Cleaning equipment for semiconductor coating production

Abstract

The utility model discloses cleaning equipment for semiconductor coating production, which comprises an equipment base and a cleaning box, the cleaning box is mounted on the upper wall surface of the equipment base, and multifunctional high-pressure coating cleaning structures are mounted on the equipment base and the cleaning box; the multifunctional high-pressure coating cleaning structure comprises a cleaning cavity, a supporting seat, a drainage fixing table, a pair of fixing clamps, a rotating seat, a rotating pipe, a pair of spraying pipes, a first bevel gear, a driving motor, a second bevel gear, a water storage tank, a pressurizing conveying pump, a water conveying pipe, a pair of high-pressure air injection assemblies, a water collecting tank and a pair of closed tank doors. The utility model relates to the technical field of semiconductor production equipment, and has the beneficial effects that the problems that the quality of a semiconductor is influenced and the surface of the semiconductor is damaged due to the fact that residues are generated and various pollutants including organic matters, inorganic matters, metal ions, particulate matters and the like are attached to the surface of the existing semiconductor after coating processing is completed are solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, specifically a cleaning device for semiconductor coating production. Background Technology

[0002] Semiconductors are materials with conductivity between that of conductors and insulators, and they are widely used in electronic devices such as diodes, transistors, and integrated circuits. These devices are core components of modern electronic devices. In addition, semiconductors play an important role in fields such as solar cells, optoelectronic devices, and sensors. However, after the coating process, semiconductors often have residues, and various contaminants, including organic matter, inorganic matter, metal ions, and particulate matter, adhere to their surfaces, affecting the quality of the semiconductor and causing damage to its surface. Utility Model Content

[0003] To achieve the above objectives, this utility model is implemented through the following technical solution: a cleaning device for semiconductor coating production, comprising: a device base and a cleaning tank, the cleaning tank being installed on the upper wall of the device base, and a multi-functional high-pressure coating cleaning structure being installed on the device base and the cleaning tank;

[0004] The multi-functional high-pressure coating cleaning structure includes: a cleaning chamber, a support base, a drainage fixing platform, a pair of fixing clamps, a rotating base, a rotating pipe, a pair of spray pipes, a first bevel gear, a drive motor, a second bevel gear, a water storage tank, a booster pump, a water delivery pipe, a pair of high-pressure jet components, a water collection tank, and a pair of closed doors.

[0005] The cleaning chamber is located inside the cleaning tank. A support base is installed in the middle of the lower wall of the cleaning chamber. A drainage fixing platform is installed on the support base. A pair of fixing clamps are installed on the upper wall of the drainage fixing platform. A rotating seat is embedded in the middle of the upper wall of the cleaning tank. A rotating pipe is embedded in the rotating seat. A pair of spray pipes are installed at the lower end of the rotating pipe. A first bevel gear is fitted on the rotating pipe. A drive motor is installed on the upper wall of the cleaning tank. A second bevel gear is installed on the output end of the drive motor. The first bevel gear and the second bevel gear mesh. A water storage tank is installed at the rear of the cleaning tank. A booster pump is installed on the water storage tank. The two ends of the water supply pipe are connected to the booster pump and the upper end of the rotating pipe, respectively. A pair of high-pressure jet components are installed on the side walls of the cleaning tank. A water collection tank is installed on the lower wall of the equipment base. A pair of closed doors are movably installed at the opening position on the front wall of the cleaning tank.

[0006] Preferably, a drainage groove is provided on the drainage fixing platform.

[0007] Preferably, the drive motor is mounted on the cleaning tank by fixing bolts.

[0008] Preferably, the water supply pipe is connected to the rotating pipe via a rotary joint.

[0009] Preferably, a drain hole is provided on the lower wall of the cleaning tank.

[0010] Preferably, each pair of high-pressure jet assemblies includes: an air inlet box, a high-pressure air inlet fan, a pair of support frames, an air inlet pipe, and several nozzles;

[0011] The air intake box is installed on the side wall of the cleaning chamber, the high-pressure air intake fan is installed inside the air intake box, a pair of support frames are installed on the inner wall of the cleaning chamber, the air intake pipe is installed on the pair of support frames, the air intake pipe is connected to the high-pressure air intake fan, and several nozzles are installed on the air intake pipe.

[0012] Beneficial effects

[0013] This utility model provides a cleaning equipment for semiconductor coating production, which has the following beneficial effects: This solution uses a multi-functional high-pressure coating cleaning structure, which can clean the semiconductor surface through a rotating spray structure to remove surface residues. At the same time, it is combined with a high-pressure jet structure to remove residual water stains on the surface, ensuring the cleanliness of the semiconductor. This solves the problem that after the semiconductor coating process is completed, there will be residues on the surface, and various contaminants, including organic matter, inorganic matter, metal ions, particulate matter, etc., will adhere to the surface, affecting the quality of the semiconductor and causing damage to the semiconductor surface. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the main cross-sectional structure of a cleaning device for semiconductor coating production according to the present invention.

[0015] Figure 2 This is a front view structural diagram of a cleaning equipment for semiconductor coating production according to the present invention.

[0016] Figure 3 This is a rear view structural diagram of a cleaning device for semiconductor coating production according to the present invention.

[0017] Figure 4 This is a three-dimensional structural diagram of the drainage fixing platform of a cleaning equipment for semiconductor coating production according to the present invention.

[0018] Figure 5 This is a top view of the drainage fixing platform of a cleaning equipment for semiconductor coating production according to the present invention.

[0019] In the diagram: 1-Equipment base; 2-Cleaning tank; 3-Cleaning chamber; 4-Support base; 5-Drainage fixing platform; 6-Fixing clamp; 7-Rotating seat; 8-Rotating pipe; 9-Spray pipe; 10-First bevel gear; 11-Drive motor; 12-Second bevel gear; 13-Water storage tank; 14-Booster pump; 15-Water supply pipe; 16-Water collection tank; 17-Sealed door; 18-Drainage trough; 19-Fixing bolt; 20-Rotary joint; 21-Drainage hole; 22-Air inlet box; 23-High-pressure air inlet fan; 24-Support frame; 25-Air inlet pipe; 26-Sprayer head. Detailed Implementation

[0020] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0021] Example: Please refer to Figure 1-5 This utility model provides a technical solution: a cleaning device for semiconductor coating production. This solution takes into account that a large number of impurities remain on the surface of existing semiconductors during coating production. Impurities adhering to the semiconductor surface will affect the surface flatness of the coating, affect the coating effect, and damage the semiconductor, affecting the quality of the semiconductor. Based on the above, this invention sets up the following technical means.

[0022] Specifically, this device includes at least an equipment base 1, a cleaning tank 2, a cleaning chamber 3, a support base 4, a drainage fixing platform 5, a pair of fixing clamps 6, a rotating base 7, a rotating pipe 8, a pair of spray pipes 9, a first bevel gear 10, a drive motor 11, a second bevel gear 12, a water storage tank 13, a booster pump 14, a water delivery pipe 15, a pair of high-pressure jet components, and a water collection tank 16.

[0023] Each pair of high-pressure jet assemblies includes: an air inlet box 22, a high-pressure air inlet fan 23, a pair of support frames 24, an air inlet pipe 25, and several nozzles 26;

[0024] The equipment base 1 provides overall support for the equipment. Before coating, the semiconductor is placed on the drainage fixing platform 5 and clamped and fixed by the fixing clamp 6. Then, the sealing door 17 is closed, and the equipment is started by the controller that matches the equipment. The drive motor 11 starts and drives the second bevel gear 12 installed on its output end to rotate. The first bevel gear 10 meshing with it drives the rotating tube 8 to rotate on the rotating seat 7. The rotating tube 8 drives the spray pipe 9 installed at its lower end to rotate around the semiconductor. When the spray pipe 9 rotates, the booster pump 14 starts and pumps cleaning water from the... Water is drawn from the storage tank 13 and supplied through the water pipe 15, and sprayed out through the spray pipe 9 to perform high-pressure rinsing on the semiconductor. The rinsing wastewater is transported to the water collection tank 16 for collection and recycling through the drainage trough 18 on the drainage fixing platform 5 and the drainage hole 21 on the cleaning tank 2. After cleaning, the high-pressure air intake fan 23 installed in the air intake box 22 is started to draw air from the outside and then transport it through the air intake pipe 25 installed on the support frame 24. Finally, the high-pressure airflow is sprayed out through the downward-sloping nozzle 26 to dry the water stains remaining on the semiconductor surface and ensure that the semiconductor surface is clean.

[0025] More specifically, the cleaning chamber 3 is located inside the cleaning tank 2. The support base 4 is installed in the middle of the lower wall of the cleaning chamber 3. The drainage fixing platform 5 is installed on the support base 4. A pair of fixing clamps 6 are installed on the upper wall of the drainage fixing platform 5. The rotating base 7 is embedded in the middle of the upper wall of the cleaning tank 2. The rotating pipe 8 is embedded in the rotating base 7. A pair of spray pipes 9 are installed at the lower end of the rotating pipe 8. The first bevel gear 10 is fitted on the rotating pipe 8. The drive motor 11 is installed on the upper wall of the cleaning tank 2. The second bevel gear 12 is installed on the output end of the drive motor 11. The first bevel gear 10 and the second bevel gear 12 mesh with each other. The water storage tank 13 is installed at the rear of the cleaning tank 2. The booster pump 14 is installed on the water storage tank 13. The two ends of the water pipe 15 are respectively connected to the booster pump 14 and the upper end of the rotating pipe 8. A pair of high-pressure jet components are installed on the two side walls of the cleaning tank 2. The water collection tank 16 is installed on the lower wall of the equipment base 1. A pair of closed doors 17 are movably installed at the opening position of the front wall of the cleaning tank 2.

[0026] An air inlet box 22 is installed on the side wall of the cleaning box 2, a high-pressure air intake fan 23 is installed inside the air inlet box 22, a pair of support frames 24 are installed on the inner wall of the cleaning chamber 3, an air inlet pipe 25 is installed on the pair of support frames 24, the air inlet pipe 25 is connected to the high-pressure air intake fan 23, and several nozzles 26 are installed on the air inlet pipe 25.

[0027] In the specific implementation process, a drainage trough 18 is further provided on the drainage fixing platform 5.

[0028] In the specific implementation process, the drive motor 11 is further mounted on the cleaning box 2 by fixing bolts 19.

[0029] In the specific implementation process, the water supply pipe 15 is further connected to the rotating pipe 8 through the rotating joint 20.

[0030] In the specific implementation process, furthermore, a drain hole 21 is provided on the lower wall of the cleaning tank 2.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cleaning device for semiconductor coating production, comprising: The equipment base (1) and the cleaning tank (2) are characterized in that the cleaning tank (2) is installed on the upper wall of the equipment base (1), and a multi-functional high-pressure coating cleaning structure is installed on the equipment base (1) and the cleaning tank (2); The multi-functional high-pressure coating cleaning structure includes: a cleaning chamber (3), a support base (4), a drainage fixing platform (5), a pair of fixing clamps (6), a rotating base (7), a rotating pipe (8), a pair of spray pipes (9), a first bevel gear (10), a drive motor (11), a second bevel gear (12), a water storage tank (13), a booster pump (14), a water delivery pipe (15), a pair of high-pressure jet components, a water collection tank (16), and a pair of closed doors (17). The cleaning chamber (3) is located inside the cleaning tank (2). The support base (4) is installed in the middle of the lower wall of the cleaning chamber (3). The drainage fixing platform (5) is installed on the support base (4). A pair of fixing clamps (6) are installed on the upper wall of the drainage fixing platform (5). The rotating seat (7) is embedded in the middle of the upper wall of the cleaning tank (2). The rotating pipe (8) is embedded in the rotating seat (7). A pair of spray pipes (9) are installed at the lower end of the rotating pipe (8). The first bevel gear (10) is fitted on the rotating pipe (8). The drive motor (11) is installed on the upper wall of the cleaning tank (2). The second bevel gear... (12) Installed on the output end of the drive motor (11), the first bevel gear (10) meshes with the second bevel gear (12), the water storage tank (13) is installed at the rear of the cleaning tank (2), the booster pump (14) is installed on the water storage tank (13), the two ends of the water pipe (15) are respectively connected to the booster pump (14) and the upper end of the rotating pipe (8), a pair of high-pressure jet components are installed on the two side walls of the cleaning tank (2), the water collection tank (16) is installed on the lower wall of the equipment base (1), and a pair of closed doors (17) are movably installed at the opening position of the front wall of the cleaning tank (2).

2. The cleaning equipment for semiconductor coating production according to claim 1, characterized in that, A drainage trough (18) is provided on the drainage fixing platform (5).

3. The cleaning equipment for semiconductor coating production according to claim 1, characterized in that, The drive motor (11) is mounted on the cleaning tank (2) by fixing bolts (19).

4. The cleaning equipment for semiconductor coating production according to claim 1, characterized in that, The water supply pipe (15) is connected to the rotating pipe (8) via a rotary joint (20).

5. The cleaning equipment for semiconductor coating production according to claim 1, characterized in that, A drain hole (21) is provided on the lower wall of the cleaning tank (2).

6. The cleaning equipment for semiconductor coating production according to claim 1, characterized in that, Each pair of high-pressure jet assemblies includes: an air inlet box (22), a high-pressure air inlet fan (23), a pair of support frames (24), an air inlet pipe (25), and several nozzles (26); An air inlet box (22) is installed on the side wall of the cleaning box (2), a high-pressure air inlet fan (23) is installed inside the air inlet box (22), a pair of support frames (24) are installed on the inner wall of the cleaning chamber (3), an air inlet pipe (25) is installed on a pair of support frames (24), the air inlet pipe (25) is connected to the high-pressure air inlet fan (23), and several nozzles (26) are installed on the air inlet pipe (25).

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