SMD type ceramic shell electroplating tool
By designing electroplating fixtures with electroplating metal hangers and conductive contacts, the problems of cumbersome and obstructive bundling operations were solved, achieving efficient electroplating of SMD ceramic shells and improving electroplating yield and performance.
Patent Information
- Application Number
- CN202423056001.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-12-11
AI Technical Summary
In the existing SMD ceramic shell electroplating process, the bundling operation is cumbersome and the fine wires obscure the metal surface, affecting the electroplating yield and performance.
An electroplating fixture is used, which includes an electroplated metal hanger, conductive contacts, and a ceramic shell clamping part. The conductive contacts are connected one-to-one with the isolated metal areas of the ceramic shell. The position of the tip is adjusted by bending to avoid obscuring plating defects. 304 stainless steel V-shaped grippers are used to provide stable clamping.
It achieves efficient electroplating of SMD ceramic shells, reduces plating obstruction, improves plating quality, and avoids cracking of the ceramic shell during the electroplating process.
Smart Images
Figure CN223496696U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to an electroplating fixture, and more particularly to an electroplating fixture for ceramic shells used in chip packaging. Background Technology
[0002] Surface mounted devices (SMDs) use ceramic packaging, which provides better hermeticity, electrical conduction, thermal conductivity, and mechanical properties, resulting in high reliability.
[0003] SMD ceramic substrates are three-dimensional interconnect structures formed by stacking ceramic green wafers with printed conductive patterns and punched conductive vias in a specific order and then processing them through a protective atmosphere sintering process. They are mainly used in semiconductor packaging. The SMD ceramic substrate material is usually black alumina ceramic. The front and back of the ceramic substrate are covered with a metal layer that is tightly bonded to the ceramic, such as electrodes and heat sinks. A sealing ring is welded on top of the ceramic. These metal layers often form an island structure, that is, they are independent and not interconnected.
[0004] In the SMD ceramic packaging process, after the ceramic substrate is assembled and welded, it needs to be electroplated. There are several existing electroplating methods, including bundling and welding. Taking the bundling method as an example, the electrodes, heat sinks, and sealing rings of the ceramic shell are bundled together using fine metal wires and then connected to an electroplating fixture, establishing an electrical connection between the independent metal parts and ultimately achieving electroplating of the SMD ceramic shell. This bundling method is cumbersome, and the bundling wires significantly obstruct the plating layer on the metal surface, affecting the electroplating yield and performance of the SMD ceramic shell. Summary of the Invention
[0005] Purpose of the invention: In view of the above-mentioned prior art, this invention proposes an electroplating fixture for SMD ceramic shells to achieve efficient electroplating of SMD ceramic shells.
[0006] Technical solution: An SMD type ceramic shell electroplating fixture, comprising: an electroplating metal hanger, a plurality of conductive contacts, and a ceramic shell clamping part; the ceramic shell clamping part is connected to the rod of the electroplating metal hanger for clamping the SMD type ceramic shell; the main body of the conductive contact is a bendable strip of metal, one end of the strip of metal is a bendable pointed end, and the other end of the strip of metal is welded to the rod of the electroplating metal hanger; the number of conductive contacts is equal to the number of isolated metal areas on the SMD type ceramic shell.
[0007] Furthermore, the connection points between the plurality of conductive contacts and the rod are distributed on both sides of the rod along its length.
[0008] Furthermore, the ceramic shell clamping part consists of one or two pairs of V-shaped claws fixed at one end to the rod, used to clamp the two sides of the ceramic shell.
[0009] Furthermore, the strip-shaped metal portion of the conductive contact is coated with insulating varnish.
[0010] Furthermore, the conductive contact is made of copper.
[0011] Furthermore, the V-shaped gripper is made of 304 stainless steel.
[0012] Beneficial effects: This utility model's SMD ceramic shell electroplating fixture facilitates efficient electroplating of SMD ceramic shells and is simple to assemble. The SMD ceramic shell electroplating fixture of this utility model minimizes obstruction of the ceramic shell's plating layer, improving plating quality. The SMD ceramic shell of this utility model remains relatively fixed in position during electroplating, avoiding collisions that could cause broken ceramic or other defects. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the structure of this utility model;
[0014] Figure 2 This is a schematic diagram of the usage state of the embodiment. Figure 1 ;
[0015] Figure 3 This is a schematic diagram of the usage state of the embodiment. Figure 2 ;
[0016] Figure 4 The diagram shows the structure of the SMD ceramic shell, where (a) is a front view, (b) is a side view, and (c) is a back view. Detailed Implementation
[0017] The present invention will be further explained below with reference to the accompanying drawings.
[0018] like Figure 1 , Figure 2 As shown, an SMD type ceramic shell electroplating fixture includes an electroplated metal hanger, several conductive contacts 1, and a ceramic shell clamping part 2. The ceramic shell clamping part 2 is connected to the rod of the electroplated metal hanger and is used to clamp the SMD type ceramic shell. The main body of the conductive contact 1 is a bendable strip of metal, one end of which is a bendable tip, and the other end of which is welded to the rod of the electroplated metal hanger. The number of conductive contacts 1 is equal to the number of isolated metal areas on the SMD type ceramic shell. The connection points between the conductive contacts 1 and the rod are distributed on both sides of the rod along its length. The strip-shaped metal portion of the conductive contacts 1 is coated with insulating varnish. The ceramic shell clamping part 2 consists of one or two pairs of V-shaped claws fixed at one end to the rod, used to clamp both sides of the ceramic shell.
[0019] In this embodiment, the structure of the SMD type ceramic shell to be electroplated is as follows: Figure 4 As shown, the two electrodes 3-1 and the heat sink 3-2 are welded to the back of the ceramic base 3-4, and the sealing ring 3-3 is welded to the front of the ceramic base 3-4.
[0020] like Figure 3 As shown, in this embodiment, the ceramic shell clamping part 2 has two pairs of V-shaped jaws. Each jaw arm 2-1 of the V-shaped jaws also adopts a strip-shaped metal structure with a certain arc shape at the end. The V-shaped jaws are made of 304 stainless steel, which has good elasticity and rigidity. Since this fixture is suitable for SMD type ceramic shells, which are small in size and lightweight, the device can form a good clamping force on the ceramic shell through the elasticity of the 304 stainless steel strip material itself. Furthermore, the end of each jaw arm is machined into a certain arc shape to increase the contact area with the side of the ceramic shell, thereby ensuring the clamping effect and preventing the ceramic shell from moving or falling off during electroplating.
[0021] In this embodiment, four conductive contacts are provided. The conductive contacts are made of copper, which has good conductivity and suitable flexibility and rigidity. The angle between the main body of the conductive contact and the electroplated metal bracket rod, as well as the angle between the tip and the main body, are adjusted by bending, so that the tip of each conductive contact corresponds one-to-one with the isolated metal area. Specifically, the two first conductive contacts 1-1 are connected to the two electrodes 3-1 on the ceramic shell, the second conductive contact 1-2 is connected to the heat sink 3-2, and the third conductive contact 1-3 is connected to the sealing ring 3-3, completing the electrical connection of all isolated metal areas.
[0022] During the electroplating process, the position of the tip relative to the corresponding isolated metal area is changed by bending and adjusting the conductive contact, so as to avoid plating defects caused by the tip blocking.
[0023] In this fixture structure, the 304 stainless steel claw arm 2-1 can be integrally stamped or cut and then welded to the rod of the electroplated metal hanger. The main body and tip of the conductive contact 1 can be an integral structure, or the two parts can be connected by welding and then integrally welded to the rod of the electroplated metal hanger.
[0024] The strip-shaped metal portion of the conductive contact 1 is coated with insulating varnish to prevent the clamp itself from being plated with metal (nickel and gold).
[0025] For different SMD type ceramic shell products, the electroplating fixture for SMD type ceramic shells of this utility model sets the number of conductive contacts 1 according to the number of isolated metal areas in the SMD type ceramic shell.
[0026] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A SMD type ceramic shell electroplating fixture, characterized in that, include: An electroplated metal hanger, several conductive contacts (1) and a ceramic shell clamping part (2); the ceramic shell clamping part (2) is connected to the rod of the electroplated metal hanger and is used to clamp the SMD type ceramic shell; the main body of the conductive contact (1) is a bendable strip of metal, one end of the strip of metal is a bendable tip, and the other end of the strip of metal is welded to the rod of the electroplated metal hanger; the number of conductive contacts (1) is equal to the number of island metal areas on the SMD type ceramic shell.
2. The SMD type ceramic shell electroplating fixture according to claim 1, characterized in that, The connection points of the plurality of conductive contacts (1) to the rod are distributed on both sides of the rod along its length.
3. The SMD type ceramic shell electroplating fixture according to claim 1 or 2, characterized in that, The ceramic shell clamping part (2) is a pair or two pairs of V-shaped claws fixed at one end to the rod, used to clamp the two sides of the ceramic shell.
4. The SMD type ceramic shell electroplating fixture according to claim 1 or 2, characterized in that, The strip-shaped metal portion of the conductive contact (1) is coated with insulating varnish.
5. The SMD type ceramic shell electroplating fixture according to claim 1 or 2, characterized in that, The conductive contact (1) is made of copper.
6. The SMD type ceramic shell electroplating fixture according to claim 3, characterized in that, The V-shaped gripper is made of 304 stainless steel.