Internal vertically stacked signal isolation transmission packaging structure and isolator
By using an internally vertically stacked signal isolation transmission packaging structure, the problems of large packaging structure size and single isolation transmission path in the prior art are solved, achieving a smaller size and higher performance isolation transmission effect.
Patent Information
- Application Number
- CN202422965023.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-12-02
AI Technical Summary
Existing signal isolation transmission structures suffer from problems such as large package size, single isolation transmission path, complex wiring, and easy impact on coupling performance.
The signal isolation transmission package structure with internal vertical stacking is adopted. The base island and the chip are uniformly encapsulated in the first plastic package, and the transceiver unit is set on the first plastic package in a flat or vertically stacked manner. The chip is connected by pads to achieve the vertical stacking layout design.
Shorten the signal path, improve transmission matching performance, meet the requirements of different isolation transmission path directions and strengths, and reduce the size of the packaging structure in the horizontal direction.
Smart Images
Figure CN223487304U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of packaging technology, specifically to an internally vertically stacked signal isolation transmission packaging structure and isolator. Background Technology
[0002] Existing signal isolation transmission structures typically employ traditional frame encapsulation, and their structures are as follows: Figure 1 As shown, the chip in the package structure is bonded to two independent frame base islands on the left and right sides in a flat manner. After being connected by wire bonding, the whole package is molded into a finished packaged chip with the function of signal transmission between the two sides.
[0003] The existing signal isolation transmission packaging structure has an isolation strength that depends on the base island spacing and has a large overall size. Furthermore, its isolation transmission path is unidirectional and dependent on the frame. In addition, its wire bonding is relatively complex, resulting in large wire bonding parasitic parameters, which can easily affect the coupling performance of the isolation transmission. Utility Model Content
[0004] The technical problem to be solved by this utility model is to provide an internally vertically stacked signal isolation transmission packaging structure and isolator, which can reduce the size of the packaging structure and optimize the isolation transmission performance.
[0005] To solve the above-mentioned technical problems, the first technical solution adopted by this utility model is as follows:
[0006] The internally vertically stacked signal isolation transmission package structure includes: a first base island, a second base island, a first chip, a second chip, a first transceiver unit, a second transceiver unit, a first molding compound, a first pad, and a second pad; the first base island and the second base island are spaced apart by a preset distance;
[0007] The first chip is disposed on the first base island; the second chip is disposed on the second base island; the first chip, the first base island, the second chip, and the second base island are encapsulated within the first encapsulation body;
[0008] The first molding compound has a first pad communicating with the first chip and a second pad communicating with the second chip; the first transceiver unit is disposed on the first molding compound and connected to the first pad; the second transceiver unit corresponds to the first transceiver unit in the stacking direction of the packaging structure or in the same layer of the packaging structure; the second transceiver unit is connected to the second pad.
[0009] Optionally, the second transceiver unit is disposed on the first encapsulation body and corresponds to the first transceiver unit.
[0010] Optionally, in the stacking direction of the packaging structure, the first base island, the first chip, and the first transceiver unit correspond to each other;
[0011] In the stacking direction of the package structure, the second base island, the second chip, and the second transceiver unit correspond to each other.
[0012] Optionally, it further includes a second encapsulation body; the first encapsulation body, the first transceiver unit, and the second transceiver unit are encapsulated within the second encapsulation body.
[0013] Optionally, it further includes a second molding compound and a third pad; the first molding compound and the first transceiver unit are molded within the second molding compound; the second transceiver unit is disposed on the second molding compound and corresponds to the first transceiver unit in the stacking direction of the package structure; the second molding compound is provided with the third pad connected to the second pad; the second transceiver unit is connected to the second pad via the third pad.
[0014] Optionally, the packaging structure further includes a third molding compound; the first molding compound, the second molding compound, and the second transceiver unit are encapsulated within the third molding compound.
[0015] Optionally, the first pad, the second pad, and the third pad are all perpendicular to the stacking direction of the package structure.
[0016] Optionally, the first chip and the first base island are connected sequentially by wire bonding; the second chip and the second base island are connected sequentially by wire bonding.
[0017] Optionally, the first transceiver unit is an antenna or a coil; the second transceiver unit is an antenna or a coil.
[0018] Another technical solution provided by this utility model is:
[0019] An isolator includes the signal isolation transmission encapsulation structure described above.
[0020] The beneficial effects of this invention are as follows: By uniformly encapsulating the base island and chip within a first plastic package, and placing the first and second transceiver units on top of the first plastic package in a flat or vertically stacked manner, and connecting them to the corresponding chips within the first plastic package via pads, this invention achieves an isolated transmission package structure with an internal vertical stacking layout design. This invention not only ensures effective isolation transmission between the primary and secondary sides, but also shortens the signal path, enhancing transmission matching performance. Furthermore, it allows for adjustments to the thickness of the plastic package to meet various isolation transmission path directions and isolation strength requirements without increasing the footprint. Additionally, it significantly reduces the horizontal dimensions of the package structure. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of a signal isolation transmission encapsulation structure in the prior art;
[0022] Figure 2 A schematic diagram of the internally vertically stacked signal isolation transmission packaging structure provided in this embodiment of the utility model. Figure 1 ;
[0023] Figure 3 A schematic diagram of the internally vertically stacked signal isolation transmission packaging structure provided in this embodiment of the utility model. Figure 2 ;
[0024] Figure 4 for Figure 2 The diagram shows the manufacturing process of the internally vertically stacked signal isolation transmission packaging structure.
[0025] Figure 5 for Figure 3 The diagram shows the manufacturing process of the internally vertically stacked signal isolation transmission packaging structure.
[0026] Label Explanation:
[0027] 10. First molding compound; 20. Second molding compound; 30. Third molding compound;
[0028] 11. First base island; 12. First chip; 13. First transceiver unit; 14. First pad;
[0029] 21. Second base island; 22. Second chip; 23. Second transceiver unit; 24. Second pad;
[0030] 31. Third pad. Detailed Implementation
[0031] To explain in detail the technical content, objectives, and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.
[0032] Example 1
[0033] Please refer to Figure 2 and Figure 3 This embodiment provides an internally vertically stacked signal isolation transmission package structure, including: a first base island 11, a second base island 21, a first chip 12, a second chip 22, a first transceiver unit 13, a second transceiver unit 23, a first molding compound 10, a first pad 24, and a second pad 31; the first base island 11 and the second base island 21 are spaced apart by a preset distance;
[0034] The first chip 12 is disposed on the first base island 11; the second chip 22 is disposed on the second base island 21; the first chip 12, the first base island 11, the second chip 22 and the second base island 21 are encapsulated in the first encapsulation body 10;
[0035] The first molding compound 10 is provided with a first pad 14 communicating with the first chip 12 and a second pad 24 communicating with the second chip 22; the first transceiver unit 13 is disposed on the first molding compound 10 and connected to the first pad 14; the second transceiver unit 23 corresponds to the first transceiver unit 13 in the stacking direction of the package structure (e.g., ...). Figure 3 As shown), or corresponding to the same level in the packaging structure (such as...). Figure 2 (as shown); the second transceiver unit 23 is connected to the second pad 24.
[0036] In this embodiment, the stacking direction refers to the layer stacking direction of the packaging structure, that is, the Z-axis direction of the packaging structure. Assuming the layer containing the first base island and the second base island is considered the first layer, then the layers containing the first chip on the first base island and the second chip on the second base island are considered the second layer stacked on the first layer. The components on the upper surface of the first molding compound are considered the third layer, and so on. A vertically stacked packaging structure is formed by stacking components along the Z-axis direction of the overall structure. Therefore, it can also be understood that the same layer in this embodiment refers to components both in the first layer / second layer…
[0037] In this embodiment, the second transceiver unit and the first transceiver unit correspond to each other in the stacking direction of the package structure, meaning that the signal transmission and reception directions of the first transceiver unit and the second transceiver unit correspond to each other in the Z-axis direction of the package structure. This can also be understood as the second transceiver unit and the first transceiver unit having a vertically corresponding relationship, one above the other. For details, please refer to... Figure 3Similarly, the correspondence between the second transceiver unit and the first transceiver unit within the same layer of the package structure refers to the correspondence between their signal transmission and reception directions along the X / Y axes of the package structure. This can also be understood as a horizontally aligned arrangement of the first and second transceiver units, with a left-right horizontal correspondence. For details, please refer to... Figure 2 The two layout designs for the transceiver unit described above ensure optimal signal transmission and reception between the primary and secondary sides, i.e., optimal isolation transmission performance.
[0038] In this embodiment, the primary-side structure includes a first chip, a first transceiver unit, and a first base island; the secondary-side structure includes a second chip, a second transceiver unit, and a second base island. The primary-side structure transmits signals wirelessly in isolation from the secondary-side structure via the first transceiver unit; the first and second base islands serve as carriers for this isolated transmission.
[0039] It is understood that in the signal isolation transmission encapsulation structure of this embodiment, the first chip, the first transceiver unit, and the first base island in the primary side structure need to be connected in sequence; and the second chip, the second transceiver unit, and the second base island in the secondary side structure need to be connected in sequence.
[0040] In some specific implementations of this embodiment, such as Figure 2 and Figure 3 As shown, in the primary side structure, before the first chip 12 and the first base island 11 are encapsulated within the first molding compound 10, the connection between the first chip 12 and the first transceiver unit 13 can be established by wire bonding. Correspondingly, in the secondary side structure, before the second chip 22 and the second base island 21 are encapsulated within the first molding compound 10, the connection between the second chip 22 and the second transceiver unit 23 can also be established by wire bonding. Since the first chip 12 and the first base island 11, and the second chip 22 and the second base island 21 are all located within the same molding compound (i.e., the first molding compound 10), establishing the connection using wire bonding is easier to implement in terms of manufacturing process and more convenient to operate.
[0041] In some specific embodiments of this example, the first chip and the first base island in the primary side structure can also be connected in other ways. For example, a pad can be brought out by drilling holes and electroplating on the surface of the first base island to connect to the first chip; or, the first chip can be a flip chip with built-in solder joints, and the solder joints of the flip chip can be ground flat and then used as pads to connect to the first base island. Correspondingly, the second chip and the second base island in the secondary side structure can also be connected in the same way, that is, a pad can be brought out by drilling holes and electroplating on the surface of the second base island to connect to the second chip; or, the second chip can be a flip chip with built-in solder joints, and the solder joints of the flip chip can be ground flat and then used as pads to connect to the second base island.
[0042] Specifically, in this embodiment, since the first transceiver unit and the second transceiver unit are located outside the first molding compound and at a different level from their corresponding chips, they cannot be connected via wire bonding between the first transceiver unit and the first chip, or between the second transceiver unit and the second chip. Therefore, as... Figure 2 and Figure 3 As shown, in this embodiment, the first pad 14, which is connected to the first chip 12, and the second pad 24, which is connected to the second chip 22, are respectively provided on the first molding compound 10, so that the first transceiver unit 13 and the second transceiver unit 23, which are located outside the first molding compound 10, can be connected to the corresponding chip through the corresponding pads, thus ensuring the normal function of the primary side structure and the secondary side structure.
[0043] In some specific embodiments of this example, the first transceiver unit is an antenna or a coil; the second transceiver unit is an antenna or a coil. In particular, the first transceiver unit and the second transceiver unit can also be directly implemented by electroplating on the first plastic encapsulation.
[0044] The signal isolation transmission packaging structure provided in this embodiment uses a vertical stacking method internally, enabling effective isolation transmission between its primary and secondary structures in the stacking or horizontal direction. This not only shortens the signal path and ensures better transmission matching performance, but also allows for adjustments to the thickness of the molding compound to meet various isolation transmission path directions and isolation strength requirements without increasing the footprint. Furthermore, it significantly reduces the horizontal dimensions of the packaging structure.
[0045] Example 2
[0046] This embodiment is a further extension of the first embodiment described above, and specifically details the correspondence between the first transceiver unit and the second transceiver unit.
[0047] As can be seen from the above embodiment one, the correspondence between the second transceiver unit and the first transceiver unit can have two layout designs: (1) corresponding in the same layer of the package structure; (2) corresponding in the stacking direction of the package structure. This embodiment will describe in detail the implementation of these two different layout designs in conjunction with specific implementation methods:
[0048] (1) The second transceiver unit corresponds to the first transceiver unit in the same layer of the packaging structure.
[0049] like Figure 2 As shown, in some specific embodiments of this example, the second transceiver unit 23 can also be disposed on the first encapsulation body 10, that is, both the first transceiver unit 13 and the second transceiver unit 23 are disposed on the upper surface of the first encapsulation body 10, and the two correspond to each other in the horizontal direction. Here, the first transceiver unit 13 and the second transceiver unit 23 are in the same layer; and the transmission and reception directions of the first transceiver unit 13 and the second transceiver unit 23 correspond to each other in the horizontal direction.
[0050] In some preferred embodiments, the first base island 11, the first chip 12, and the first transceiver unit 13 correspond to each other in the stacking direction of the package structure; correspondingly, the second base island 21, the second chip 22, and the second transceiver unit 23 correspond to each other in the stacking direction of the package structure.
[0051] In some preferred embodiments, such as Figure 2 As shown, the packaging structure further includes a second encapsulation body 20; the first encapsulation body 10, the first transceiver unit 13, and the second transceiver unit 23 are encapsulated within the second encapsulation body 20. The second encapsulation body 20 serves to fix the first transceiver unit 13 and the second transceiver unit 23.
[0052] It is understandable that, based on this layout design, the first transceiver unit on the primary side and the second transceiver unit on the secondary side will be isolated in the horizontal direction. At the same time, for the overall isolated transmission package structure, both the primary and secondary side structures are implemented using a vertical stacking method, and the two form a mirror structure. This not only greatly optimizes the overall layout design of the package structure, significantly reduces its horizontal size, and strengthens the overall structure, but also enables the overall internal vertical stacking design to be achieved with the shortest connection, minimizing the size of the package structure to the greatest extent.
[0053] (2) The second transceiver unit corresponds to the first transceiver unit in the stacking direction of the packaging structure.
[0054] like Figure 3As shown, in some specific embodiments of this example, the first transceiver unit 13 and the second transceiver unit 23 can be stacked vertically. Specifically, the packaging structure will also include a second molding compound 20 and a third pad 31; wherein, the first molding compound 10 and the first transceiver unit 13 disposed on the upper surface of the first molding compound 10 are encapsulated within the second molding compound 20; the second transceiver unit 23 is disposed on the upper surface of the second molding compound 20 and corresponds to the first transceiver unit 13 within the first molding compound 10 in the stacking direction of the packaging structure; the second molding compound 20 is provided with the third pad 31 communicating with the second pad 24; the second transceiver unit 23 is connected to the second pad 24 through the third pad 31. It can be understood that, in the stacking direction of the packaging structure, the first base island 11, the first chip 12, the first transceiver unit 13, and the second transceiver unit 23 are correspondingly distributed, making the overall packaging structure more compact and more conducive to the miniaturization design of the packaging structure.
[0055] In some preferred embodiments, such as Figure 3 As shown, the packaging structure further includes a third molding compound 30; the first molding compound 10, the second molding compound 20, and the second transceiver unit 23 are encapsulated within the third molding compound 30. Here, the third molding compound serves to fix the second transceiver unit.
[0056] In some preferred embodiments, the first pad, the second pad, and the third pad are all perpendicular to the stacking direction of the package structure. That is, all pads in the package structure are vertical pads, which facilitates processing and shortens the interconnection.
[0057] In particular, in this layout design, by adjusting the thickness of the second encapsulation, the "isolation distance" between the primary and secondary structures can be adjusted, thereby adjusting the isolation strength to meet the requirements of various isolation transmission path directions and isolation strength.
[0058] It is understandable that, based on this layout design, the first transceiver unit on the primary side and the second transceiver unit on the secondary side will perform isolated transmission in the vertical direction. Since the first transceiver unit and the second unit are designed to be stacked vertically, it will not affect the overall horizontal area of the package structure at all, and can significantly reduce the size of the package structure in the horizontal direction; furthermore, it can meet the requirements of various isolated transmission path directions and isolation strengths by adjusting the thickness of the molding compound without increasing the footprint, thereby improving the applicability of the isolated transmission package structure.
[0059] Example 3
[0060] This embodiment is a further extension of Embodiment 2, providing corresponding manufacturing processes for its two different layout designs.
[0061] Please see Figure 4 ,correspond Figure 2 The manufacturing process of the signal isolation transmission packaging structure shown includes:
[0062] S1: Create the framework;
[0063] S2: First chip installation: The first chip is installed on the top of the first base island by means of bonding or other methods, and the second chip is installed on the top of the second base island by means of bonding or other methods;
[0064] S3: Wire bonding: Wire bonding connects the first chip to the first transceiver unit, and the second chip to the second transceiver unit;
[0065] S4: First encapsulation: The first base island, the second base island, the first chip, and the second chip are encapsulated by encapsulation methods such as injection molding to form the first encapsulated body.
[0066] S5: Laser + Electroplating + Surface Treatment: Solder joints connecting to the first chip and the second chip are formed by electroplating through holes in the upper surface of the first molding compound; then, surface treatment is performed on the two solder joints to form the first pad and the second pad. The purpose of this step is to bring the signal of the first chip out to the surface of the first molding compound through the first pad, and to bring the signal of the second chip out to the surface of the second molding compound through the second pad.
[0067] S6: Second chip mounting: The first transceiver unit and the second transceiver unit are respectively mounted on the first molded body by means of bonding or other methods, and connected to the corresponding first and second pads respectively. Here, the first transceiver unit and the second transceiver unit, which are both located on the upper surface of the first molded body, need to be corresponding in the horizontal direction, that is, they are on the same straight line, to ensure the best isolation transmission effect.
[0068] S7: Second encapsulation: The first encapsulated body, the first transceiver unit, and the second transceiver unit are encapsulated by encapsulation methods such as injection molding to form a second encapsulated body.
[0069] S8: Rib cutting and shaping.
[0070] The above process, by designing the layout of the internally vertically stacked primary side structure and the internally vertically stacked secondary side structure in a mirror-symmetrical manner, not only achieves effective horizontal isolation transmission, shortening the signal path and ensuring better transmission matching performance, but also significantly reduces the size of the package structure in the horizontal direction; it can also greatly optimize the overall layout design of the package structure, significantly reduce its horizontal size, and strengthen the overall structure; furthermore, it can achieve the fewest and shortest interconnections, minimizing the size of the package structure to the greatest extent.
[0071] Please see Figure 5 ,correspond Figure 3 The manufacturing process of the signal isolation transmission packaging structure shown includes:
[0072] S1: Create the framework;
[0073] S2: First chip installation: The first chip is installed on the top of the first base island by means of bonding or other methods, and the second chip is installed on the top of the second base island by means of bonding or other methods;
[0074] S3: First wire bonding: Bonding the first chip to the first transceiver unit, and the second chip to the second transceiver unit;
[0075] S4: First encapsulation: The first base island, the second base island, the first chip, and the second chip are encapsulated by encapsulation methods such as injection molding to form the first encapsulated body.
[0076] S5: First laser engraving + electroplating + surface treatment: Solder joints connecting to the first chip and the second chip are formed by electroplating through holes in the surface of the first molding compound; then, surface treatment is performed on the two solder joints to form the first pad and the second pad. The purpose of this step is to bring the signal of the first chip out to the surface of the first molding compound through the first pad, and to bring the signal of the second chip out to the surface of the second molding compound through the second pad.
[0077] S6: Second bonding: The first transceiver unit is set on the first molding body at the position corresponding to the first pad by means of bonding or other methods.
[0078] S7: Second encapsulation: The first encapsulated body and the first transceiver unit are encapsulated by encapsulation methods such as injection molding to form a second encapsulated body;
[0079] S8: Second laser engraving + electroplating + surface treatment: Solder joints connected to the second pads are formed by electroplating through holes in the surface of the second molding compound. These solder joints are then surface treated to form the third pads. The purpose of this step is to bring the signals from the second chip out to the surface of the second molding compound through the second and third pads. Preferably, the second and third pads are located on the same straight line to ensure the stability of the connection while shortening the wiring.
[0080] S9: Third bonding: The second transceiver unit is mounted on the second molding compound using methods such as bonding, and the second transceiver unit is connected to the third pad. Here, the second transceiver unit needs to correspond in the stacking direction with the first transceiver unit in the second molding compound, that is, it needs to be located directly above the first transceiver unit to ensure the best isolation transmission effect.
[0081] S10: Third encapsulation: The first encapsulated body, the second encapsulated body, and the second transceiver unit are encapsulated by encapsulation methods such as injection molding to form a third encapsulated body.
[0082] S11: Rib cutting and shaping.
[0083] The above-described process design arranges the internal layout of the package structure in a vertically stacked manner, enabling vertical isolation between the first transceiver unit on the primary side and the second transceiver unit on the secondary side. The signal isolation transmission package structure manufactured using this process not only shortens the signal path and ensures better transmission matching performance, but also allows for adjustments to the thickness of the molding compound to meet various isolation transmission path directions and isolation strength requirements without increasing the footprint. Furthermore, it significantly reduces the horizontal dimensions of the package structure.
[0084] Example 4
[0085] This embodiment further extends any of the embodiments one to three described above, providing an isolator. The isolator can achieve face-to-face isolation of communication transmission in the vertical direction or isolation of communication transmission in the horizontal direction; more importantly, its isolation transmission performance is improved to a certain extent, and the size of its internal isolation chip is optimized.
[0086] The isolator provided in this embodiment includes the signal isolation transmission packaging structure described in any of the above embodiments. The specific structure of the signal isolation transmission packaging structure and its corresponding manufacturing process are not detailed here; please refer to the descriptions in the above embodiments for more information.
[0087] The isolator provided in this embodiment has an isolation chip internally arranged in a vertically stacked manner. Its primary and secondary structures can be configured to achieve effective isolation transmission in either the stacking direction or the horizontal direction. This not only shortens the signal path and ensures better transmission matching performance, but also allows for adjustments to the thickness of the molding compound to meet various isolation transmission path directions and isolation strength requirements without increasing the footprint. Furthermore, it significantly reduces the horizontal dimensions of the package structure.
[0088] The isolator in this embodiment is well-suited for scenarios requiring wireless isolation transmission, such as high- and low-voltage wireless isolation in power systems.
[0089] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.
Claims
1. An internally vertically stacked signal isolation transmission packaging structure, characterized in that, include: A first base island, a second base island, a first chip, a second chip, a first transceiver unit, a second transceiver unit, a first molding compound, a first pad, and a second pad; the first base island and the second base island are spaced apart by a preset distance; The first chip is disposed on the first base island; the second chip is disposed on the second base island; the first chip, the first base island, the second chip, and the second base island are encapsulated within the first encapsulation body; The first molding compound has a first pad communicating with the first chip and a second pad communicating with the second chip; the first transceiver unit is disposed on the first molding compound and connected to the first pad; the second transceiver unit corresponds to the first transceiver unit in the stacking direction of the packaging structure, or corresponds to the first transceiver unit in the same layer of the packaging structure. The second transceiver unit is connected to the second pad.
2. The internally vertically stacked signal isolation transmission packaging structure as described in claim 1, characterized in that, The second transceiver unit is disposed on the first plastic encapsulation body and corresponds to the first transceiver unit.
3. The internally vertically stacked signal isolation transmission packaging structure as described in claim 2, characterized in that, In the stacking direction of the packaging structure, the first base island, the first chip, and the first transceiver unit correspond to each other; In the stacking direction of the package structure, the second base island, the second chip, and the second transceiver unit correspond to each other.
4. The internally vertically stacked signal isolation transmission packaging structure as described in claim 2, characterized in that, It also includes a second encapsulation body; the first encapsulation body, the first transceiver unit, and the second transceiver unit are encapsulated within the second encapsulation body.
5. The internally vertically stacked signal isolation transmission packaging structure as described in claim 1, characterized in that, It also includes a second molding compound and a third pad; the first molding compound and the first transceiver unit are molded within the second molding compound; the second transceiver unit is disposed on the second molding compound and corresponds to the first transceiver unit in the stacking direction of the package structure; the second molding compound is provided with the third pad connected to the second pad; the second transceiver unit is connected to the second pad via the third pad.
6. The internally vertically stacked signal isolation transmission packaging structure as described in claim 5, characterized in that, The packaging structure further includes a third molding compound; the first molding compound, the second molding compound, and the second transceiver unit are encapsulated within the third molding compound.
7. The internally vertically stacked signal isolation transmission packaging structure as described in claim 5, characterized in that, The first pad, the second pad, and the third pad are all perpendicular to the stacking direction of the package structure.
8. The internally vertically stacked signal isolation transmission packaging structure as described in claim 1, characterized in that, The first chip and the first base island are connected sequentially via wire bonding; the second chip and the second base island are connected sequentially via wire bonding.
9. The internally vertically stacked signal isolation transmission packaging structure as described in claim 1, characterized in that, The first transceiver unit is an antenna or a coil; the second transceiver unit is an antenna or a coil.
10. An isolator, characterized in that, Includes the signal isolation transmission encapsulation structure described in any one of claims 1 to 9.