Laser processing equipment
By setting and moving the components of the laser processing equipment along a specific direction, the problem of excessive space occupied by laser devices is solved, and the equipment is miniaturized and compacted.
Patent Information
- Application Number
- CN202422250931.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-09-12
AI Technical Summary
In existing laser processing equipment, the complex laser device occupies too much space in the first gantry, which makes it impossible to install the material transfer component or makes the equipment too large, which is not conducive to the miniaturization of the equipment.
The first gantry and the processing fixture are set on the base along the first direction. The laser processing device is set on the first gantry. The material box carrying device is set at the end of the processing fixture away from the first gantry. The material transfer device is set on the machine base through the second gantry. The material transfer displacement component moves along the first and second directions to realize the transfer of the workpiece and avoid the material transfer component occupying the space of the first gantry.
This results in a compact structure and small size for laser processing equipment, which can effectively utilize the space of the processing fixture on the machine base and reduce the space occupied by the equipment.
Smart Images
Figure CN223492309U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of laser processing technology, and more specifically, relates to a laser processing device. Background Technology
[0002] Laser processing utilizes the energy of light, which is focused by a lens to achieve a very high energy density at the focal point, and then processes the material through a photothermal effect. Laser processing requires no tools, has a high processing speed, and produces minimal surface deformation; therefore, it is widely used in the processing of materials such as sapphire glass.
[0003] Laser processing equipment includes a transfer assembly for loading and unloading workpieces. For ease of installation, this assembly is typically mounted on the same first gantry as the laser device, with the material box positioned on the side of the first gantry or processing fixture. However, when the laser device has a complex structure, it requires significant space on the first gantry, making it inconvenient to install the transfer assembly. Alternatively, installing the transfer assembly may excessively occupy the equipment's lateral space, resulting in an overly large device that hinders miniaturization. Utility Model Content
[0004] This application provides a laser processing device with a small size.
[0005] The technical solution adopted in this application is a laser processing equipment, including:
[0006] Base;
[0007] A first gantry frame and a processing fixture are disposed on the base and arranged along a first direction, and the processing fixture is at least movable relative to the base along the first direction;
[0008] A laser processing device, mounted on the first gantry, is used to process the workpiece on the processing fixture;
[0009] A material box carrying device is disposed at one end of the processing fixture away from the first gantry frame. The material box carrying device is provided with a loading station and a unloading station along the second direction. The loading station is used to carry the material box containing the workpiece to be processed, and the unloading station is used to carry the material box containing the processed workpiece.
[0010] The material transfer device includes a second gantry frame, a material transfer and displacement component, and a material pick-up component. The second gantry frame is mounted on the machine base, and the material transfer and displacement component is mounted on the second gantry frame. The material transfer and displacement component is drivenly connected to the material pick-up component so that the material pick-up component can move along a first direction and a second direction to transfer the workpiece from the loading station to the processing fixture, and to transfer the workpiece on the processing fixture to the unloading station. The first direction and the second direction are perpendicular to each other.
[0011] The laser processing equipment provided in this application has a first gantry and a processing fixture respectively mounted on a base and arranged along a first direction. The processing fixture is movable at least along the first direction. The laser processing device is mounted on the first gantry, and the material box carrying device is located at the end of the processing fixture away from the first gantry. The material transfer component in the material transfer device is mounted on the machine base through a second gantry. The material transfer component drives the material picking component to move along the first and second directions, thereby transferring the workpiece from the loading station to the processing fixture and transferring the workpiece on the processing fixture to the unloading station. This method eliminates the need for the material transfer component to be mounted on the first gantry and allows the material picking component to utilize some of the space occupied by the processing fixture on the machine base, making the structure of the laser processing equipment more compact and smaller in size.
[0012] Optionally, the second gantry is disposed on one side of the processing fixture, and the second gantry extends along the first direction;
[0013] The material transfer and displacement assembly includes a first material transfer and displacement drive and a second material transfer and displacement drive. The first material transfer and displacement drive is disposed on the second gantry frame. The drive end of the first material transfer and displacement drive is provided with a first material transfer mounting member extending along a second direction. The second material transfer and displacement drive is disposed on the first material transfer mounting member. The second material transfer and displacement drive is drivenly connected to the material picking assembly. The first material transfer and displacement drive drives the first material transfer mounting member to move along a first direction, and the second material transfer and displacement drive drives the material picking assembly to move along a second direction.
[0014] Optionally, the material handling assembly includes:
[0015] The third material transfer displacement drive is disposed on the second material transfer displacement drive;
[0016] An adsorption element is disposed on the third material transfer displacement drive element, and the adsorption element is driven by the third material transfer displacement drive element to move along a third direction, which is perpendicular to the first direction and the second direction respectively.
[0017] Optionally, the material handling assembly further includes a flipping drive, which is disposed on the third material transfer drive, and the adsorption element is disposed on the flipping drive. The flipping drive drives the adsorption element to flip so that the adsorption element can adsorb the workpiece at different angles.
[0018] Optionally, the processing fixture is provided in multiple sets, and the multiple sets of processing fixtures are arranged along the second direction;
[0019] Each of the processing fixtures corresponds to a set of material handling components, and multiple sets of material handling components are mounted on the material transfer component via a second material transfer mounting component.
[0020] Optionally, the machine also includes a fixture driving device, which is disposed on the machine base and is drivenly connected to the machining fixture so that the machining fixture can move along a first direction and a second direction.
[0021] Optionally, the laser processing apparatus includes a laser, a beam splitter, and a laser head mounted on the first gantry.
[0022] The light-emitting aperture of the laser is connected to the light-inlet aperture of the beam splitter;
[0023] The beam splitter has two light-emitting holes, and the beam splitter is used to split the laser emitted by the laser into two laser beams, which are then emitted through the corresponding light-emitting holes.
[0024] The laser heads are arranged along the second direction, and the light inlet of each laser head is connected to the light outlet of the corresponding beam splitter.
[0025] Optionally, the laser and the beam splitter are both placed laterally along the second direction, and the laser and the beam splitter are arranged along the first direction. One end of the beam splitter extends along the first direction to form a protrusion, and the protrusion is provided with a light inlet of the beam splitter.
[0026] Optionally, the beam splitter includes a main body and a protrusion extending from one end of the main body along a first direction. A first reflector is disposed in the protrusion. Two light-emitting holes are disposed on the main body. A second reflector, a third reflector, a fourth reflector, a fifth reflector, a sixth reflector, a seventh reflector, and a beam splitter are disposed in the main body.
[0027] The laser emitted by the laser enters the protrusion through the light inlet on the protrusion and is reflected by the first reflector into the main body. The laser entering the main body is reflected by the second reflector to the beam splitter for splitting. One of the split laser beams is reflected by the third and fourth reflectors in sequence and then exits from one of the light outlets. The other split laser beam is reflected by the fifth, sixth and seventh reflectors in sequence and then exits from the other light outlet.
[0028] Optionally, an eighth reflector is provided between the beam splitter and the fifth reflector, and the eighth reflector is movable within the main body along a first direction to the optical path between the beam splitter and the fifth reflector. An extinction element is also provided in the reflection direction of the eighth reflector. Attached Figure Description
[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0030] Figure 1 This is a schematic diagram of the structure of the laser processing equipment according to an embodiment of this application;
[0031] Figure 2 This is a schematic diagram of the material transfer device in the laser processing equipment according to an embodiment of this application;
[0032] Figure 3 This is a schematic diagram of the structure of the laser processing apparatus in the laser processing equipment of this application embodiment;
[0033] Figure 4 This is a schematic diagram of the beam splitting component in the laser processing equipment according to an embodiment of this application.
[0034] Figure Labels
[0035] 100. Machine base; 200. First gantry frame; 300. Machining fixture;
[0036] 400. Laser processing apparatus; 410. Laser; 420. Beam splitter assembly; 421. Main body; 422. Protrusion; 423. First reflecting mirror; 424. Second reflecting mirror; 425. Third reflecting mirror; 426. Fourth reflecting mirror; 427. Fifth reflecting mirror; 428. Sixth reflecting mirror; 429. Seventh reflecting mirror; 429a. Beam splitter; 429b. Eighth reflecting mirror; 429c. Extinction element; 430. Laser head;
[0037] 500. Material box carrying device;
[0038] 600. Transfer device; 610. Second gantry frame; 620. Transfer displacement assembly; 621. First transfer displacement drive; 622. Second transfer displacement drive; 623. First transfer mounting component; 624. Second transfer mounting component; 630. Picking assembly; 631. Third transfer displacement drive; 632. Adsorption component; 633. Tilting drive;
[0039] 700. Fixture driving device. Specific Implementation
[0040] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.
[0041] It should be noted that when a metastructure is said to be "fixed to" or "set to" another metastructure, it can be directly on or indirectly on that other metastructure. When a metastructure is said to be "connected to" another metastructure, it can be directly connected to or indirectly connected to that other metastructure.
[0042] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or metastructure referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the descriptions of some applications, "multiple" means two or more, unless otherwise explicitly specified.
[0044] See Figure 1 The laser processing equipment provided in this application can be used to process workpieces such as glass.
[0045] The laser processing equipment includes a base 100, a first gantry 200, a processing fixture 300, a laser processing device 400, a material box carrying device 500, and a material transfer device 600.
[0046] The first gantry 200 and the processing fixture 300 are mounted on the base and arranged along a first direction, with the processing fixture 300 being movable relative to the machine base 100 along the first direction. A laser processing device 400 is mounted on the first gantry 200 and is used to process the workpiece on the processing fixture 300. A material box carrying device 500 is located at the end of the processing fixture 300 away from the first gantry 200. The material box carrying device 500 has a loading station and a unloading station arranged along a second direction. The loading station is used to carry a material box containing a workpiece to be processed, and the unloading station is used to carry a material box containing a processed workpiece.
[0047] Combination Figure 1 and Figure 2 The material transfer device 600 includes a second gantry 610, a material transfer component 620, and a material pick-up component 630. The second gantry 610 is mounted on the machine base 100, and the material transfer component 620 is mounted on the second gantry 610. The material transfer component 620 is drivenly connected to the material pick-up component 630 so that the material pick-up component 630 can move along a first direction and a second direction to transfer the workpiece from the loading station to the processing fixture 300, and to transfer the workpiece on the processing fixture 300 to the unloading station. The first direction and the second direction are perpendicular to each other.
[0048] The laser processing equipment provided in this application has a first gantry 200 and a processing fixture 300 respectively arranged on a base along a first direction, and the processing fixture 300 can move at least along the first direction. The laser processing device 400 is arranged on the first gantry 200, and the material box carrying device 500 is arranged at the end of the processing fixture 300 away from the first gantry 200. The material transfer component 620 in the material transfer device 600 is arranged on the base 100 through the second gantry 610. The material transfer component 620 drives the material picking component 630 to move along the first direction and the second direction, so as to transfer the workpiece from the loading station to the processing fixture 300 and transfer the workpiece on the processing fixture 300 to the unloading station. This method eliminates the need for the material transfer component 620 to be arranged on the first gantry 200, and allows the material picking component 630 to utilize part of the space occupied by the processing fixture 300 on the base 100, so as to make the structure of the laser processing equipment more compact and the size smaller.
[0049] Combination Figure 1 and Figure 2 The second gantry 610 is disposed on one side of the processing fixture 300 and extends along the first direction so that there is enough space for the material transfer component 620 to drive the material picking component 630 to move along the first direction.
[0050] The material transfer component 620 includes a first material transfer drive 621 and a second material transfer drive 622. The first material transfer drive 621 is mounted on the second gantry 610. The driving end of the first material transfer drive 621 is provided with a first material transfer mounting member 623 extending along a second direction. The second material transfer drive 622 is mounted on the first material transfer mounting member 623 and is drivenly connected to the material handling component 630. The first material transfer mounting member 623 allows the material handling component 630 to be positioned above the processing fixture 300 and the material box carrying device 500, facilitating the transfer of workpieces between the processing fixture 300 and the material box carrying device 500. Specifically, the first material transfer drive 621 drives the first material transfer mounting member 623 to move along a first direction, and the second material transfer drive 622 drives the material handling component 630 to move along a second direction.
[0051] The working process of the material transfer device 600 of this application is as follows:
[0052] When material needs to be loaded, the material handling component 630 can move along the first direction and the second direction to the location of the loading station under the action of the first material transfer displacement drive 621 and the second material transfer displacement drive 622, and the material handling module can pick up the workpiece at the loading station.
[0053] Next, the material handling component 630, under the action of the first material transfer drive 621 and the second material transfer drive 622, moves along the first direction and the second direction to transport the workpiece to the location of the processing fixture 300. The material handling component 630 then places the workpiece on the processing fixture 300. During this process, the processing fixture 300 can move away from the first gantry 200 along the first direction to avoid interference between the material handling component 630 and the first gantry 200 or the laser processing device 400 on the first gantry 200 when transferring the workpiece. After the processing fixture 300 receives the workpiece, it moves along the first direction to a position below the laser processing device 400.
[0054] After processing is completed, the material handling component 630 picks up the workpiece on the processing fixture 300 under the action of the first material transfer drive 621 and the second material transfer drive 622, and transfers the workpiece to the unloading station. The material handling component 630 places the workpiece at the unloading station. Repeating the above steps can complete the loading and unloading of all workpieces.
[0055] The material transfer device 600 of this application, by setting the second gantry 610 on one side of the processing fixture 300 and extending it along the first direction, allows the second gantry 610 to make full use of the space occupied by the processing fixture 300 in the first direction on the base 100, since the processing fixture 300 can move along the first direction. In addition, the first material transfer displacement drive 621 set on the second gantry 610 is mounted with the second material transfer displacement drive 622 through the first material transfer mounting member 623 extending along the second direction. The second material transfer displacement drive 622 is connected to the material pick-up assembly 630. This method allows the material pick-up assembly 630 to utilize the space occupied by the processing fixture 300 on the base 100 above the processing fixture 300, making the structure of the laser processing equipment more compact.
[0056] Furthermore, in some embodiments, the first material transfer drive 621 and the second material transfer drive 622 can adopt a lead screw drive structure, for example, including a rotary motor and a lead screw transmission module, using the lead screw transmission module to convert the rotary driving force of the rotary motor into linear motion. Of course, the arrangement of the first material transfer drive 621 and the second material transfer drive 622 is not limited to this. For example, in other embodiments of this application, a rotary motor and a rack and pinion can also be included, and the rotary driving force of the rotary motor can also be converted into linear motion through the rack and pinion. Or, in another embodiment of this application, the first material transfer drive 621 and the second material transfer drive 622 can also be directly linear motors or linear cylinders.
[0057] See Figure 2 The material handling assembly 630 may include a third material transfer displacement drive 631 and an adsorption member 632. The third material transfer displacement drive 631 is disposed on the second material transfer displacement drive 622, and the adsorption member 632 is disposed on the third material transfer displacement drive 631. The adsorption member 632 is driven by the third material transfer displacement drive 631 to move along a third direction, which is perpendicular to the first direction and the second direction respectively. The adsorption member 632 is used to adsorb the workpiece. Driven by the third material transfer displacement drive 631, the adsorption member 632 can move along a third direction, which can be a vertical direction.
[0058] Specifically, the third material transfer drive 631 can be a linear cylinder, which drives the adsorption component 632 to move up and down in a third direction by extending and retracting the piston rod of the linear cylinder.
[0059] Furthermore, in some embodiments, the material handling component 630 may also include a flipping drive 633, which is disposed on the third material transfer displacement drive 631, and an adsorption member 632 is disposed on the flipping drive 633. The flipping drive 633 drives the adsorption member 632 to flip so that the adsorption member 632 can adsorb the workpiece at different angles.
[0060] Understandably, during the workpiece loading process, to save space, the workpiece is usually placed vertically in the material box. During processing, the workpiece usually needs to be placed horizontally. In this case, a flipping drive 633 can be used to flip the suction member 632, allowing the suction member 632 to pick up workpieces at different angles. In one embodiment of this application, the flipping angle can be set to 90 degrees. That is, the flipping drive 633 can flip the suction member 632 between the vertical and horizontal directions, satisfying the need to place a vertically placed workpiece at a horizontal angle or a horizontally placed workpiece at a vertical angle. Of course, the flipping angle of the suction member 632 is not limited and can be set to other angles according to actual needs.
[0061] The flipping drive 633 can be a rotary cylinder. Of course, in other embodiments, the flipping drive 633 can also be a rotary motor.
[0062] Furthermore, in some embodiments, in order to improve processing efficiency, multiple sets of processing fixtures 300 may be provided, and multiple sets of processing fixtures 300 may be arranged along the second direction to make full use of the space of the machine base 100 in the second direction.
[0063] Each processing fixture 300 is provided with a set of material picking components 630, and multiple sets of material picking components 630 are set on the material transfer component 620 through the second material transfer mounting component 624.
[0064] For example, two sets of processing fixtures 300 can be provided, and two sets of material handling components 630 can be provided accordingly. The material transfer component 620 can simultaneously drive the two sets of material handling components 630 to pick up and place materials from the two sets of processing fixtures 300. Of course, in other embodiments, the processing fixtures 300 can also be provided with three, four or more sets.
[0065] Specifically, the third material transfer drive 631 in each material handling assembly 630 can be disposed on the second material transfer mounting component 624, and the second material transfer mounting component 624 is disposed on the drive end of the third material transfer drive 631.
[0066] See Figure 1 and Figure 3The laser processing equipment may also include a fixture drive device 700, which is mounted on the machine base 100 and is drivenly connected to the processing fixture 300 so that the processing fixture 300 can move along a first direction and a second direction. By driving the processing fixture 300 to move along the first and second directions, the fixture drive device 700 can adjust the position of the processing fixture 300 on the machine base 100, so as to facilitate the loading and unloading of the processing fixture 300 by the material transfer device 600, and at the same time, it is beneficial for the laser processing device 400 to process the workpiece on the processing fixture 300.
[0067] Furthermore, in some embodiments, the fixture drive device 700 may be a two-dimensional moving platform.
[0068] See Figure 3 The laser processing apparatus 400 may include a laser 410, a beam splitter 420, and a laser head 430, all mounted on a first gantry 200. The exit aperture of the laser 410 is connected to the inlet aperture of the beam splitter 420. The beam splitter 420 has two exit apertures, used to split the laser emitted by the laser 410 into two beams, which are then emitted through their respective exit apertures. The laser heads 430 are arranged along a second direction, and the inlet aperture of each laser head 430 is connected to the exit aperture of the corresponding beam splitter 420.
[0069] In one embodiment, the laser 410 and the beam splitter 420 may be disposed on the upper surface of the first gantry 200, and the laser head 430 may be disposed on the side of the first gantry 200.
[0070] Specifically, the laser emitted by laser 410 is split by beam splitting assembly 420, and then exits from the corresponding exit hole of beam splitting assembly 420 and enters the corresponding laser head 430. Laser head 430 then emits the laser to process the workpiece on processing fixture 300. Since there are two laser heads 430, the two laser heads 430 can process two workpieces simultaneously.
[0071] In addition, in some embodiments, the distance between the two laser heads 430 can be the same as the distance between the processing fixtures 300, so that the two laser heads 430 can process the workpieces on the two processing fixtures 300 at the same time.
[0072] Furthermore, to make the laser processing apparatus 400 more compact and reduce its space occupation, both the laser 410 and the beam splitter 420 are placed laterally along the second direction. The laser 410 and the beam splitter 420 can be arranged along the first direction, and one end of the beam splitter 420 extends along the first direction to form a protrusion 422, which is provided with a light inlet hole. The laser emitted by the laser 410 enters the beam splitter 420 through the light inlet hole provided on the protrusion 422, and the protrusion 422 facilitates the conduction of the laser emitted by the laser 410 into the interior of the beam splitter 420.
[0073] It is understandable that both the laser 410 and the beam splitter 420 have optical paths inside and have a certain length. Therefore, by placing both the laser 410 and the beam splitter 420 laterally along the second direction and arranging them along the first direction, it is possible to avoid the laser 410 and the beam splitter 420 occupying too much space in the first or second direction, which can make the structure of the laser processing device 400 more compact.
[0074] For details, please refer to Figure 4 The beam splitter 420 includes a main body 421 and a protrusion 422 extending from one end of the main body 421 along a first direction. A first reflector 423 is disposed in the protrusion 422. Two light-emitting holes are disposed on the main body 421. A second reflector 424, a third reflector 425, a fourth reflector 426, a fifth reflector 427, a sixth reflector 428, a seventh reflector 429 and a beam splitter 429a are disposed in the main body 421.
[0075] The laser emitted by laser 410 enters the protrusion 422 through the light inlet on the protrusion 422 and is reflected by the first reflector 423 into the main body 421. The laser entering the main body 421 is reflected by the second reflector 424 to the beam splitter 429a for beam splitting. One of the split laser beams is reflected by the third reflector 425 and the fourth reflector 426 in sequence and then exits from one of the light outlets. The other split laser beam is reflected by the fifth reflector 428 and the sixth reflector 429 in sequence and then exits from the other light outlet.
[0076] Furthermore, in some embodiments, an eighth reflector 429b may be provided between the beam splitter 429a and the fifth reflector, and the eighth reflector 429b may be moved along the first direction within the main body 421 to the optical path between the beam splitter 429a and the fifth reflector. An extinction element 429c may also be provided in the reflection direction of the eighth reflector 429b.
[0077] Specifically, when the laser processing device 400 only requires one laser head 430 to emit light, the eighth reflector 429b can be moved along the first direction within the main body 421 to the optical path between the beam splitter 429a and the fifth reflector. The laser beam split by the beam splitter 429a and transmitted to the fifth reflector is reflected onto the extinction member 429c, which then extinguishes the laser beam. At this time, only the corresponding laser head 430 that is emitted from the corresponding light-emitting hole after being reflected by the third reflector 425 and the fourth reflector 426 after being split by the beam splitter 429a can emit light. This allows for control of single laser head 430 or two laser heads 430 emitting light.
[0078] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of some applications should be included within the protection scope of some applications.
Claims
1. A laser processing device, characterized in that, include: Base; A first gantry and a processing fixture are disposed on the machine base and arranged along a first direction, and the processing fixture is at least movable relative to the machine base along the first direction; A laser processing device, mounted on the first gantry, is used to process the workpiece on the processing fixture; A material box carrying device is disposed at one end of the processing fixture away from the first gantry frame. The material box carrying device is provided with a loading station and a unloading station along the second direction. The loading station is used to carry the material box containing the workpiece to be processed, and the unloading station is used to carry the material box containing the processed workpiece. The material transfer device includes a second gantry frame, a material transfer and displacement component, and a material pick-up component. The second gantry frame is mounted on the machine base, and the material transfer and displacement component is mounted on the second gantry frame. The material transfer and displacement component is drivenly connected to the material pick-up component so that the material pick-up component can move along a first direction and a second direction to transfer the workpiece from the loading station to the processing fixture, and to transfer the workpiece on the processing fixture to the unloading station. The first direction and the second direction are perpendicular to each other.
2. The laser processing equipment as described in claim 1, characterized in that, The second gantry is disposed on one side of the processing fixture, and the second gantry extends along the first direction; The material transfer and displacement assembly includes a first material transfer and displacement drive and a second material transfer and displacement drive. The first material transfer and displacement drive is disposed on the second gantry frame. The drive end of the first material transfer and displacement drive is provided with a first material transfer mounting member extending along a second direction. The second material transfer and displacement drive is disposed on the first material transfer mounting member. The second material transfer and displacement drive is drivenly connected to the material picking assembly. The first material transfer and displacement drive drives the first material transfer mounting member to move along a first direction, and the second material transfer and displacement drive drives the material picking assembly to move along a second direction.
3. The laser processing equipment as described in claim 2, characterized in that, The material handling component includes: The third material transfer displacement drive is disposed on the second material transfer displacement drive; An adsorption element is disposed on the third material transfer displacement drive element, and the adsorption element is driven by the third material transfer displacement drive element to move along a third direction, which is perpendicular to the first direction and the second direction respectively.
4. The laser processing equipment as described in claim 3, characterized in that, The material handling assembly further includes a flipping drive, which is disposed on the third material transfer drive. The adsorption element is disposed on the flipping drive, and the flipping drive drives the adsorption element to flip so that the adsorption element can adsorb the workpiece at different angles.
5. The laser processing equipment as described in any one of claims 1 to 4, characterized in that, The processing fixture is provided in multiple sets, and the multiple sets of processing fixtures are arranged along the second direction; Each of the processing fixtures corresponds to a set of material handling components, and multiple sets of material handling components are mounted on the material transfer component via a second material transfer mounting component.
6. The laser processing equipment as described in claim 5, characterized in that, It also includes a fixture driving device, which is disposed on the machine base and is connected to the machining fixture so that the machining fixture can move along a first direction and a second direction.
7. The laser processing equipment as described in any one of claims 1 to 4, characterized in that, The laser processing device includes a laser, a beam splitter, and a laser head mounted on the first gantry. The light-emitting aperture of the laser is connected to the light-inlet aperture of the beam splitter; The beam splitter has two light-emitting holes, and the beam splitter is used to split the laser emitted by the laser into two laser beams, which are then emitted through the corresponding light-emitting holes. The laser heads are arranged along the second direction, and the light inlet of each laser head is connected to the light outlet of the corresponding beam splitter.
8. The laser processing equipment as described in claim 7, characterized in that, Both the laser and the beam splitter are placed laterally along the second direction, and the laser and the beam splitter are arranged along the first direction. One end of the beam splitter extends along the first direction to form a protrusion, and the protrusion is provided with a light inlet of the beam splitter.
9. The laser processing equipment as described in claim 8, characterized in that, The beam splitting assembly includes a main body and a protrusion extending from one end of the main body along a first direction. A first reflector is disposed in the protrusion. Two light-emitting holes are disposed on the main body. A second reflector, a third reflector, a fourth reflector, a fifth reflector, a sixth reflector, a seventh reflector, and a beam splitter are disposed in the main body. The laser emitted by the laser enters the protrusion through the light inlet on the protrusion and is reflected by the first reflector into the main body. The laser entering the main body is reflected by the second reflector to the beam splitter for splitting. One of the split laser beams is reflected by the third and fourth reflectors in sequence and then exits from one of the light outlets. The other split laser beam is reflected by the fifth, sixth and seventh reflectors in sequence and then exits from the other light outlet.
10. The laser processing equipment as described in claim 9, characterized in that, An eighth reflector is provided between the beam splitter and the fifth reflector, and the eighth reflector can be moved along a first direction within the main body to the optical path between the beam splitter and the fifth reflector. An extinction element is also provided in the reflection direction of the eighth reflector.