Plastic packaging machine for circuit board

Abstract

The utility model relates to a plastic packaging machine for a circuit board, which belongs to the field of plastic packaging equipment and comprises a vacuum box, a vacuum pump is arranged in the vacuum box, a box cover is arranged on the upper end face of the vacuum box, and the vacuum pump is used for vacuumizing a sealing bag placed in the vacuum box. The box cover can be rotatably attached to the upper end face of the vacuum box so that the interior of the vacuum box can be sealed. The sealing assembly comprises two heating rods and two bag pressing rods; the two heating rods are arranged in the vacuum box in a bilateral symmetry manner; and the two bag pressing rods are rotatably arranged in the vacuum box and located on the outer sides of the two heating rods, and the sealing bags located on the heating rods are clamped through the bag pressing rods. According to the utility model, through the sealing assembly, the opening of the sealing bag can be plastically sealed, then the vacuum box can supply air to release pressure, open the box cover and take out the plastically sealed sealing bag, so that the circuit board can be quickly packaged, vacuumized and sealed, and the packaging and plastic sealing efficiency is further improved.

Description

Technical Field

[0001] This utility model relates to the field of plastic packaging equipment technology, specifically a circuit board plastic packaging machine. Background Technology

[0002] With the development of digitalization, networking, and intelligence, core industries such as integrated circuits, software, and new components have also developed rapidly. Circuit boards are widely used. After the circuit boards are manufactured, they need to be vacuum-packed. If the circuit boards are not properly sealed, the gold plating, tin plating, and solder pads on their surfaces will oxidize, affecting the soldering process and hindering subsequent processing.

[0003] The existing circuit board is placed in a sealed bag, and the inside needs to be vacuumed to seal it before the bag is sealed. This requires multiple devices to operate in batches, resulting in low processing efficiency and high processing cost. Therefore, a circuit board plastic packaging machine is proposed to solve the above technical problems. Utility Model Content

[0004] In view of one or more of the above-mentioned defects or improvement needs of the prior art, this utility model provides a circuit board plastic packaging machine, which has the advantage of improving the plastic packaging efficiency.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a circuit board encapsulation packaging machine, including a vacuum box, a vacuum pump inside the vacuum box, and a box cover on the upper surface of the vacuum box. The vacuum pump is used to evacuate a sealed bag placed inside the vacuum box, and the box cover can be rotatably fitted to the upper surface of the vacuum box to seal the inside of the vacuum box.

[0006] The sealing assembly includes: two heating rods and two bag-pressing rods; the two heating rods are symmetrically arranged inside the vacuum chamber; the two bag-pressing rods are rotatably arranged inside the vacuum chamber and located outside the two heating rods, clamping the sealing bag on the heating rods and heating and sealing the sealing bag placed on the heating rods.

[0007] The lifting mechanism, located at the bottom of the vacuum chamber, is used to adjust the vertical position of the sealed bag.

[0008] As a further improvement of this utility model, the vacuum chamber is also equipped with a pressure relief valve and a sealing assembly inside;

[0009] A pressure relief valve is located inside the vacuum chamber, with one end extending to the outside of the vacuum chamber; a sealing assembly is located on the lower end face of the chamber cover.

[0010] As a further improvement of this utility model, the sealing assembly includes: a first sealing ring disposed on the box cover and an abutment plate disposed on the inner side of the box cover;

[0011] Two contact plates are provided, and they are symmetrically distributed on the lower end face of the box cover.

[0012] As a further improvement of this utility model, the vacuum box has a groove on its upper end face and a second sealing ring disposed inside the groove.

[0013] As a further improvement of this utility model, the lifting mechanism includes: a mounting plate, two support plates arranged symmetrically on the left and right, and a support rod disposed between the mounting plate and the support plates;

[0014] The servo motor is mounted on the upper surface of another support plate that is not connected to the support rod.

[0015] A lead screw is located at the output end of the servo motor, and the other end is rotatably mounted on the upper surface of a mounting plate.

[0016] The support frame is located between the outside of the lead screw and the support rod.

[0017] As a further improvement of this utility model, the support frame is provided with four positioning pins, which are evenly distributed to limit the sealing bag.

[0018] As a further improvement of this utility model, a circuit board plastic encapsulation packaging machine further includes: a locking assembly; the locking assembly includes: two connecting plates symmetrically arranged on the box cover; and a connecting shaft baffle that slides inside the connecting plates and is located on the upper end face of the connecting shaft.

[0019] A spring is sleeved on the outside of the connecting shaft, with its upper and lower ends connected to the baffle and connecting plate, respectively; a buckle plate is located on the lower end face of the connecting shaft; two limiting plates are symmetrically arranged on the outside of the vacuum chamber.

[0020] In summary, the beneficial effects of the above-described technical solutions conceived by this utility model compared with the prior art include:

[0021] This utility model involves placing a sealed bag containing a circuit board onto a lifting mechanism. The lifting mechanism adjusts the position of the sealed bag, positioning the bag opening onto a sealing assembly. The lid is then closed, and a locking assembly enhances the seal between the lid and the vacuum chamber. A vacuum is then created inside the vacuum chamber. After vacuuming, the sealing assembly seals the bag opening. The vacuum chamber is then depressurized, the lid is opened, and the sealed bag is removed. This allows for rapid packaging, vacuuming, and sealing of circuit boards, thereby improving packaging and sealing efficiency. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the vacuum pump structure of this utility model;

[0024] Figure 3 This is a schematic diagram of the lifting mechanism of this utility model;

[0025] Figure 4 This is a schematic diagram of the locking assembly structure of this utility model;

[0026] Figure 5 This is a schematic diagram of the pressure relief valve structure of this utility model.

[0027] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically: 1. Vacuum chamber; 11. Vacuum pump; 12. Pressure relief valve; 13. Chamber cover; 14. Sealing assembly; 141. First sealing ring; 142. Contact plate; 2. Sealing assembly; 21. Heating rod; 22. Bag pressing rod; 3. Lifting mechanism; 31. Mounting plate; 32. Support plate; 33. Support rod; 34. Servo motor; 35. Lead screw; 36. Bearing frame; 4. Locking assembly; 41. Connecting plate; 42. Connecting shaft; 43. Baffle; 44. Spring; 45. Buckle plate; 46. Limiting plate. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] In the embodiments, by Figure 1 Provided is a circuit board encapsulation packaging machine, comprising: a vacuum chamber 1, a vacuum pump 11 inside the vacuum chamber, and a cover 13 on the upper surface of the vacuum chamber. The vacuum pump 11 is used to evacuate a sealed bag placed inside the vacuum chamber 1, and the cover 13 is rotatably attached to the upper surface of the vacuum chamber 1 to seal the inside of the vacuum chamber 1.

[0030] The sealing assembly 2 includes: two heating rods 21 and two bag-pressing rods 22; the two heating rods 21 are symmetrically arranged inside the vacuum chamber 1; the two bag-pressing rods 22 are rotatably arranged inside the vacuum chamber 1 and located outside the two heating rods 21. The bag-pressing rods 22 clamp the sealing bag located on the heating rods 21, and heat and seal the sealing bag placed on the heating rods 21.

[0031] The lifting mechanism 3 is located at the bottom of the vacuum chamber 1 and is used to adjust the vertical position of the sealed bag.

[0032] This embodiment provides a circuit board encapsulation packaging machine of the present invention. By placing a sealed bag containing a circuit board onto a lifting mechanism 3, the lifting mechanism 3 can adjust the position of the sealed bag. The opening of the sealed bag is placed on a heating rod 21, and the sealed bag on the heating rod 21 is clamped by a bag-pressing rod 22. After the box lid 13 is closed, the sealing between the box lid 13 and the vacuum box 1 is improved by the locking assembly 4. Then, the vacuum pump 11 will evacuate the vacuum box 1. After the vacuum is evacuated, the opening of the sealed bag is heated by the heating rod 21, which can seal the opening of the sealed bag. Then, the vacuum box 1 will release air and depressurize, the box lid 13 will be opened, and the sealed bag will be taken out. This allows for quick encapsulation of circuit boards, thereby improving the encapsulation efficiency.

[0033] Preferred, such as Figure 1-2 As shown, the vacuum chamber 1 is also equipped with a pressure relief valve 12 and a sealing assembly 14 inside;

[0034] The pressure relief valve 12 is located inside the vacuum chamber 1, with one end extending to the outside of the vacuum chamber 1; the sealing assembly 14 is located on the lower end face of the chamber cover 13.

[0035] More preferably, such as Figure 4 As shown, the sealing assembly 14 includes: a first sealing ring 141 disposed on the box cover 13 and an abutment plate 142 disposed on the inner side of the box cover 13;

[0036] Two contact plates 142 are provided, and they are symmetrically distributed on the lower end face of the box cover 13.

[0037] More preferably, such as Figure 1 As shown, vacuum chamber 1 has a groove on its upper end face and a second sealing ring located inside the groove.

[0038] In this embodiment, a specific implementation of the vacuum chamber 1 is given. After the chamber cover 13 is closed, the chamber cover 13 will drive the first sealing ring 141 to be inserted into the groove opened on the upper surface of the vacuum chamber 1 and to contact the second sealing ring, thereby improving the sealing between the chamber cover 13 and the vacuum chamber 1. When the chamber cover 13 is closed, the bottom of the contact plate 142 will contact the upper bag opening of the sealing bag containing the circuit board, thereby preventing the sealing bag opening from opening too wide and affecting the sealing effect of the sealing bag. Then the vacuum pump 11 can evacuate the vacuum chamber 1. After the sealing bag containing the circuit board in the vacuum chamber 1 is sealed, the pressure relief valve 12 is used to release the pressure inside the vacuum chamber 1.

[0039] Preferred, such as Figure 3 As shown, the lifting mechanism 3 includes: a mounting plate 31, two support plates 32 arranged symmetrically on the left and right, and a support rod 33 disposed between the mounting plate 31 and the support plates 32;

[0040] The servo motor 34 is located on the upper surface of another support plate 32 that is not connected to the support rod 33;

[0041] The lead screw 35 is located at the output end of the servo motor 34, and the other end is rotatably mounted on the upper surface of the mounting plate 31.

[0042] The support frame 36 is located between the lead screw 35 and the support rod 33.

[0043] More preferably, the support frame 36 is provided with four positioning pins, which are evenly distributed to limit the sealing bag.

[0044] In this embodiment, a specific implementation of the lifting mechanism 3 is given. The servo motor 34 drives the lead screw 35 to rotate. Since the support frame 36 is also located on the outside of the support rod 33, the rotating lead screw 35 will drive the support frame 36 connected to the outer thread to move up and down. Thus, the height of the support frame 36 can be adjusted according to the thickness of the circuit board, thereby improving the convenience of sealing the plastic bag.

[0045] Preferred, such as Figure 4-5 As shown, a circuit board plastic encapsulation packaging machine further includes: a locking assembly 4; the locking assembly 4 includes: two connecting plates 41 symmetrically arranged on the box cover 13; a connecting shaft 42 baffle 43 sliding inside the connecting plates 41 and disposed on the upper end face of the connecting shaft 42;

[0046] A spring 44 is sleeved on the outside of the connecting shaft 42, and the upper and lower end faces of the spring 44 are connected to the baffle 43 and the connecting plate 41 respectively; a buckle 45 is provided on the lower end face of the connecting shaft 42; two limiting plates 46 are symmetrically provided on the outside of the vacuum box 1.

[0047] In this embodiment, a specific embodiment of the locking assembly 4 is given. By pulling the connecting shaft 42, the baffle 43 on the upper end face of the connecting shaft 42 will compress the spring 44. By rotating the connecting shaft 42, the upper end face of the buckle plate 45 will contact the lower end face of the limiting plate 46. At this time, due to the existence of the spring 44's rebound force, the locking assembly 4 will improve the sealing performance of the vacuum box 1.

[0048] This utility model discloses a circuit board sealing and packaging machine. A sealed bag containing a circuit board is placed on a support frame 36. A servo motor 34 drives a lead screw 35 to rotate. Since the support frame 36 slides outside the support rod 33, the rotating lead screw 35 causes the externally threaded support frame 36 to move up and down, thus adjusting the height of the support frame 36 according to the thickness of the circuit board. This improves the convenience of sealing the bag. The opening of the sealed bag is placed on a heating rod 21, and a bag-pressing rod 22 is placed on the opening of the sealed bag, allowing the bag-pressing rod 22 to simply clamp the sealed bag. After the lid 13 is closed, the lid 13 causes the first sealing ring 141 to insert into a groove on the upper surface of the vacuum chamber 1 and contact the second sealing ring, thereby improving the seal between the lid 13 and the vacuum chamber 1. When the lid 13 is closed, the bottom of the contact plate 142 will contact the upper opening of the sealed bag containing the circuit board, thus preventing the sealed bag opening from opening too wide and affecting the sealing effect of the sealed bag. Pulling the connecting shaft 42 will compress the spring 44 on the baffle 43 on the upper end of the connecting shaft 42. Rotating the connecting shaft 42 will make the upper end of the buckle plate 45 contact the lower end of the limiting plate 46. At this time, due to the rebound force of the spring 44, the locking component 4 will improve the sealing performance of the vacuum box 1. The vacuum pump 11 will evacuate the vacuum box 1, and then the heating rod 21 will seal the opening of the sealed bag. Then, the pressure relief valve 12 will release the pressure in the vacuum box 1, and the lid 13 can be opened to take out the sealed bag, thereby quickly packaging and sealing the circuit board, thus improving the packaging and sealing efficiency.

[0049] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0050] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A circuit board encapsulation and packaging machine, characterized in that... include: A vacuum chamber (1) is provided inside the vacuum chamber with a vacuum pump (11) and a cover (13) is provided on the upper surface of the vacuum chamber. The vacuum pump (11) is used to evacuate a sealed bag placed inside the vacuum chamber (1). The cover (13) is rotatably attached to the upper surface of the vacuum chamber (1) to seal the inside of the vacuum chamber (1). The sealing assembly (2) includes: two heating rods (21) and two bag-pressing rods (22); the two heating rods (21) are symmetrically arranged inside the vacuum chamber (1); the two bag-pressing rods (22) are rotatably arranged inside the vacuum chamber (1) and located outside the two heating rods (21). The bag-pressing rods (22) clamp the sealing bag on the heating rods (21) and heat and seal the sealing bag placed on the heating rods (21) through the heating rods (21); The lifting mechanism (3) is located at the bottom of the vacuum box (1) and is used to adjust the vertical position of the sealing bag.

2. The circuit board encapsulation packaging machine according to claim 1, characterized in that, The vacuum chamber (1) is also equipped with a pressure relief valve (12) and a sealing assembly (14) inside; A pressure relief valve (12) is located inside the vacuum chamber (1) and one end extends to the outside of the vacuum chamber (1); a sealing assembly (14) is located on the lower end face of the chamber cover (13).

3. The circuit board encapsulation packaging machine according to claim 2, characterized in that, The sealing assembly (14) includes: a first sealing ring (141) disposed on the box cover (13) and an abutment plate (142) disposed on the inner side of the box cover (13); The contact plate (142) is provided in two parts, and is symmetrically distributed on the lower end face of the box cover (13).

4. The circuit board encapsulation packaging machine according to claim 2, characterized in that, The vacuum chamber (1) has a groove on its upper end face and a second sealing ring located inside the groove.

5. The circuit board encapsulation packaging machine according to claim 1, characterized in that, The lifting mechanism (3) includes: a mounting plate (31), two support plates (32) arranged symmetrically on the left and right, and a support rod (33) located between the mounting plate (31) and the support plates (32); The servo motor (34) is located on the upper surface of another support plate (32) that is not connected to the support rod (33); A lead screw (35) is located at the output end of a servo motor (34), and the other end is rotatably mounted on the upper surface of a mounting plate (31). The support frame (36) is located between the outside of the lead screw (35) and the support rod (33).

6. The circuit board encapsulation packaging machine according to claim 5, characterized in that, The support frame (36) is provided with four positioning pins, which are evenly distributed to limit the sealing bag.

7. A circuit board encapsulation and packaging machine, characterized in that, It also includes: a locking assembly (4); the locking assembly (4) includes: two connecting plates (41) symmetrically arranged on the box cover (13); a connecting shaft (42) baffle (43) sliding inside the connecting plates (41) and located on the upper end face of the connecting shaft (42); A spring (44) is sleeved on the outside of the connecting shaft (42), and the upper and lower ends of the spring (44) are connected to the baffle (43) and the connecting plate (41) respectively; a buckle plate (45) is provided on the lower end of the connecting shaft (42); two limiting plates (46) are symmetrically provided on the outside of the vacuum box (1).

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