diagram of the main body of the platform in this embodiment. Figure 3 yes Figure 2 Schematic diagram of the sectional structure of the middle AA, as shown below. Figure 2 and Figure 3 As shown, a groove 10 is formed on the outer edge of the platform body 1, and the support structure 2 is set in the groove 10.

[0029] In this embodiment, the highest point of the support structure 2 is set higher than the upper surface of the platform body 1. When in use, the silicon wafer placed on the platform contacts the top surface of the support structure 2, but does not contact the platform body 1. This can effectively avoid the problems of wear on the platform body 1, damage to the silicon wafer after contact with the platform body 1, and adsorption between the silicon wafer and the platform body 1 in the prior art.

[0030] In this embodiment, the stage body 1 adopts a commonly used stainless steel Teflon stage. A groove 10 is formed on the outer edge of the stage body 1, and a support structure 2 is set within the groove 10, with the highest point of the support structure 2 higher than the upper surface of the stage body 1. During the wafer placement process, when the silicon wafer is transferred to the stage for alignment, the wafer is supported by the support structure 2, and other parts of the stage body 1 do not contact the wafer. This effectively solves the problem of stage wear and wafer damage caused by contact between the wafer and the stage body 1. Furthermore, before alignment, the stage body 1, support structure 2, and wafer form a sealed environment. After the stage is vacuumed, the wafer is adsorbed and fixed. During wafer alignment, the stage vacuum is released, and the clamping motor operates, allowing the wafer to complete the displacement and alignment action on the support structure 2. This eliminates the problem of alignment failure caused by adsorption between the stage and the wafer, and reduces downtime caused by abnormal wafer alignment.

[0031] As an optional implementation method, Figure 4 This is a cross-sectional view of the support structure in this embodiment, as shown below. Figure 4 As shown, the support structure 2 in this embodiment includes an "O" ring 21 and a protective layer 22 covering the outside of the "O" ring 21. The protective layer 22 is made of polytetrafluoroethylene.

[0032] Polytetrafluoroethylene (PTFE) possesses excellent chemical stability, corrosion resistance, sealing properties, high lubricity and non-stickiness, electrical insulation, and good anti-aging resistance, making it the preferred material for the protective layer 22 of the support structure 2. During use, the silicon wafer contacts the PTFE outer layer of the support structure 2, avoiding the risk of scratches that can occur in existing technologies where the silicon wafer directly contacts the carrier body 1.

[0033] In this embodiment, by setting a protective layer 22 on the outside of the "O" ring 21 and using polytetrafluoroethylene (PTFE) material for the protective layer 22, it is possible to ensure that the surface of the support structure 2 is smooth and clean, while the PTFE material itself is safe and stable and will not cause contamination to the silicon wafer.

[0034] As an optional implementation method, Figure 5 yes Figure 3 An enlarged structural diagram at point A in the middle, as shown below. Figure 5 As shown, the cross-section 101 of the groove 10 is set to be inclined towards the inside of the platform body 1 along the edge of the platform body 1.

[0035] This configuration allows for better installation and fixation of the support structure 2, and improves the stability of the connection between the support structure 2 and the platform body 1.

[0036] Optionally, the included angle 102 between the cut surface 101 and the edge line of the platform body 1 is set to 8°-15°. In this embodiment, preferably, the included angle 102 between the cut surface 101 and the edge line of the platform body 1 is set to 10°.

[0037] This configuration makes the connection between the support structure 2 and the platform body 1 more stable, preventing the support structure 2 from falling off during use.

[0038] As an optional implementation, the depth of the groove 10 is 5%-10% of the thickness of the stage body 1.

[0039] This design ensures that the overall structure of the stage body 1 is not affected during use, while the support structure 2 is installed in the groove 10, thus solving the problem of wear on the stage body 1 and scratches on the silicon wafer caused by direct contact between the silicon wafer and the stage body 1.

[0040] As an optional implementation, the edges of the groove 10 and the support structure 2 are rounded to avoid damage to the silicon wafer or other components in contact with it during use.

[0041] This embodiment also provides a pick and place machine, including a pick and place machine body and the aforementioned pick and place machine centering stage, wherein the pick and place machine centering stage is mounted on the pick and place machine body.

[0042] This chip mounter features a groove 10 on the outer edge of the stage body 1, within which a support structure 2 is installed. The highest point of the support structure 2 is higher than the upper surface of the stage body 1. During chip mounting, when the silicon wafer is transferred to the stage for alignment, it is supported by the support structure 2, and other parts of the stage body 1 do not contact the wafer. This effectively solves the problem of stage wear and wafer damage caused by contact between the wafer and the stage body 1. Furthermore, before alignment, the stage body 1, support structure 2, and wafer form a sealed environment. After the stage is vacuumed, the wafer is held in place. During alignment, the vacuum is released, the clamping motor operates, and the wafer completes the alignment process on the support structure 2. This eliminates alignment failures caused by wafer adhesion and reduces downtime due to abnormal wafer alignment.

[0043] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A centering stage for a pick-and-place machine, characterized in that, Includes the platform body and supporting structure, of which: A groove is formed on the outer edge of the main body of the platform; The support structure is disposed within the groove, and the highest point of the support structure is higher than the upper surface of the platform body.

2. The placement machine centering stage according to claim 1, characterized in that: The support structure includes an "O" ring and a protective layer covering the outside of the "O" ring, the protective layer being made of polytetrafluoroethylene.

3. A placement machine centering stage according to claim 1 or 2, characterized in that: The cross-section of the groove is set to be inclined towards the inside of the platform body along the edge of the platform body.

4. A placement machine centering stage according to claim 3, characterized in that: The angle between the cut surface and the edge line of the platform body is set to 8°-15°.

5. A placement machine centering stage according to claim 4, characterized in that: The angle between the cut surface and the edge line of the platform body is set to 10°.

6. A placement machine centering stage according to claim 1 or 2, characterized in that: The depth of the groove is 5%-10% of the thickness of the platform body.

7. A placement machine centering stage according to claim 1 or 2, characterized in that: The edges of the groove and the edges of the support structure are both rounded.

8. A pick-and-place machine, characterized in that: It includes a pick and place machine body and a pick and place machine centering stage as described in any one of claims 1-7, wherein the pick and place machine centering stage is mounted on the pick and place machine body.

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