Electric connection mechanism and chemical vapor deposition device
By employing an electrical connection mechanism with conductive wires and spherical terminals for rolling adjustment in a chemical vapor deposition apparatus, the problem of easy breakage of conductive strips was solved, achieving stable substrate performance and production capacity maintenance, and reducing operational burden.
Patent Information
- Application Number
- CN202423033848.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-12-09
AI Technical Summary
In existing chemical vapor deposition equipment, the conductive strip is prone to breakage during stage lifting and lowering, resulting in substandard substrate performance. Furthermore, replacing the conductive strip increases the operational burden and reduces production capacity.
An electrical connection mechanism is adopted, including a conductive wire and a connection assembly. The connection assembly consists of a conductive shell and a ball terminal. The conductive wire rolls within the limiting cavity through the ball terminal to adjust its extension direction and prevent the end from breaking. The connection assembly is connected to the stage and the inner wall of the reaction chamber, respectively.
It extends the service life of the electrical connection mechanism, maintains a stable electric field in the reaction chamber, ensures substrate performance, reduces the workload of operators, and avoids a decrease in production capacity.
Smart Images
Figure CN223502284U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of substrate processing technology, and in particular to an electrical connection mechanism and a chemical vapor deposition apparatus. Background Technology
[0002] Chemical vapor deposition is a method that uses gaseous compounds or elements containing thin film elements to chemically react on the surface of a substrate to form a thin film. It is widely used in the production process of substrate 40′. Figure 1 This is a schematic diagram of a chemical vapor deposition apparatus provided by existing technology, such as... Figure 1 As shown, a chemical vapor deposition (CVD) apparatus typically includes a reaction chamber 20', a stage 30', and a conductive strip 10'. The reaction chamber 20' can be selectively opened or closed. The stage 30' is disposed within the reaction chamber 20' and serves to support the substrate 40' to be deposited. The two ends of the conductive strip 10' are electrically connected to the inner walls of the stage 30' and the reaction chamber 20', respectively, thereby grounding the stage 30' and ensuring that the interior of the reaction chamber 20' maintains an equipotential. During the deposition process, the stage 30' moves up and down according to the deposition process settings.
[0003] In the prior art, the conductive strip 10′ is a thin metal sheet structure, with its two ends connected to the inner wall of the stage 30′ or the reaction chamber 20′ via clamping plates, bolts, or other connecting components. However, during the lifting and lowering of the stage 30′, the end of the conductive strip 10′ is prone to forming a linear bend and breaking. If the conductive strip 10′ breaks, the performance parameters of the deposited substrate 40′ will fail to meet the standards. Replacing the conductive strip 10′ will increase the opening frequency of the reaction chamber 20′, which not only increases the workload of the operators but also leads to a decrease in production capacity.
[0004] Therefore, there is an urgent need for an electrical connection mechanism and a chemical vapor deposition device to solve the above-mentioned technical problems. Utility Model Content
[0005] One objective of this invention is to provide an electrical connection mechanism in which the ends are not easily broken or damaged during the relative movement of the two electrically connected components, and the service life is long.
[0006] To achieve this objective, the present invention adopts the following technical solution:
[0007] An electrical connection mechanism includes a conductive wire and two sets of connection components, wherein the two sets of connection components are respectively disposed at both ends of the conductive wire, and the connection components include:
[0008] A conductive housing, wherein a limiting cavity and a wire passage hole communicating with the limiting cavity are provided on the conductive housing;
[0009] A spherical terminal is rotatably disposed within the limiting cavity, and the conductive wire passes through the wire hole and is connected to the spherical terminal.
[0010] As an alternative, the conductive wire is an elastic conductive wire.
[0011] As an alternative, the limiting cavity is constructed to be spherical.
[0012] As an optional solution, the conductive outer shell includes a first half-shell and a second half-shell. A first groove is provided on the first half-shell, and a second groove is provided on the second half-shell. The first half-shell and the second half-shell are connected, and the first groove and the second groove are opposite to each other and surround to form the limiting cavity.
[0013] As an alternative, a notch is provided on the side of the first half-shell facing the second half-shell and / or on the side of the second half-shell facing the first half-shell, so that the wire hole is formed between the first half-shell and the second half-shell.
[0014] As an optional solution, the connection assembly further includes a conductive support member, the conductive housing being connected to the conductive support member, and the conductive support member being configured to connect to an external conductive component.
[0015] As an optional solution, the connection assembly further includes a connector, one end of which is connected to the conductive support and the other end of which is connected to the conductive housing.
[0016] As an alternative, multiple conductive shells are connected to the conductive support.
[0017] Another objective of this invention is to provide a chemical vapor deposition apparatus that, by employing the aforementioned electrical connection mechanism, produces substrates with stable performance and long component lifespan, thereby ensuring production capacity and reducing the workload of operators.
[0018] To achieve this objective, the present invention adopts the following technical solution:
[0019] A chemical vapor deposition apparatus includes a reaction chamber, a stage, and an electrical connection mechanism. The stage is disposed within the reaction chamber and is movable within the reaction chamber. The two conductive housings of the electrical connection mechanism are respectively connected to the inner walls of the stage and the reaction chamber.
[0020] As an alternative, in the same electrical connection mechanism, the wire holes on the two conductive housings are arranged facing each other.
[0021] The beneficial effects of this utility model are:
[0022] In use, the electrical connection mechanism of this utility model connects two sets of connection components to two components to be connected. Since the conductive wire, conductive shell, and spherical terminal are all conductive, reliable electrical connection between the two components to be connected can be ensured. When the two components to be connected move relative to each other, the spherical terminal rolls within the corresponding conductive shell, thereby adaptively adjusting the extension direction of the conductive wire end, thus preventing the conductive wire end from breaking and ensuring a long service life.
[0023] The chemical vapor deposition equipment of this invention has connecting components at both ends of the electrical connection mechanism connected to the stage and the inner wall of the reaction chamber, respectively, thereby enabling the stage to be grounded. When the stage moves relative to the reaction chamber, the spherical terminal rolls within the corresponding conductive shell, thereby adaptively adjusting the extension direction of the conductive wire end and preventing the conductive wire end from breaking. On the one hand, this maintains a stable electric field within the reaction chamber, ensuring that the performance parameters of the deposited substrate meet the standards; on the other hand, it eliminates the need for frequent replacement of the electrical connection mechanism, reducing the workload of operators and preventing a decrease in production capacity. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of a chemical vapor deposition apparatus provided by existing technology;
[0025] Figure 2 This is a schematic diagram of the structure of the chemical vapor deposition apparatus provided in a specific embodiment of this utility model;
[0026] Figure 3 This is a schematic diagram of the structure of the first electrical connection mechanism provided in a specific embodiment of this utility model;
[0027] Figure 4 This is a schematic diagram of the structure of the second electrical connection mechanism provided in a specific embodiment of this utility model;
[0028] Figure 5 This is a structural schematic diagram of the third electrical connection mechanism provided in a specific embodiment of this utility model;
[0029] Figure 6 This is a schematic diagram of multiple electrical connection mechanisms sharing a conductive support member according to a specific embodiment of this utility model.
[0030] In the picture:
[0031] 10′, Conductive strip; 20′, Reaction chamber; 30′, Stage; 40′, Substrate;
[0032] 10. Electrical connection mechanism; 11. Conductive wire; 12. Connecting assembly; 121. Conductive housing; 1211. First half-shell; 12111. First groove; 1212. Second half-shell; 12121. Second groove; 1213. Limiting cavity; 1214. Wire through hole; 1215. Flange; 122. Spherical terminal; 123. Conductive support; 1231. Slot; 124. Connector; 125. First fastener; 126. Second fastener; 127. Third fastener;
[0033] 20. Reaction chamber;
[0034] 30. Platform;
[0035] 40. Drive mechanism;
[0036] 50. Substrate. Detailed Implementation
[0037] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not the entire structure.
[0038] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0039] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0040] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0041] This embodiment provides an electrical connection mechanism and a chemical vapor deposition apparatus. The electrical connection mechanism can realize the electrical connection between two components. The following is an example of the electrical connection mechanism used in a chemical vapor deposition apparatus.
[0042] Figure 2 This is a schematic diagram of the chemical vapor deposition apparatus provided in this embodiment, as shown below. Figure 2 As shown, the chemical vapor deposition apparatus includes a reaction chamber 20, a stage 30, an electrical connection mechanism 10, and a drive mechanism 40. The reaction chamber 20 is a sealed chamber that can be opened and closed. The stage 30 is disposed within the reaction chamber 20 and is used to support the substrate 50 to be deposited. The drive mechanism 40 is located outside the reaction chamber 20, with its output end extending into the reaction chamber 20 and connected to the stage 30, thereby driving the stage 30 to move within the reaction chamber 20. Optionally, the drive mechanism 40 can drive the stage 30 to move vertically. The two ends of the electrical connection mechanism 10 are respectively connected to the inner walls of the stage 30 and the reaction chamber 20, thereby achieving an electrical connection between the stage 30 and the reaction chamber 20, i.e., grounding the stage 30 and ensuring that the interior of the reaction chamber 20 maintains an equipotential.
[0043] Optionally, such as Figure 2 As shown, the stage 30 and the inner wall of the reaction chamber 20 can be connected by one, two, or more electrical connection mechanisms 10. In some embodiments, the stage 30 and the inner wall of the reaction chamber 20 are connected by 16 electrical connection mechanisms 10. In other embodiments, the number of electrical connection mechanisms provided in the chemical vapor deposition apparatus can be flexibly selected.
[0044] Figure 3 This is a schematic diagram of the structure of the first type of electrical connection mechanism provided in this embodiment, as shown below. Figure 2 and Figure 3As shown, the electrical connection mechanism 10 includes a conductive wire 11 and two sets of connection components 12. The two sets of connection components 12 are respectively disposed at both ends of the conductive wire 11. The connection component 12 includes a conductive housing 121 and a spherical terminal 122. The conductive housing 121 is provided with a limiting cavity 1213 and a wire passage hole 1214. The wire passage hole 1214 communicates with the limiting cavity 1213. The spherical terminal 122 is rotatably disposed in the limiting cavity 1213. The conductive wire 11 passes through the wire passage hole 1214 and is connected to the spherical terminal 122.
[0045] In this embodiment, the two connecting components 12 of the electrical connection mechanism 10 are respectively connected to two components to be connected. Since the conductive wire 11, the conductive housing 121, and the ball terminal 122 are all conductive, the two components to be connected can be reliably connected. When the two components to be connected move relative to each other, the ball terminal 122 rolls in the corresponding conductive housing 121, thereby adaptively adjusting the extension direction of the end of the conductive wire 11, avoiding breakage of the end of the conductive wire 11, and extending its service life.
[0046] In the chemical vapor deposition equipment of this invention, the connecting components 12 at both ends of the electrical connection mechanism 10 are connected to the inner walls of the stage 30 and the reaction chamber 20, respectively, thereby enabling the grounding of the stage 30. When the stage 30 moves relative to the reaction chamber 20, the spherical terminal 122 rolls within the corresponding conductive housing 121, thereby adaptively adjusting the extension direction of the end of the conductive wire 11 to prevent the end of the conductive wire 11 from breaking. On the one hand, this maintains a stable electric field within the reaction chamber 20, ensuring that the performance parameters of the deposited substrate 50 meet the standards; on the other hand, it eliminates the need for frequent replacement of the electrical connection mechanism 10, reducing the workload of operators and preventing a decrease in production capacity.
[0047] like Figure 2 As shown, in the same electrical connection mechanism 10, the wire holes 1214 on the two conductive housings 121 are arranged facing each other. This arrangement reduces the overall tortuosity of the extension path of the conductive wire 11, thereby avoiding excessive bending angles at the ends of the conductive wire 11 and further reducing the risk of breakage. In some embodiments, of the two conductive housings 121 of the electrical connection mechanism 10, one is mounted on the side wall of the stage 30, and the other is mounted on the inner side wall of the reaction chamber 20 opposite to the side wall. In some embodiments (not shown), of the two conductive housings 121 of the electrical connection mechanism 10, one is mounted on the lower side wall of the stage 30, and the other is mounted on the inner bottom plate of the reaction chamber 20.
[0048] In this embodiment, the conductive wire 11 is an elastic conductive wire. During the movement of the stage 30 relative to the reaction chamber 20, the elastic conductive wire 11 can adaptively expand and contract, preventing the end of the conductive wire 11 from being subjected to excessive pulling and avoiding excessive length, thus preventing the conductive wire 11 from hooking or interfering with other structures. In some embodiments, the conductive wire 11 is made of a metal material to form a spring-like structure, which can elastically deform while maintaining conductivity. Optionally, the metal material used to make the conductive wire 11 can be stainless steel or spring steel, etc. In some embodiments, the surface of the conductive wire 11 can be silver-plated to improve its conductivity.
[0049] In this embodiment, the spherical terminal 122 can be made of silver-plated stainless steel or nickel-plated aluminum block, and no specific limitation is made here.
[0050] like Figure 3 As shown, the limiting cavity 1213 is spherical in shape, with a diameter slightly larger than that of the spherical terminal 122. This design not only reduces the frictional resistance of the spherical terminal 122 when it rolls within the limiting cavity 1213, making the change of direction of the conductive wire 11 smoother, but also helps to ensure that the spherical terminal 122 and the conductive housing 121 always maintain contact, thus ensuring the reliability of the electrical connection between the spherical terminal 122 and the conductive housing 121.
[0051] like Figure 3 As shown, the conductive outer shell 121 includes a first half-shell 1211 and a second half-shell 1212. A first groove 12111 is provided on the first half-shell 1211, and a second groove 12121 is provided on the second half-shell 1212. The first half-shell 1211 and the second half-shell 1212 are connected, and the first groove 12111 and the second groove 12121 are opposite to each other and surround to form a limiting cavity 1213. By configuring the conductive outer shell 121 as composed of two half-shells, it is convenient to install the spherical terminal 122 into the corresponding limiting cavity 1213. Optionally, both the first half-shell 1211 and the second half-shell 1212 can be made of metal material. To improve conductivity, silver can be plated on the surface of the metal material. Optionally, the first half-shell 1211 and the second half-shell 1212 can be connected by welding, fasteners, or other methods, which are not specifically limited here.
[0052] like Figure 3As shown, a notch is provided on the side of the first half-shell 1211 facing the second half-shell 1212, and a notch is also provided on the side of the second half-shell 1212 facing the first half-shell 1211. The two notches are arranged opposite each other to form a wire passage hole 1214. With this arrangement, when assembling the electrical connection mechanism 10, the conductive wire 11 can be connected to the spherical terminal 122 first, and then the spherical terminal 122 can be inserted into the limiting cavity 1213, improving the convenience of assembly. In some embodiments, the notch can be provided only on the side of the first half-shell 1211 facing the second half-shell 1212, and this notch and the second half-shell 1212 together form the wire passage hole 1214. In other embodiments, the notch can also be provided only on the side of the second half-shell 1212 facing the first half-shell 1211, and this notch and the first half-shell 1211 together form the wire passage hole 1214.
[0053] In some embodiments, such as Figure 3 As shown, the conductive housing 121 is directly mounted on the component to be connected (i.e., the inner wall of the stage 30 or the reaction chamber 20) via the first fastener 125. This arrangement simplifies the overall structure of the electrical connection mechanism 10. Specifically, as... Figure 3 As shown, the conductive housing 121 is provided with a flange portion 1215, which is connected to the component to be conductive via a first fastener 125. This design is not only simple in structure but also easy to disassemble. Optionally, the first fastener 125 can be a bolt. In this embodiment, both the first half-shell 1211 and the second half-shell 1212 are provided with flange portions 1215. In other embodiments, the flange portion 1215 may be provided only on one of the first half-shell 1211 and the second half-shell 1212; no specific limitation is made here.
[0054] Figure 4 This is a schematic diagram of the structure of the second electrical connection mechanism provided in this embodiment, as shown below. Figure 4 As shown, the connecting assembly 12 also includes a conductive support 123. The conductive housing 121 is connected to the conductive support 123, which is used to connect to an external component to be connected. The conductive support 123 improves the ease of connection between the connecting assembly 12 and the external component. Optionally, the conductive support 123 is constructed as a plate and made of metal. It is understood that silver plating can be applied to the surface of the conductive support 123 to further improve its conductivity. The conductive support 123 can be connected to the component to be connected via a second fastener 126. Optionally, the second fastener 126 can be a bolt.
[0055] In some embodiments, such as Figure 4As shown, the connecting assembly 12 further includes a connector 124, one end of which is connected to the conductive support 123, and the other end is connected to the conductive housing 121. In this embodiment, the connector 124 is constructed as an L-shaped plate, with both ends of the L-shaped plate respectively fitting against the conductive housing 121 and the conductive support 123, and respectively connected by a third fastener 127. Optionally, the third fastener 127 can be a bolt. In this embodiment, the first half-shell 1211 is connected to the conductive support 123 through a connector 124, and the second half-shell 1212 is also connected to the conductive support 123 through a connector 124, thereby improving the reliability of the connection between the conductive housing 121 and the conductive support 123.
[0056] Figure 5 This is a schematic diagram of the third type of electrical connection mechanism provided in this embodiment, as shown below. Figure 5 As shown, the conductive support 123 is provided with a slot 1231, into which the conductive housing 121 is inserted. This snap-fit connection improves the ease of connection between the conductive support 123 and the conductive housing 121. Furthermore, the slot 1231 also serves to position the conductive housing 121. Optionally, the conductive housing 121 and the slot 1231 are interference-fitted to ensure reliable connection. To further improve the reliability of the connection between the conductive housing 121 and the conductive support 123, a third fastener 127 can be used to connect the sidewall of the slot 1231 to the conductive housing 121.
[0057] In another embodiment (not shown), the conductive housing 121 can also be connected to the conductive support 123 by welding.
[0058] Since multiple electrical connection mechanisms 10 are provided between the stage 30 and the reaction chamber 20, in order to improve the convenience of installation, Figure 6 This is a schematic diagram of multiple electrical connection mechanisms sharing a conductive support member as provided in this embodiment, such as... Figure 6 As shown, multiple conductive housings 121 are connected to the conductive support 123, meaning that multiple electrical connection mechanisms 10 can share the conductive support 123. When assembling the chemical vapor deposition apparatus, the conductive housings 121 at one end of each of the multiple electrical connection mechanisms 10 can be first mounted on one conductive support 123. Then, the conductive housings 121 at the other end of each of the multiple electrical connection mechanisms 10 can be mounted on another conductive support 123. Finally, these two conductive supports 123 are fixed to the inner walls of the stage 30 and the reaction chamber 20, respectively. This arrangement reduces the workload of operations within the reaction chamber 20, thereby improving the ease of assembly of the chemical vapor deposition apparatus.
[0059] like Figure 6As shown, taking the stage 30 and the reaction chamber 20 as an example, 16 electrical connection mechanisms 10 are set in the stage 30 and the reaction chamber 20 respectively. Four conductive shells 121 are connected to one conductive support 123. In other embodiments, the number of conductive shells 121 connected to the conductive support 123 can be flexibly set as needed, and no specific limitation is made here.
[0060] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. For those skilled in the art, based on the concept of this utility model, there will be changes in the specific implementation methods and application scope. The content of this specification should not be construed as a limitation of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. An electrical connection mechanism, characterized in that, It includes a conductive wire (11) and two sets of connecting components (12), the two sets of connecting components (12) being respectively disposed at both ends of the conductive wire (11), and the connecting components (12) including: A conductive housing (121) is provided with a limiting cavity (1213) and a wire passage hole (1214) communicating with the limiting cavity (1213); A spherical terminal (122) is rotatably disposed within the limiting cavity (1213), and a conductive wire (11) passes through the wire hole (1214) and is connected to the spherical terminal (122).
2. The electrical connection mechanism as described in claim 1, characterized in that, The conductive wire (11) is an elastic conductive wire.
3. The electrical connection mechanism as described in claim 1, characterized in that, The limiting cavity (1213) is spherical in shape.
4. The electrical connection mechanism as described in claim 1, characterized in that, The conductive outer shell (121) includes a first half-shell (1211) and a second half-shell (1212). A first groove (12111) is provided on the first half-shell (1211), and a second groove (12121) is provided on the second half-shell (1212). The first half-shell (1211) and the second half-shell (1212) are connected. The first groove (12111) and the second groove (12121) are opposite to each other and surround the limiting cavity (1213).
5. The electrical connection mechanism as described in claim 4, characterized in that, The first half-shell (1211) has a notch on the side facing the second half-shell (1212) and / or the second half-shell (1212) has a notch on the side facing the first half-shell (1211) so that the wire hole (1214) is formed between the first half-shell (1211) and the second half-shell (1212).
6. The electrical connection mechanism as described in claim 1, characterized in that, The connection assembly (12) further includes a conductive support (123), the conductive housing (121) is connected to the conductive support (123), and the conductive support (123) is configured to be connected to an external conductive component.
7. The electrical connection mechanism as described in claim 6, characterized in that, The connecting component (12) further includes a connector (124), one end of which is connected to the conductive support (123), and the other end is connected to the conductive shell (121).
8. The electrical connection mechanism as described in claim 7, characterized in that, The conductive support (123) is connected to a plurality of conductive shells (121).
9. A chemical vapor deposition apparatus, characterized in that, The device includes a reaction chamber (20), a stage (30), and an electrical connection mechanism as described in any one of claims 1-8, wherein the stage (30) is disposed within the reaction chamber (20) and is movable within the reaction chamber (20), and the two conductive housings (121) of the electrical connection mechanism are respectively connected to the inner walls of the stage (30) and the reaction chamber (20).
10. The chemical vapor deposition apparatus as described in claim 9, characterized in that, In the same electrical connection mechanism, the wire holes (1214) on the two conductive housings (121) are arranged facing each other.