Bluetooth module packaging structure

Abstract

The utility model discloses a Bluetooth module packaging structure, which comprises a plastic packaging body and a substrate, the front surface of the substrate is provided with an upper core base island, an SMT base island, a Bluetooth signal antenna and a plurality of inner pin bonding pads, the back surface of the substrate is provided with an outer pin bonding pad, the front surface and the side surface of the substrate are packaged in the plastic packaging body, and the inner pin bonding pads are arranged in the plastic packaging body. The back surface of the substrate is exposed out of the plastic package body; a chip is arranged on the upper chip base island, and the chip is connected with the inner pin bonding pad through a bonding wire; a component is arranged on the SMT base island; and the inner pin bonding pad is electrically connected with the outer pin bonding pad. The packaging structure has the advantages of high reliability, low cost and the like, and can meet the miniaturization trend of Bluetooth products; the shape design of the packaging structure is compatible with sop16, the packaging structure can be directly replaced with an existing traditional packaging device, and the universality of a product is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically to a Bluetooth module packaging structure. Background Technology

[0002] Semiconductor packaging provides sufficient protection for chips and internal components, preventing them from failing due to prolonged exposure to air or mechanical damage. With the development of 5G technology, new demands have been placed on various radio frequency (RF) modules. Traditional RF modules are functionally incomplete, requiring external components and antennas to achieve specific signal transmission functions. Because surface mount technology (SMT) and traditional packaging processes belong to different fields, integration is difficult, preventing components from being packaged in traditional structures. Therefore, components and semiconductor packaging products are separate, requiring later integration into the same system, which limits the miniaturization of Bluetooth RF products. Furthermore, this separation of components and semiconductor packaging products poses potential reliability risks, restricting the promotion and use of Bluetooth RF products. Utility Model Content

[0003] To address the problems existing in the prior art, this utility model provides a novel Bluetooth module packaging structure. This packaging structure has advantages such as high reliability and low cost, and can meet the miniaturization trend of Bluetooth products. The packaging structure is compliant with SOP16 and can be directly replaced with existing traditional packaging devices, greatly improving the versatility of the product.

[0004] The technical solution provided by this utility model is as follows:

[0005] A Bluetooth module packaging structure includes a molding compound and a substrate. The front side of the substrate is provided with an upper core island, an SMT core island, a Bluetooth signal antenna, and multiple inner pin pads. The back side of the substrate is provided with outer pin pads. The front and sides of the substrate are encapsulated in the molding compound, and the back side of the substrate is exposed from the molding compound.

[0006] A chip is disposed on the upper core island, and the chip is connected to the inner pin pad by a bonding wire;

[0007] The SMT base island is equipped with components.

[0008] The inner pin pad is electrically connected to the outer pin pad.

[0009] Furthermore, the chip base island is fixed to the chip using adhesive.

[0010] Furthermore, the components are connected to the SMT base island via solder paste.

[0011] Furthermore, the surface of the SMT base island is coated with flux and solder paste.

[0012] Furthermore, the SMT base island is connected to the components via a eutectic compound.

[0013] Furthermore, the substrate is a BT or FR4 substrate, and the thickness of the substrate ranges from 0.15 to 2.00 mm.

[0014] Furthermore, the thickness of the adhesive is in the range of 0.02-0.1 mm.

[0015] Furthermore, the diameter of the bonding wire is in the range of 0.018-0.035 mm.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] This invention provides a Bluetooth module packaging structure that integrates components and a Bluetooth signal antenna that are typically absent in traditional packages, significantly reducing the size of the Bluetooth module. Heat generated by the semiconductor chip and components is transferred to the external lead pads on the back side via the chip base island beneath the chip and the SMT base island beneath the components, and then dissipates outside the package structure. All chips and components are encapsulated within a plastic package, achieving high reliability. Simultaneously, integrating multiple components into the semiconductor package structure saves on metal materials and reduces the cost of the final product. The package structure's shape design is compatible with SOP16, allowing direct replacement with existing traditional packaged devices, greatly improving product versatility. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the substrate structure of the Bluetooth module packaging structure in an embodiment of this utility model;

[0019] Figure 2 This is a welding diagram of the Bluetooth module packaging structure in an embodiment of this utility model;

[0020] Figure 3 This is a product outline drawing of the Bluetooth module packaging structure in an embodiment of this utility model;

[0021] Figure 4 This is a process flow diagram illustrating the fabrication of the Bluetooth module packaging structure in this embodiment of the present invention.

[0022] The attached figures are labeled as follows:

[0023] 1-Substrate, 2-Upper core island, 3-Chip, 5-SMT core island, 8-Bluetooth signal antenna, 9-Inner pin pad, 10-Outer pin pad. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this application, not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0025] Therefore, the detailed description of the embodiments of this application provided below with reference to the accompanying drawings is intended merely to illustrate selected embodiments of this application and is not intended to limit the scope of protection claimed by this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0026] It should be understood that in the description of the embodiments of this utility model, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of the embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0027] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for mutual communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model according to the specific circumstances.

[0028] like Figure 1 and Figure 2As shown, this utility model provides an LGA package structure for a Bluetooth module, including a molding compound and a substrate 1 encapsulated within the molding compound, simultaneously enabling electrical connection of the product. The front side of the substrate 1 includes an upper chip island 2, on which a chip 3 is disposed. The chip 3 is connected to the upper chip island 2 via die bonding. Specifically, a die bonder applies adhesive to the upper chip island 2, places the chip 3 on the adhesive, and cures the adhesive in an oven, thereby connecting the chip 3 to the upper chip island 2. The front side of the substrate 1 also includes an SMT base island 5. Flux and solder paste are applied to the upper chip island 2 using dispensing or stencil printing to fix the components. Specifically, reflow solder paste melts, forming a eutectic compound between the component leads and the SMT base island 5 of the substrate 1, thus fixing the components. A Bluetooth signal antenna 8 is integrated on the front side of the substrate 1.

[0029] The front side of substrate 1 is a functional area with several internal lead pads 9. Using bonding wires, the chip 3 is connected to the internal lead pads 9 via wire bonding using a wire bonder. The back side of substrate 1 has external lead pads 10. The internal lead pads 9 and external lead pads 10 are electrically connected. A molding compound is applied to all parts of the front side of substrate 1 for encapsulation. The molding compound is made of epoxy or silicone resin, providing electrical insulation and forming a sealed enclosure to protect the internal chip 3, components, and other electrical connections.

[0030] Optionally, substrate 1 is a BT or FR4 substrate, and the thickness of substrate 1 ranges from 0.15 to 2.00 mm.

[0031] Optionally, the thickness of the adhesive film ranges from 0.02 to 0.1 mm.

[0032] Optionally, the bonding wire diameter ranges from 0.018 to 0.035 mm.

[0033] like Figure 3 As shown, the front and sides of the substrate 1 of the packaging structure are encapsulated in a plastic package, the back of the substrate 1 is exposed from the plastic package, and the external lead pads 10 disposed around the back of the substrate 1 are exposed.

[0034] Figure 4 The manufacturing process of the above-described semiconductor package structure is shown. The preparation of this semiconductor package structure includes the following steps:

[0035] Step 1, Solder paste printing: Solder paste is evenly applied to the SMT base islands by making holes at the corresponding positions on the stencil through each SMT base island, under the action of the squeegee of the printing machine; the solder paste printed on the SMT base islands is pre-melted in the reflow oven to achieve solder balls on the SMT base islands. The solder paste melted in the reflow oven forms solder balls, which makes the internal tension of the solder balls stable.

[0036] Step 2, Component Placement: Use a surface mount machine to accurately place the components onto the corresponding positions on the printed substrate surface; clean the residual solder paste on the substrate to ensure the substrate surface is clean and to avoid cross-current between components with small spacing.

[0037] Step 3, Die Bonding: Apply die bonder to the upper substrate island using a die bonder, place the chip on the die bonder, and cure the die bonder in an oven to allow the die bonder to cross-link with the chip and the upper substrate island, thus connecting the chip to the upper substrate island.

[0038] Step 4, Wire Bonding: Using bonding wires (materials include copper wire, aluminum wire, palladium-plated copper wire, gold wire, silver wire, silver alloy wire, etc.), heat, pressure, and ultrasonic energy are used to tightly bond the bonding wires to the inner lead pads, realizing electrical interconnection between the chip and the substrate and information exchange between chips.

[0039] Step 5, Molding: The semiconductor substrate islands, chip, die adhesive, SMT substrate islands, components, solder paste, Bluetooth signal antenna, internal lead pads, and bonding wires are sealed with a sealing resin molding compound to form a semiconductor package. The molding compound is made of resin material, specifically epoxy or silicone resin.

[0040] Step 6, Product Cutting: Use pneumatic punching or cutting methods to divide the encapsulated substrate into individual products.

[0041] In summary, this invention provides a novel semiconductor packaging structure that integrates components and a Bluetooth signal antenna that are typically absent in traditional packages, significantly reducing the size of the Bluetooth module. Heat generated by the semiconductor chip and components is transferred to the external lead pads on the back side via the chip base island beneath the chip and the SMT base island beneath the components, and then dissipates outside the package structure. All chips and components are encapsulated within the plastic package, achieving high reliability. Furthermore, integrating multiple components into the semiconductor package structure saves on metal materials and reduces the cost of the final product. The package structure's shape design is compatible with SOP16, allowing direct replacement with existing traditional packaged devices, greatly improving product versatility.

[0042] The above is only a specific embodiment of the present application, but the scope of protection of this application is not limited to this. Any changes or substitutions within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A Bluetooth module packaging structure, characterized in that: The substrate includes a molding compound and a substrate. The front side of the substrate is provided with an upper core island, an SMT core island, a Bluetooth signal antenna, and multiple internal pin pads. The back side of the substrate is provided with external pin pads. The front and sides of the substrate are encapsulated in the molding compound, and the back side of the substrate is exposed from the molding compound. A chip is disposed on the upper core island, and the chip is connected to the inner pin pad by a bonding wire; The SMT base island is equipped with components. The inner pin pad is electrically connected to the outer pin pad.

2. The Bluetooth module packaging structure according to claim 1, characterized in that: The chip base island is fixed to the chip using adhesive.

3. The Bluetooth module packaging structure according to claim 1, characterized in that: The components are connected to the SMT base island via solder paste.

4. The Bluetooth module packaging structure according to claim 1, characterized in that: The surface of the SMT base island is coated with flux and solder paste.

5. The Bluetooth module packaging structure according to any one of claims 1-4, characterized in that: The SMT base islands are connected to the components via eutectic compounds.

6. The Bluetooth module packaging structure according to claim 5, characterized in that: The substrate is a BT or FR4 substrate with a thickness ranging from 0.15 to 2.00 mm.

7. The Bluetooth module packaging structure according to claim 2, characterized in that: The thickness of the adhesive is in the range of 0.02-0.1 mm.

8. The Bluetooth module packaging structure according to claim 6 or 7, characterized in that: The diameter of the bonding wire ranges from 0.018 to 0.035 mm.

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