Mobile phone shell

Abstract

The embodiment of the utility model discloses a mobile phone shell, which comprises a back plate assembly, a frame piece, a magnetic attraction piece and a heat dissipation medium, and is characterized in that the frame piece is connected to the periphery of the back plate assembly; the magnetic attraction part is arranged inside or on the surface of the backboard assembly, the backboard assembly is divided into a first area and a second area by the magnetic attraction part, the first area is located on an inner ring defined by the magnetic attraction part, the second area is located on an outer ring defined by the magnetic attraction part and the frame part, a first containing cavity is formed inside the first area, and a second containing cavity is formed inside the second area. A second containing cavity is formed in the second area, and the first containing cavity communicates with the second containing cavity. The heat dissipation medium is at least arranged in the first containing cavity and can at least partially flow from the first containing cavity to the second containing cavity for heat dissipation. According to the embodiment of the invention, the heat dissipation medium in the first accommodating cavity can at least partially flow into the second accommodating cavity after absorbing the heat on the mobile phone, so that the heat gathered in the first area can be quickly transferred to the second area to realize quick heat dissipation.

Description

Technical Field

[0001] This application relates to the field of mobile phone accessories technology, and in particular to a mobile phone case. Background Technology

[0002] As mobile phone screens get larger, the risk of phones breaking also increases. Phone cases can protect phones and are therefore very popular among users.

[0003] However, with the continuous improvement of mobile phone performance and charging power, the problem of mobile phone overheating has become more and more common. Mobile phone cases can affect the heat dissipation of mobile phones, especially when using mobile phones in summer. Overheating of mobile phones can have a significant impact on the lifespan and stability of mobile phone batteries. Utility Model Content

[0004] This application provides a mobile phone case that can improve the heat dissipation effect of the mobile phone case, which helps to reduce the temperature of the mobile phone.

[0005] This application provides a mobile phone case, which includes a back panel assembly, a frame, a magnetic clasp, and a heat dissipation medium. The frame is connected to the periphery of the back panel assembly to form a receiving groove for placing a mobile phone. The magnetic clasp is disposed inside the shell or on one side surface of the back panel assembly, dividing the back panel assembly into a first region and a second region. The first region is located in the inner circle formed by the magnetic clasp, and the second region is located in the outer circle formed by the magnetic clasp and the frame. A first receiving cavity is provided inside the shell of the back panel assembly located in the first region, and a second receiving cavity is provided inside the shell of the back panel assembly located in the second region. The first receiving cavity and the second receiving cavity are in communication. The heat dissipation medium is at least disposed in the first receiving cavity. The heat dissipation medium is at least in a liquid state. After absorbing heat, the heat dissipation medium located in the first region can at least partially flow from the first receiving cavity to the second receiving cavity for heat dissipation.

[0006] Beneficial effects: In the embodiments of this application, the first receiving cavity located in the inner ring of the magnetic accumulator is connected to the second receiving cavity located in the outer ring of the magnetic accumulator, and at least the first receiving cavity is filled with a heat dissipation medium. The heat dissipation medium is at least in a liquid state. Therefore, after absorbing the heat generated on the mobile phone, the heat dissipation medium in the first receiving cavity can flow into the second receiving cavity, thereby transferring the heat accumulated in the first area to the second area to achieve rapid heat dissipation, reduce the temperature of the mobile phone during charging, avoid excessive local temperature, and further improve charging efficiency. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] Figure 1 This is a schematic diagram of the structure of a mobile phone case in one embodiment of this application;

[0009] Figure 2 This is a cross-sectional schematic diagram of a mobile phone case in one embodiment of this application;

[0010] Figure 3 This is a partially exploded structural diagram of a mobile phone case in one embodiment of this application;

[0011] Figure 4 This is a partial structural diagram of a mobile phone case in one embodiment of this application;

[0012] Figure 5 This is a partial structural diagram of a mobile phone case in another embodiment of this application;

[0013] Figure 6 This is a partial structural schematic diagram of a mobile phone case in another embodiment of this application;

[0014] Figure 7 This is a top view of the structure of a mobile phone case in one embodiment of this application;

[0015] Figure 8 for Figure 7 A schematic cross-sectional view at point AA in the middle;

[0016] Figure 9 for Figure 7 Another cross-sectional view at point AA.

[0017] Explanation of reference numerals in the attached drawings: 100, phone case; 100a, receiving groove; 110, back panel assembly; 110a, first receiving cavity; 110b, second receiving cavity; 110c, third receiving cavity; 110d, lens avoidance part; 111, first region; 112, second region; 113, first back panel; 113a, medium filling hole; 1131, insert bonding protrusion; 1132, sealing rib; 1133, ultrasonic bonding rib; 114, second back panel; 115, third region; 116, first interval region; 117, second interval region; 120, frame component; 130, magnetic component; 131, magnetic clasp component; 140, heat dissipation medium; BB, first direction. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0019] like Figures 1-3 As shown, the first aspect of this application provides a mobile phone case 100, which is used to cover a mobile phone to protect it. The mobile phone case 100 includes a back panel assembly 110, a frame 120, a magnetic component 130, and a heat dissipation medium 140.

[0020] The frame member 120 is connected to the periphery of the back panel assembly 110, and the back panel assembly 110 and the frame member 120 together form a receiving groove 100a for placing a mobile phone. A mobile phone typically has a front panel for display, a back panel opposite to the front panel, and a frame connecting the front and back panels. The back panel assembly 110 abuts against the back panel of the mobile phone to protect the back panel, and the frame member 120 abuts against the frame of the mobile phone to protect the frame.

[0021] The magnetic attachment 130 is typically aligned with the wireless charging coil of the phone. When the external magnetic wireless charger is attached to the phone case 100, the magnetic wireless charger can align with the phone's wireless charging coil, thereby improving wireless charging efficiency. The magnet inside the magnetic wireless charger is usually ring-shaped. To match common magnetic wireless chargers on the market, the magnetic attachment 130 can be ring-shaped or arc-shaped.

[0022] The magnetic clasp 130 is disposed inside the housing or on one side surface of the back panel assembly 110. That is, the magnetic clasp 130 can be exposed on the surface of the back panel assembly 110 or enclosed inside the back panel assembly 110. The connection between the magnetic clasp 130 and the back panel assembly 110 can be, for example, by adhesion, snap-fit, etc. The magnetic clasp 130 divides the back panel assembly 110 into a first region 111 and a second region 112. The first region 111 is located in the inner circle formed by the magnetic clasp 130, and the second region 112 is located in the outer circle formed by the magnetic clasp 130 and the frame member 120. A first receiving cavity 110a is provided inside the housing of the back panel assembly 110 located in the first region 111, and a second receiving cavity 110b is provided inside the housing of the back panel assembly 110 located in the second region 112. The first region 111 and the second region 112 are connected, thereby allowing the first receiving cavity 110a and the second receiving cavity 110b to communicate.

[0023] When a mobile phone is charging or in use, it generates heat. This heat is conducted through the back panel assembly 110 to the heat dissipation medium 140. The heat dissipation medium 140 typically has good thermal conductivity, allowing it to absorb the heat from the phone relatively quickly, thereby accelerating heat dissipation and lowering the phone's temperature. The heat dissipation medium 140 can, for example, be an electronic fluorinated liquid, synthetic oil coolant, phase change material, etc.

[0024] The heat dissipation medium 140 is at least disposed within the first receiving cavity 110a, meaning it can be disposed solely within the first receiving cavity 110a, or simultaneously within both the first receiving cavity 110a and the second receiving cavity 110b. The heat dissipation medium 140 is at least in a liquid state, allowing it to absorb heat and then flow at least partially from the first receiving cavity 110a to the second receiving cavity 110b for heat dissipation. This enables rapid transfer of heat accumulated in the first region 111 to the second region 112, achieving rapid heat dissipation, reducing the phone's charging temperature, and further improving charging efficiency. Alternatively, the heat dissipation medium 140 in the second receiving cavity 110b can also flow to the first receiving cavity 110a to absorb heat from the first region 111. Optionally, the first receiving cavity 110a covers the entire first region 111 as much as possible, and the second receiving cavity 110b covers the entire second region 112 as much as possible, thereby providing as much heat dissipation medium 140 as possible in the back panel assembly 110 to improve the heat dissipation effect.

[0025] Generally, the diameters of the receiving coil of the mobile phone and the transmitting coil of the magnetic wireless charger are smaller than the diameter of the magnetic member 130. Both the receiving and transmitting coils are located within the enclosure area of ​​the magnetic member 130. Since both the receiving and transmitting coils generate heat during operation, the heat generated within the enclosure area of ​​the magnetic member 130 is relatively large during wireless charging, meaning the heat generated in the first region 111 is relatively large. In this embodiment, the first receiving cavity 110a and the second receiving cavity 110b are connected. Therefore, the heat dissipation medium 140 in the first receiving cavity 110a can flow into the second receiving cavity 110b, thereby helping to dissipate heat in the first region 111, reducing the temperature of the mobile phone during charging, preventing excessively high local temperatures, and improving charging efficiency. It should be noted that, since the heat generated by different parts of the phone varies when it is charging or in use, the temperature of the heat dissipation medium 140 in different locations will also vary. Users can accelerate the flow of the heat dissipation medium 140 by shaking the phone case 100, so that the heat dissipation medium 140 in different locations can exchange heat fully, thereby further accelerating the heat dissipation of the phone and reducing local high temperatures.

[0026] In some embodiments, the heat dissipation medium 140 also has a solid state. In its solid state, the heat dissipation medium 140 can absorb heat generated from the mobile phone and then transform into a liquid state. After cooling, the heat dissipation medium 140 can transform from a liquid state back to a solid state. During the transformation from solid to liquid, although the temperature remains unchanged, the heat dissipation medium 140 can absorb a large amount of latent heat, thereby helping the mobile phone dissipate heat. The phase transition temperature of the heat dissipation medium 140 can be selected as approximately the temperature at which the mobile phone heats up, thereby inducing a phase transition when the mobile phone heats up and accelerating heat dissipation. For example, the phase transition temperature of the heat dissipation medium 140 when transforming from solid to liquid is greater than or equal to 20 degrees Celsius and less than or equal to 45 degrees Celsius.

[0027] like Figure 3 As shown, in some embodiments, the backplate assembly 110 further includes a third region 115 for placing the magnetic member 130. A third receiving cavity 110c is placed inside the housing of the backplate assembly 110 located within the third region 115. The magnetic member 130 is disposed in the third receiving cavity 110c, which is closed relative to the first receiving cavity 110a and the second receiving cavity 110b. The third receiving cavity 110c can be a closed space inside the backplate assembly 110 or an open space on the surface of the backplate assembly 110, as long as it is closed and isolated relative to the first receiving cavity 110a and the second receiving cavity 110b. By placing the magnetic member 130 in the third receiving cavity 110c, contact between the magnetic member 130 and the heat dissipation medium 140 can be avoided, thereby preventing the magnetic member 130 from being corroded by the heat dissipation medium 140. Optionally, the magnetic 130 is recessed in the back panel assembly 110 or flush with the back panel assembly 110, thereby preventing the magnetic 130 from rubbing against external objects and helping to reduce the thickness of the back panel assembly 110.

[0028] like Figure 3 As shown, in some embodiments, the back panel assembly 110 includes a first back panel 113 and a second back panel 114. The first back panel 113 is positioned closer to the phone than the second back panel 114. The frame member 120 is connected to the periphery of the first back panel 113 or the periphery of the second back panel 114. A first receiving cavity 110a is disposed between the first back panel 113 and the second back panel 114, and a second receiving cavity 110b is disposed between the first back panel 113 and the second back panel 114. The first receiving cavity 110a and the second receiving cavity 110b are formed by the first back panel 113 and the second back panel 114 enclosing each other, which can reduce the difficulty of production and improve production efficiency.

[0029] Optionally, the first backplate 113 is provided with a medium filling hole 113a. After the first backplate 113 and the second backplate 114 are combined, the heat dissipation medium 140 is injected through the medium filling hole 113a. After the heat dissipation medium 140 is injected, the medium filling hole 113a is blocked to prevent the heat dissipation medium 140 from leaking out.

[0030] Optionally, the first back plate 113 and the second back plate 114 are welded by ultrasonic welding. A sealing rib 1132 is provided on the surface of the first back plate 113 facing the second back plate 114, and an ultrasonic bonding rib 1133 is provided on the sealing rib 1132. When the second back plate 114 is placed on top of the first back plate 113, the ultrasonic bonding rib 1133 connects to the second back plate 114. By providing the ultrasonic bonding rib 1133, the welding strength between the second back plate 114 and the first back plate 113 is improved. Optionally, the ultrasonic bonding rib 1133 is arranged around the periphery of the third receiving cavity 110c, thereby improving the sealing effect of the third receiving cavity 110c.

[0031] A sealing rib 1132 is provided on the surface of the first back plate 113 facing the second back plate 114. The sealing rib 1132 is located in the third region 115. An ultrasonic bonding rib 1133 is provided on the sealing rib 1132. The ultrasonic bonding rib 1133 is welded to the second back plate 114. The first back plate 113, the second back plate 114, the sealing rib 1132 and the ultrasonic bonding rib 1133 together form a closed third receiving cavity 110c.

[0032] A magnetic suction element 130 is disposed on the surface of the first back plate 113 opposite to the second back plate 114. Optionally, the magnetic suction element 130 is recessed into the surface of the first back plate 113. Alternatively, the magnetic suction element 130 is disposed on the surface of the second back plate 114 opposite to the first back plate 113. Optionally, the magnetic suction element 130 is recessed into the surface of the second back plate 114. Alternatively, the magnetic suction element 130 is disposed between the first back plate 113 and the second back plate 114.

[0033] like Figure 4 As shown, in some embodiments, the magnetic suction member 130 is arc-shaped, and a first gap region 116 is provided between the two ends of the magnetic suction member 130, that is, the magnetic suction member 130 does not enclose the first region 111 into a closed region. The first receiving cavity 110a and the second receiving cavity 110b are connected through the first gap region 116. For example, the first receiving cavity 110a extends to the first gap region 116 and is connected to the second receiving cavity 110b, or the second receiving cavity 110b extends to the first gap region 116 and is connected to the first receiving cavity 110a.

[0034] like Figure 5As shown, in some embodiments, the magnetic attractor 130 includes a plurality of magnetic attractor sub-components 131 arranged sequentially. Exemplarily, the plurality of magnetic attractor sub-components 131 are arranged in a ring or arc shape to adapt to the ring magnet within the magnetic wireless charger. At least two magnetic attractor sub-components 131 are spaced apart from each other, such that a second spacing region 117 is provided between the two magnetic attractor sub-components 131. The first receiving cavity 110a and the second receiving cavity 110b are connected through one or more second spacing regions 117. Optionally, a second spacing region 117 is provided between every two adjacent magnetic attractor sub-components 131, thereby increasing the number of second spacing regions 117 and making their distribution more uniform, which is beneficial for further promoting the flow of the heat dissipation medium 140 in different areas.

[0035] As mobile phone camera capabilities have improved, the camera module on a phone often protrudes from the phone's body. For example... Figure 6 As shown, in some embodiments, a lens avoidance portion 110d is provided on the back panel assembly 110. The lens avoidance portion 110d can avoid the lens module of the mobile phone, so that the back panel assembly 110 can fit snugly against the body of the mobile phone. In some cases, due to space limitations, the lens avoidance portion 110d abuts against the magnetic member 130, thereby restricting the flow of the heat dissipation medium 140 in the second region 112. Based on this, the structure and size of the lens avoidance portion 110d or the structure and size of the magnetic member 130 can be optimized so that the magnetic member 130 and the lens avoidance portion 110d are spaced apart. The second receiving cavity 110b also includes a portion located between the magnetic member 130 and the lens avoidance portion 110d to prevent the magnetic member 130 and the lens avoidance portion 110d from separating the second receiving cavity 110b. Optionally, the distance between the lens avoidance portion 110d and the magnetic member 130 is 2-3 mm.

[0036] For example, the distance between the magnetic member 130 and the lens avoidance portion 110d can be increased by adjusting the frame size of the lens avoidance portion 110d. Alternatively, the distance between the magnetic member 130 and the lens avoidance portion 110d can be increased by reducing the width of the magnetic member 130. Alternatively, the number of magnetic members 131 can be reduced on the side of the magnetic member 130 closest to the lens avoidance portion 110d, thereby creating a certain amount of space and increasing the distance between the magnetic member 130 and the lens avoidance portion 110d.

[0037] It should be noted that when the back panel assembly 110 is provided with a third receiving cavity 110c for placing the magnetic member 130, the outer wall of the third receiving cavity 110c and the lens avoidance part 110d need to be spaced apart so that the second receiving cavity 110b is located between the outer wall of the third receiving cavity 110c and the lens avoidance part 110d.

[0038] like Figures 7-8As shown, in some embodiments, the side of the first back plate 113 facing the second back plate 114 has a first sidewall in the first region 111. The first sidewall includes a peripheral sidewall closer to the magnetic member 130 and a middle sidewall further away from the magnetic member 130. The middle sidewall is closer to the second back plate 114 than the peripheral sidewall.

[0039] For example, the dimension of the first receiving cavity 110a on the side near the magnetic member 130 in the first direction BB is greater than the dimension of the side of the first receiving cavity 110a away from the magnetic member 130 in the first direction BB, where the first direction BB is the thickness direction of the back panel assembly 110. That is, the closer to the magnetic member 130, the greater the thickness of the first receiving cavity 110a, and the more heat dissipation medium 140 there is. It can be understood that the closer to the magnetic member 130, the greater the heat generation. Therefore, providing more heat dissipation medium 140 on the side of the first receiving cavity 110a near the magnetic member 130 is beneficial to reducing the temperature of the mobile phone and alleviating local high temperatures.

[0040] like Figure 8 As shown, in some embodiments, the dimension of the second receiving cavity 110b on the side closer to the magnetic member 130 in the first direction BB is larger than the dimension of the second receiving cavity 110b on the side farther from the magnetic member 130 in the first direction BB. Similarly, the closer to the magnetic member 130, the greater the heat generation. Therefore, providing more heat dissipation medium 140 on the side of the second receiving cavity 110b closer to the magnetic member 130 is beneficial to reducing the temperature of the mobile phone and alleviating local high temperatures.

[0041] like Figure 8 As shown, in some embodiments, the periphery of the first back plate 113 is provided with a mating engagement protrusion 1131, which faces away from the second back plate 114. The frame member 120 is connected to the first back plate 113 through the mating engagement protrusion 1131. Exemplarily, the frame member 120 is injection molded to the first back plate 113 through the mating engagement protrusion 1131, which can improve the connection strength between the first back plate 113 and the frame member 120.

[0042] like Figure 9As shown, in some embodiments, the first back plate 113 and the frame member 120 enclose a receiving cavity for accommodating the mobile phone, that is, the first back plate 113 is used to fit against the mobile phone. The dimension of the side of the first back plate 113 near the magnetic member 130 in the first direction BB is smaller than the dimension of the side of the first back plate 113 away from the magnetic member 130 in the first direction BB. That is, by thinning the side of the first back plate 113 near the magnetic member 130, more heat dissipation medium 140 can be accommodated, while maintaining a certain strength. Alternatively, the dimension of the side of the second back plate 114 near the magnetic member 130 in the first direction BB is smaller than the dimension of the side of the second back plate 114 away from the magnetic member 130 in the first direction BB. That is, by thinning the side of the second back plate 114 near the magnetic member 130, more heat dissipation medium 140 can be accommodated.

[0043] Compared to thinning the second backplate 114, thinning the first backplate 113 allows the heat dissipation medium 140 to be closer to the phone, resulting in better heat absorption. Furthermore, since the height of the heat dissipation medium 140 near the magnetic connector 130 is greater than that away from the magnetic connector 130, the heat dissipation medium 140 near the magnetic connector 130 can flow to the heat dissipation medium 140 away from the magnetic connector 130 after being heated and becoming liquid, thus facilitating heat exchange between the heat dissipation media 140.

[0044] like Figure 9 As shown, in some embodiments, the size of the first receiving cavity 110a in the first direction BB is larger than the size of the second receiving cavity 110b in the first direction BB. That is, the thickness of the first receiving cavity 110a is greater than the thickness of the second receiving cavity 110b. By increasing the thickness of the first receiving cavity 110a, more heat dissipation medium 140 can be accommodated in the first receiving cavity 110a, thereby improving the heat dissipation capacity of the first region 111, which is beneficial to reducing the temperature of the mobile phone and alleviating local high temperature.

[0045] like Figure 9 As shown, in some embodiments, the side of the first back plate 113 facing the second back plate 114 has a first sidewall in the first region 111, and the side of the first back plate 113 facing the second back plate 114 has a second sidewall in the second region 112, with the first sidewall being further away from the second back plate 114 than the second sidewall.

[0046] For example, in the first direction BB, the size of the first backplate 113 in the first region 111 is smaller than the size of the first backplate 113 in the second region 112, that is, the thickness of the first backplate 113 in the first region 111 is smaller than the thickness of the first backplate 113 in the second region 112. By thinning the first region 111 of the first backplate 113, more heat dissipation medium 140 can be accommodated.

[0047] Alternatively, the side of the second back plate 114 facing the first back plate 113 has a third sidewall in the first region 111, and the side of the second back plate 114 facing the first back plate 113 has a fourth sidewall in the second region 112, with the third sidewall being further away from the first back plate 113 than the fourth sidewall.

[0048] For example, in the first direction BB, the size of the second backplate 114 in the first region 111 is smaller than the size of the second backplate 114 in the second region 112, that is, the thickness of the second backplate 114 in the first region 111 is smaller than the thickness of the second backplate 114 in the second region 112. By thinning the first region 111 of the second backplate 114, more heat dissipation medium 140 can be accommodated.

[0049] Compared to thinning the second backplate 114, thinning the first backplate 113 allows the heat dissipation medium 140 to be closer to the phone, thus achieving better heat absorption.

[0050] In some embodiments, the phone case 100 further includes a heat-conducting sheet, which can serve to even out heat distribution. The heat-conducting sheet is disposed inside the housing or on one side surface of the back panel assembly 110. Exemplarily, the heat-conducting sheet is disposed on the surface of the first back panel 113 opposite to the second back panel 114; optionally, the heat-conducting sheet is recessed into the surface of the first back panel 113. Alternatively, the heat-conducting sheet is disposed on the surface of the second back panel 114 opposite to the first back panel 113; optionally, the heat-conducting sheet is recessed into the surface of the second back panel 114. Alternatively, the heat-conducting sheet is disposed between the first back panel 113 and the second back panel 114. The heat-conducting sheet may or may not abut against the magnetic member 130, and the heat-conducting sheet may or may not abut against the heat dissipation medium 140; these are not limited here.

[0051] By incorporating heat-conducting sheets, the temperature across the backplate assembly 110 can be made more uniform, thus promoting heat dissipation. Exemplary heat-conducting sheets may include graphite films, metal films, vapor chambers, etc.

[0052] Optionally, the heat-conducting sheet is disposed only in the second region 112, thereby reducing the impact on the transmitting coil and charging coil located in the first region 111. Alternatively, the heat-conducting sheet is disposed only in the first region 111 and the second region 112, thereby achieving better heat dissipation.

[0053] In some embodiments, the frame component 120 and the back panel assembly 110 may be made of the same or different materials. For example, both the frame component 120 and the back panel assembly 110 may be made of silicone, with the frame component 120 and the back panel integrally molded, resulting in a relatively soft overall design for the phone case 100. Alternatively, the frame component 120 may be made of TPU (Thermoplastic polyurethanes). TPU is a type of elastomer that can be plasticized by heating and dissolved by solvents, possessing excellent comprehensive properties such as high strength, high toughness, wear resistance, and oil resistance. Its application to the outer frame of the phone case 100 enhances its strength and prevents damage from drops. The back panel assembly 110 may be made of PC (Polycarbonate board). PC has advantages such as high transparency, light weight, impact resistance, sound insulation, heat insulation, flame retardancy, and aging resistance. Its application to the back panel assembly 110 of the phone case 100 effectively protects the phone. During production, the back panel assembly 110 can be produced first, and the insert bonding protrusion 1131 can be produced on the back panel assembly 110. Then, the frame part 120 can be injection molded on the back panel assembly 110. The frame part 120 and the back panel assembly 110 are bonded together by insert injection molding. The insert bonding protrusion 1131 makes it easy to injection mold the back panel assembly 110 and the frame part 120 together.

[0054] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0055] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A mobile phone case, characterized in that, include: Backplane assembly; A frame piece is attached to the periphery of the back panel assembly to form a receiving slot for placing a mobile phone. A magnetic suction element is disposed inside the housing or on one side surface of the back panel assembly. The magnetic suction element divides the back panel assembly into a first region and a second region. The first region is located in the inner circle formed by the magnetic suction element, and the second region is located in the outer circle formed by the magnetic suction element and the frame member. A first receiving cavity is provided inside the housing of the back panel assembly located in the first region, and a second receiving cavity is provided inside the housing of the back panel assembly located in the second region. The first receiving cavity and the second receiving cavity are in communication. A heat dissipation medium is disposed at least in the first receiving cavity. The heat dissipation medium is at least in a liquid state. After absorbing heat, the heat dissipation medium located in the first region can flow at least partially from the first receiving cavity to the second receiving cavity for heat dissipation.

2. The mobile phone case according to claim 1, characterized in that, The heat dissipation medium also has a solid state, in which it can absorb heat generated from the mobile phone and then transform into a liquid state; after cooling, the heat dissipation medium can transform from a liquid state into a solid state.

3. The mobile phone case according to claim 1, characterized in that, The magnetic suction element is arc-shaped, and a first gap region is provided between its two ends. The first receiving cavity and the second receiving cavity are connected through the first gap region; and / or... The magnetic attractor includes a plurality of magnetic attractor components arranged in sequence, with at least two magnetic attractor components spaced apart from each other to form a second gap region between the two magnetic attractor components, and the first receiving cavity and the second receiving cavity are connected through the second gap region.

4. The mobile phone case according to claim 1, characterized in that, The back panel assembly is provided with a lens avoidance portion, and the magnetic member is spaced apart from the lens avoidance portion, so that the second receiving cavity also includes a portion located between the magnetic member and the lens avoidance portion.

5. The mobile phone case according to claim 1, characterized in that, The back panel assembly includes a first back panel and a second back panel, wherein the first back panel is closer to the mobile phone than the second back panel, and the frame member is connected to the periphery of the first back panel or the periphery of the second back panel. The first back plate and the second back plate together form the first receiving cavity and the second receiving cavity; The magnetic suction element is disposed on the side surface of the first back plate opposite to the second back plate, or the magnetic suction element is disposed on the side surface of the second back plate opposite to the first back plate, or the magnetic suction element is disposed between the first back plate and the second back plate.

6. The mobile phone case according to claim 5, characterized in that, The first back plate has a first sidewall in the first region on the side facing the second back plate. The first sidewall includes an outer sidewall closer to the magnetic member and an inner sidewall further away from the magnetic member. The inner sidewall is closer to the second back plate than the outer sidewall.

7. The mobile phone case according to claim 5, characterized in that, The first back plate has a first sidewall in the first region and a second sidewall in the second region on the side facing the second back plate, and the first sidewall is further away from the second back plate than the second sidewall; And / or, The surface of the second back plate facing the first back plate has a third sidewall in the first region and a fourth sidewall in the second region, wherein the third sidewall is further away from the first back plate than the fourth sidewall.

8. The mobile phone case according to claim 5, characterized in that, The first back plate has a recessed engagement protrusion on its periphery, the recessed engagement protrusion being away from the second back plate, and the frame member being connected to the first back plate through the recessed engagement protrusion.

9. The mobile phone case according to claim 1, characterized in that, The phone case also includes a heat-conducting sheet, which is disposed inside the housing or on one side surface of the back panel assembly, and the heat-conducting sheet is disposed at least in the second region.

10. The mobile phone case according to claim 5, characterized in that, The backplate assembly further includes a third region for placing the magnetic attractor. The surface of the first backplate facing the second backplate is provided with a sealing rib. The sealing rib is located in the third region. The sealing rib is provided with an ultrasonic bonding rib. The ultrasonic bonding rib is connected to the second backplate. The first backplate, the second backplate, the sealing rib and the ultrasonic bonding rib together form a closed third receiving cavity. The magnetic attractor is disposed in the third receiving cavity.

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