Electronic device

Abstract

The embodiment of the utility model relates to the technical field of power-off protection, and discloses an electronic device which comprises a case, the case comprises a main body part and a cover plate, a mounting groove is formed in the main body part, the cover plate covers a groove opening of the mounting groove and is detachably connected with the main body part, and a mainboard is arranged in the mounting groove and is detachably connected with the main body part; the time-delay power supply assembly comprises a fixing plate, a capacitor and a power supply resistor, the capacitor and the power supply resistor are arranged on one side of the fixing plate, the fixing plate is arranged at a notch of the mounting groove, the side, provided with the capacitor and the power supply resistor, of the fixing plate faces the mainboard, and the capacitor is electrically connected with the mainboard through the power supply resistor. The power supply resistor is attached to the fixing plate, the side, away from the capacitor, of the fixing plate is attached to the cover plate, and therefore heat of the power supply resistor is conducted to the outside sequentially through the fixing plate and the cover plate. Through the mode, the time-delay power supply assembly in the electronic equipment is more convenient to install.

Description

Technical Field

[0001] This application relates to the field of power failure protection technology, specifically to an electronic device. Background Technology

[0002] Electronic devices possess strong computing and data processing capabilities, enabling them to perform complex tasks. Therefore, they are widely used in fields such as highway lane control, mechanical inspection equipment, and industrial automation control. When electronic devices suddenly lose power due to human error, power outages, or other factors, not only is their normal operation affected, but data loss can also occur due to the inability to save data in time, leading to irreparable damage. Currently, the main solution is to incorporate a delayed power supply module within the electronic device. This module provides a short-term emergency power supply during power outages, laying the foundation for data preservation and safe system shutdown, thus preventing data loss.

[0003] In a time-delay power supply module, the power supply components are typically mounted on a separate circuit board, which is then directly connected to the chassis wall for installation. Furthermore, to reduce the board's size, the power supply components are usually arranged quite densely. However, this results in large capacitors and other power supply components, and the limited space within the chassis hinders effective heat dissipation. Additionally, the power supply components can obstruct the user's view during installation, making the process more difficult. Utility Model Content

[0004] In view of the above problems, this application provides an electronic device to solve the problem of the difficulty in installing delayed power supply modules in existing electronic devices.

[0005] According to one aspect of the embodiments of this application, an electronic device is provided. The electronic device includes a chassis, comprising a main body and a cover plate. A mounting groove is formed on the main body, and the cover plate covers the opening of the mounting groove and is detachably connected to the main body. A motherboard is disposed in the mounting groove. A time-delay power supply assembly includes a fixing plate, a capacitor, and a power supply resistor. The capacitor and the power supply resistor are both disposed on one side of the fixing plate. The fixing plate is disposed at the opening of the mounting groove, and the side on which the capacitor and the power supply resistor are disposed faces the motherboard. The capacitor is electrically connected to the motherboard through the power supply resistor and is used to supply power to the motherboard when the electronic device is powered off, so as to achieve time-delay power-off. The power supply resistor is attached to the fixing plate, and the side of the fixing plate away from the capacitor is attached to the cover plate, so that the heat of the power supply resistor is conducted to the outside through the fixing plate and the cover plate in sequence.

[0006] In one alternative embodiment, the sidewall of the mounting groove extends into the mounting groove to form a fixing bracket, and the end of the fixing bracket opposite to the sidewall of the mounting groove is recessed into the bottom wall of the mounting groove to form a step portion, which is fixedly connected to the fixing plate to limit the position of the fixing plate by the step slope of the step portion.

[0007] In one alternative approach, a fixing hole is provided on the side of the fixing plate facing the cover plate, and a through hole is provided at a corresponding position on the cover plate. The through hole is used for fasteners to pass through and connect to the fixing hole, so that the cover plate is pressed against the fixing plate by the fasteners, so that the cover plate and the fixing plate are tightly attached.

[0008] In one alternative embodiment, the delay power supply assembly further includes a capacitor board, which is disposed on the side of the mounting plate facing the motherboard and is fixedly connected to the mounting plate. A capacitor is disposed on the capacitor board, and a power supply resistor is disposed on the side of the capacitor board facing the mounting plate and is attached to the mounting plate.

[0009] In one alternative embodiment, a capacitor's solder feet are provided through the capacitor plate, with the solder feet at least partially protruding from the side of the capacitor plate facing the fixing plate; a thermally conductive limiting member is sandwiched between the power supply resistor and the fixing plate to separate the solder feet from the fixing plate.

[0010] In one alternative approach, a clearance opening is provided on the capacitor plate, the capacitor passes through the clearance opening, and a portion of the capacitor is located in the gap between the fixing plate and the capacitor plate.

[0011] In one alternative embodiment, heat-generating devices are provided on both sides of the motherboard. The heat-generating devices on the first side of the motherboard are in contact with the bottom wall of the mounting slot, so that the bottom wall of the mounting slot dissipates heat from the heat-generating devices on the first side. The electronic device also includes a heat-conducting component, which has a first contact surface and a second contact surface perpendicular to each other. The first contact surface is in contact with the heat-generating devices on the second side of the motherboard, and the second contact surface is in contact with the side wall of the mounting slot. The heat-conducting component is used to conduct the heat from the heat-generating devices on the second side to the side wall of the mounting slot through the first contact surface and the second contact surface, so that the heat-generating devices on the second side are dissipated through the side wall of the mounting slot.

[0012] In one alternative embodiment, the heat-generating device on the first surface includes a processor, the height of which is lower than the height of at least some other heat-generating devices on the first surface; a heat-conducting block is sandwiched between the processor and the bottom wall of the mounting slot, the heat-conducting block being used to conduct the heat of the processor to the bottom wall of the mounting slot, so as to dissipate heat from the processor through the bottom wall of the mounting slot.

[0013] In one alternative approach, a limiting groove is provided on the bottom wall of the mounting groove facing the inside of the mounting groove, and the heat-conducting block is inserted into the limiting groove to restrict the movement of the heat-conducting block in the horizontal direction.

[0014] In one alternative approach, the capacitor is cylindrical, with its height greater than its width, and is positioned horizontally.

[0015] This embodiment of the application places the capacitor and power supply resistor of the time-delay power supply component on the same side of the mounting plate, and then inverts the side of the mounting plate containing the capacitor and power supply resistor into the mounting groove. This ensures that the side of the mounting plate without the component faces the user, and the mounting plate is located at the opening of the mounting groove. When the mounting plate is connected to the side wall of the mounting groove, the view is not obstructed by the components of the time-delay power supply component, and the opening of the groove is open, providing sufficient space for the user to perform installation operations, making the installation of the time-delay power supply component more convenient. Furthermore, by attaching the power supply resistor to the mounting plate and the mounting plate to the cover plate, the heat generated by the power supply resistor can be directly conducted to the outside through the mounting plate and cover plate. This eliminates the need for openings in the chassis and installing a fan cooling system inside the electronic device, effectively preventing environmental factors such as dust, vibration, and temperature changes from affecting the internal components of the electronic device, thus improving the stability of the electronic device.

[0016] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, specific embodiments of this application are given below. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0018] Figure 1 A perspective view of the electronic device provided in an embodiment of the present invention is shown;

[0019] Figure 2 A cross-sectional view of an electronic device provided in an embodiment of the present invention is shown;

[0020] Figure 3 A perspective view of a portion of the structure of the electronic device provided in an embodiment of the present invention is shown;

[0021] Figure 4 An exploded view of a portion of the structure of the electronic device provided in an embodiment of this utility model is shown;

[0022] Figure 5 A perspective view of another part of the structure of the electronic device provided in this embodiment of the present invention is shown;

[0023] Figure 6 A perspective view of the bottom wall of the mounting groove in the electronic device provided in this embodiment of the present invention is shown;

[0024] Figure 7 A perspective view of the electronic device provided in an embodiment of the present invention is shown from another angle;

[0025] Figure 8 An exploded view of the electronic device provided in an embodiment of the present invention is shown.

[0026] The reference numerals in the detailed embodiments are as follows:

[0027] 1. Electronic equipment;

[0028] 100. Chassis; 200. Motherboard; 300. Delay power supply assembly; 400. Thermal conductive components; 500. Fasteners; 600. Power supply module; 700. I / O module;

[0029] 110. Main body; 120. Cover plate;

[0030] 111. Mounting groove; 1111. Groove opening; 1112. Side wall; 1113. Bottom wall; 1113a. Groove; 1113b. Limiting groove;

[0031] 112. Fixed support; 1121. Step section; 1122. Step slope;

[0032] 121. Through hole;

[0033] 210. Heating element; 220. First side; 230. Second side; 240. Heat-conducting block;

[0034] 310. Fixing plate; 320. Capacitor; 330. Power supply resistor; 340. Capacitor plate; 350. Thermally conductive limiting component;

[0035] 311. Mounting hole; 312. Fixing hole; 313. Stud; 321. Welding foot; 341. Clearance opening;

[0036] 410. First bonding surface; 420. Second bonding surface; 430. Heat-conducting plate; 431. Heat-conducting section;

[0037] 710. Circuit board; 711. I / O interface. Detailed Implementation

[0038] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0040] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0041] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0042] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0043] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0044] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0045] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0046] Electronic devices may experience sudden power outages due to human error, power failures, or other factors during operation. In such cases, files being edited or saved on the device may not have been fully written to the storage medium, leading to data loss or inconsistencies. In severe cases, system files may be corrupted, affecting system stability. Furthermore, sudden power outages can leave the system in an unstable state due to improper shutdown, potentially causing system crashes or slow performance upon restart. Therefore, it is essential to incorporate a delayed power supply module into electronic devices. This module provides a short-term emergency power supply during power outages, allowing the device to save data and safely shut down the system.

[0047] Currently, there are two main power supply methods for delayed power supply modules. One method uses an external UPS or backup power supply to provide emergency power to electronic equipment, while the other uses capacitors (such as supercapacitors) to provide emergency power. In the first method, the external UPS is bulky and requires a lot of space, which can affect the installation of other equipment in the work environment. Backup power supplies are also relatively expensive, and their charging capacity and number of charging cycles can decrease, leading to insufficient equipment reliability after long-term operation.

[0048] Therefore, electronic devices used in special environments (such as industrial environments), taking industrial computers as an example, typically employ a second power supply method (i.e., capacitors) to provide emergency power due to limited space in industrial settings and the higher reliability and stability requirements of industrial computers. Specifically, the capacitors, power supply resistors, and other power supply components in the time-delay power supply module are integrated onto a separate circuit board. Screws and other fasteners are then passed through through-holes on the board and directly connected to the chassis to secure the board. Furthermore, to reduce the board's size, the power supply components are usually arranged relatively densely. However, capacitors and other power supply components are typically quite large, and the limited space within the chassis makes installation difficult, as these components can obstruct the user's view.

[0049] Therefore, to facilitate the installation of the delay power supply module, this application proposes an electronic device. The device's chassis includes a main body and a cover plate. The motherboard and the delay power supply component are both housed in a mounting slot within the main body. The cover plate covers the opening of the mounting slot and is detachably connected to the main body. Specifically, the delay power supply component includes a mounting plate, a capacitor, and a power supply resistor, with the capacitor and power supply resistor both located on the same side of the mounting plate. When installing the delay power supply component, the side of the mounting plate containing the capacitor and power supply resistor is inverted and placed inside the mounting slot, i.e., the mounting plate is placed at the opening of the mounting slot, with the side containing the capacitor and power supply resistor facing the motherboard. At this time, the side of the mounting plate facing the user is free of any components, and the opening of the mounting slot is open. The user's view is not obstructed during the installation of the delay power supply component, and the slot has sufficient space to easily secure the mounting plate.

[0050] Furthermore, capacitors are electrically connected to the motherboard via power supply resistors to provide power to the motherboard when the electronic device is powered off, thus achieving a delayed power-off. However, when capacitors supply power to the motherboard through power supply resistors, the power supply resistors generate a significant amount of heat. If the power supply resistors are not cooled in time, this heat will accumulate inside the chassis, potentially causing the chassis temperature to become too high. This can lead to most components operating at overheating levels, impacting the operational status and lifespan of the electronic device. In particular, electronic devices used in special environments (such as industrial environments) typically lack fan cooling systems within their chassis to prevent damage from dust, vibration, and temperature fluctuations. This further exacerbates the problem of ineffective heat dissipation from the power supply resistors.

[0051] Therefore, to ensure proper heat dissipation of the power supply resistor, in the electronic device provided in this application, the power supply resistor of the time-delay power supply component is also attached to a mounting plate, and the side of the mounting plate away from the capacitor and the power supply resistor is attached to a cover plate. This structure allows the heat from the power supply resistor to be conducted to the outside through the mounting plate and the cover plate in sequence, thus dissipating heat from the power supply resistor in a timely manner and preventing the heat from accumulating inside the chassis and affecting other components inside the chassis.

[0052] Please see Figures 1 to 4 , Figure 1 A perspective view of the electronic device provided in an embodiment of the present invention is shown. Figure 2 A cross-sectional view of an electronic device provided in an embodiment of the present invention is shown. Figure 3 A perspective view of a portion of the structure of the electronic device provided in an embodiment of the present invention is shown. Figure 4An exploded view of a portion of the structure of an electronic device provided in an embodiment of this utility model is shown. The electronic device 1 can be an industrial computer, or a device similar to an industrial computer that does not have an internal heating system. In this embodiment, only an industrial computer is used as an example for illustration. The electronic device 1 includes a chassis 100, a motherboard 200, and a delayed power supply assembly 300.

[0053] like Figure 1 and Figure 2 As shown, the chassis 100 includes a main body 110 and a cover plate 120. A mounting groove 111 is formed on the main body 110. The cover plate 120 covers the groove opening 1111 of the mounting groove 111 and is detachably connected to the main body 110. The motherboard 200 is disposed in the mounting groove 111.

[0054] like Figure 2 , Figure 3 and Figure 4 As shown, the delayed power supply assembly 300 includes a fixing plate 310, a capacitor 320, and a power supply resistor 330. Both the capacitor 320 and the power supply resistor 330 are disposed on one side of the fixing plate 310, which is located at the slot 1111 of the mounting groove 111, with the side of the fixing plate with the capacitor 320 and the power supply resistor 330 facing the motherboard 200. The capacitor 320 is electrically connected to the motherboard 200 through the power supply resistor 330, and is used to supply power to the motherboard 200 when the electronic device 1 is powered off, thus achieving delayed power-off. The power supply resistor 330 is attached to the fixing plate 310, and the side of the fixing plate 310 facing away from the capacitor 320 is attached to the cover plate 120, allowing the heat from the power supply resistor 330 to be conducted to the outside through the fixing plate 310 and the cover plate 120 in sequence.

[0055] The chassis 100 has internal space to accommodate various functional components (e.g., motherboard 200, delay power supply component 300, etc.), and also serves to dissipate heat from internal components that generate heat. The chassis 100 includes a main body 110 and a cover plate 120, such as... Figure 1 As shown, the vertically arranged wall in the chassis 100 is the side wall 1112 of the chassis 100. The side wall 1112 and the wall located above the side wall 1112 and arranged horizontally together constitute the main body 110. The wall located below the side wall 1112 and arranged horizontally is the cover plate 120. All the walls included in the main body 110 can be integrally formed, or multiple parts can be fixedly connected by means of bonding, welding, etc., or they can be connected by detachable connection methods such as snap-fit ​​or threaded connection. The cover plate 120 is detachably connected to the main body 110, specifically by means of snap-fit ​​or threaded connection. In this way, when the electronic device 1 malfunctions, the cover plate 120 can be directly removed from the main body 110 for inspection and repair of the components inside the chassis 100.

[0056] Both the motherboard 200 and the delay power supply component 300 are housed in the mounting slot 111 of the main body 110. For example... Figure 2 and Figure 3 As shown, the motherboard 200 and the delay power supply component 300 are vertically stacked within the mounting slot 111. This not only reduces the horizontal area of ​​the electronic device but also makes the internal structure of the mounting slot 111 more compact, thus improving the utilization rate of the internal space. In this embodiment, as an example, the motherboard 200 can be placed at the bottom of the mounting slot 111, the delay power supply component can be placed at the opening of the mounting slot 111, and the bottom wall 1113 and side wall 1112 of the mounting slot 111 can be detachably connected. When maintenance of the motherboard 200 is required, only the bottom wall 1113 needs to be removed from the side wall 1112 for direct maintenance of the motherboard 200, making component maintenance within the mounting slot 111 more convenient.

[0057] Furthermore, heat-generating devices 210 are typically located on both sides of the motherboard 200. Positioning the motherboard 200 at the bottom of the mounting slot 111 allows for full utilization of the side walls 1112 and bottom wall 1113 of the mounting slot 111 to dissipate heat from the heat-generating devices 210. Specifically, as... Figure 2 and Figure 5 As shown, Figure 5 This diagram shows a perspective view of another part of the structure of the electronic device provided in this embodiment of the present invention. Heating devices 210 are provided on both sides of the motherboard 200. The heating devices 210 on the first side 220 of the motherboard 200 are in contact with the bottom wall 1113 of the mounting groove 111, so that the bottom wall 1113 of the mounting groove 111 dissipates heat from the heating devices 210 on the first side 220. The electronic device 1 also includes a heat-conducting component 400, which has a first contact surface 410 and a second contact surface perpendicular to each other. Surface 420, the first bonding surface 410 is bonded to the heat-generating device 210 on the second surface 230 of the motherboard 200, and the second bonding surface 420 is bonded to the side wall 1112 of the mounting groove 111. The heat-conducting component 400 is used to conduct the heat of the heat-generating device 210 on the second surface 230 to the side wall 1112 of the mounting groove 111 through the first bonding surface 410 and the second bonding surface 420, so as to dissipate heat from the heat-generating device 210 on the second surface 230 through the side wall 1112 of the mounting groove 111.

[0058] like Figure 2 and Figure 5As shown, heat-generating devices 210 are provided on both the first side 220 and the second side 230 of the motherboard 200. The first side 220 is the side of the motherboard 200 that directly faces the chassis 100, that is, the first side 220 directly faces the bottom wall 1113 of the mounting slot 111. Therefore, the heat-generating devices 210 on the first side 220 can directly contact the bottom wall 1113 of the mounting slot 111, thereby conducting heat to the bottom wall 1113 of the mounting slot 111 for heat dissipation. The heat-generating devices 210 on the first side 220 may include the processor, memory, MOS devices, 5G modules, and other heat-generating devices. The heights of these heat-generating devices 210 are different, and the height of the processor is lower than the height of at least some of the other heat-generating devices on the first side 220.

[0059] Therefore, in order to ensure that the heat generated by the processor can be conducted to the bottom wall 1113 for heat dissipation, such as Figure 2 As shown, a heat-conducting block 240 is sandwiched between the processor and the bottom wall 1113 of the mounting slot 111. The heat-conducting block 240 is used to conduct the heat of the processor to the bottom wall 1113 of the mounting slot 111, so that the processor can be dissipated through the bottom wall 1113 of the mounting slot 111. The heat-conducting block 240 can be integrally formed with the bottom wall 1113, that is, the heat-conducting block 240 can be a protrusion extending from the bottom wall 1113 towards the mounting slot 111, or it can be an independent component connected to the bottom wall 1113 by bonding, welding, threaded connection, etc. By sandwiching the heat-conducting block 240 between the processor and the bottom wall 1113, it can be ensured that when other heat-generating devices on the first surface 220 are in contact with the bottom wall 1113, the processor can be in contact with the heat-conducting block 240, thereby ensuring that the processor can dissipate heat normally.

[0060] Of course, in order to better fit the bottom wall 1113 of the mounting slot 111 with other heating devices on the first surface 220, such as Figure 6 As shown, Figure 6 A perspective view of the bottom wall of the mounting slot in the electronic device provided by this embodiment of the present invention is shown. A groove 1113a, which is height-adapted to other heat-generating devices on the first surface 220, can also be provided on the side of the bottom wall 1113 of the mounting slot 111 facing the mounting slot 111. This allows the bottom wall 1113 to fit against other heat-generating devices on the first surface 220 through the groove 1113a after the motherboard 200 is placed in the mounting slot 111. Furthermore, a protrusion that is height-adapted to other heat-generating devices can also be provided on the bottom wall 1113.

[0061] Furthermore, the processors installed inside different electronic devices 1 may be different, and the shapes of the processors may also be different. Therefore, in order to ensure that different processors can fit well with the heat-conducting block 240, the heat-conducting block 240 does not need to be fixed to the bottom wall 1113 by means of adhesive, welding, threaded connection, etc. Instead, pressure is applied to the heat-conducting block 240 by the processor and the bottom wall 1113 to fix the heat-conducting block 240. When encountering different processors, heat-conducting blocks 240 of different shapes can be placed between the processor and the bottom wall 1113, making the replacement and installation of the heat-conducting block 240 more convenient.

[0062] However, when the electronic device 1 experiences violent movement due to an accident such as an impact or drop, if the pressure applied to the heat-conducting block 240 by the processor and the bottom wall 1113 is insufficient, the heat-conducting block 240 may shift in position due to insufficient friction between its surface and the surfaces of the processor and the bottom wall 1113. Therefore, to keep the heat-conducting block 240 relatively fixed, such as... Figure 2 and Figure 6 As shown, a limiting groove 1113b is also provided on the side of the bottom wall 1113 of the mounting groove 111 facing into the mounting groove 111. The heat-conducting block 240 is inserted into the limiting groove 1113b to restrict the heat-conducting block 240 in the horizontal direction (i.e., the direction parallel to the bottom wall 1113, for example) through the limiting groove 1113b. Figure 6 Movement in the direction indicated by the double arrow X or the double arrow Y.

[0063] By providing a limiting groove 1113b on the bottom wall 1113, the heat-conducting block 240 can be restricted from moving in a direction parallel to the bottom wall 1113 by the side wall of the limiting groove 1113b. In other words, the heat-conducting block 240 can be restricted from moving in a direction parallel to the bottom wall 1113 by the side wall of the limiting groove 1113b. Figure 6 Movement in the direction indicated by the double arrow X or the double arrow Y effectively prevents the heat-conducting block 240 from failing to fit the processor due to positional displacement. During the assembly of the electronic device 1, the heat-conducting block 240 can also be pre-positioned via the limiting groove 1113b, making the assembly of the electronic device 1 more convenient.

[0064] Furthermore, to prevent processing errors from causing the processor and bottom wall 1113 to fail to apply pressure to the heatsink 240, thermally conductive elastic pads such as silicone pads or rubber pads can be sandwiched between the heatsink 240 and the processor. This not only allows for better heat transfer from the processor to the heatsink 240 through the thermally conductive elastic pads, but also utilizes the elasticity of the pads to prevent problems caused by processing errors that prevent the heatsink 240 from properly adhering to the processor. Alternatively, thermally conductive pads or thermal grease can be placed between the heatsink 240 and the bottom wall 1113 to improve the heat transfer efficiency between them.

[0065] like Figure 2 and Figure 5 As shown, since a delayed power supply component 300 is also provided between the motherboard 200 and the cover plate 120, the heat-generating device 210 on the second side 230 of the motherboard 200 cannot directly dissipate heat by being in contact with the cover plate 120. Therefore, a heat-conducting component 400 can be provided in the mounting slot 111 to conduct the heat generated by the heat-generating device 210 on the second side 230 to the side wall 1112 for heat dissipation. Specifically, the first contact surface 410 of the heat-conducting component 400 is in contact with the heat-generating device 210 on the second side 230, and the second contact surface 420 of the heat-conducting component 400 is in contact with the side wall 1112, so that the heat generated by the heat-generating device 210 on the second side 230 is conducted to the heat-conducting component 400 through the first contact surface 410, and then to the side wall 1112 through the second contact surface 420.

[0066] Specifically, heat-conducting components 400 can be individually provided for each heating element 210 on the second surface 230, or a single heat-conducting component 400 can be provided for heating elements 210 of the same height or in close proximity, thereby reducing the number of parts in the electronic device 1. The heat-conducting component 400 can be a relatively tall block. In this case, the first bonding surface 410 can be the bottom surface of the heat-conducting component 400, and the second bonding surface 420 can be any side surface of the heat-conducting component 400. Of course, when the heat-conducting component 400 needs to conduct heat to multiple heating elements 210 simultaneously, and these heating elements 210 have different heights, protrusions or grooves adapted to the height of the heating elements 210 can also be provided on the first bonding surface 410. The heat-conducting component 400 can be made of metal materials with good thermal conductivity, such as aluminum or aluminum-magnesium alloy.

[0067] Since part of the heat-conducting component 400 is located between the motherboard 200 and the delay power supply component 300, if the heat-conducting component 400 is still a relatively tall block, it will result in a relatively tall and large overall size of the electronic device 1. Therefore, in order to reduce the size of the electronic device 1, such as Figure 2 As shown, the heat-conducting component 400 can be a heat-conducting plate 430, and the heat-conducting plate 430 is vertically bent to form multiple heat-conducting segments 431. The first bonding surface 410 and the second bonding surface 420 are each located on one of the heat-conducting segments 431. The heat-conducting component 400 with this structure occupies less space in the height direction of the electronic device 1, which helps to reduce the overall height of the electronic device 1 and thus reduce the volume of the electronic device 1.

[0068] When the heating element 210 that is attached to the first contact surface 410 is located near one of the side walls 1112 of the mounting groove 111, and there are no other components between them or the other components are of low height, the heat-conducting plate 430 can be bent to form two heat-conducting sections 431. If the height of other components between the heating element 210 that is attached to the first contact surface 410 and the side wall 1112 is higher than the height of the heating element, the heat-conducting plate 430 can be bent to form two or more heat-conducting sections 431, so that the heat-conducting plate 430 can avoid other components and attach the second contact surface 420 to the side wall 1112.

[0069] By evenly conducting the heat generated by the heat-generating device 210 on the motherboard 200 to each wall of the main body 110, the walls of the main body 110 all participate in the heat dissipation of the heat-generating device 210 on the motherboard 200, making full use of the heat conduction of the main body 110, and fully considering the heat generation of all power consumption heat sources on the motherboard 200, effectively avoiding heat accumulation inside the chassis 100.

[0070] The delayed power supply component 300 provides a short-term emergency power supply to the motherboard 200 when the electronic device 1 loses power, enabling the electronic device 1 to save data and safely shut down the system. The delayed power supply component 300 is connected to the main body 110 via a mounting plate 310 to securely mount the delayed power supply component 300 within the mounting slot 111. Figure 2 As shown, capacitor 320 and power supply resistor 330 are both located on the side of fixed plate 310 facing motherboard 200. Capacitor 320 can be supercapacitor, electrolytic capacitor, double-layer capacitor, etc., and power supply resistor 330 can be discharge resistor, charging resistor, bleed current resistor, etc., to supply power to motherboard 200 when electronic device 1 is powered off.

[0071] Capacitor 320 and power supply resistor 330 can be directly mounted on the fixing plate 310, meaning the fixing plate 310 is a circuit board for integrating capacitor 320 and power supply resistor 330. Furthermore, the heat generated by the power supply resistor 330 needs to be conducted through the fixing plate 310 to the cover plate 120, and then through the cover plate 120 to the outside for heat dissipation. If the fixing plate 310 is a circuit board, the circuit board needs to be directly attached to the cover plate 120, which may cause stress on the circuit board due to differences in thermal expansion coefficients, potentially damaging the circuit board or components on it. Therefore, to ensure the stability of the delayed power supply, such as Figure 2 and Figure 4 As shown, the delay power supply component 300 also includes a capacitor plate 340, which is disposed on the side of the fixing plate 310 facing the main board 200 and is fixedly connected to the fixing plate 310. A capacitor 320 is disposed on the capacitor plate 340, and a power supply resistor 330 is disposed on the side of the capacitor plate 340 facing the fixing plate 310 and is attached to the fixing plate 310.

[0072] The capacitor 320 can be positioned at any location on the capacitor plate 340. Specifically, it can be positioned on the side of the capacitor plate 340 away from the fixing plate 310, or it can be positioned on the side of the capacitor plate 340 facing the fixing plate 310. In this case, since the height of the capacitor 320 is higher than the height of the power supply resistor 330, in order to make the fixing plate 310 fit with the power supply resistor 330, a protrusion adapted to the height of the power supply resistor 330 can be provided on the fixing plate 310 so that the fixing plate 310 fits with the power supply resistor 330.

[0073] When assembling the time-delay power supply component 300, firstly, the capacitor 320 and the power supply resistor 330 are placed on the capacitor plate 340. Then, the side of the capacitor plate 340 with the power supply resistor 330 is positioned facing the fixing plate 310. The capacitor plate 340 is then fixedly connected to the fixing plate 310, so that the power supply resistor 330 is in contact with the fixing plate 310, thereby completing the assembly of the time-delay power supply component 300. Specifically, as follows... Figure 4 As shown, a mounting hole 311 can be provided on the side of the fixing plate 310 facing the capacitor plate 340, and a through hole can be opened on the capacitor plate 340. Then, the fastener 500 passes through the through hole on the capacitor plate 340 and is connected to the mounting hole 311 to fix the capacitor plate 340 and the fixing plate 310 together.

[0074] By setting up a capacitor plate 340 and integrating the capacitor 320 and the power supply resistor 330 on the capacitor plate 340, and then attaching the side of the power supply resistor 330 away from the capacitor plate 340 to the fixing plate 310, the heat of the power supply resistor 330 is conducted to the cover plate 120 through the fixing plate 310. This avoids directly attaching the circuit board with the integrated capacitor 320 and the power supply resistor 330 to the cover plate 120, thereby preventing the heat conducted by the power supply resistor 330 to the cover plate 120 from affecting the circuit board and helping to ensure the stability of the delay power supply component 300.

[0075] When installing the time-delay power supply component 300, such as Figure 3As shown, the side of the fixing plate 310 with the capacitor 320 is inverted and placed into the mounting slot 111. The side of the fixing plate 310 facing away from the main board 200 has no components, so the user can directly see the connection structure on the fixing plate 310 through the slot 1111 of the mounting slot 111. At this time, connecting the fixing plate 310 to the side wall 1112 at the slot opening of the mounting slot 111 completes the installation of the time-delay power supply component 300. Finally, the cover plate 120 is placed over the slot opening of the mounting slot 111 and connected to the main body 110, so that the cover plate 120 and the fixing plate 310 are in close contact, allowing heat dissipation for the power supply resistor 330 through the cover plate 120 and the fixing plate 310. The fixing plate 310 can be connected to the side wall 1112 by snap-fit, adhesive, welding, or other methods. Specifically, the fixing plate 310 can be directly connected to the surface at the opening of the mounting groove 111, that is, the fixing plate 310 can be directly connected to the surface of the side wall 1112 facing the cover plate 120. Alternatively, the side wall 1112 can extend into the mounting groove 111 to form a connecting structure, and then the fixing plate 310 can be connected to the connecting structure inside the mounting groove 111.

[0076] In the above embodiment, by setting the capacitor 320 and the power supply resistor 330 of the time-delay power supply component 300 on the same side of the fixing plate 310, and by upside down setting the side of the fixing plate 310 with the capacitor 320 and the power supply resistor 330 in the mounting groove 111, the side of the fixing plate 310 without the device faces the user, and the fixing plate 310 is located at the opening of the mounting groove 111. When the fixing plate 310 is connected to the side wall of the mounting groove 111, not only will the view not be blocked by the device of the time-delay power supply component 300, but the opening 1111 is in an open state, providing sufficient space for the user to perform installation operations, making the installation of the time-delay power supply component 300 more convenient. Furthermore, by attaching the power supply resistor 330 to the mounting plate 310 and attaching the mounting plate 310 to the cover plate 120, the heat generated by the power supply resistor 330 can be directly conducted to the outside through the mounting plate 310 and the cover plate 120. This eliminates the need to drill holes in the chassis 100 and install a fan cooling system inside the electronic device 1, effectively preventing environmental factors such as dust, vibration, and temperature changes from affecting the internal components of the electronic device 1 and improving the stability of the electronic device 1.

[0077] Furthermore, most of the electronic components within the electronic device 1 are typically mounted directly on the motherboard 200, resulting in a relatively large area for the motherboard 200. This also leads to a relatively large area at the opening of the mounting slot 111. The mounting plate 310, on the other hand, usually only needs to house the capacitors 320 and power supply resistors 330 included in the delay power supply assembly 300. To save costs and reduce the weight of the electronic device 1, the mounting plate 310 can be made smaller than the area of ​​the motherboard 200. However, this results in the area at the opening of the mounting slot 111 being larger than the area of ​​the mounting plate 310. When only the mounting plate 310 is located at the opening of the mounting slot 111, the position of the mounting plate 310 is prone to shifting during the connection process between the mounting plate 310 and the side wall 1112 of the mounting slot 111. This makes it difficult to align the connection structure on the mounting plate 310 with the connection structure on the side wall 1112 of the mounting slot 111, increasing installation difficulty. Furthermore, when there are taller components on the side of the motherboard 200 facing the fixing plate 310 but not opposite to the fixing plate 310, the capacitor 320 may collide with the components on the motherboard 200 after the fixing plate 310 is shifted, which may easily cause damage to the components.

[0078] Therefore, in order to facilitate the connection between the fixing plate 310 and the side wall 1112 of the mounting groove 111, in some embodiments of this application, such as Figure 3 and Figure 4 As shown, the side wall 1112 of the mounting groove 111 extends into the mounting groove 111 to form a fixing bracket 112. One end of the fixing bracket 112 away from the side wall 1112 of the mounting groove 111 is recessed into the bottom wall 1113 of the mounting groove 111 to form a step portion 1121. The step portion 1121 is fixedly connected to the fixing plate 310 so as to limit the position of the fixing plate 310 by the step slope 1122 of the step portion 1121.

[0079] Specifically, fixing brackets 112 extend into the mounting groove 111 on both opposite sidewalls 1112 of the mounting groove 111. For example, when the length of the fixing plate 310 is closer to the mounting groove 111 along... Figure 3 When the length of the sidewall 1112 is set in the direction indicated by the double arrow Y, it can be along the mounting groove 111. Figure 3 The sidewall 1112, positioned in the direction indicated by the double arrow X, extends toward the interior of the mounting groove 111 to form a fixing bracket 112; when the length of the fixing plate 310 is closer to the mounting groove 111 along... Figure 3 When the length of the sidewall 1112 is set in the direction indicated by the double arrow X, it can be along the mounting groove 111. Figure 3 The side wall 1112, which is set in the direction indicated by the double arrow Y, extends into the mounting groove 111 to form a fixed bracket 112.

[0080] Furthermore, when forming the mounting bracket 112, only the side wall 1112 located at the opening 1111 of the mounting groove 111 can be extended into the mounting groove 111, thus reducing the space occupied by the mounting bracket 112 within the mounting groove 111. Only one mounting bracket 112 with a length matching the width of the mounting plate 310 can be provided on one side wall, simplifying the structure on the chassis 100. Alternatively, multiple shorter mounting brackets 112 can be provided on the same side wall, and the mounting plate 310 can be installed by simultaneously connecting the mounting plate 310 to multiple mounting brackets 112. This structure reduces the overall volume of the mounting bracket 112, which helps to reduce the weight of the electronic device 1.

[0081] like Figure 4 As shown, one end of the fixing bracket 112 that faces away from the side wall is recessed towards the bottom wall 1113 of the mounting groove 111, so that the fixing bracket 112 forms a step portion 1121 with a relatively low height. In this embodiment of the application, as an example, such as... Figure 3 and Figure 4 As shown, the fixing bracket 112 is formed by extending the side wall 1112 of the mounting groove 111 into the mounting groove 111 along the direction indicated by the double arrow X in the figure. In this case, the fixing bracket 112 is positioned along the direction indicated by the double arrow Y in the figure. When the fixing plate 310 is connected to the step portion 1121, the step slope 1122 of the step portion 1121 will be located on both sides of the fixing plate 310 along the direction indicated by the double arrow Y, thereby restricting the movement of the fixing plate 310 in the direction indicated by the double arrow Y. Alternatively, it can be formed by extending the side wall 1112 of the mounting groove 111 into the mounting groove 111 along the direction indicated by the double arrow Y in the figure. In this case, the step slope 1122 of the step portion 1121 is used to restrict the movement of the fixing plate 310 in the direction indicated by the double arrow X in the figure.

[0082] By setting a fixed bracket 112 and forming a step portion 1121 and a step slope 1122 on the fixed bracket 112, the position of the fixed plate 310 can be restricted by the step slope 1122 of the step portion 1121, thereby making the installation of the fixed plate 310 more convenient.

[0083] Furthermore, the fixing plate 310 has a relatively large area. When the cover plate 120 is attached to the fixing plate 310, gaps may exist between the fixing plate 310 and the cover plate 120 due to factors such as processing errors. This will affect the heat conduction between the fixing plate 310 and the cover plate 120. Therefore, in order to make the fixing plate 310 and the cover plate 120 fit more tightly, in some embodiments of this application, such as... Figure 3 and Figure 7 As shown, Figure 7The diagram shows a perspective view of the electronic device provided in this embodiment of the present invention from another angle. The fixing plate 310 is provided with a fixing hole 312 on the side facing the cover plate 120. A through hole 121 is provided at a corresponding position on the cover plate 120. The through hole 121 is used for fasteners to pass through and connect to the fixing hole 312, so that the cover plate 120 is pressed against the fixing plate 310 by the fasteners, so that the cover plate 120 and the fixing plate 310 are tightly attached.

[0084] Specifically, the fixing hole 312 can be a threaded hole, and the fastener can be a screw, bolt, or other component that can be threaded into the threaded hole. When the cover plate 120 is not tightly fitted to the fixing plate 310 due to long-term use of the electronic device 1, the cover plate 120 and the fixing plate 310 can be tightly fitted again by tightening the fastener. By providing the fixing hole 312 on the fixing plate 310 and the through hole 121 at the corresponding position on the cover plate 120, when the cover plate 120 is connected to the main body 110, the cover plate 120 and the fixing plate 310 can be tightly fitted by the fastener, which helps to improve the heat conduction efficiency between the cover plate 120 and the fixing plate 310, thereby improving the heat dissipation efficiency of the power supply resistor 330.

[0085] Furthermore, the delayed power supply component 300 needs to provide a stable current to the motherboard 200 when the electronic device 1 is powered off, so that the devices on the motherboard 200 can function normally. The capacitor 320, as a power source, is typically not directly connected to the motherboard 200, but rather electrically connected to the capacitor board 340. The electrical connection between the capacitor 320 and the motherboard 200 is achieved by electrically connecting the capacitor board 340 and the motherboard 200. Therefore, to ensure that the capacitor 320 can stably supply current to the motherboard 200, the stability of the connection between the capacitor 320 and the capacitor board 340 needs to be guaranteed.

[0086] The solder feet 321 on the capacitor 320 provide good mechanical fixation, allowing the capacitor 320 to be securely mounted on the capacitor plate 340. It is not easily dislodged due to vibration or other external forces. Furthermore, the solder joints of the solder feet 321 can withstand long-term current flow, reducing the likelihood of increased resistance or poor connection. Therefore, in some embodiments of this application, the capacitor 320 can be fixed by inserting the solder feet 321 of the capacitor 320 into the capacitor plate 340 and then fixing the solder feet 321 to the capacitor plate 340 through soldering.

[0087] However, the solder leads 321 on capacitor 320 are usually quite long. After being inserted into capacitor board 340, solder leads 321 typically protrude 3mm to 12mm. Power supply resistor 330 is usually a surface mount resistor, and most surface mount resistors are no more than 1mm high; even larger SMD resistors are typically between 1.2mm and 2.5mm high. If power supply resistor 330 is directly attached to mounting plate 310, solder leads 321 may come into contact with mounting plate 310. To ensure the thermal conductivity of mounting plate 310, it is usually made of metals such as aluminum or aluminum-magnesium alloy. Direct contact between solder leads 321 and mounting plate 310 can cause capacitor 320 to short-circuit, affecting the normal operation of delay power supply component 300.

[0088] Therefore, to avoid direct contact between the welding foot 321 and the fixing plate 310, in some embodiments of this application, such as Figure 2 and Figure 4 As shown, a welding foot 321 of a capacitor 320 is provided through the capacitor plate 340. The welding foot 321 protrudes at least partially from the side of the capacitor plate 340 facing the fixing plate 310. A thermally conductive limiting member 350 is sandwiched between the power supply resistor 330 and the fixing plate 310. The thermally conductive limiting member 350 is used to separate the welding foot 321 from the fixing plate 310.

[0089] Furthermore, to reduce the number of components in electronic device 1, the power supply resistors 330 on capacitor plate 340 can be centrally located in one position. This allows for the use of only one thermally conductive limiting member 350 to conduct heat from the power supply resistors 330 to the mounting plate 310. Additionally, to ensure relative stability between capacitor plate 340 and mounting plate 310, such as... Figure 2 As shown, studs 313 can also be provided on the fixing plate 310, and mounting holes 311 on the fixing plate 310 can be provided on the studs 313. When the capacitor plate 340 and the fixing plate 310 are fixedly connected, the positional relationship between the capacitor plate 340 and the fixing plate 310 can be restricted by the studs 313 at multiple positions on the capacitor plate 340, so that the capacitor plate 340 is subjected to force balance and the stability between the capacitor plate 340 and the fixing plate 310 is higher.

[0090] The above embodiment provides a thermally conductive limiting member 350 between the capacitor plate 340 and the fixing plate 310, thereby creating a certain distance between them. This isolates the welding feet 321 of the capacitor 320 from the fixing plate 310, effectively preventing short circuits caused by the welding feet 321 of the capacitor 320 contacting the fixing plate 310 and improving the stability of the capacitor 320.

[0091] Furthermore, the thermally conductive limiting member 350 creates a certain space between the fixing plate 310 and the capacitor plate 340. To avoid wasting this space, in some embodiments of this application, such as... Figure 2 and Figure 4 As shown, a clearance opening 341 is provided on the capacitor plate 340, and the capacitor 320 passes through the clearance opening 341, with some of the capacitors 320 located in the gap between the fixing plate 310 and the capacitor plate 340.

[0092] Specifically, a relatively large clearance opening 341 can be opened on the capacitor plate 340 to accommodate multiple capacitors 320 together within the same clearance opening 341, or as follows: Figure 2 As shown, each capacitor 320 is provided with an independent clearance opening 341, making it easier to fix the capacitor 320 when the structure with capacitor plates 340 around it is more convenient. Furthermore, the height of the structure of the capacitor 320 on the side of the capacitor plate 340 facing the fixing plate 310 can be the same, making the structure on the capacitor plate 340 neater and more compact. Of course, the height of the structure of the capacitor 320 on the side of the capacitor plate 340 facing the fixing plate 310 can also be different. For example, when the heights of the components on the main board 200 opposite to the capacitor plate 340 are different, if the component opposite to the capacitor 320 is taller, the structure of the capacitor 320 on the side of the capacitor plate 340 facing the fixing plate 310 can be set higher; if the component opposite to the capacitor 320 is shorter, the structure of the capacitor 320 on the side of the capacitor plate 340 facing the fixing plate 310 can be set lower, or even the clearance opening 341 can be omitted for the capacitor 320.

[0093] The above embodiment utilizes the space between the capacitor plate 340 and the fixing plate 310 by opening a clearance opening 341 on the capacitor plate 340 and passing the capacitor 320 through the clearance opening 341. This effectively improves the utilization rate of the internal space of the mounting slot 111, making the internal structure of the electronic device 1 more compact and helping to reduce the size of the electronic device 1.

[0094] To further reduce the size of electronic device 1, in some examples of this application, such as Figure 2 and Figure 4As shown, capacitor 320 is cylindrical, and its height is greater than its width. Capacitor 320 is positioned horizontally (i.e., parallel to capacitor plate 340, for example, as indicated by double arrows X or Y in the figure). In this embodiment, as an example, assuming capacitor 320 is a supercapacitor, its height is typically 40mm, but its diameter is only 18mm. If capacitor 320 is positioned along the direction indicated by double arrow Z in the figure, the distance between the main board 200 and the fixing plate 310 must be greater than or equal to 40mm. However, the distance between the main board 200 and the cover plate 120 in electronic device 1 is typically only about 37.5mm. This results in interference between capacitor 320 and main board 200, and the overall height of electronic device 1 will be relatively high. If the capacitor 320 is set in the direction shown by the double arrow X or the double arrow Y in the figure, the height of the capacitor 320 in the direction shown by the double arrow Z in the figure is only 18mm. This height is much smaller than the distance between the motherboard 200 and the cover plate 120. Therefore, interference between the capacitor 320 and the motherboard 200 can be avoided, and it is also beneficial to reduce the height of the electronic device 1.

[0095] Furthermore, such as Figure 8 As shown, Figure 8 An exploded view of the electronic device provided in this embodiment of the present invention is shown. The electronic device 1 also includes a power supply module 600, which is independently integrated on a small circuit board and electrically connected to the motherboard 200, so that the power supply module 600 supplies power to the motherboard 200. The power supply module 600 can be electrically connected to the motherboard 200 by wires or by connectors such as gold fingers-slots or pin headers-female headers, to reduce the number of internal cables of the electronic device 1 and enhance the reliability of electrical signal connections. In addition, the independently set power supply module 600 is more flexible in use. Users can set different power supply modules in the electronic device 1 according to actual needs. For example, the power supply circuits corresponding to the single power supply (e.g., standard DC 12V) and wide voltage power supply (e.g., wide voltage input DC 9-30V) are different. The power supply circuits corresponding to the single power supply mode can be integrated onto separate circuit boards as independent power supply modules 600, so that the motherboard 200 can be compatible with different power supply modes by electrically connecting different power supply modules 600 to the motherboard 200.

[0096] In addition, such as Figure 8As shown, to enable more I / O interfaces on electronic device 1, electronic device 1 also includes an I / O module 700. Specifically, the I / O module 700 includes a circuit board 710, on which multiple I / O interfaces 711 are provided, and the multiple I / O interfaces 711 are electrically connected to the motherboard 200 through the circuit board 710. The I / O interface 711 can be one or more of the following interfaces: network port, USB, serial port, etc. Among them, when the I / O interface 711 is a serial port, it can be a DB9 serial port or a two-in-one serial port (such as a two-in-one Phoenix connector). The opening socket of the two-in-one serial port can correspond to two serial port signals. This not only reduces the space occupied by the serial port, but also supports RS232 / RS422 / RS485 signals, etc. Furthermore, the two-in-one serial port can use corresponding male terminals to lead out serial cables, and can flexibly use individual signals.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. An electronic device, characterized in that, The electronic device includes: A chassis includes a main body and a cover plate. A mounting groove is formed on the main body. The cover plate covers the opening of the mounting groove and is detachably connected to the main body. The motherboard is housed within the mounting slot; A delayed power supply component includes a mounting plate, a capacitor, and a power supply resistor. The capacitor and the power supply resistor are both disposed on one side of the mounting plate. The mounting plate is disposed at the opening of the mounting slot, with the side of the mounting plate containing the capacitor and the power supply resistor facing the motherboard. The capacitor is electrically connected to the motherboard through the power supply resistor and is used to supply power to the motherboard when the electronic device is powered off, thereby achieving delayed power-off. The power supply resistor is attached to the fixing plate, and the side of the fixing plate away from the capacitor is attached to the cover plate, so that the heat of the power supply resistor is conducted to the outside through the fixing plate and the cover plate in sequence.

2. The electronic device according to claim 1, characterized in that, The sidewall of the mounting groove extends into the mounting groove to form a fixed bracket. One end of the fixed bracket away from the sidewall of the mounting groove is recessed into the bottom wall of the mounting groove to form a stepped portion. The stepped portion is fixedly connected to the fixed plate so as to limit the position of the fixed plate by the stepped slope of the stepped portion.

3. The electronic device according to claim 2, characterized in that, The fixing plate has a fixing hole on the side facing the cover plate, and a through hole is provided at a corresponding position on the cover plate. The through hole is used for fasteners to pass through and connect to the fixing hole, so that the cover plate is pressed against the fixing plate by the fasteners, so that the cover plate and the fixing plate are tightly attached.

4. The electronic device according to claim 1, characterized in that, The delay power supply component also includes a capacitor board, which is disposed on the side of the fixing plate facing the motherboard and is fixedly connected to the fixing plate. The capacitor is disposed on the capacitor board, and the power supply resistor is disposed on the side of the capacitor board facing the fixing plate and is attached to the fixing plate.

5. The electronic device according to claim 4, characterized in that, The capacitor plate has a through-hole welding foot for the capacitor, and the welding foot at least partially protrudes from the side of the capacitor plate facing the fixing plate; A thermally conductive limiting member is sandwiched between the power supply resistor and the fixing plate, and the thermally conductive limiting member is used to separate the welding foot from the fixing plate.

6. The electronic device according to claim 5, characterized in that, The capacitor plate has a clearance opening, the capacitor passes through the clearance opening, and part of the capacitor is located in the gap between the fixing plate and the capacitor plate.

7. The electronic device according to any one of claims 1-6, characterized in that, Heating devices are provided on both sides of the motherboard. The heating devices on the first side of the motherboard are in contact with the bottom wall of the mounting slot so that the bottom wall of the mounting slot can dissipate heat from the heating devices on the first side. The electronic device further includes a heat-conducting component, which has a first contact surface and a second contact surface perpendicular to each other. The first contact surface is in contact with a heat-generating device on the second surface of the motherboard, and the second contact surface is in contact with the side wall of the mounting groove. The heat-conducting component is used to conduct heat from the heat-generating device on the second surface to the side wall of the mounting groove through the first contact surface and the second contact surface, so as to dissipate heat from the heat-generating device on the second surface through the side wall of the mounting groove.

8. The electronic device according to claim 7, characterized in that, The heating element on the first surface includes a processor, the height of which is lower than the height of at least a portion of the other heating elements on the first surface; A heat-conducting block is sandwiched between the processor and the bottom wall of the mounting slot. The heat-conducting block is used to conduct the heat of the processor to the bottom wall of the mounting slot, so as to dissipate heat from the processor through the bottom wall of the mounting slot.

9. The electronic device according to claim 8, characterized in that, The bottom wall of the mounting groove is also provided with a limiting groove on the side facing the inside of the mounting groove. The heat-conducting block is inserted into the limiting groove to restrict the movement of the heat-conducting block in the horizontal direction.

10. The electronic device according to any one of claims 1-6, characterized in that, The capacitor is cylindrical, and its height is greater than its width. The capacitor is arranged horizontally.

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