Solder strip structure, battery piece and battery string

Abstract

The utility model provides a solder strip structure, a battery piece and a battery string. The solder strip structure is applied to a battery piece, and the diameter of the solder strip structure is gradually increased in the transmission direction of current in the solder strip structure. When the battery piece is used, the current density in the welding strip structure is gradually increased in the current transmission direction, namely, the current density at the head of the welding strip structure is small, the current density at the tail of the welding strip structure is large, and the diameter of the head of the welding strip structure is designed to be small; on the premise that low-current-density transmission at the head of the solder strip structure is not affected, the shading area of the solder strip structure is reduced, and the semiconductor substrate has more light receiving area; the diameter of the tail part of the solder strip structure is designed to be thicker, so that the transmission resistance is reduced, the transmission loss caused by high current density is reduced, and the power generation power of a battery piece is improved.

Description

Technical Field

[0001] This utility model relates to the field of battery cell technology, and in particular to a solder strip structure, battery cell and battery string. Background Technology

[0002] In current photovoltaic module technology, solar cells are connected by solder ribbons. These ribbons act as conductors, collecting and transmitting the current generated by the cells to the junction box. However, the power generation capacity of the cells in existing technologies needs further improvement. Utility Model Content

[0003] Therefore, it is necessary to provide a solder strip structure, a battery cell, and a battery string to address the issue that the power generation capacity of existing battery cells needs to be further improved.

[0004] The technical solution is as follows:

[0005] In one aspect, a solder strip structure is provided for use in a battery cell, wherein the diameter of the solder strip structure gradually increases along the direction of current transmission within the solder strip structure.

[0006] The technical solution will be further explained below:

[0007] In one embodiment, the solder strip structure includes a head solder strip segment and a tail solder strip segment, wherein the diameter of the tail solder strip segment is larger than the diameter of the head solder strip segment.

[0008] In one embodiment, the ribbon structure further includes an intermediate ribbon segment located between the head ribbon segment and the tail ribbon segment, the number of intermediate ribbon segments being at least one, the diameters of the intermediate ribbon segments being different, and the diameters of the head ribbon segment, the intermediate ribbon segments, and the tail ribbon segment increasing sequentially along the direction of current transmission within the ribbon structure.

[0009] In one embodiment, there are two intermediate solder strip segments, namely a first solder strip segment and a second solder strip segment. Along the direction of current transmission within the solder strip structure, the head solder strip segment, the first solder strip segment, the second solder strip segment, and the tail solder strip segment are connected in sequence, and the diameters of the head solder strip segment, the first solder strip segment, the second solder strip segment, and the tail solder strip segment increase in sequence.

[0010] In one embodiment, the head solder strip segment, each of the intermediate solder strip segments, and the tail solder strip segment are all coaxially arranged.

[0011] In one embodiment, the diameter of the solder strip structure increases linearly along the direction of current transmission within the structure.

[0012] In a second aspect, a battery cell is provided, comprising a semiconductor substrate, sub-gate lines, and the aforementioned solder ribbon structure, wherein the number of sub-gate lines is at least one, and each of the sub-gate lines is spaced apart on the semiconductor substrate along a predetermined direction, and the solder ribbon structure is electrically connected to each of the sub-gate lines.

[0013] In one embodiment, the battery cell further includes main grid lines, and the number of main grid lines and the number of solder ribbon structures are both at least one. Each of the main grid lines is spaced apart along a direction that is at an angle to the preset direction and is electrically connected to each of the sub-grid lines. Each of the solder ribbon structures is correspondingly soldered to each of the main grid lines.

[0014] In one embodiment, the ribbon structure includes a tail ribbon segment that extends from the edge of the battery cell.

[0015] Thirdly, a battery string is provided, comprising at least two of the aforementioned battery cells, wherein a solder strip structure on the battery cells is electrically connected to adjacent battery cells.

[0016] In the above embodiments, the current density within the solder ribbon structure, battery cell, and battery string gradually increases along the current transmission direction. Specifically, the current density is low at the head of the solder ribbon structure and high at the tail. By designing a smaller diameter at the head of the solder ribbon structure, the light-shielding area of ​​the solder ribbon structure is reduced without affecting the low current density transmission at the head, allowing the semiconductor substrate to have a larger light-receiving area. Conversely, by designing a larger diameter at the tail of the solder ribbon structure, its transmission resistance is reduced, minimizing transmission losses caused by high current density and increasing the power generation of the battery cell. Attached Figure Description

[0017] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the solder strip structure of one embodiment.

[0020] Figure 2 This is a schematic diagram of the structure of a battery cell according to one embodiment.

[0021] Figure 3 for Figure 2 A magnified view of part A in the middle.

[0022] Figure 4 This is a schematic diagram of the structure of a battery string in one embodiment.

[0023] Explanation of reference numerals in the attached figures:

[0024] 10. Battery string; 100. Battery cell; 110. Welding strip structure; 111. Head welding strip segment; 112. Tail welding strip segment; 113. First welding strip segment; 114. Second welding strip segment; 120. Semiconductor substrate; 130. Sub-busbar; 140. Main busbar. Detailed Implementation

[0025] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0026] like Figure 1 and Figure 2 As shown, in one embodiment, a battery cell 100 is provided, which includes a semiconductor substrate 120, sub-gate lines 130, and a solder ribbon structure 110. The number of sub-gate lines 130 is at least one, and each sub-gate line 130 is spaced apart on the semiconductor substrate 120 along a predetermined direction. The solder ribbon structure 110 is electrically connected to each sub-gate line 130.

[0027] In the above embodiment, when the battery cell 100 is in use, the semiconductor substrate 120 absorbs light energy and converts the light energy into current. The sub-gate line 130 collects the converted current, and the solder ribbon structure 110 collects the current on each sub-gate line 130 and transmits the current to the junction box for storage and power supply.

[0028] The semiconductor substrate 120 can be configured as any structure in the prior art capable of converting light energy into electrical energy.

[0029] like Figure 2 and Figure 3As shown, optionally, the solar cell 100 also includes main busbars 140. The number of main busbars 140 and the number of solder ribbon structures 110 are both at least one. Each main busbar 140 is spaced apart along a direction that forms an angle with a preset direction and is electrically connected to each sub-busbar 130. Each solder ribbon structure 110 is correspondingly soldered onto each main busbar 140. In this way, the solder ribbon structure 110 can be stably and reliably fixed to the main busbars 140, ensuring that the current on each sub-busbar 130 can be concentrated within the solder ribbon structure 110, thereby improving the reliability of the solar cell 100.

[0030] The preset direction, the number of main gate lines 140, and the number of solder ribbon structures 110 can all be flexibly adjusted according to actual usage needs. Specifically, in this embodiment, the preset direction can be set to the width direction of the semiconductor substrate 120. The main gate lines 140 are spaced apart along the length direction of the semiconductor substrate 120. The number of main gate lines 140 is the same as the number of solder ribbon structures 110. The length of the solder ribbon structure 110 is greater than the length of the main gate lines 140.

[0031] The solder ribbon structure 110 comprises a copper substrate and a tin alloy coating. The tin alloy coating is uniformly coated on the surface of the copper substrate according to a certain composition ratio and thickness. The copper substrate has good conductivity, enabling it to effectively transmit current. The tin alloy coating provides solderability, allowing the solder ribbon structure 110 to be firmly soldered to the main busbar 140 of the solar cell 100. High-quality solder ribbon material should have low resistance and high conductivity to reduce current loss during transmission.

[0032] like Figure 2 As shown, optionally, the solder strip structure 110 includes a tail solder strip segment 112 that extends from the edge of the solar cell 100. Thus, the solar cell 100 can be connected in series with adjacent solar cells 100 via the tail solder strip segment 112 to form a battery string 10, improving the practicality of the solar cell 100.

[0033] like Figure 1 and Figure 2 As shown, in one embodiment, a solder strip structure 110 is applied to the battery cell 100, and the diameter of the solder strip structure 110 gradually increases along the direction of current transmission within the solder strip structure 110.

[0034] In the above embodiment, the current density of the solder ribbon structure 110 gradually increases along the current transmission direction during use. That is, the current density at the head of the solder ribbon structure 110 is small, and the current density at the tail of the solder ribbon structure 110 is large. The diameter of the head of the solder ribbon structure 110 is designed to be thinner, which reduces the light-shielding area of ​​the solder ribbon structure 110 without affecting the transmission of the small current density at the head of the solder ribbon structure 110, and the semiconductor substrate 120 has more light-receiving area. The diameter of the tail of the solder ribbon structure 110 is designed to be thicker, which reduces its transmission resistance, reduces the transmission loss caused by the large current density, and improves the power generation of the battery cell 100.

[0035] Wherein, along the direction of current transmission within the solder strip structure 110, the diameter of the solder strip structure 110 gradually increases. This can be either a linear increase in the diameter of the solder strip structure 110 along the direction of current transmission within the solder strip structure 110, or a non-linear increase in the diameter of the solder strip structure 110 along the direction of current transmission within the solder strip structure 110.

[0036] like Figure 1 As shown, optionally, the solder strip structure 110 includes a head solder strip segment 111 and a tail solder strip segment 112, wherein the diameter of the tail solder strip segment 112 is larger than the diameter of the head solder strip segment 111.

[0037] In this specific embodiment, the solder strip structure 110 is stepped. The head solder strip segment 111 and the tail solder strip segment 112 are both cylindrical. In other embodiments, the cross-section of the solder strip structure 110 along the direction perpendicular to its own axis can also be triangular or other shapes (the diameter of the solder strip structure 110 can be the diameter of the circumcircle of its own cross-section).

[0038] like Figure 1 As shown, optionally, the solder ribbon structure 110 also includes intermediate solder ribbon segments located between the head solder ribbon segment 111 and the tail solder ribbon segment 112. There is at least one intermediate solder ribbon segment, and each intermediate solder ribbon segment has a different diameter. Along the direction of current transmission within the solder ribbon structure 110, the diameter of the head solder ribbon segment 111, the diameter of each intermediate solder ribbon segment, and the diameter of the tail solder ribbon segment 112 increase sequentially. In this way, the solder ribbon structure 110 can balance current transmission and light absorption, ensuring smooth current transmission while minimizing obstruction of the semiconductor substrate 120. This allows the semiconductor substrate 120 to have a larger light-receiving area, thereby increasing the power generation of the solar cell 100.

[0039] The number of intermediate welding strips can be flexibly adjusted according to actual usage needs.

[0040] like Figure 1As shown, in this specific embodiment, there are two intermediate solder strip segments, namely the first solder strip segment 113 and the second solder strip segment 114. Along the direction of current transmission within the solder strip structure 110, the head solder strip segment 111, the first solder strip segment 113, the second solder strip segment 114, and the tail solder strip segment 112 are connected in sequence. The diameters of the head solder strip segment 111, the first solder strip segment 113, the second solder strip segment 114, and the tail solder strip segment 112 increase in sequence.

[0041] The lengths of the head solder strip 111, the middle solder strip, and the tail solder strip 112, along the direction of current transmission within the solder strip structure 110, can be flexibly adjusted according to actual usage needs. Specifically, in this embodiment, the lengths of the head solder strip 111, the first solder strip 113, the second solder strip 114, and the tail solder strip 112 are all the same along the direction of current transmission within the solder strip structure 110.

[0042] like Figure 1 As shown, optionally, the head solder strip 111, each intermediate solder strip, and the tail solder strip 112 are all coaxially arranged. This ensures that current can be smoothly transmitted between the head solder strip 111 and the intermediate solder strips, between two adjacent intermediate solder strips, and between the intermediate solder strips and the tail solder strip 112, thereby improving the reliability of the solar cell 100.

[0043] It should be noted that the coaxial arrangement of the head welding strip segment 111, each intermediate welding strip segment, and the tail welding strip segment 112 means that the axis of the head welding strip segment 111, the axis of each intermediate welding strip segment, and the axis of the tail welding strip segment 112 are all located on the same straight line.

[0044] like Figure 4 As shown, in one embodiment, a battery string 10 is provided, which includes at least two battery cells 100 as described in any of the above embodiments, wherein a solder strip structure 110 on the battery cell 100 is electrically connected to an adjacent battery cell 100.

[0045] In the battery string 10 described above, during use, the current density within the solder ribbon structure 110 gradually increases along the current transmission direction. That is, the current density is low at the head of the solder ribbon structure 110 and high at the tail. By designing a smaller diameter at the head of the solder ribbon structure 110, the light-shielding area of ​​the solder ribbon structure 110 is reduced without affecting the low current density transmission at the head, allowing the semiconductor substrate 120 to have a larger light-receiving area. By designing a larger diameter at the tail of the solder ribbon structure 110, its transmission resistance is reduced, reducing transmission losses caused by high current density and improving the power generation of the battery string 10.

[0046] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0047] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0048] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0049] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0050] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0051] It should also be understood that, in interpreting the connection or positional relationships of components, although not explicitly described, connection and positional relationships are interpreted to include a range of error, which should be within the acceptable deviation range of a specific value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0052] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A solder strip structure applied to a solar cell (100), characterized in that, Along the direction of current transmission within the solder strip structure (110), the diameter of the solder strip structure (110) gradually increases.

2. The welding strip structure according to claim 1, characterized in that, The welding strip structure (110) includes a head welding strip segment (111) and a tail welding strip segment (112), wherein the diameter of the tail welding strip segment (112) is larger than the diameter of the head welding strip segment (111).

3. The welding strip structure according to claim 2, characterized in that, The ribbon structure (110) further includes an intermediate ribbon segment located between the head ribbon segment (111) and the tail ribbon segment (112). The number of intermediate ribbon segments is at least one, and the diameters of each intermediate ribbon segment are different. Along the direction of current transmission within the ribbon structure (110), the diameters of the head ribbon segment (111), the intermediate ribbon segments, and the tail ribbon segment (112) increase sequentially.

4. The welding strip structure according to claim 3, characterized in that, There are two intermediate solder strip segments, namely the first solder strip segment (113) and the second solder strip segment (114). Along the direction of current transmission in the solder strip structure (110), the head solder strip segment (111), the first solder strip segment (113), the second solder strip segment (114), and the tail solder strip segment (112) are connected in sequence. The diameters of the head solder strip segment (111), the first solder strip segment (113), the second solder strip segment (114), and the tail solder strip segment (112) increase in sequence.

5. The welding strip structure according to claim 3, characterized in that, The head welding strip segment (111), each of the intermediate welding strip segments, and the tail welding strip segment (112) are all coaxially arranged.

6. The welding strip structure according to claim 1, characterized in that, Along the direction of current transmission within the solder strip structure (110), the diameter of the solder strip structure (110) increases linearly.

7. A battery cell, characterized in that, The device includes a semiconductor substrate (120), sub-gate lines (130), and a solder ribbon structure (110) as described in any one of claims 1 to 6. The number of sub-gate lines (130) is at least one, and each sub-gate line (130) is spaced apart on the semiconductor substrate (120) along a predetermined direction. The solder ribbon structure (110) is electrically connected to each of the sub-gate lines (130).

8. The battery cell according to claim 7, characterized in that, The battery cell (100) also includes a main grid line (140), and the number of the main grid lines (140) and the number of the solder strip structures (110) are both at least one. Each of the main grid lines (140) is spaced apart along a direction that is at an angle to the preset direction, and each is electrically connected to each of the sub-grid lines (130). Each of the solder strip structures (110) is correspondingly soldered onto each of the main grid lines (140).

9. The battery cell according to claim 7, characterized in that, The ribbon structure (110) includes a tail ribbon segment (112) that extends from the edge of the battery cell (100).

10. A battery string, characterized in that, It includes at least two solar cells (100) as described in any one of claims 7 to 9, wherein a solder strip structure (110) on the solar cell (100) is electrically connected to the adjacent solar cell (100).

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