Uniform-air-supply temperature-controllable cold type helmet
By employing a semiconductor cooling device and sensor monitoring and control system in the helmet, the problems of uneven cooling and condensation in the helmet have been solved, achieving uniform airflow and comfortable cooling effect inside the helmet.
Patent Information
- Application Number
- CN202422987615.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-12-04
AI Technical Summary
Existing helmets suffer from uneven cooling and condensation during summer or high-intensity physical activities, affecting wearing comfort and causing safety hazards.
The helmet uses a semiconductor cooling device to cool the fresh air and its unique structure ensures that the cooled fresh air is evenly delivered into the helmet. Combined with a sensor monitoring and control system, it prevents condensation from forming.
It achieves uniform and comfortable cooling inside the helmet, avoids condensation, and improves the safety and comfort of wearing it.
Smart Images

Figure CN223489228U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to helmet technology, and in particular to a cooling helmet with uniform air delivery and controllable temperature. Background Technology
[0002] Helmets are widely used as essential protective gear in everyday life, such as when riding motorcycles, electric bikes, and bicycles, as well as in workplaces like factories and construction sites. However, in summer or during strenuous physical activity, helmets can hinder heat dissipation from the head. Since the head is a concentrated area for heat dissipation, this can lead to feelings of heat and stuffiness. Consequently, some people are unwilling to wear helmets due to their lack of comfort, thus creating safety hazards.
[0003] To address this issue, designs such as the cooling helmet with patent publication number CN103120434A and another cooling helmet with patent publication number CN105559229A both employ liquid cooling for helmet refrigeration. The difference between the two lies in the preparation method of the refrigerant. However, this liquid cooling method for helmets has significant problems, such as the complexity of handling the liquid cooling pipes within the confined space of the helmet, the risk of leakage in the liquid cooling pipes, and the excessive condensation on the surface of the liquid cooling pipes that cannot be drained.
[0004] For example, designs such as a helmet with a cooling function (patent publication number CN114190641A) and a cooling helmet (patent publication number CN210043266U) use semiconductor cooling and other methods to cool the helmet. However, the application of semiconductor cooling only uses cold-end radiation cooling, resulting in an uneven distribution of cooling effect and uneven temperature inside the helmet. At the same time, the cold end of the semiconductor cooling chip is directly placed inside the helmet, which also causes the problem of condensation and inability to drain.
[0005] In addition, there are generally two methods for cooling: radiative heat transfer and convective heat transfer. The cooling method used in the aforementioned comparative documents is usually radiative heat transfer. However, for a small space like a helmet, and considering the issue of condensation, the temperature difference needs to be strictly controlled. Therefore, a more reasonable cooling method is needed to achieve the cooling function inside the helmet. Summary of the Invention
[0006] The purpose of this invention is to solve the above-mentioned problems and provide a uniformly supplied air temperature controllable cooling helmet. It cools the fresh air through a semiconductor cooling device and, through the helmet's unique structure, ensures that the cooled fresh air is evenly supplied into the helmet, avoiding condensation. It also effectively combines the helmet with the cooling device and features convenient installation and on-demand adjustment.
[0007] The above-mentioned technical problems of this utility model are mainly solved by the following technical solution: a uniform air supply temperature controllable cooling helmet, including a shell, characterized in that the shell is a hollow double-layer structure, the hollow part constitutes an air supply cavity, and a plurality of air supply vents are provided on the inner side wall of the air supply cavity; a cold and heat source temperature control module is provided at the rear of the shell.
[0008] The temperature control module includes an air supply chamber, a ventilation chamber, a control chamber, and a power supply chamber; a semiconductor cooling chip is provided between the air supply chamber and the ventilation chamber, with cold air fins on the side of the semiconductor cooling chip facing the air supply chamber and heat dissipation fins on the side of the semiconductor cooling chip facing the ventilation chamber.
[0009] A vortex fan is installed in the air supply chamber, and an axial fan is installed in the ventilation chamber.
[0010] In the aforementioned uniform air supply temperature controllable cooling helmet, preferably, the inner side of the shell is provided with a buffer pad layer and an inner liner in sequence, wherein the buffer pad layer has a first perforation that matches the air supply vent on the shell, and the inner liner has a second perforation that matches the air supply vent and the first perforation.
[0011] In the aforementioned uniform air supply temperature controllable cooling helmet, preferably, the temperature control module is connected to the air supply cavity inside the shell through an air supply duct.
[0012] In the aforementioned uniform air supply temperature controllable cooling helmet, preferably, the control cabin is equipped with a controller, and cold end sensors and hot end sensors connected to the controller are respectively provided on both sides of the semiconductor cooling chip.
[0013] In the aforementioned uniform air supply temperature controllable cooling helmet, preferably, an in-helmet sensor is provided inside the helmet, and an air supply sensor is provided in the air supply cavity. The in-helmet sensor and the air supply sensor are connected to the controller.
[0014] In the aforementioned uniform air supply temperature controllable cooling helmet, preferably, the air supply chamber, ventilation chamber, control chamber and power supply chamber in the temperature control module are separated from each other, wherein the bottom of the air supply chamber is provided with a fresh air inlet and the bottom of the ventilation chamber is provided with an air inlet.
[0015] In the aforementioned uniform air supply temperature controllable cooling helmet, preferably, the ventilation chamber is provided with a heat dissipation vent facing directly behind the helmet, and air inlets are provided around the heat dissipation vent.
[0016] In the aforementioned uniform air supply temperature controllable cooling helmet, preferably, a heat insulation plate is provided between the air supply chamber and the ventilation chamber.
[0017] In the aforementioned uniformly supplied temperature-controlled cooling helmet, preferably, a goggle is provided at the front of the helmet and in conjunction with the shell, and a breathing hole is provided below the goggle on the shell corresponding to the mouth and nose.
[0018] This technical solution utilizes semiconductor cooling to deliver air inside the helmet. An air delivery cavity is designed according to the special structure of the helmet shell, and air outlets are arranged inside the air delivery cavity according to ergonomics, thereby achieving uniform air delivery inside the helmet.
[0019] In this design, a vortex fan is used inside the helmet to change the airflow direction. Outdoor air enters the air supply channel through the fresh air inlet, exchanges heat with the cooling fins inside the thermoelectric cooler, and the cooled air is then forced into the air supply cavity by the vortex fan, and subsequently into the helmet, ensuring a comfortable and clean airflow for the user. On the other side of the thermoelectric cooler, heat from the heat dissipation fins is carried away by an axial fan, ensuring that the operating temperature of the hot end meets usage requirements. The hot and cold sides do not interfere with each other, allowing the thermoelectric cooler to achieve optimal heat exchange efficiency.
[0020] To ensure the helmet's cooling effect and the effective operation of the semiconductor cooling system, this device is equipped with multiple sensors. All sensors are equipped with temperature and humidity monitoring and data transmission functions, and all data inputs are routed to the controller. Through these sensor settings, not only is the cooling effect inside the helmet ensured, but the dew point temperature inside the helmet is also monitored to prevent condensation. Feedback is then sent to the control system to adjust parameters such as the air supply temperature and the cooling power of the semiconductor cooling chip. Simultaneously, the temperature at both ends of the semiconductor cooling chip is monitored to prevent damage caused by overcooling or overheating.
[0021] Compared with the prior art, the beneficial effects of this utility model are: it uses the principle of semiconductor cooling to process the air supply, and the special structure of the helmet makes the air supply uniform; it effectively controls and adjusts the temperature of each point in the internal space of the helmet to achieve a good cooling effect that meets the user's requirements; it has a wide range of applications; it not only has a good cooling effect, but also has no condensation phenomenon, making the human body feel comfortable. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the external structure of a cooling helmet according to this utility model.
[0023] Figure 2 This is a schematic diagram of the overall cross-sectional structure of this utility model.
[0024] Figure 3 yes Figure 2 A magnified schematic diagram of the structure at point M in the middle.
[0025] Figure 4 This is a schematic diagram of a shell structure according to the present invention.
[0026] Figure 5 This is a schematic diagram of an inner liner structure according to the present invention.
[0027] Figure 6 This is a schematic diagram of a refrigeration principle of this utility model.
[0028] Figure 7 This is a schematic diagram of a temperature control module structure according to the present invention.
[0029] In the diagram: 1-Shell, 101-Air supply cavity, 102-Air supply vent, 2-Temperature control module, 201-Controller, 202-Power supply compartment, 203-Axial flow fan, 204-Heat dissipation fins, 205-Semiconductor cooling chip, 206-Cold air fins, 207-Vortex fan, 208-Hot end sensor, 209-Cold end sensor, 210-Helmet internal sensor, 211-Air supply sensor, 212-Fresh air vent, 213-Air inlet, 214-Heat dissipation vent, 215-Air supply compartment, 216-Control compartment, 217-Ventilation compartment, 3-Goggles, 4-Breathing hole, 5-Buffer pad, 501-First cutout, 6-Inner liner, 601-Second cutout. Detailed Implementation
[0030] The technical solution of this utility model will be further described in detail below through embodiments and in conjunction with the accompanying drawings.
[0031] A type of uniformly supplied air temperature-controlled cooling helmet, such as Figure 1 As shown, the helmet shell 1 includes a full-face helmet structure. The shell 1 is made of materials such as carbon fiber or glass fiber. The front of the helmet is provided with a goggle 3 that is hinged to the shell 1. A breathing hole 4 is provided below the goggle 3 at the nose mask area. The rear of the helmet is provided with a temperature control module 2, which is the cold and heat source for the helmet's cooling and heating in this embodiment.
[0032] Shell 1 has a hollow double-layer structure, see [link / reference] Figures 2 to 4 The hollow section forms an air supply cavity 101, and multiple air outlets 102 are provided on the inner wall of the air supply cavity 101. The shell 1 contains a buffer layer 5 and an inner liner 6. The buffer layer 5 is made of EPS or similar materials, which can be compressed and deformed when the helmet is impacted, absorbing the impact force and reducing the impact on the head. EPS is a lightweight material that is easy to process. To meet the air supply requirements, a first perforation 501 is arranged in conjunction with the air outlets 102 on the inner side of the air supply cavity 101, corresponding to the air outlets 102. The inner liner 6 is mainly designed for wearing comfort and can be made of materials such as velvet. The inner liner 6 also has a second perforation 601, such as... Figure 5As shown, the second perforation 601 is adapted to the air outlet 102 and the first perforation 501, but the range of the second perforation 601 can be more flexible, with the main principle being not to obstruct the air supply. In this way, the helmet shell 1, combined with the perforations of the buffer pad layer 5 and the inner liner pad 6, ensures the uniformity of air supply in the overall structure.
[0033] See Figure 6 , Figure 7 The entire temperature control module 2 is made into a single unit. In practical applications, it is assembled with the housing 1 using a modular assembly method. The air supply is achieved by connecting the air supply duct to the air supply cavity 101 inside the housing 1. Of course, the temperature control module 2 can also be partially integrated with the helmet housing.
[0034] The temperature control module 2 includes a mutually separated air supply compartment 215, a ventilation compartment 217, a control compartment 216, and a power supply compartment 202. The heat exchanger, a thermoelectric cooler 205, of the temperature control module 2 is located between the air supply compartment 215 and the ventilation compartment 217. The partition material between the two compartments is a heat insulation board to enhance isolation and prevent heat loss through heat exchange. The number of thermoelectric coolers 205 can be set according to actual needs, such as one or two.
[0035] The thermoelectric cooler 205 has cooling fins 206 on the side facing the air supply compartment and heat dissipation fins 204 on the side facing the ventilation compartment. The cooling fins 206 are arranged vertically, parallel to the airflow direction. The bottom of the air supply compartment 215 has a fresh air inlet 212, and the bottom of the ventilation compartment 217 has an air inlet 213.
[0036] A vortex fan 207 is installed in the air supply compartment 215, and an axial fan 203 is installed in the ventilation compartment 217.
[0037] Outdoor air enters through the fresh air inlet 212 and undergoes full heat exchange through the cold air fins 206. The air that has completed heat exchange is then sent into the helmet's air supply cavity 101 through the air duct via the vortex fan 207, thereby completing the preparation and delivery of air.
[0038] The semiconductor cooling method involves heat exchange between external air and the cooling fins 206 on one side (inner side) of the semiconductor cooling chip 205, with the cooled air then being sent into the helmet. On the other side (outer side) of the semiconductor cooling chip 205, heat is dissipated through heat dissipation fins 204 and a fan to ensure the normal operating temperature of the hot end.
[0039] This device incorporates the design of the air supply chamber 215, with a control chamber 216 arranged inside. The control chamber 216 houses a controller 201, which, in conjunction with multiple sensors, enables temperature control of the cooling helmet. The sensors include an in-helmet sensor 210 located inside the helmet, an air supply sensor 211 located within the air supply cavity 101, and cold-end sensors 209 and hot-end sensors 208 located on either side of the semiconductor cooling chip 205. All sensors are connected to the controller 201.
[0040] The control compartment 216 is equipped with a control compartment cover to facilitate maintenance in case of controller 206 failure.
[0041] Furthermore, the heat dissipation fins 204 of the semiconductor cooling chip 205 can be flexibly arranged. The ventilation chamber 217 is provided with a heat dissipation vent 214 facing the rear of the helmet. The direction in which outdoor air enters the ventilation chamber 217 can be arranged in various ways, such as entering from the bottom air inlet 213 or from the periphery of the rear heat dissipation vent 214. After heat exchange by the heat dissipation fins 204, the air is blown out of the heat dissipation vent 214 by the axial flow fan 203, thus completing the heat dissipation of the hot end of the semiconductor cooling chip 205.
[0042] The power supply compartment 202 houses a power source, which can be a rechargeable lithium battery or a fully concealed battery with a charging interface on the outside for continuous external power supply during long-term helmet use. A cover is provided on the outside of the power supply compartment 202 for easy battery replacement; however, if the battery is fully concealed with a charging interface, the cover is not required.
[0043] In this embodiment, temperature and humidity data at the location are obtained by a sensor installed inside the helmet shell 1 and aggregated to the controller 2, which then executes programs such as controlling the air supply temperature and controlling the cooling power of the semiconductor refrigeration chip.
[0044] The cold air obtained after cooling by the thermoelectric cooler 205 is sent into the air supply cavity 101 by changing the airflow direction through the vortex fan 207, so as to meet the uniform air supply in the limited space of the helmet shell 1; at the hot end of the thermoelectric cooler 205, the heat exchange is carried out with the heat dissipation fins 204 through multiple natural air intakes arranged in different directions of the heat dissipation vents 214, so as to ensure that the thermoelectric cooler 205 can give full play to the heat exchange effect.
[0045] This solution can switch the positive and negative terminals of the power supply of the semiconductor cooling chip 205 to change the operating conditions of the cold and hot ends, thereby achieving interchangeable cooling and heating functions.
[0046] The helmet in this embodiment can be a half helmet, a 3 / 4 helmet, an off-road helmet, etc., and the technical solutions of these helmets can all be inspired by the design principles of this embodiment.
[0047] The above embodiments are illustrative of the present invention and not intended to limit the present invention. The described embodiments are merely some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present invention.
Claims
1. A uniformly supplied air temperature controllable cooling helmet, comprising a shell (1), characterized in that... The shell is a hollow double-layer structure, the hollow part forms an air supply cavity (101), and a number of air supply vents (102) are provided on the inner side wall of the air supply cavity; a cold and heat source temperature control module (2) is provided at the rear of the shell. The temperature control module includes an air supply chamber (215), a ventilation chamber (217), a control chamber (216), and a power supply chamber (202); a semiconductor cooling chip (205) is provided between the air supply chamber and the ventilation chamber, and the semiconductor cooling chip is provided with cold air fins (206) on the side facing the air supply chamber and heat dissipation fins (204) on the side facing the ventilation chamber. A vortex fan (207) is provided in the air supply chamber, and an axial fan (203) is provided in the ventilation chamber.
2. The uniformly supplied air temperature controllable cooling helmet according to claim 1, characterized in that, The inner side of the shell (1) is provided with a buffer pad layer (5) and an inner liner (6) in sequence. The buffer pad layer is provided with a first perforation (501) that matches the air outlet (102) on the shell. The inner liner is provided with a second perforation (601) that matches the air outlet and the first perforation.
3. The uniformly supplied air temperature controllable cooling helmet according to claim 1, characterized in that, The temperature control module (2) is connected to the air supply cavity (101) inside the housing (1) through the air supply duct.
4. A uniformly supplied air temperature controllable cooling helmet according to claim 1, characterized in that, The control cabin (216) is equipped with a controller (201), and a cold end sensor (209) and a hot end sensor (208) connected to the controller are respectively provided on both sides of the semiconductor cooling chip (205).
5. A uniformly supplied air temperature controllable cooling helmet according to claim 4, characterized in that, An in-helmet sensor (210) is provided inside the helmet, and an air supply sensor (211) is provided inside the air supply cavity (101). The in-helmet sensor and the air supply sensor are connected to the controller (201).
6. A uniformly supplied air temperature controllable cooling helmet according to claim 1, 2, 3, 4, or 5, characterized in that, The air supply compartment (215), ventilation compartment (217), control compartment (216) and power supply compartment (202) in the temperature control module (2) are separated from each other. The bottom of the air supply compartment is provided with a fresh air vent (212), and the bottom of the ventilation compartment is provided with an air inlet (213).
7. A uniformly supplied air temperature controllable cooling helmet according to claim 6, characterized in that, The ventilation chamber (217) has a heat dissipation vent (214) directly behind the helmet, and air inlets are provided around the heat dissipation vent.
8. A uniformly supplied air temperature controllable cooling helmet according to claim 1, characterized in that, A heat insulation plate is provided between the air supply chamber (215) and the ventilation chamber (217).
9. A uniformly supplied air temperature controllable cooling helmet according to claim 1, characterized in that, The helmet has a goggle (3) that fits into the shell (1) at the front end, and a breathing hole (4) is provided below the goggle on the shell part corresponding to the mouth and nose.
Citation Information
Patent Citations
Refrigeration helmet
CN103120434A
Refrigerating helmet
CN105559229A
Helmet with refrigeration function
CN114190641A
Refrigeration helmet
CN210043266U