Wafer rack box detection equipment

Abstract

The utility model discloses wafer rack box detection equipment, which is characterized in that a wafer rack box is placed on a placing platform, a multi-axis driving group, a detection group, the placing platform and a light source group are started, the light source group provides illumination for the detection group, and the detection group is driven by the multi-axis driving group to be close to the wafer rack box so as to detect the wafer rack box. And contact detection and visual detection are carried out on each dimensional point of the wafer rack box, so that multi-dimensional detection is realized, and the detection precision and accuracy are improved.

Description

Technical Field

[0001] This utility model relates to the field of automatic testing technology, and in particular to a wafer rack box testing device. Background Technology

[0002] From production to transportation and downstream testing, dicing, and packaging to create physical integrated circuit products, wafers have extremely high requirements for surface cleanliness, scratches, and dirt. Therefore, each wafer must be separated and stably packaged in a special packaging box. However, since the special custom packaging box is an injection molding product, there is a risk that the wafers may be broken due to positional deviations when the automated robotic arm takes them out because of positional deviations caused by mold parameters, deformation of the wafer packaging box's loading and unloading port, and deformation of the loading and unloading port's reference surface.

[0003] The semiconductor industry now has increasingly higher precision requirements for wafer rack boxes, and many dimensions need to be carefully controlled. However, the conventional measurement method is to measure each dimension one by one using a contact 3D measuring machine, which has low measurement efficiency. Utility Model Content

[0004] The purpose of this invention is to address the technical problems existing in the background art by proposing a wafer rack box inspection device.

[0005] To achieve the above-mentioned technical objectives, the technical solution adopted by this utility model in the first aspect is as follows:

[0006] A wafer cassette inspection device includes a placement platform, a multi-axis drive group, a detection group, and a light source group. The detection group is used for contact inspection and visual inspection of the wafer cassette. The placement platform is used for placing the wafer cassette and horizontally deflecting it. The multi-axis drive group is located on the first side of the placement platform. The detection group is mounted on the multi-axis drive group and moves in three-dimensional space under the drive of the multi-axis drive group to inspect the wafer cassette. The light source group is located on the second side of the placement platform and is used to provide light.

[0007] Preferably, the multi-axis drive group includes an X-axis motion module, a Z-axis motion module, and a Y-axis motion module that are driven and coordinated in sequence, and the detection group is installed on the Y-axis motion module.

[0008] Preferably, the detection group includes a carrier board and a first sensor and a second sensor mounted on the carrier board. The carrier board is driven and connected to the Y-axis motion module. The first sensor and the second sensor cooperate with each other to detect the contour information of the wafer cassette.

[0009] Preferably, the first sensor includes a contact sensor, and the second sensor includes a vision sensor.

[0010] Preferably, the placement platform includes a rotary drive and a fixture mounted on the output end of the rotary drive. The fixture is used to place the wafer rack and is horizontally deflected under the drive of the rotary drive.

[0011] Preferably, the fixture has two symmetrically arranged positioning blocks with a distance between them.

[0012] Preferably, the positioning block is provided with multiple steps, which are used to assemble wafer racks of different sizes.

[0013] Preferably, the wafer rack inspection equipment also includes a marble platform, on which the placement platform, multi-axis drive group and light source group are all installed.

[0014] Compared with the prior art, the utility model has the following beneficial technical effects: the wafer rack is placed on the placement platform, and the multi-axis drive group, detection group, placement platform and light source group are activated. The light source group provides illumination to the detection group. Driven by the multi-axis drive group, the detection group approaches the wafer rack and performs contact detection and visual detection on various dimensions of the wafer rack, realizing multi-dimensional detection to improve detection accuracy and precision. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0016] Figure 2 This is a schematic diagram of the internal structure of an embodiment of the present utility model;

[0017] Figure 3 This is a schematic diagram of the placement platform structure in an embodiment of the present utility model.

[0018] Reference numerals: 100 Cabinet, 101 Marble Platform, 200 Cover, 300 Placement Platform, 301 Rotary Drive Component, 302 Fixture, 3021 Positioning Block, 3022 Step, 400 Multi-axis Drive Group, 401 X-axis Motion Module, 402 Z-axis Motion Module, 403 Y-axis Motion Module, 500 Detection Group, 501 Carrier Plate, 502 First Sensor, 503 Second Sensor, 600 Light Source Group. Detailed Implementation

[0019] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0020] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or assembly referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more features. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a link, or a specific connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the connection within two groups. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0023] like Figures 1-3 As shown, this utility model proposes a wafer cassette inspection device, which includes a placement platform 300, a multi-axis drive group 400, a detection group 500, and a light source group 600. The detection group 500 is used for contact inspection and visual inspection of the wafer cassette. The placement platform 300 is used for placing the wafer cassette and horizontally deflecting it. The multi-axis drive group 400 is placed on the first side of the placement platform 300. The detection group 500 is mounted on the multi-axis drive group 400 and moves in three-dimensional space under the drive of the multi-axis drive group 400 to inspect the wafer cassette. The light source group 600 is pre-positioned on the second side of the placement platform 300 and is used to provide light.

[0024] Specifically, the wafer rack inspection equipment also includes a cabinet 100 and a housing 200 mounted on the cabinet 100, with a two-tiered structure. The placement platform 300, multi-axis drive group 400, and light source group 600 are all housed within the housing 200. The cabinet 100 contains a control module electrically connected to the placement platform 300, multi-axis drive group 400, inspection group 500, and light source group 600, respectively. The control module can be composed of a PLC and various circuit boards, and its function is to control the placement platform 300, multi-axis drive group 400, inspection group 500, and light source group 600 directly within the housing 200. In this embodiment, the wafer rack inspection equipment also includes a display screen, input peripherals, and other interactive devices, allowing users to directly control the wafer rack inspection equipment and quickly... When acquiring information, it's important to note that the wafer holder needs to be pre-calibrated for flatness before being placed on the placement platform 300. This is done using a calibration mechanism, such as a level. After calibration, the wafer holder to be tested is placed on the platform. Commands are transmitted to the control module via an interactive device. The control module controls the placement platform 300, the multi-axis drive group 400, the detection group 500, and the light source group 600. The light source group 600 is activated to provide illumination. The first and second sides of the placement platform 300 are arranged opposite each other to ensure that the detection group 500 can acquire clear images during visual inspection. The multi-axis drive group 400 drives the detection group 500 to approach the wafer holder for multi-dimensional measurement and inspection.

[0025] The dimension point detection here includes the distance from each wafer slot of the wafer holder to the bottom plane, the spacing between the two positioning holes on the right side of the front face of the wafer holder, the vertical distance between the front face of the wafer holder, the horizontal distance between the front face of the wafer holder, the width of the rear slot, the perpendicularity of the front face of the wafer holder to the reference, the depth distance from the wafer to the reference after placing the wafer, and the distance between each wafer.

[0026] Of course, users can use only contact detection, only visual detection, or both.

[0027] Furthermore, the multi-axis drive group 400 includes an X-axis motion module 401, a Z-axis motion module 402, and a Y-axis motion module 403 that are driven and coordinated in sequence. The detection group 500 is installed on the Y-axis motion module 403. The three-axis drive structure enables the detection group 500 to move in any three-dimensional space inside the cover 200, resulting in more detectable points and more flexible configuration of the detection points.

[0028] Furthermore, the detection group 500 includes a carrier plate 501 and a first sensor 502 and a second sensor 503 mounted on the carrier plate 501. The carrier plate 501 is driven and connected to the Y-axis motion module 403. The first sensor 502 and the second sensor 503 cooperate with each other to detect the contour information of the wafer cassette.

[0029] The first sensor 502 includes a contact sensor, and the second sensor 503 includes a vision sensor.

[0030] Furthermore, the placement platform 300 includes a rotary drive 301 and a fixture 302 mounted on the output end of the rotary drive 301. The fixture 302 is used to place the wafer rack, and under the drive of the rotary drive 301, the fixture 302 deflects horizontally.

[0031] Specifically, in order to detect as much information as possible on the wafer cassette, the fixture 302 is deflected horizontally by the rotary drive 301 to ensure that the detection group 500 can detect information from various angles of the wafer cassette. The rotary drive 301 can be a rotary motor, a rotary cylinder, or a combined rotary mechanism.

[0032] Furthermore, the fixture 302 is provided with two symmetrically arranged positioning blocks 3021 with a distance between them. The positioning blocks 3021 are provided with multi-level steps 3022, which are used to assemble wafer rack boxes of different sizes.

[0033] Specifically, the steps 3022 of the two positioning blocks 3021 have a certain specified distance between them. Different steps 3022 correspond to different distances. Therefore, different sizes of wafer rack boxes can be quickly adapted according to these steps 3022 without the need for the user to manually align them.

[0034] Furthermore, the wafer rack inspection equipment also includes a marble platform 101, a placement platform 300, a multi-axis drive group 400, and a light source group 600, all of which are mounted on the marble platform 101.

[0035] Specifically, the main mineral components of the marble platform are pyroxene, plagioclase, a small amount of olivine, biotite and trace amounts of magnetite. It has a black luster, a precise structure, uniform texture, good stability, high strength and hardness, and can maintain high precision under heavy loads. It also has good flatness, which is beneficial for testing.

[0036] The above description provides one or more embodiments in conjunction with specific content, but it is not intended that the specific implementation of this utility model is limited to these descriptions. Any methods or structures that are similar to or identical to those of this utility model, or any technical deductions or substitutions made based on the concept of this utility model, should be considered within the scope of protection of this utility model.

Claims

1. A wafer rack inspection device, characterized in that, It includes a placement platform (300), a multi-axis drive group (400), a detection group (500), and a light source group (600); The detection group (500) is used to perform contact and visual inspection on the wafer holder. The placement platform (300) is used to place the wafer holder and horizontally deflect it. The multi-axis drive group (400) is placed on the first side of the placement platform (300). The detection group (500) is mounted on the multi-axis drive group (400) and, driven by the multi-axis drive group (400), moves in three-dimensional space and inspects the wafer holder. The light source group (600) is positioned on the second side of the placement platform (300) and is used to provide a light source.

2. The wafer rack inspection equipment according to claim 1, characterized in that, The multi-axis drive group (400) includes an X-axis motion module (401), a Z-axis motion module (402), and a Y-axis motion module (403) that are driven and cooperated in sequence, and the detection group (500) is installed on the Y-axis motion module (403).

3. The wafer rack inspection equipment according to claim 2, characterized in that, The detection group (500) includes a carrier plate (501) and a first sensor (502) and a second sensor (503) mounted on the carrier plate (501). The carrier plate (501) is driven to be connected to the Y-axis motion module (403). The first sensor (502) and the second sensor (503) cooperate with each other to detect the contour information of the wafer cassette.

4. The wafer rack inspection equipment according to claim 3, characterized in that, The first sensor (502) includes a contact sensor, and the second sensor (503) includes a vision sensor.

5. The wafer rack inspection equipment according to claim 1, characterized in that, The placement platform (300) includes a rotary drive (301) and a fixture (302) mounted on the output end of the rotary drive (301). The fixture (302) is used to place the wafer rack. Under the drive of the rotary drive (301), the fixture (302) deflects horizontally.

6. The wafer rack inspection equipment according to claim 5, characterized in that, The fixture (302) is provided with two symmetrically arranged positioning blocks (3021) with a spacing between them.

7. The wafer rack inspection equipment according to claim 6, characterized in that, The positioning block (3021) is provided with multiple steps (3022), which are used to assemble wafer rack boxes of different sizes.

8. The wafer rack inspection equipment according to claim 1, characterized in that, It also includes a marble platform (101), on which the placement platform (300), the multi-axis drive group (400) and the light source group (600) are all mounted.

Images