FET gas sensing device
By designing a FET gas sensing device, the problem of sensor performance degradation in complex environments was solved, achieving efficient and reliable gas detection, extending sensor lifespan, and reducing costs.
Patent Information
- Application Number
- CN202422817006.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-18
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-11-18
AI Technical Summary
Existing gas sensors are susceptible to dust and humidity in complex and harsh environments, leading to performance degradation or even failure and a shortened lifespan.
A FET gas sensing device was designed, comprising a sensor placement platform, a separable sensing slot, a heating wire, and a temperature control module, ensuring that the sensor operates in a sealed environment and enabling flexible gas detection through a pagoda interface and a touch panel.
It improves the sensitivity and accuracy of gas detection, extends the lifespan of the sensor, ensures high-performance operation in different environments, and reduces measurement errors and experimental costs.
Smart Images
Figure CN223500926U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of gas sensing device technology, and in particular to a FET gas sensing device. Background Technology
[0002] Gas sensors convert information related to the type and concentration of gases into changes in electrical signals. Based on these changes in electrical signals, they can qualitatively and quantitatively identify and judge the gas being tested in the environment, enabling real-time detection, monitoring, and alarm functions.
[0003] Currently, gas sensors are generally directly exposed to the external environment. When used in complex and harsh external environments for a long time, dust and humidity in the external environment will seriously affect the performance of the gas sensor, and in severe cases, it will cause the sensor to fail and shorten its service life.
[0004] To address the above problems, a FET gas sensing device is proposed. Utility Model Content
[0005] To overcome the above shortcomings, this utility model provides a FET gas sensing device, which aims to improve the problem that gas sensors in the prior art are generally directly exposed to the external environment. When used in a complex and harsh external environment for a long time, dust and humidity in the external environment will seriously affect the performance of the gas sensor, and in severe cases, it will lead to sensor failure and shorten the service life of the gas sensor.
[0006] To achieve the above objectives, the present invention adopts the following technical solution: a FET gas sensing device, comprising a gas sensing device body, a sensor placement platform provided on the left side of the bottom wall of the gas sensing device body, a detachable sensing groove provided on the left side of the bottom wall of the gas sensing device body, a sensing mechanism provided inside the gas sensing device body, the sensing mechanism being used to sense the temperature of the gas sensing device body and connected to a heating wire, two pagoda interfaces provided on the lower left and upper right of the gas sensing device body, a ring of heating wire provided on the upper side of the inner wall of the gas sensing device body, a motherboard chamber provided on the right side wall of the gas sensing device body for protecting the motherboard, and a touch panel installed on the outer side of the motherboard chamber.
[0007] As a further description of the above technical solution:
[0008] The sensing mechanism includes a temperature control module and a temperature sensor. The temperature sensor is located inside the lower part of the main body of the gas sensing device. The temperature sensor is internally connected to the temperature control module via a wire, and externally connected to the motherboard. It can provide real-time temperature feedback and determine the opening and closing of the temperature control module. The temperature control module is located inside the upper part of the motherboard and controls the heating wire to heat up.
[0009] As a further description of the above technical solution:
[0010] The pagoda interface can be connected to a flexible hose. Since the two interfaces are located in the upper and lower directions, the air inlet and outlet can be determined according to the density of the gas to be measured.
[0011] As a further description of the above technical solution:
[0012] The sensor placement platform and the separable sensor slot are perfectly matched in size, which ensures the airtightness of the device.
[0013] As a further description of the above technical solution:
[0014] The separable sensing groove can be customized with different grooves according to the size of the interdigital electrodes.
[0015] As a further description of the above technical solution:
[0016] The heating wire is placed in a ring on the upper side of the inner wall of the main body to uniformly heat the device, which is controlled by the temperature control module.
[0017] As a further description of the above technical solution:
[0018] The motherboard is embedded in the outer right side wall of the main body, and a motherboard chamber is provided to protect the motherboard.
[0019] As a further description of the above technical solution:
[0020] The touch panel is mounted on the outdoor side of the motherboard and is connected to the motherboard via integrated wires for easy operation.
[0021] This utility model has the following beneficial effects:
[0022] 1. In this utility model, by setting up a sensor placement platform and a separable sensor groove, the sensor is perfectly fitted and inserted into the main body. The sensitive material can be completely exposed to the gas to be tested, and the electrodes are exposed on the outside of the main body, which facilitates the connection of the detection equipment. The advantages of small size and high efficiency effectively save testing time and reduce experimental pollution and costs.
[0023] 2. In this utility model, the device achieves diversified and modular functions through the built-in sensing mechanism and heating wire. Users can set different temperatures as needed to simulate different scenarios. Attached Figure Description
[0024] Figure 1 This is a perspective view of a FET gas sensing device proposed in this utility model;
[0025] Figure 2 This is a schematic diagram of the pagoda interface of a FET gas sensing device proposed in this utility model;
[0026] Figure 3 This is an exploded view of a FET gas sensing device proposed in this utility model.
[0027] Legend:
[0028] 1. Separable sensor slot; 2. Sensor placement platform; 3. Gas sensor body; 4. Pagoda interface; 5. Touch panel; 6. Main board; 7. Main board compartment; 8. Temperature sensor; 9. Heating wire; 10. Wire; 11. Temperature control module; 12. Integrated wire. Detailed Implementation
[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0030] Reference Figure 1 - Figure 3 This utility model provides an embodiment of a FET gas sensing device, comprising a gas sensing device body 3, a sensor placement platform 2 located on the left side of the bottom wall of the gas sensing device body 3, a detachable sensing groove 1 located on the left side of the bottom wall of the gas sensing device body 3, a sensing mechanism located inside the gas sensing device body 3 for sensing the temperature of the gas sensing device body 3 and connected to a heating wire 9, two pagoda interfaces 4 located on the lower left and upper right of the gas sensing device body 3, a ring of heating wire 9 located on the upper side of the inner wall of the gas sensing device body 3, a main board chamber 7 located on the right side wall of the gas sensing device body 3 for protecting the main board 6, and a touch panel 5 installed on the outside of the main board chamber 7.
[0031] Specifically, the gas sensing device body 3 has a sensor placement platform 2 and a separable sensing groove 1 on its side. The surface of the separable sensing groove 1 has grooves for placing interdigital electrodes. The size of the interdigital electrodes can be made according to the size of the interdigital electrodes. The interdigital electrodes are placed in the grooves, and finally the sensing groove is inserted into the sensing device. The interdigital sensing part enters the sealed environment, while the electrodes are exposed to the outside for easy measurement. A heating wire 9 is wrapped around the upper side of the inside of the gas sensing device body 3. The heating wire 9 is composed of thermistors, which can achieve uniform heating of the internal environment of the body. The main board 6 is embedded in the outer wall of the right side of the sensing device body to control the overall internal temperature. A main board chamber 7 is provided to protect the main board 6 and the circuit. The touch panel 5 is installed on the outside of the main board chamber 7 and is fixed with screws. Users can set the temperature and heat preservation time through the touch panel 5 and can display the internal temperature of the body in real time. The operation is simple.
[0032] Reference Figure 1 - Figure 3 The sensing mechanism includes a temperature control module 11 and a temperature sensor 8. The temperature sensor 8 is located inside the lower part of the gas sensing device body 3. The temperature sensor 8 is connected to the temperature control module 11 through a wire 10. The temperature sensor 8 is connected to the motherboard 6 externally. It can provide real-time temperature feedback and determine the opening and closing of the temperature control module 11. The temperature control module 11 is located inside the upper part of the motherboard 6 and controls the heating wire 9 to heat up.
[0033] Specifically, the temperature sensor 8 is embedded in the upper part of the main body and connected to the heating wire 9 to keep it working normally. It monitors the internal temperature in real time and transmits the data to the temperature control module 11. The temperature control module 11 is located in the lower part of the main body and is connected to the temperature sensor 8. It controls the operation of the heating wire 9 in real time and transmits the data of the temperature sensor 8 to the main board 6, playing a connecting role.
[0034] Reference Figure 1 - Figure 3 The pagoda interface 4 can be connected to a flexible tube. Since the two interfaces are located in the upper and lower directions, the air inlet and outlet can be determined according to the density of the gas to be measured. The sensor placement platform 2 and the separable sensor groove 1 are perfectly matched in size, which can ensure the airtightness of the device. The separable sensor groove 1 can be customized with different grooves according to the size of the interdigital electrodes. The heating wire 9 is placed in a circle on the upper side of the inner wall of the main body to heat the device evenly. It is controlled by the temperature control module 11. The main board 6 is embedded in the outer wall of the right side of the main body and a main board chamber 7 is provided to protect the main board 6. The touch panel 5 is installed on the outside of the main board chamber 7 and is connected to the main board 6 through the integrated wire 12 for convenient operation.
[0035] Specifically, the main body of the sensing device has pagoda-shaped interfaces 4 on both sides, one above the other, which can be used to determine the inlet and outlet of the gas according to the density of the gas to be measured, and can be connected to a flexible hose. The sensor placement platform 2 and the detachable sensor slot 1 are designed to provide an accurate and reliable gas detection environment. The sensor placement platform 2 ensures that the sensor is securely installed inside the device, while the flexibility of the detachable sensor slot 1 allows for customization according to the size of specific sensors, such as interdigitated electrodes, ensuring that every part of the sensor is in close contact with the gas to be measured, thereby improving the sensitivity and accuracy of gas detection. This design effectively prevents gas leakage and maintains the airtightness of the device, which is crucial for gas detection, as any gas leakage may lead to inaccurate measurement results. The heating wire 9 is arranged in a ring on the upper side of the inner wall of the device, and its main function is to uniformly heat the internal space of the device, providing a stable and suitable temperature environment for the gas sensor to operate. This helps ensure that the sensor operates under consistent conditions, reducing measurement errors that may be caused by temperature fluctuations. The uniform distribution of heating wire 9 also means that the gas is heated more evenly throughout the device, thereby improving the consistency and reliability of detection. The function of temperature control module 11 is to monitor the temperature inside the device and automatically control the working state of heating wire 9 according to preset parameters to maintain an ideal temperature environment. This not only ensures the optimal working conditions of the sensor, but also extends the service life of the sensor and the entire device. By precisely controlling the temperature, temperature control module 11 can also help optimize the response speed and stability of gas detection, enabling the gas sensing device to maintain high performance in various environments. The motherboard 6 and the touch panel 5 are connected by integrated wires 12 to transmit electrical signals.
[0036] Working Principle: During use, gas is first introduced through one of the two pagoda-shaped interfaces 4 at the bottom of the device, which connects to a flexible tube to introduce the gas to be detected. The appropriate interface is selected as the inlet or outlet based on the gas density to ensure effective gas entry into the sensing device. The sensor, such as the interdigitated electrode, is fixed on the sensor placement platform 2. The groove of the separable sensing slot 1 is customized according to the actual size of the sensor to ensure that the electrode portion is exposed for easy gas contact while maintaining the airtightness of the entire sensing device. A heating wire 9 is wound around the upper side of the inner wall of the main body as a heating element, controlled by the temperature control module 11. When the device is powered on, the temperature control module 11 will start heating according to the preset parameters. The heating wire 9 heats the inside of the device evenly. The built-in temperature sensor 8 monitors the internal temperature of the device in real time and transmits the data to the temperature control module 11. The temperature control module 11 determines whether to adjust the working state of the heating wire 9 to ensure that the internal temperature of the device is always maintained at a suitable level to meet the optimal working conditions of the sensor. After heating, the internal environment of the device is stable. The electrode part of the sensor comes into contact with the introduced gas and undergoes a chemical or physical reaction, generating an electrical signal. These signals are transmitted to the temperature control module 11 through the temperature sensor 8 and are finally processed and analyzed by the main board 6. Through the touch panel 5 on the outside of the main board chamber 7, the user can intuitively set parameters such as detection temperature and heat preservation time, and view the temperature changes inside the device in real time.
[0037] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A FET gas sensing device, comprising a gas sensing device body (3), characterized in that: A sensor placement platform (2) is provided on the left side of the bottom wall of the gas sensing device body (3). A separable sensing groove (1) is provided on the left side of the bottom wall of the gas sensing device body (3). A sensing mechanism is provided inside the gas sensing device body (3). The sensing mechanism is used to sense the temperature of the gas sensing device body (3) and is connected to the heating wire (9). Two pagoda interfaces (4) are provided on the lower left and upper right of the gas sensing device body (3). A ring of heating wire (9) is provided on the upper side of the inner wall of the gas sensing device body (3). A main board chamber (7) is provided on the right side wall of the gas sensing device body (3) to protect the main board (6). A touch panel (5) is installed on the outside of the main board chamber (7).
2. The FET gas sensing device according to claim 1, characterized in that: The sensing mechanism includes a temperature control module (11) and a temperature sensor (8). The temperature sensor (8) is located inside the lower part of the main body (3) of the gas sensing device. The temperature sensor (8) is connected to the temperature control module (11) through a wire (10). The temperature sensor (8) is connected to the main board (6) outside. It can provide real-time temperature feedback and determine the opening and closing of the temperature control module (11). The temperature control module (11) is located inside the upper part of the main board (6) to control the heating wire (9) to heat up.
3. The FET gas sensing device according to claim 1, characterized in that: The pagoda interface (4) can be connected to a hose. Since the two interfaces are located in the upper and lower directions, the air inlet and outlet can be determined according to the density of the gas to be measured.
4. The FET gas sensing device according to claim 1, characterized in that: The sensor placement platform (2) and the separable sensor slot (1) are perfectly matched in size, which can ensure the airtightness of the device.
5. A FET gas sensing device according to claim 1, characterized in that: The separable sensing groove (1) can be customized with different grooves according to the size of the interdigital electrodes.
6. A FET gas sensing device according to claim 2, characterized in that: The heating wire (9) is placed in a circle on the upper side of the inner wall of the main body to heat the device evenly, and is controlled by the temperature control module (11).
7. The FET gas sensing device according to claim 1, characterized in that: The motherboard (6) is embedded in the outer wall of the right side of the main body, and the motherboard chamber (7) is provided to protect the motherboard (6).
8. A FET gas sensing device according to claim 1, characterized in that: The touch panel (5) is installed on the outside of the motherboard chamber (7) and connected to the motherboard (6) via an integrated wire (12) for easy operation.