Ceramic and double-ferrite composite material structure suitable for broadband microstrip product
By using a ceramic matrix and dual ferrite composite material structure in the microstrip circulator, the problem that a single-material substrate is difficult to meet the broadband requirements is solved, and a microstrip product with smaller size, wider bandwidth and lower cost is achieved, which is suitable for the integration and miniaturization of microwave communication systems.
Patent Information
- Application Number
- CN202422069322.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-26
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-08-26
AI Technical Summary
Existing single-material substrates are difficult to meet the performance indicators of wide-band microstrip circulators, especially in terms of miniaturization and integration requirements of microwave communication systems. Traditional single-material substrates are difficult to achieve wider frequency band requirements and precision requirements.
A ceramic matrix and dual ferrite composite material structure is adopted, including nesting low magnetic moment and high magnetic moment ferrites in the ceramic matrix to form a composite substrate, and printing microstrip circuits on its surface, combining alumina ceramic sheets and permanent magnets to improve performance.
It achieves smaller product size to meet wider frequency bandwidth, which is in line with the trend of integration and miniaturization of microstrip products, while reducing production costs and expanding application scenarios.
Smart Images
Figure CN223487306U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of microwave materials and devices, and in particular to a ceramic-plus-double ferrite composite material structure suitable for broadband microstrip products. Background Technology
[0002] Microstrip circulators are important microwave devices with a ring structure and microstrip line characteristics, and are widely used in fields such as communications, radar, radio and satellite communications.
[0003] Ferrite materials are typically chosen as substrate materials for microstrip circulators because they possess unique magnetic and dielectric properties that can meet the circulator's specific requirements for magnetic field and electromagnetic wave transmission.
[0004] The substrate material of a microstrip circulator often determines the frequency band in which the microstrip product can be used. For wideband microstrip circulator products, existing single-material substrates can no longer meet the required performance specifications. If we blindly pursue single-material substrates, the products manufactured will be limited by their material properties and will be difficult to meet the growing miniaturization and integration requirements of today's microwave communication systems.
[0005] For microstrip products, the material properties of the substrate determine the upper and lower limits of its frequency band. With the current trend of product integration and miniaturization in the microstrip field, traditional single-material substrates struggle to achieve the performance specifications required by customers over a wide bandwidth. These specifications cannot be met by using smaller dimensions to achieve the required frequency bands. Moreover, with the miniaturization of circuit structures, simply shrinking circuit lines poses significant challenges to the precision and manufacturing processes of circuit fabrication.
[0006] As the requirements for microwave system integration increase, customers also expect microstrip products to meet wider bandwidth requirements, achieving the bandwidth that previously required two products combined in a single product. However, current mainstream single-material substrates often struggle to meet this requirement. Utility Model Content
[0007] To overcome the above deficiencies, this utility model provides a ceramic-plus-double ferrite composite material structure suitable for broadband microstrip products.
[0008] To achieve the above objectives, the present invention provides the following technical solution:
[0009] A ceramic-plus-double-ferrite composite material structure suitable for broadband microstrip products includes a ceramic matrix, wherein a ferrite mounting hole is provided in the middle of the ceramic matrix, and a low magnetic moment ferrite is tightly nested in the ferrite mounting hole; a high magnetic moment ferrite is tightly nested in the low magnetic moment ferrite.
[0010] Furthermore, the ceramic substrate, the low magnetic moment ferrite, and the high magnetic moment ferrite have the same thickness, and the composite substrate formed by nesting them has the same surface height, and microstrip circuits are printed on the surface.
[0011] Furthermore, the ceramic substrate is a square substrate sheet, and the ferrite mounting hole is a circular hole.
[0012] Furthermore, the low magnetic moment ferrite is a toroidal tube; the high magnetic moment ferrite is a cylinder, nested inside the low magnetic moment ferrite.
[0013] Furthermore, the side of the composite substrate without microstrip circuitry is soldered to a metal base plate, while the side with microstrip circuitry is bonded to a ceramic sheet, on which a permanent magnet is bonded.
[0014] Furthermore, the ceramic sheet is made of a ceramic material with alumina as the main component.
[0015] This invention offers the following advantages: It provides a composite substrate material suitable for micro-bandwidth products. This substrate material can meet wider bandwidth requirements with a smaller product size, aligning with the integration and miniaturization trends in this field. The composite material produced in this way can excellently meet the integration and miniaturization needs of corresponding technical specifications. It also boasts more balanced performance, a wider bandwidth, and broader application prospects. Microcircuit fabrication, whether using thick-film or thin-film processes, utilizes precious metals; by significantly reducing size, production costs can be effectively lowered. The use of this composite substrate structure effectively expands product application scenarios and increases product versatility. Attached Figure Description
[0016] Figure 1 It is a structural diagram of the utility model;
[0017] Figure 2 A schematic diagram of the assembled microstrip product structure;
[0018] Explanation of reference numerals in the attached figures: 1. Ceramic substrate; 2. Low magnetic moment ferrite; 3. High magnetic moment ferrite; 4. Metal substrate; 5. Composite substrate; 6. Ceramic sheet; 7. Permanent magnet; 8. Microstrip circuit. Detailed Implementation
[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0020] Example 1, applicable to ceramic plus ferrite composite material structure for broadband microstrip products, refers to... Figure 1 As shown, the left side is a front view of the structure, and the right side is a side view. It includes a ceramic substrate 1, with a ferrite mounting hole in the center. A low-magnetic-moment ferrite 2 is tightly nested within the ferrite mounting hole. A high-magnetic-moment ferrite 3 is tightly nested within the low-magnetic-moment ferrite 2. The ceramic substrate 1, the low-magnetic-moment ferrite 2, and the high-magnetic-moment ferrite 3 have the same thickness. The surfaces of the composite substrate 5 formed by the nesting are of the same height, ensuring that the materials are in close contact at the junction of the rings. The resulting composite substrate 5 has uniform thickness and tight connection, with no obvious extrusion cracks or pits on the surface of each material. After the composite substrate 5 is fabricated, the designed microstrip circuit 8 can be printed onto the surface of the fabricated composite substrate 5. Finally, sintering is performed to fix the paste, thus fixing the circuit onto the composite substrate 5.
[0021] The ceramic substrate 1 is a square substrate sheet, and the ferrite mounting hole is a circular hole; the low magnetic moment ferrite 2 is a circular annular tube, and the high magnetic moment ferrite 3 is a cylinder nested inside the low magnetic moment ferrite 2.
[0022] Example 2, as Figure 2 As shown, the left side is a front view of the structure, and the right side is a side view. The composite substrate 5 in Example 1 is assembled into a microstrip product. The side of the composite substrate 5 without the microstrip circuit 8 is soldered to the metal base plate 4, and the side with the microstrip circuit 8 is bonded to a ceramic sheet 6. A permanent magnet 7 is bonded to the ceramic sheet 6. The ceramic sheet is made of alumina-based ceramic material.
[0023] The composite substrate structure of the dual magnetic moment material of this invention is more conducive to the miniaturization and integration of microstrip products; it meets a wide range of product bandwidth applications and has a broader application prospect.
[0024] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.
[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0027] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A ceramic-plus-ferrite composite material structure suitable for broadband microstrip products, characterized in that, It includes a ceramic substrate (1), the ceramic substrate (1) has a ferrite mounting hole in the middle, and a low magnetic moment ferrite (2) is tightly nested in the ferrite mounting hole; a high magnetic moment ferrite (3) is tightly nested in the low magnetic moment ferrite (2).
2. The ceramic-plus-ferrite composite material structure suitable for broadband microstrip products according to claim 1, characterized in that, The ceramic substrate (1), the low magnetic moment ferrite (2), and the high magnetic moment ferrite (3) have the same thickness, and the composite substrate (5) formed by nesting has the same surface height, and microstrip circuits (8) are printed on the surface.
3. The ceramic-plus-ferrite composite material structure suitable for broadband microstrip products according to claim 1, characterized in that, The ceramic substrate (1) is a square substrate sheet, and the ferrite mounting hole is a circular hole.
4. The ceramic-plus-ferrite composite material structure suitable for broadband microstrip products according to claim 1, characterized in that, The low magnetic moment ferrite (2) is a circular annular tube; the high magnetic moment ferrite (3) is a cylinder, nested inside the low magnetic moment ferrite (2).
5. The ceramic-plus-ferrite composite material structure suitable for broadband microstrip products according to claim 2, characterized in that, The side of the composite substrate (5) without microstrip circuit (8) printed on it is soldered onto the metal base plate (4), and the side with microstrip circuit (8) printed on it is bonded to a ceramic sheet (6), and a permanent magnet (7) is bonded to the ceramic sheet (6).