Heat dissipation assembly and power bank

Abstract

In order to achieve the purpose, the heat dissipation assembly comprises a supporting plate and a cover plate, the supporting plate and the cover plate each comprise a heat dissipation structure, and the supporting plate and the cover plate provide a containing cavity for containing the heat dissipation module; the heat dissipation module comprises at least one pair of oppositely arranged supporting pieces and piezoelectric diaphragms, the at least one pair of oppositely arranged supporting pieces divides the containing cavity into a vibration area and a heat dissipation area, and the vibration area is located between the pair of supporting pieces; the piezoelectric diaphragm is positioned in the vibration area, two ends are respectively fixed on the supporting piece, and airflow is driven to flow by virtue of vibration; the heat dissipation area is provided with a flow guide groove, and the flow guide groove is communicated with the outside of the heat dissipation assembly. The heat dissipation assembly has a good heat dissipation effect. The utility model further provides a power bank with the heat dissipation assembly.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation, specifically to the field of piezoelectric heat dissipation structures. Background Technology

[0002] Existing power bank heat dissipation technologies mainly include heat conduction heat dissipation using heat-conducting sheets and airflow heat dissipation.

[0003] Heat conduction cooling refers to a process where, inside the power bank, a heat-conducting pad is attached to the battery at one end, absorbing and conducting the heat generated by the battery to a heat sink at the other end, thus enhancing heat dissipation. In some power banks, the heat-absorbing pad, heat sink, and heat dissipation fin work together: the heat-absorbing pad absorbs heat from the battery, the heat sink transfers heat, and the heat sink and ventilation holes dissipate heat. Some designs also have ventilation holes on the outer casing to facilitate heat escape, but a dust filter is usually installed to prevent dust from entering the power bank.

[0004] Airflow cooling refers to using airflow channels to allow air to circulate inside the power bank and carry away heat. For example, some power banks use blower and exhaust structures, along with air inlets and outlets, to promote air circulation and enhance heat dissipation.

[0005] However, the heat dissipation efficiency of the above-mentioned heat dissipation structure is limited. Under some high power output or long-term use conditions, it may still be unable to completely and effectively dissipate all the heat, causing the power bank temperature to rise. Utility Model Content

[0006] One objective of this invention is to provide a heat dissipation component with superior heat dissipation performance.

[0007] The heat dissipation assembly for achieving the above objectives includes a support plate and a cover plate, both of which include heat dissipation structures. The support plate and cover plate provide a receiving cavity for accommodating a heat dissipation module. The heat dissipation module includes at least one pair of opposing support members and a piezoelectric diaphragm. The at least one pair of opposing support members divides the receiving cavity into a vibration zone and a heat dissipation zone. The vibration zone is located between the pair of support members. The piezoelectric diaphragm is located in the vibration zone, with both ends fixed to the support members, and its vibration drives airflow. The heat dissipation zone is provided with a guide groove, which communicates with the outside of the heat dissipation assembly.

[0008] In one or more embodiments, the flow channel includes alternating U-shaped heat dissipation walls and single-layer heat dissipation walls.

[0009] In one or more embodiments, the flow channel includes a plurality of single-layer heat dissipation walls, with adjacent single-layer heat dissipation walls defining a flow channel.

[0010] In one or more embodiments, at least a portion of the single-layer heat dissipation wall has a flow guiding end at its tail.

[0011] In one or more embodiments, the support member is provided with clips for holding the piezoelectric diaphragm.

[0012] In one or more embodiments, the tray or the cover plate provides a sidewall, and the flow channel communicates with the outside of the heat dissipation assembly via heat dissipation holes on the sidewall.

[0013] In one or more embodiments, the tray and / or the cover plate are made of copper.

[0014] In one or more embodiments, the heat dissipation structure is disposed above and below the vibration zone, and is a heat dissipation grille or heat dissipation hole.

[0015] In one or more embodiments, the heat dissipation assembly further includes an electrical interface electrically connected to the piezoelectric diaphragm.

[0016] Another objective of this invention is to provide a power bank, including a battery and a casing, and also including the aforementioned heat dissipation component attached to the surface of the battery.

[0017] The aforementioned heat dissipation component is based on piezoelectric heat dissipation technology using piezoelectric diaphragms. The continuous vibration of the diaphragm sends cold air into the cavity of the heat dissipation component, and the flow channel further discharges the hot air, thereby effectively improving the heat dissipation effect of the heat dissipation component. Attached Figure Description

[0018] The above and other features, properties and advantages of this utility model will become more apparent from the following description taken in conjunction with the accompanying drawings and embodiments, wherein:

[0019] Figure 1 This is an external schematic diagram of the heat dissipation component;

[0020] Figure 2 This is a schematic diagram of the cover plate;

[0021] Figure 3 This is a schematic diagram of the heat dissipation module;

[0022] Figure 4 This is a schematic diagram showing the heat dissipation module located inside the housing cavity;

[0023] Figure 5 This is a schematic diagram of one embodiment of the flow guide channel;

[0024] Figure 6 This is a schematic diagram of one embodiment of a heat dissipation structure.

[0025] Symbol marking explanation

[0026] 10 Heat dissipation components

[0027] 11. Pallets

[0028] 12 Cover plates

[0029] 13 Heat dissipation module

[0030] 14. Flow guide channel

[0031] 15 Sidewalls

[0032] 101 Heat dissipation structure

[0033] 102 Receiving cavity

[0034] 103 Sealing Plate

[0035] 133 Support component

[0036] 134 piezoelectric diaphragm

[0037] 135 clip

[0038] 137 wires

[0039] 141 U-shaped heat dissipation wall

[0040] 142 Single-layer heat dissipation wall

[0041] 150 ventilation holes

[0042] 1021 Vibration Zone

[0043] 1022 Heat dissipation area 1420 Airflow guide end Detailed Implementation

[0044] The present invention will be further described below with reference to specific embodiments and accompanying drawings. More details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention can obviously be implemented in many other ways different from those described herein. Those skilled in the art can make similar extensions and derivations based on actual application situations without departing from the spirit of the present invention. Therefore, the scope of protection of the present invention should not be limited by the content of this specific embodiment.

[0045] It should be noted that these and other accompanying drawings are merely examples and are not drawn to scale, and should not be used as a limitation on the scope of protection of this utility model.

[0046] Existing power bank heat dissipation technologies are insufficient to meet the heat dissipation requirements of high-power power banks. Therefore, this disclosure proposes a heat dissipation component, such as... Figures 1 to 4 As shown, the heat dissipation assembly 10 includes a support plate 11 and a cover plate 12. Both the support plate 11 and the cover plate 12 are provided with heat dissipation structures 101. The heat dissipation structures 101 include, but are not limited to, heat dissipation structures for heat dissipation, ... Figure 1 The heat dissipation grille shown or Figure 6 The structures shown include heat dissipation holes.

[0047] The tray 11 and cover 12 provide a receiving cavity 102 for accommodating the heat dissipation module 13. (See reference...) Figure 3 and Figure 4 As shown, the heat dissipation module 13 is located in the receiving cavity 102 and includes at least a pair of support members 133 and a piezoelectric diaphragm 134.

[0048] The support members 133 are arranged facing each other, dividing the receiving cavity 102 into a vibration zone 1021 and a heat dissipation zone 1022. The vibration zone 1021 is located between the pair of support members 133, as shown below. Figure 4 As shown. Piezoelectric diaphragms 134 are located in the vibration zone 1021, and both ends of each piezoelectric diaphragm 134 are fixed to the support member 133. In some embodiments, the support member 133 is provided with clips 135 for clamping the piezoelectric diaphragms 134.

[0049] The piezoelectric diaphragm 134 is based on piezoelectric heat dissipation technology, which drives airflow by means of its vibration.

[0050] Piezoelectric cooling technology utilizes the properties of piezoelectric materials to achieve heat dissipation. Piezoelectric materials expand and contract when subjected to an applied voltage. This property can be used to induce vibration in cantilever blades, thereby generating gas flow and achieving heat dissipation. Based on this, a piezoelectric diaphragm undergoes reciprocating deformation under alternating voltage, causing a change in the volume of a sealed cavity, which in turn drives gas flow.

[0051] Based on the high-frequency vibration of the piezoelectric diaphragm, the heat dissipation component can operate continuously, stably, and efficiently, improving heat dissipation performance and ensuring consistency. Furthermore, this method significantly reduces heat dissipation noise compared to traditional methods.

[0052] In some embodiments, the piezoelectric diaphragm 134 includes, but is not limited to, the use of organic piezoelectric materials, such as polyvinylidene fluoride (PVDF), ceramic-polymer composites, or single-crystal-polymer composites.

[0053] Based on the characteristics of the piezoelectric diaphragm 134, the heat dissipation assembly also includes an electrical interface, such as a power supply wire 137, that is electrically connected to the piezoelectric diaphragm 134 and electrically connected to an external power source. By setting different voltages, the piezoelectric diaphragm 134 vibrates, thereby realizing the input of cold air and the output of hot air.

[0054] The heat dissipation area 1022 is provided with a flow channel 14, which communicates with the outside of the heat dissipation assembly. For example, in some embodiments, the tray 11 or cover 12 provides a sidewall 15, and the flow channel 14 communicates with the outside of the heat dissipation assembly via heat dissipation holes 150 on the sidewall 15 to exhaust hot air from the receiving cavity 102.

[0055] The flow channel 14 is used to guide the airflow within the receiving cavity 102. Due to the vibration of the piezoelectric diaphragm 134 in the first direction, heat enters the receiving cavity 102 through the support plate, causing the internal air temperature to rise. When the piezoelectric diaphragm 134 vibrates in the opposite direction to the first direction, the hot air in the vibration zone 1021 is compressed and flows towards the heat dissipation zone 1022. At this time, through the guiding effect of the flow channel 14, it is directed to the heat dissipation hole, expelling the hot air from the component. This process repeats, achieving active heat dissipation.

[0056] exist Figure 4 In the illustrated embodiment, the flow channel 14 includes alternating U-shaped heat dissipation walls 141 and single-layer heat dissipation walls 142, constructing a flow path for hot air and reducing flow losses. In such... Figure 5 In other embodiments shown, the flow channel 14 may also include only a single-layer heat dissipation wall 142, with adjacent single-layer heat dissipation walls 142 defining a flow channel, one end of which is connected to a heat dissipation hole to draw out hot air.

[0057] Preferably, at least part of the single-layer heat dissipation wall 142 has a flow guide end 1420 at its tail end, and the flow guide end 1420 has a certain curvature to facilitate the flow of air.

[0058] In conjunction with the vibration zone 1021 and the heat dissipation zone 1022, in Figure 1 In the embodiment shown, the cover plate 11 includes a heat dissipation grille that cooperates with the vibration zone 1021 and a sealing plate 103 that cooperates with the heat dissipation zone 1022. The sealing plate 103 ensures that the airflow flows out from the heat dissipation holes on the side wall without interfering with the cold air.

[0059] To improve heat dissipation, the support plate 11 and / or cover plate 12 are made of copper to increase thermal conductivity. The guide channel 14 can also be made of a material with high thermal conductivity, such as copper.

[0060] Based on the above description of the heat dissipation components, it can also be understood that a power bank includes a battery and a casing, as well as the aforementioned heat dissipation components attached to the surface of the battery.

[0061] During operation, when the piezoelectric diaphragm vibrates in the opposite direction to the battery, heat is transferred to the inner cavity of the piezoelectric diaphragm through the thermal conductivity of the copper tray, raising the internal air temperature. When the piezoelectric diaphragm vibrates towards the battery, cool air is drawn into the receiving cavity through the heat dissipation structure on the cover. Simultaneously, due to the downward pressure of the piezoelectric diaphragm, the air in the vibration zone is compressed to both sides and flows out of the heat dissipation assembly under the guidance of the guide grooves, expelling the hot air. This cycle repeats continuously, with the heat dissipation assembly continuously supplying cool air and dissipating the battery's heat.

[0062] This application uses specific terms to describe embodiments of the application. Terms such as "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that references to "an embodiment," "one embodiment," or "an alternative embodiment" in different locations throughout this specification do not necessarily refer to the same embodiment. Furthermore, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0063] While the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible variations and modifications without departing from the spirit and scope of the present invention. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope defined by the claims of the present invention.

Claims

1. A heat dissipation assembly, comprising a tray and a cover plate, wherein a heat dissipation structure is provided thereon, and the tray and cover plate provide a receiving cavity for accommodating a heat dissipation module; characterized in that, The heat dissipation module includes: At least one pair of opposing support members divide the receiving cavity into a vibration zone and a heat dissipation zone, with the vibration zone defined between the pair of support members; A piezoelectric diaphragm is located in the vibration zone, with its two ends fixed to the support member, and its vibration drives the airflow. The heat dissipation area is provided with a flow guide groove, which is connected to the outside of the heat dissipation component.

2. The heat dissipation assembly as described in claim 1, characterized in that, The flow channel includes alternating U-shaped heat dissipation walls and single-layer heat dissipation walls.

3. The heat dissipation assembly as described in claim 1, characterized in that, The flow channel includes multiple single-layer heat dissipation walls, and adjacent single-layer heat dissipation walls define the flow channel.

4. The heat dissipation assembly as described in claim 2 or 3, characterized in that, At least part of the single-layer heat dissipation wall has a flow guiding end at its tail.

5. The heat dissipation assembly as described in claim 1, characterized in that, The support member is provided with clips for holding the piezoelectric diaphragm.

6. The heat dissipation assembly as described in claim 1, characterized in that, The tray or the cover plate provides a sidewall, and the flow channel communicates with the outside of the heat dissipation component via heat dissipation holes on the sidewall.

7. The heat dissipation assembly as described in claim 1, characterized in that, The tray and / or the cover plate are made of copper.

8. The heat dissipation assembly as described in claim 1, characterized in that, The heat dissipation structure is located above and below the vibration zone and is a heat dissipation grille or heat dissipation hole.

9. The heat dissipation assembly as described in claim 1, characterized in that, The heat dissipation assembly also includes an electrical interface that is electrically connected to the piezoelectric diaphragm.

10. A power bank, comprising a battery and a casing, characterized in that, It also includes a heat dissipation component as described in any one of claims 1-9, attached to the surface of the battery.

Images