Injection mold shaping device

Abstract

The utility model provides an injection mold shaping device and relates to the technical field of injection molds. The injection mold shaping device comprises a fixed mold and a movable mold, a telescopic cylinder is arranged at the side end of the movable mold, cooling holes and heating holes are formed in the fixed mold and the movable mold, semiconductor coolers are arranged at the lower end of the fixed mold and the lower end of the movable mold, and a cooling plate and a heat dissipation plate are arranged on the two sides of each semiconductor cooler respectively. According to the injection mold shaping device, heating holes and cooling holes are formed in the fixed mold and the movable mold, a second water suction pump is started before injection molding and during injection molding of the device, a heat medium heated by a heat dissipation plate in a heating box can be injected into the heating holes, and therefore the heating holes can preheat the mold, and when injection molding of the device is completed and a model is cooled, the mold is cooled; the first water suction pump is started and can inject a cold medium refrigerated by the refrigeration plate in the cooling box into the cooling holes, so that the fixed mold and the movable mold are rapidly cooled.

Description

Technical Field

[0001] This utility model relates to an injection mold, specifically an injection mold shaping device, and belongs to the field of injection mold technology. Background Technology

[0002] Injection molds are tools used to manufacture plastic products. They form the desired product by injecting molten plastic into a closed mold, which then cools and solidifies. The structure of an injection mold typically consists of a moving mold and a fixed mold, which open and close alternately during the operation of the injection molding machine to complete steps such as injection, cooling, and demolding.

[0003] However, traditional injection molds often have inadequate performance in terms of preheating and heat dissipation. This can lead to slow mold heating and an inability to achieve rapid and uniform cooling during the cooling process. This not only affects the efficiency of the molding cycle but may also cause quality problems in injection molded products, such as stress concentration, poor dimensional stability, and surface defects.

[0004] To address these issues, we provide an injection mold shaping device. Utility Model Content

[0005] To address the aforementioned problems, this utility model provides an injection mold shaping device, the specific technical solution of which is as follows:

[0006] A molding die shaping device includes a fixed die and a movable die. A telescopic cylinder is provided on the side of the movable die. Cooling holes and heating holes are provided in both the fixed die and the movable die. A semiconductor cooler is provided at the lower end of the fixed die and the movable die. A cooling plate and a heat dissipation plate are respectively provided on both sides of the semiconductor cooler. A cooling box and a heating box are respectively connected to both sides of the semiconductor cooler. A cooling pipe is connected to the upper end of the cooling box. A first water pump is provided in the cooling pipe. A second water pump is provided in the heating pipe.

[0007] Preferably, the fixed mold and the moving mold include a heat insulation layer, and a conductive layer is provided inside the heat insulation layer. The heat insulation layer is made of a metal material with poor thermal conductivity, and the conductive layer is made of a metal material with good thermal conductivity.

[0008] Preferably, the cooling holes and heating holes are evenly distributed within the conductive layer, and the fixed mold and the moving mold are both provided with mold grooves on their sides. The conductive layer is located at the side end of the mold grooves, and the cooling holes and heating holes are arranged alternately.

[0009] Preferably, the cooling plate is located inside the cooling box, the heat dissipation plate is located inside the heating box, the lower end of the cooling conduit is located inside the cooling box, and the lower end of the heating conduit is located inside the heating box.

[0010] Preferably, the upper end of the cooling conduit is connected to a No. 1 mixing pipe, the No. 1 mixing pipe is connected to all the cooling holes by cooling branch pipes, the lower end of the cooling holes is connected to a cold return pipe, and the lower end of the cold return pipe is connected to the cooling box.

[0011] Preferably, the upper end of the heating conduit is connected to a second mixing pipe, the second mixing pipe is connected to all the heating holes by a heating branch pipe, the lower end of the heating hole is connected to a heat return pipe, and the lower end of the heat return pipe is connected to the heating box.

[0012] Preferably, both the cooling box and the heating box are connected to a stirring motor on their sides, and both the cooling box and the heating box are rotatably connected to a stirring rod, with the driving end of the stirring motor connected to the stirring rod.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. This injection mold shaping device has heating holes in the fixed mold and the moving mold. Before and during injection, the No. 2 water pump is started, which injects the heat medium heated by the heat sink in the heating box into the heating holes. The heat medium exchanges heat in the heating holes and then flows back into the heating box. This circulation can heat the fixed mold and the moving mold, thus preheating them. Through preheating, the temperature of the mold can be evenly distributed, which helps the plastic to have a uniform temperature during injection molding, reduces product shrinkage, deformation and other defects, improves product surface quality and reduces scrap rate.

[0015] 2. This injection mold shaping device has cooling holes in the fixed mold and moving mold. After injection is completed and the mold is waiting to cool, the second water pump is turned off and the first water pump is started. The first water pump injects the cooling medium, which is cooled by the cooling plate in the cooling box, into the cooling holes. The cooling medium exchanges heat in the cooling holes and then flows back into the cooling box. This cycle is repeated, which can quickly cool the fixed mold and moving mold. Rapid cooling can release the molded parts in the mold more quickly, reduce waiting time, and improve overall production efficiency. Rapid and uniform cooling helps to prevent warping, deformation or stress concentration caused by uneven cooling, thereby improving product quality.

[0016] 3. This injection mold shaping device is equipped with stirring rods in the cooling box and heating box. Starting the stirring motor can drive the stirring rods to rotate, thereby making the cold medium in the cooling box and the hot medium in the heating box evenly mixed. This ensures that the temperature of the cold and hot media is uniform, which facilitates uniform temperature changes in the entire mold. This helps to ensure uniform temperature changes in the entire product and improves product quality. Attached Figure Description

[0017] Figure 1This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a front view schematic diagram of the fixed mold and the moving mold of this utility model;

[0019] Figure 3 This is a schematic diagram of the side end structure of the fixed mold of this utility model;

[0020] Figure 4 This is a schematic diagram of the cross-sectional structure of the fixed mold of this utility model;

[0021] Figure 5 This is a cross-sectional structural diagram of the cooling box and heating box of this utility model.

[0022] Figure Descriptions: 1. Fixed mold; 101. Insulation layer; 102. Conductive layer; 2. Moving mold; 3. Telescopic cylinder; 4. Cooling hole; 5. Heating hole; 6. Semiconductor cooler; 601. Cooling plate; 602. Heat sink; 7. Cooling box; 701. Cooling conduit; 702. No. 1 water pump; 703. No. 1 mixing pipe; 704. Cooling branch pipe; 705. Cold reflux pipe; 8. Heating box; 801. Heating conduit; 802. No. 2 water pump; 803. No. 2 mixing pipe; 804. Heating branch pipe; 805. Hot reflux pipe; 9. Stirring motor; 10. Stirring rod. Detailed Implementation

[0023] The present invention will now be further described with reference to the accompanying drawings.

[0024] Please see Figure 1 — Figure 5 The mold includes a fixed mold 1 and a movable mold 2. A telescopic cylinder 3 is provided on the side of the movable mold 2. The telescopic cylinder 3 is used to move the movable mold 2 so that it can be connected to the fixed mold 1. The fixed mold 1 and the movable mold 2 include a heat insulation layer 101. A conductive layer 102 is provided inside the heat insulation layer 101. The fixed mold 1 and the movable mold 2 are both provided with mold grooves on their sides. The conductive layer 102 is located on the side of the mold groove. The heat insulation layer 101 is made of a metal material with poor thermal conductivity, and the conductive layer 102 is made of a metal material with good thermal conductivity. The heat insulation layer 101 is used to constrain the direction of heat transmission in the conductive layer 102, so that heat can be transmitted as much as possible towards the mold groove, thereby improving its temperature regulation efficiency. Cooling holes 4 and heating holes 5 are provided in both the fixed mold 1 and the movable mold 2. The cooling holes 4 and heating holes 5 are evenly provided in the conductive layer 102, so that the temperature change of the mold is uniform.

[0025] A semiconductor cooler 6 is installed at the lower end of the fixed mold 1 and the moving mold 2. The semiconductor cooler 6 is a device that uses the Peltier effect for cooling. It transfers heat by passing a direct current through a semiconductor material, generating a low temperature at one end and a high temperature at the other. A cooling plate 601 and a heat sink 602 are respectively installed on both sides of the semiconductor cooler 6. The cooling plate 601 is the low-temperature end of the semiconductor cooler 6, and the heat sink 602 is the heat-dissipating end of the semiconductor cooler 6. A cooling box 7 and a heating box 8 are respectively connected to both sides of the semiconductor cooler 6. The cooling plate 601 is located inside the cooling box 7, and the heat sink 602 is located inside the heating box 8. 02 is located inside the heating box 8. Both the cooling box 7 and the heating box 8 store heat exchange medium. The upper end of the cooling box 7 is connected to a cooling conduit 701, and the lower end of the cooling conduit 701 is located inside the cooling box 7. A first water pump 702 is installed inside the cooling conduit 701. The upper end of the cooling conduit 701 is connected to a first mixing pipe 703. The first mixing pipe 703 is connected to all the cooling holes 4 by cooling branch pipes 704. The first mixing pipe 703 can make the medium temperature in all the cooling branch pipes 704 uniform. The lower end of the cooling hole 4 is connected to a cold return pipe 705, and the lower end of the cold return pipe 705 is connected to the cooling box 7.

[0026] The upper end of the heating chamber 8 is connected to a heating conduit 801, and the lower end of the heating conduit 801 is located inside the heating chamber 8. A second water pump 802 is installed inside the heating conduit 801. The upper end of the heating conduit 801 is connected to a second mixing pipe 803. A heating branch pipe 804 is connected between the second mixing pipe 803 and all the heating holes 5. The second mixing pipe 803 can make the medium temperature in all the heating branch pipes 804 uniform. The lower end of the heating hole 5 is connected to a heat return pipe 805, and the lower end of the heat return pipe 805 is connected to the heating chamber 8.

[0027] Both the cooling box 7 and the heating box 8 are connected to a stirring motor 9 on their sides. Both the cooling box 7 and the heating box 8 are rotatably connected to a stirring rod 10. The driving end of the stirring motor 9 is connected to the stirring rod 10. When the stirring motor 9 is started, it will drive the stirring rod 10 to rotate, thereby mixing the heat exchange medium in the cooling box 7 or the heating box 8, thus ensuring that the medium temperature is uniform.

[0028] In use, before and during injection molding, the second water pump 802 is started, which draws the medium from the heating box 8. Under the heating action of the heat dissipation plate 602, the medium in the heating box 8 becomes a hot medium. The hot medium enters the second mixing pipe 803 through the heating conduit 801, and then is evenly injected into each heating branch pipe 804, and then enters each heating hole 5, so as to exchange heat with the fixed mold 1 and the moving mold 2. Then the hot medium flows back into the heating box 8 through the heat return pipe 805, and this cycle is repeated to preheat the fixed mold 1 and the moving mold 2.

[0029] When the injection molding process is complete and the mold is waiting to cool, the second water pump 802 is stopped. The hot medium falls into the heating box 8 under the action of gravity. Then, the first water pump 702 is started, which will draw the medium in the cooling box 7. The medium in the cooling box 7 becomes cold medium under the action of the cooling plate 601. The cold medium enters the first mixing pipe 703 through the cooling conduit 701, and then is evenly injected into each cooling branch pipe 704, and then enters each cooling hole 4, thus exchanging heat with the fixed mold 1 and the moving mold 2. Then, the cold medium enters the cooling box 7 again through the cold return pipe 705. This cycle allows the fixed mold 1 and the moving mold 2 to cool down quickly.

[0030] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without inventive effort, and these embodiments will all fall within the protection scope of the claims of this utility model.

Claims

1. A molding die shaping device, comprising a fixed mold (1) and a movable mold (2), characterized in that: The moving mold (2) is provided with a telescopic cylinder (3) on its side. Cooling holes (4) and heating holes (5) are provided in both the fixed mold (1) and the moving mold (2). A semiconductor cooler (6) is provided at the lower end of the fixed mold (1) and the moving mold (2). A cooling plate (601) and a heat sink (602) are respectively provided on both sides of the semiconductor cooler (6). A cooling box (7) and a heating box (8) are respectively connected to both sides of the semiconductor cooler (6). A cooling pipe (701) is connected to the upper end of the cooling box (7). A first water pump (702) is provided in the cooling pipe (701). A heating pipe (801) is connected to the upper end of the heating box (8). A second water pump (802) is provided in the heating pipe (801).

2. The injection mold shaping device according to claim 1, characterized in that: The fixed mold (1) and the moving mold (2) include a heat insulation layer (101), and a conductive layer (102) is provided inside the heat insulation layer (101). The heat insulation layer (101) is made of a metal material with poor thermal conductivity, and the conductive layer (102) is made of a metal material with good thermal conductivity.

3. The injection mold shaping device according to claim 2, characterized in that: The cooling holes (4) and heating holes (5) are evenly opened in the conductive layer (102). The fixed mold (1) and the moving mold (2) are both provided with model grooves on their sides. The conductive layer (102) is located on the side of the model groove. The cooling holes (4) and heating holes (5) are arranged alternately.

4. The injection mold shaping device according to claim 1, characterized in that: The cooling plate (601) is located inside the cooling box (7), the heat dissipation plate (602) is located inside the heating box (8), the lower end of the cooling conduit (701) is located inside the cooling box (7), and the lower end of the heating conduit (801) is located inside the heating box (8).

5. The injection mold shaping device according to claim 1, characterized in that: The upper end of the cooling conduit (701) is connected to a No. 1 mixing pipe (703), and the No. 1 mixing pipe (703) is connected to all the cooling holes (4) by a cooling branch pipe (704). The lower end of the cooling hole (4) is connected to a cold return pipe (705), and the lower end of the cold return pipe (705) is connected to the cooling box (7).

6. The injection mold shaping device according to claim 1, characterized in that: The upper end of the heating conduit (801) is connected to the No. 2 mixing pipe (803), and the No. 2 mixing pipe (803) is connected to all the heating holes (5) by a heating branch pipe (804). The lower end of the heating hole (5) is connected to the heat return pipe (805), and the lower end of the heat return pipe (805) is connected to the heating box (8).

7. The injection mold shaping device according to claim 1, characterized in that: The cooling box (7) and heating box (8) are each connected to a stirring motor (9) on their side. The cooling box (7) and heating box (8) are each rotatably connected to a stirring rod (10). The driving end of the stirring motor (9) is connected to the stirring rod (10).

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