Improved implantable RFID tire label

Abstract

The utility model discloses an improved implantable RFID tire tag, and relates to the field of electronic tags, the front surface of a PCB is provided with a first bonding pad, one end of a first bonding pad main body is provided with a first convex part, and the vertical width of the first convex part is matched with the outer diameter of a connecting end. During welding, firstly, the connecting end is attached to the first convex part and the first bonding pad main body; then, the connecting end and the first convex part are welded through liquid soldering tin, so that the connecting end is preliminarily fixed; and the connecting end and the first bonding pad main body are welded by using liquid soldering tin, so that the welding of the connecting end and the first bonding pad is reinforced. Therefore, the bonding pad structure of the PCB is used for positioning and welding the spring antenna, so that the offset of the spring antenna is reduced, and the welding firmness of the spring antenna is ensured. In addition, the other end of the first bonding pad main body is provided with a second convex part for positioning and mounting an RFID chip module; a second bonding pad is arranged on the back face of the PCB so that the bonding strength of the PCB and the rubber coating can be improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic tags, specifically an improved implantable RFID tire tag. Background Technology

[0002] Chinese utility model patent CN218974930U discloses a high-performance implantable RFID tire tag, including a PCB board with a pad structure comprising a central pad and two side pads. The central pad is used to fix the RFID chip module. The two side pads are symmetrically distributed around the central pad, and one end of a spring antenna is fixed to the side pads by solder. Furthermore, the central pad has a group of openings to aid in heat dissipation for the RFID chip module. The side pads have groups of through-holes. During the soldering process, liquid solder can be injected into the through-hole groups. After the solder solidifies, the through-hole groups form a rivet-like connection structure, improving the tightness of the soldering between the spring antenna and the PCB board.

[0003] However, the aforementioned PCB board still suffers from the following problems: First, due to the large vertical width of the side pads and the fluidity of the liquid solder, the liquid solder can easily pull the spring antenna towards the upper or lower side of the side pads, causing the spring antenna to shift and affecting its positioning and soldering, thus impacting product quality. Second, because of the large vertical width of the side pads, a larger amount of liquid solder is required; otherwise, it can easily lead to cold solder joints, resulting in a weak spring antenna soldering and affecting product quality. Third, because the horizontal length of the side pads is small, the fixed soldering area between the spring antenna and the side pads is small, affecting the soldering strength. Furthermore, the elliptical shape of the side pads is also unfavorable for the positioning and soldering of the RFID chip module. Therefore, an improved embedded RFID tire tag is urgently needed. Summary of the Invention

[0004] The purpose of this invention is to provide an improved implantable RFID tire tag, which aims to overcome the aforementioned problems existing in the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] An improved implantable RFID tire tag includes a PCB board and a spring antenna. The front side of the PCB board is symmetrically provided with two first pads. Each first pad includes a first pad body. One end of the first pad body is provided with a first protrusion. The first protrusion is used to weld the connection end of the spring antenna, and the upper and lower widths of the first protrusion are adapted to the outer diameter of the connection end.

[0007] Furthermore, the vertical width of the first protrusion is 0.6 to 1.0 times the outer diameter of the spring antenna.

[0008] Furthermore, the aforementioned first protrusion is rectangular.

[0009] Furthermore, the aforementioned first pad body is provided with at least one through hole.

[0010] Furthermore, the first pad body is provided with two through holes, and the two through holes are located on the upper and lower sides of the connection end, respectively.

[0011] Furthermore, it also includes an RFID chip module, and the other end of the first pad body is provided with a second protrusion, which is used to solder the pins of the RFID chip module.

[0012] Furthermore, the outer contour of the second protrusion is adapted to the pins of the RFID chip module.

[0013] Furthermore, the aforementioned second protrusion is rectangular.

[0014] Furthermore, a second pad is provided on the back of the aforementioned PCB board.

[0015] Furthermore, the second pad includes a second pad body and a third protrusion; the second pad body overlaps with the first pad body, and the third protrusion overlaps with the first protrusion.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] In this invention, the first pad of the PCB board includes a first pad body, one end of which has a first protrusion, and the vertical width of the first protrusion matches the outer diameter of the connecting end. During soldering, firstly, the connecting end is placed on the first protrusion and the first pad body; then, liquid solder is used to solder the connecting end to the first protrusion, initially fixing the connecting end. Because the vertical width of the first protrusion is narrow, the liquid solder flows slowly, resulting in minimal displacement of the connecting end; liquid solder is then used to solder the connecting end to the first pad body, reinforcing the soldering between the connecting end and the first pad. Therefore, the PCB board pad structure of this invention positions and solders the spring antenna, reducing its displacement and ensuring a reliable solder joint. Attached Figure Description

[0018] Figure 1 This is a front view of the present invention.

[0019] Figure 2 This is a front view of the PCB board in this utility model.

[0020] Figure 3 This is a rear view of the PCB board in this utility model. Detailed Implementation

[0021] The specific embodiments of this utility model are described below with reference to the accompanying drawings. Many details are described below to provide a comprehensive understanding of this utility model; however, those skilled in the art can implement this utility model without these details.

[0022] like Figure 1 and Figure 2 As shown, an improved implantable RFID tire tag includes a PCB board 1, an RFID chip module 2, and a spring antenna 3. The PCB board 1 has two first pads 11 symmetrically arranged on its front side.

[0023] like Figure 1 As shown, the RFID chip module 2 includes, but is not limited to, an LED1206 packaged module, which is soldered to the first pad 11 using a surface mount machine. Preferably, the spring antenna 3 includes, but is not limited to, using a variable diameter process, so that its connecting end 31 is a dense ring portion with a cross-section of about 2mm, in order to increase the contact area between the connecting end 31 and the first pad 11, making the soldering more reliable.

[0024] like Figure 1 , Figure 2 and Figure 3 As shown, the improvement of this utility model lies in the pad structure of the PCB board 1, which will be described in detail below.

[0025] like Figure 1 and Figure 2 As shown, the first pad 11 includes a first pad body 110, one end of which is provided with a first protrusion 111 and the other end is provided with a second protrusion 112.

[0026] like Figure 1 and Figure 2 As shown, the second protrusion 112 extends towards the center of the PCB board 1 and is used for soldering the pins 21 of the RFID chip module 2. The two second protrusions 112 are spaced apart, with the RFID chip module 2 placed in the middle. The second protrusion 112 may be, but is not limited to, rectangular. When the RFID chip module 2 is mounted on the PCB board 1 using a pick-and-place machine, the pick-and-place machine uses the second protrusion 112 as a positioning feature for image recognition technology, making the mounting of the RFID chip module 2 more accurate.

[0027] like Figure 1 and Figure 2 As shown, preferably, the outer contour of the second protrusion 112 is adapted to the pin 21 of the RFID chip module 2, reducing the mounting offset of the RFID chip module 2 and further making the mounting of the RFID chip module 2 more accurate.

[0028] like Figure 1 and Figure 2As shown, the first protrusion 111 is used to weld the connecting end 31 of the spring antenna 3. The vertical width W of the first protrusion 111 is adapted to the outer diameter D of the connecting end 31. The first protrusion 111 may be, but is not limited to, rectangular.

[0029] like Figure 1 and Figure 2 As shown, preferably, the vertical width of the first protrusion 111 is 0.6 to 1.0 times the outer diameter D of the connecting end 31. Preferably, the first protrusion 111 extends to the edge of the PCB board 1 to increase the contact area with the connecting end 31.

[0030] like Figure 1 As shown, preferably, the lateral length of the first pad 11 from the first protrusion 111 to the first pad body 110 is adapted to the length of the connecting end 31. During soldering, firstly, the connecting end 31 is... Figure 1 The connector 31 is placed on the first pad 11. Then, liquid solder is used to weld the connector 31 to the first protrusion 111 to initially fix the connector 31. Because the vertical width of the first protrusion 111 is narrow, the liquid solder flows slowly, and the connector 31 deviates slightly. Liquid solder is then used to weld the connector 31 to the body of the first pad 110 to strengthen the connection between the connector 31 and the first pad 11.

[0031] like Figure 1 , Figure 2 and Figure 3 As shown, the first pad body 110 has at least one through hole 10. Preferably, the first pad body 110 has two through holes 10, and the two through holes 10 are located on the upper and lower sides of the connecting end 31, respectively. Of course, the number of through holes 10 in each first pad body 110 can also be 1, 3, 4, etc. When the connecting end 31 is soldered to the first pad body 110 with liquid solder, the liquid solder fills the through holes 10 to form a riveting structure, making the soldering more secure.

[0032] like Figure 1 and Figure 2 As shown, preferably, the left and right edges of the PCB board 1 are convex arcs, making the outer edge of the PCB smoother, reducing sharp edges, and lowering the risk of damage to the tire after the RFID tire tag is implanted in the tire rubber.

[0033] like Figure 2 and Figure 3 As shown, a second pad 12 is provided on the back side of the PCB board 1. Preferably, the second pad 12 includes a second pad body 120 and a third protrusion 121. The second pad body 120 overlaps with the first pad body 110, and the third protrusion 121 overlaps with the first protrusion 111. This improves the strength of the PCB board.

[0034] Furthermore, the back of PCB board 1 is not coated with photosensitive ink. In actual production, it may be necessary to coat the surface of the embedded RFID tire tag with a rubber coating (adhesive). The second pad 12 on the back of PCB board 1 and the fact that it is not coated with photosensitive ink can increase the bonding strength between PCB board 1 and the adhesive in the rubber coating, thereby ensuring sufficient bonding strength after the RFID tire tag is embedded in the tire rubber and avoiding delamination and bulging problems.

[0035] The above are merely specific embodiments of this utility model, but the design concept of this utility model is not limited thereto. Any non-substantial modifications made to this utility model using this concept shall be considered as an infringement of the protection scope of this utility model.

Claims

1. An improved implantable RFID tire tag, comprising a PCB board (1) and a spring antenna (3), wherein two first pads (11) are symmetrically arranged on the front side of the PCB board (1), characterized in that: The first pad (11) includes a first pad body (110), one end of which is provided with a first protrusion (111). The first protrusion (111) is used to weld the connection end (31) of the spring antenna (3). The upper and lower widths (W) of the first protrusion (111) are adapted to the outer diameter of the connection end (31).

2. The improved implantable RFID tire tag according to claim 1, characterized in that: The vertical width of the first protrusion (111) is 0.6 to 1.0 times the outer diameter (D) of the connecting end (31).

3. An improved implantable RFID tire tag according to claim 1, characterized in that: The first protrusion (111) is rectangular.

4. An improved implantable RFID tire tag according to claim 1, characterized in that: The first pad body (110) is provided with at least one through hole (10).

5. An improved implantable RFID tire tag according to claim 4, characterized in that: The first pad body (110) is provided with two through holes (10), and the two through holes (10) are located on the upper and lower sides of the connection end (31), respectively.

6. An improved implantable RFID tire tag according to any one of claims 1-5, characterized in that: It also includes an RFID chip module (2), and the other end of the first pad body (110) is provided with a second protrusion (112), which is used to solder the pins of the RFID chip module (2).

7. An improved implantable RFID tire tag according to claim 6, characterized in that: The outer contour of the second protrusion (112) is adapted to the pin (21) of the RFID chip module (2).

8. An improved implantable RFID tire tag according to claim 7, characterized in that: The second protrusion (112) is rectangular.

9. An improved implantable RFID tire tag according to any one of claims 1-5, characterized in that: The back of the PCB board (1) is provided with a second pad (12).

10. An improved implantable RFID tire tag according to claim 9, characterized in that: The second pad (12) includes a second pad body (120) and a third protrusion (121). The second pad body (120) overlaps with the first pad body (110), and the third protrusion (121) overlaps with the first protrusion (111).

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