Single-fan semiconductor refrigeration helmet

Abstract

The utility model discloses a single-fan semiconductor refrigeration helmet which is characterized in that the single-fan semiconductor refrigeration helmet comprises a shell of a hollow double-layer structure, an air supply cavity is formed by a hollow part, and an air supply opening is formed in the inner side wall of the air supply cavity; a temperature control module is arranged at the rear part of the shell; the temperature control module comprises a cabin body, and the cabin body is divided into a heat exchange area, a control cabin and a power supply cabin; the heat exchange area is provided with an air inlet, and an axial flow fan is arranged on the inner side of the air inlet. The heat exchange area is divided into an air supply duct and a heat dissipation duct by a semiconductor chilling plate; the axial flow fan supplies air to the two channels at the same time; cold air fins are arranged on the side, facing the air supply duct, of the semiconductor chilling plate, and heat dissipation fins are arranged on the side, facing the heat dissipation duct, of the semiconductor chilling plate. Air supply is uniform, the temperature of each point in the internal space of the helmet is effectively controlled and adjusted, and a good refrigeration effect meeting the requirements of a user is achieved; and no condensate water precipitation phenomenon exists, the human body feels comfortable, and the application range is wide.

Description

Technical Field

[0001] This utility model relates to helmet technology, and in particular to a single-fan semiconductor cooling helmet. Background Technology

[0002] Helmets are widely used as essential protective gear in everyday life, such as when riding motorcycles, electric bikes, and bicycles, as well as in workplaces like factories and construction sites. However, in summer or during strenuous physical activity, helmets can hinder heat dissipation from the head. Since the head is a concentrated area for heat dissipation, this can lead to feelings of heat and stuffiness. Consequently, some people are unwilling to wear helmets due to their lack of comfort, thus creating safety hazards.

[0003] There are two main types of cooling helmets disclosed in the technology. One type, as disclosed in patent publication number CN103120434A, consists of a helmet body, a flexible tube, a cooling device, and an inner liner. The helmet body and inner liner are molded into a helmet shape, and the seams between the helmet body and the inner liner are pressed together. A coiled flexible tube is adhered to the inner liner, and an inlet and an outlet are fixed to the flexible tube, which is filled with circulating fluid. The inlet is connected to the inlet of the control system on the cooling device, and the outlet is connected to the outlet of the control system on the cooling device. This technology uses liquid cooling for cooling. However, using liquid cooling in helmets has obvious problems, such as the complexity of handling the liquid cooling pipes in the confined space of the helmet, the risk of leakage in the liquid cooling pipes, and the large amount of condensate that cannot be drained from the surface of the liquid cooling pipes. Secondly, a helmet with a cooling function, such as the one described in patent publication number CN114190641A, includes a helmet body, a partition disposed inside the helmet body to form a cavity with the inner wall of the helmet body, an air inlet and an air outlet penetrating the cavity on the helmet body, a fan disposed at the air outlet of the helmet body to draw air into the cavity, so that an airflow from the air inlet to the air outlet is formed in the cavity, a semiconductor cooling chip disposed on the partition with the heat-absorbing end of the semiconductor cooling chip facing inward and the heat-dissipating end of the semiconductor cooling chip facing the cavity, and a control module, etc. Although this technology uses semiconductor cooling, the application of semiconductor cooling only uses cold-end radiation cooling, resulting in the cooling effect not being completely uniformly distributed, leading to uneven temperature distribution inside the helmet. At the same time, the cold end of the semiconductor cooling chip being directly disposed inside the helmet also has the problem of condensation precipitation that cannot be discharged.

[0004] In addition, there are generally two methods for cooling: radiative heat transfer and convective heat transfer. The cooling method used in the aforementioned comparative documents is usually radiative heat transfer. However, for a small space like a helmet, and considering the issue of condensation, the temperature difference needs to be strictly controlled. Therefore, a more reasonable cooling method is needed to achieve the cooling function inside the helmet. Summary of the Invention

[0005] The purpose of this invention is to solve the above-mentioned problems and provide a single-fan semiconductor cooling helmet. It cools fresh air through a semiconductor cooling device and, through the helmet's unique structure, ensures that the cooled fresh air is evenly delivered into the helmet, avoiding condensation. It also effectively combines the helmet with the cooling device, and features simple structure, convenient installation, and temperature adjustment as needed.

[0006] The above-mentioned technical problems of this utility model are mainly solved by the following technical solution: a single-fan semiconductor cooling helmet, characterized by including a hollow double-layer shell, the hollow part forming an air supply cavity, and an air supply vent on the inner side wall of the air supply cavity; a temperature control module is provided at the rear of the shell; the temperature control module includes a chamber, which is divided into a heat exchange area, a control chamber and a power supply chamber.

[0007] The heat exchange zone is provided with an air inlet, and an axial flow fan is provided inside the air inlet; the heat exchange zone is divided into two channels by a semiconductor cooling chip: one is an air supply duct leading to the air supply cavity, and the other is a heat dissipation duct exhausting air to the outside of the casing; the axial flow fan supplies air to the two channels simultaneously.

[0008] The semiconductor cooling chip has cooling fins on the side facing the air supply duct and cooling fins on the side facing the heat dissipation duct.

[0009] In the aforementioned single-fan semiconductor cooling helmet, preferably, the air inlet is located at the lower part of the cabin, and an air duct partition is provided between the axial fan and the semiconductor cooling chip.

[0010] In the aforementioned single-fan semiconductor cooling helmet, preferably, the air duct partition completely isolates the air supply duct from the heat dissipation duct, and the air duct partition extends from the outlet of the axial fan to the top of the temperature control module.

[0011] In the aforementioned single-fan semiconductor cooling helmet, preferably, the cooling fins and air supply ducts are arranged on the side of the cabin facing the inner side of the shell, and the heat dissipation fins and heat dissipation ducts are arranged on the side of the cabin facing the outer side of the shell; the control cabin and power supply cabin are located on the side of the heat dissipation ducts.

[0012] In the aforementioned single-fan semiconductor cooling helmet, preferably, the cooling air fins are provided with an integral airflow guide protrusion between them and the cabin wall.

[0013] In the aforementioned single-fan semiconductor cooling helmet, preferably, a buffer pad layer and an inner liner are sequentially provided on the inner side of the shell, wherein the buffer pad layer has a first perforation that matches the air outlet on the shell, and the inner liner has a second perforation that corresponds to the air outlet and the first perforation.

[0014] In the aforementioned single-fan semiconductor cooling helmet, preferably, a cold end sensor and a hot end sensor are respectively provided on both sides of the semiconductor cooling chip, and the cold end sensor and the hot end sensor are connected to a controller installed in the control cabin.

[0015] In the aforementioned single-fan semiconductor cooling helmet, preferably, an in-helmet sensor is provided inside the helmet, and an air supply sensor is provided in the air supply cavity. The in-helmet sensor and the air supply sensor are connected to a controller located in the control cabin.

[0016] In the aforementioned single-fan semiconductor cooling helmet, preferably, the temperature control module's cabin and shell are either an integrated structure or separate structures.

[0017] This technical solution employs semiconductor cooling. The airflow inside the helmet utilizes a special helmet shell structure with an airflow cavity containing multiple air vents to ensure uniform airflow within the helmet. Air convection at the hot and cold ends of the semiconductor cooling system is powered simultaneously by the same axial fan, flowing through two channels (air supply duct and heat dissipation duct) separated by the semiconductor cooling chip. Specifically, external air is drawn in through the air inlet, passes through the axial fan, and then enters the air supply duct and heat dissipation duct respectively, with the two channels completely isolated.

[0018] The air inside the air supply duct exchanges heat with the cooling fins inside the thermoelectric cooler, lowering the air temperature before it is delivered into the air supply cavity and then into the helmet. On the other side of the thermoelectric cooler, the heat from the heat dissipation fins is dissipated to the outside by convection cooling of the air entering the heat dissipation duct, thus ensuring that the operating temperature of the hot end meets the usage requirements.

[0019] To ensure the helmet's cooling effect and the effective operation of the semiconductor cooling system, this device is equipped with multiple sensors, all of which have temperature and humidity monitoring and data transmission capabilities. All data is fed into the controller. Specifically, the sensors inside the helmet are designed to ensure effective cooling, monitor the dew point temperature to prevent condensation, and provide feedback to control the airflow temperature and the cooling power of the semiconductor cooling chip. The airflow sensor monitors the airflow temperature and humidity to prevent condensation. The cold-end and hot-end sensors primarily monitor the temperature at both ends of the semiconductor cooling chip to prevent damage caused by overcooling or overheating.

[0020] In addition, this solution is mainly designed for summer operation, but also has corresponding operating logic for winter operation. In this case, the positive and negative terminals of the power supply of the semiconductor cooling chip are switched, with the cold end in heating mode and the hot end in cooling mode. Combined with the operation of the fan and sensors, the heating effect inside the helmet can be achieved.

[0021] Compared with the prior art, the advantages of this utility model are: it uses the principle of semiconductor cooling to process the air supply, and the special structure of the helmet makes the air supply uniform; it effectively controls and adjusts the temperature of each point inside the helmet to achieve a good cooling effect that meets the user's requirements; and there is no condensation phenomenon, making the human body feel comfortable and with a wide range of applications. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the external structure of a cooling helmet according to this utility model.

[0023] Figure 2 This is a schematic diagram of the overall cross-sectional structure of this utility model.

[0024] Figure 3 yes Figure 2 A magnified schematic diagram of the structure at point M in the middle.

[0025] Figure 4 This is a schematic diagram of a refrigeration principle of this utility model.

[0026] Figure 5 This is a schematic diagram of a temperature control module structure according to the present invention.

[0027] In the diagram: 1-Shell, 101-Air supply cavity, 102-Air supply vent, 2-Temperature control module, 201-Carrier body, 202-Air duct partition, 203-Axial flow fan, 204-Air inlet, 205-Control compartment, 206-Power supply compartment, 207-Heat dissipation fins, 208-Heat dissipation vent, 209-Heat dissipation duct, 210-Air supply duct, 211-Cold air fins, 212-Semiconductor cooling chip, 213-Guide protrusion, 214-Power supply, 215-Cold end sensor, 216-Air supply sensor, 217-Helmet interior sensor, 218-Hot end sensor, 219-Controller, 3-Buffer pad, 301-First cutout, 4-Inner liner, 401-Second cutout. Detailed Implementation

[0028] The technical solution of this utility model will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0029] This embodiment describes a single-fan semiconductor cooling helmet, such as... Figure 1 As shown, the shell 1 has a hollow double-layer structure, with the hollow part forming an air supply cavity 101. Air supply vents 102 are evenly arranged on the inner wall of the air supply cavity 101. A temperature control module 2 is provided at the rear of the shell 1.

[0030] Inside the shell 1, a buffer pad layer 3 and an inner liner pad 4 are added in sequence, such as Figure 2 , Figure 3As shown, the buffer layer 3 is made of EPS or similar materials, which can be compressed and deformed to absorb impact force when the helmet is impacted, reducing the impact on the head. EPS and similar materials are lightweight molded materials that are easy to process. To meet the air supply requirements, the buffer layer 3 has a first perforation 301 corresponding to the air supply vent 102 of the air supply cavity 101. The inner liner 4 is designed for wearing comfort and can be made of materials such as velvet. The inner liner 4 has a second perforation 401, the range of which can be more flexible, but the main principle is not to obstruct air supply. The combination of the perforations in the buffer layer 3 and the inner liner 4 in the helmet shell 1 ensures the uniformity of air supply in the overall structure.

[0031] Temperature control module 2 includes a housing 201, which is divided into a heat exchange area, a control compartment 205, and a power supply compartment 206. The heat source for temperature control module 2 is a semiconductor cooling chip 212. (See attached image) Figure 4 , Figure 5 The number of semiconductor cooling chips 212 can be set according to actual needs, such as 1 chip, 2 chips, etc.

[0032] The heat exchange zone is equipped with an air inlet 204, which is located at the lower part of the housing 201. An axial flow fan 203 is installed inside the air inlet 204. The heat exchange zone is divided into two channels by a semiconductor cooling chip 212 and corresponding internal stiffening plates of the housing 201: an air supply duct 210 leading to the air supply cavity 101, and a heat dissipation duct 209 exhausting air to the outside of the housing 1. The axial flow fan 203 supplies air to both channels simultaneously.

[0033] A cooling fin 211 is provided on the side of the semiconductor cooling chip 212 facing the air supply duct 210, and a heat dissipation fin 207 is provided on the side facing the heat dissipation duct 209. The cooling fin 211 and the air supply duct 210 are arranged on the side of the cabin 201 facing the inside of the shell 1, and the heat dissipation fin 207 and the heat dissipation duct 209 are arranged on the side of the cabin 201 facing the outside of the shell 1. The control compartment 205 and the power supply compartment 206 are located on the side of the heat dissipation duct 209, and their arrangement should not affect the exhaust.

[0034] The control compartment 205 houses a controller 219, which, in conjunction with multiple sensors, enables temperature control of the cooling helmet. A cover is provided on the outside of the control compartment 205 to facilitate maintenance in case of controller 219 malfunction. The power compartment 206 houses a power supply 214, which can be a rechargeable lithium battery or a concealed battery assembly. Preferably, a charging interface is provided on the outside for continuous external power supply during extended helmet use. A cover is provided on the outside of the power compartment 206 for battery replacement; however, if the battery is concealed with a pre-installed charging interface, the cover is not required.

[0035] An air duct partition 202, completely isolating the supply air duct and the heat dissipation air duct, is provided between the axial flow fan 203 and the thermoelectric cooling chip 212. The air duct partition 202 must meet aerodynamic requirements and can be a flat plate or a curved plate, etc. The air duct partition 202 should extend from the outlet of the axial flow fan 203 to the top of the temperature control module. The material of the air duct partition 202 should be reinforced with heat insulation material to prevent heat loss through heat exchange.

[0036] Both the cooling fins 211 and the heat dissipation fins 207 are arranged vertically in the direction of airflow. External air enters through the air inlet 204, is powered by the axial flow fan 203, and is then separated by the air duct partition 202. The airflow passes through the supply air duct 210 and the heat dissipation air duct 209 respectively.

[0037] According to the principles of this scheme, the cooling fins 211 are provided with an integrated airflow protrusion 213 between them and the wall of the cabin 201, including other aerodynamically designed air ducts based on the actual structure of the shell 1. This ensures that all air entering the air supply duct 210 undergoes sufficient heat exchange via the cooling fins 211, and the heat-exchanged air is then finally delivered into the helmet via the air supply cavity 101, thus completing the preparation and delivery of airflow. Simultaneously, the airflow entering the heat dissipation duct 209 carries away heat after heat exchange via the heat dissipation fins 207, and is blown out through the heat dissipation vent 208, completing the heat dissipation of the hot end of the semiconductor cooling chip 212.

[0038] Sensor placement and application:

[0039] A cold-end sensor 215 and a hot-end sensor 218 are respectively installed on both sides of the semiconductor cooling chip 212. An in-helmet sensor 217 is installed inside the helmet, and an air supply sensor 216 is installed in the air supply cavity 101. All sensors are connected to a controller 219 installed in the control cabin 205.

[0040] In addition, the cabin 201 of the temperature control module 2 and the shell 1 can be designed as a single unit or as separate units, such as a module that is installed in conjunction with the shell 1.

[0041] The above embodiments are illustrative of the present invention and not intended to limit it. The described embodiments are merely some, not all, of the present invention. For example, the helmet can be a half helmet, a 3 / 4 helmet, an off-road helmet, etc. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

Claims

1. A single-fan semiconductor cooling helmet, characterized in that: The shell (1) includes a hollow double-layer structure, with the hollow part forming an air supply cavity (101), and an air supply vent (102) provided on the inner side wall of the air supply cavity; a temperature control module (2) is provided at the rear of the shell; the temperature control module includes a cabin (201), which is divided into a heat exchange area, a control cabin (205) and a power supply cabin (206). The heat exchange zone is provided with an air inlet (204), and an axial flow fan (203) is provided inside the air inlet; the heat exchange zone is divided into two channels by a semiconductor cooling chip (212): one is an air supply duct (210) leading to the air supply cavity, and the other is a heat dissipation duct (209) exhausting air to the outside of the housing; the axial flow fan supplies air to the two channels simultaneously; The semiconductor cooling chip has a cooling fin (211) on the side facing the air supply duct and a heat dissipation fin (207) on the side facing the heat dissipation duct.

2. The single-fan semiconductor cooling helmet according to claim 1, characterized in that, The air inlet (204) is located at the lower part of the cabin (201), and a duct partition plate (202) is provided between the axial flow fan (203) and the semiconductor cooling chip (212).

3. A single-fan semiconductor cooling helmet according to claim 2, characterized in that, The air duct partition (202) completely isolates the air supply duct from the heat dissipation duct, and the air duct partition extends from the outlet of the axial flow fan (203) to the top of the temperature control module (2).

4. A single-fan semiconductor cooling helmet according to claim 1 or 2, characterized in that, The cooling fins (211) and the air supply duct are arranged on the inner side of the cabin (201), and the heat dissipation fins (207) and the heat dissipation duct (209) are arranged on the outer side of the cabin; the control cabin (205) and the power supply cabin (206) are located on the side of the heat dissipation duct.

5. A single-fan semiconductor cooling helmet according to claim 1, characterized in that, The cooling air fins (211) are provided with a flow guide protrusion (213) that is integral with the cabin wall (201).

6. A single-fan semiconductor cooling helmet according to claim 1, characterized in that, The inner side of the shell (1) is provided with a buffer pad layer (3) and an inner liner (4) in sequence. The buffer pad layer is provided with a first hollow (301) that matches the air outlet (102) on the shell. The inner liner is provided with a second hollow (401) that corresponds to the air outlet and the first hollow.

7. A single-fan semiconductor cooling helmet according to claim 1, characterized in that, The semiconductor cooling chip (212) is provided with a cold end sensor (215) and a hot end sensor (218) on both sides respectively. The cold end sensor and the hot end sensor are connected to the controller (219) located in the control cabin (205).

8. A single-fan semiconductor cooling helmet according to claim 7, characterized in that, An in-helmet sensor (217) is provided inside the helmet, and an air supply sensor (216) is provided in the air supply cavity (101). The in-helmet sensor and the air supply sensor are connected to a controller (219) located in the control cabin (205).

9. A single-fan semiconductor cooling helmet according to claim 1 or 2, characterized in that, The temperature control module's cabin (201) and shell (1) are either a single unit or separate units.

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