Circuit board with electrostatic protection function
By optimizing the substrate material and structural design of the circuit board, and combining it with separators, voltage suppressors, shielding covers and conductive coatings, the problems of slow response speed and aging failure of existing ESD protection mechanisms have been solved, achieving fast response and high reliability electrostatic protection.
Patent Information
- Application Number
- CN202422829460.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-11-20
AI Technical Summary
Existing ESD protection mechanisms rely on resistor-capacitor filters, which have insufficient response speed and are prone to aging and failure in complex environments, affecting the reliability of circuit boards.
The substrate is made of a polymer composite material with excellent conductivity and mechanical strength. Separation areas, voltage suppressors, varistors, shielding covers and ground plane copper foil are set on the substrate. Combined with conductive coating and ground line design, signal line layout and electromagnetic shielding are optimized to form a multi-layer protection mechanism.
It improves the electrostatic discharge protection capability of the circuit board, has a faster response speed, is more reliable in complex environments, and enhances mechanical strength and signal stability.
Smart Images
Figure CN223503089U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a circuit board, and more particularly to a circuit board with electrostatic protection function. Background Technology
[0002] Electrostatic discharge (ESD) protection is crucial for the safety and stability of electronic devices. In various applications, such as computers, communication equipment, and medical instruments, electrostatic discharge (ESD) can occur due to external environmental factors or human contact. This can damage sensitive internal electronic components, affecting normal operation and even causing permanent damage. Therefore, developing circuit boards with excellent ESD protection has become a key focus in the industry.
[0003] Some common ESD protection mechanisms rely on resistor-capacitor (RC) filters to delay and absorb overvoltage surges. While this method is simple and effective, its response speed is often not fast enough for transient pulses at extremely high frequencies. Furthermore, in complex and variable working environments, some ESD protection components may age and fail after long-term exposure, reducing the overall system reliability. Utility Model Content
[0004] To overcome the shortcomings of common ESD protection mechanisms that rely on resistor-capacitor (RC) filters to delay and absorb overvoltage surges, although this method is simple and effective, its response speed is often not fast enough for transient pulses at extremely high frequencies. Furthermore, in complex and variable working environments, some ESD protection components may age and fail after long-term exposure, reducing the overall system reliability. The objective is to provide a circuit board with electrostatic protection function that optimizes the overall ESD layout and effect and protects the electrostatic protection components on the circuit board.
[0005] A circuit board with electrostatic discharge (ESD) protection includes a substrate with a partition area for centralized mounting of sensitive circuit components; signal lines laid on the substrate for transmitting high-speed analog signals, which are laid out to avoid high-frequency noise sources and sensitive areas, and are laid out in differential pairs on critical paths; one or more voltage suppressors laid out on one side of the periphery of the partition area on the substrate; one or more varistors arranged on the other side of the periphery of the partition area; a shielding cover covering the partition area of the substrate and surrounding the voltage suppressors and the varistors to provide electromagnetic shielding; and a ground plane copper foil disposed in the inner or bottom layer of the substrate.
[0006] Furthermore, the upper and lower surfaces of the substrate are coated with a conductive coating.
[0007] Furthermore, the substrate is made of a polymer composite material with excellent electrical conductivity and mechanical strength.
[0008] Furthermore, it also includes a ground wire, which is arranged along both sides of the signal line.
[0009] Furthermore, there is an appropriate spacing between the signal line and the ground line.
[0010] Furthermore, when the substrate is a multilayer board, the ground plane copper foil is disposed in the middle layer of the substrate.
[0011] The beneficial effects are as follows: This utility model sets up a separation area on the substrate to centrally install sensitive circuit components and uses a shield to cover these areas, which effectively isolates external electromagnetic interference and provides voltage suppressors, varistors, ground plane copper foil, etc. At the same time, it optimizes the sensitive transmission path. Under the multi-layer protection mechanism, the electrostatic protection function of the circuit board not only has a faster response speed, but is also more reliable in complex and ever-changing working environments.
[0012] This invention uses a polymer composite material with excellent conductivity and mechanical strength to make a substrate, and coats the upper and lower surfaces of the substrate with a conductive coating. This not only improves the overall ESD resistance of the circuit board, but also enhances its mechanical strength, enabling it to maintain good performance in various working environments. Attached Figure Description
[0013] Figure 1 This is a three-dimensional structural diagram of the present invention.
[0014] Figure 2 This is a plan view of the present invention with the shielding cover removed.
[0015] Figure 3 This is a plan view of the lower surface of the substrate of this utility model.
[0016] Figure 4 This invention relates to the substrate and conductive coating of the present invention.
[0017] The component names and serial numbers in the figure are as follows: 1-substrate, 2-separation area, 3-signal line, 4-voltage suppressor, 5-varistor, 6-shielding cover, 7-ground plane copper foil, 8-ground line, 9-conductive coating. Detailed Implementation
[0018] The present invention will be further described below with reference to specific embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention, but are not intended to limit the present invention.
[0019] A circuit board with electrostatic discharge protection, such as Figure 1-4As shown, it includes a substrate 1, which serves as the skeleton of the entire circuit board. It is made of a high-molecular composite material with excellent conductivity and mechanical strength, which not only improves the overall ESD resistance of the circuit board, but also provides a solid support for other components. On the substrate 1, there is a separation area 2, which is specifically used to centrally install sensitive circuit components, thereby effectively isolating them from potential high-frequency noise sources and interference sources.
[0020] Signal lines 3 are laid out on the substrate 1. In order to reduce interference and signal attenuation, they are responsible for transmitting high-speed analog signals. The routing path of signal lines 3 is optimized according to the function of the circuit board, and is shortened as much as possible to reduce electrostatic discharge paths and strictly avoid high-frequency noise sources and sensitive areas. On the critical path, signal lines 3 are laid out in the form of differential pairs. This measure further enhances the anti-interference capability of the signal and ensures stable signal transmission.
[0021] To address potential overvoltage situations in the circuit, the circuit board is specially equipped with a voltage suppressor 4 and a varistor 5. The voltage suppressor 4 is located on one side of the periphery of the partition area 2, which can quickly suppress transient voltage spikes and protect sensitive circuits from overvoltage impacts. The varistor 5 is located on the other side of the periphery of the partition area 2, which can absorb overvoltage energy and provide an additional protective barrier for the circuit, further enhancing the circuit's anti-interference capability.
[0022] A shielding cover 6 is wrapped around the partition area 2 of the substrate 1, which also surrounds the voltage suppressor 4 and the varistor 5. This design not only effectively isolates external electromagnetic interference, but also provides a relatively closed electromagnetic environment for sensitive circuits, thereby ensuring the stable operation of the circuit. At the same time, in harsh working environments, the shielding cover 6 can provide a certain physical protection for the covered area, reducing the impact of the external environment on this part of the circuit board.
[0023] like Figure 3 As shown, a ground plane copper foil 7 is provided on the substrate 1. When the substrate 1 is a multilayer board, the ground plane copper foil 7 is placed in the middle layer to effectively isolate electromagnetic interference between the upper and lower layers. As a continuous conductive plane, the ground plane copper foil 7 can absorb and disperse electromagnetic waves from the upper or lower layers, reducing crosstalk between signals and external interference. For a single-layer board, the ground plane copper foil 7 is placed in the inner or bottom layer, which also plays an important shielding role. This design not only enhances the anti-interference ability of the circuit, but also improves the overall performance of the circuit board.
[0024] In addition, such as Figure 4As shown, the upper and lower surfaces of the substrate 1 are coated with a conductive coating 9. This coating is made of conductive materials such as carbon nanotubes or silver nanowires. The conductive coating 9 can quickly conduct away static electricity and prevent static electricity accumulation from damaging the circuit, thereby further improving the electrostatic protection capability of the circuit board.
[0025] Finally, as Figure 1-2 As shown, the arrangement of ground wire 8 is also an important part of the circuit board design. It is arranged along both sides of signal line 3 with an appropriate distance between it and signal line 3. The main function of ground wire 8 is to provide a signal return path, reduce crosstalk between signal lines 3, and further enhance the circuit's anti-interference capability. This design not only ensures stable signal transmission but also improves the overall performance of the circuit board.
[0026] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of the present invention and should not be construed as limiting the scope of protection of the present invention in any way. Based on this explanation, those skilled in the art can conceive of other specific embodiments of the present invention without creative effort, and these embodiments will all fall within the scope of protection of the present invention.
Claims
1. A circuit board with electrostatic discharge protection function, comprising a substrate having a partition area thereon for centrally mounting sensitive circuit components; Its features are: It also includes signal lines, which are laid on the substrate for transmitting high-speed analog signals. When laying them out, they avoid high-frequency noise sources and sensitive areas, and are laid out in the form of differential pairs on the critical path; one or more voltage suppressors are provided and are laid out on one side of the periphery of the partition area on the substrate; one or more varistors are provided and are arranged on the other side of the periphery of the partition area. A shielding cover is provided to cover the partition area of the substrate and to enclose the voltage suppressor and the varistor to provide electromagnetic shielding; a ground plane copper foil is disposed in the inner or bottom layer of the substrate.
2. A circuit board with electrostatic discharge protection function according to claim 1, characterized in that: The upper and lower surfaces of the substrate are coated with a conductive coating.
3. A circuit board with electrostatic discharge protection function according to claim 2, characterized in that: The substrate is made of a polymer composite material with excellent electrical conductivity and mechanical strength.
4. A circuit board with electrostatic discharge protection function according to claim 3, characterized in that: It also includes a ground wire, which is arranged along both sides of the signal line.
5. A circuit board with electrostatic discharge protection function according to claim 4, characterized in that: There is an appropriate spacing between the signal line and the ground line.
6. A circuit board with electrostatic discharge protection function according to claim 5, characterized in that: When the substrate is a multilayer board, the ground plane copper foil is disposed in the middle layer of the substrate.