Step plate pressing and stacking structure
By setting isolation tape and connecting frame in the stepped plate lamination structure, combined with thermally conductive adhesive strip and copper foil, the problem of small contact area between the prepreg and the core board is solved, achieving stable lamination and rapid heat dissipation.
Patent Information
- Application Number
- CN202423012163.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-12-06
AI Technical Summary
In existing stepped plate lamination structures, the contact area between the prepreg and the core plate is small, resulting in unstable lamination, slow heat dissipation, and poor heat dissipation effect.
An insulating tape is placed between the prepreg and the core board, and a groove and a connecting frame are made on the edge of the core board. The connecting frame and groove are used to increase the contact area, and thermal conductive strips and copper foil are combined to accelerate heat dissipation.
This improves the stability and heat dissipation of the lamination process, ensures rapid heat dissipation of the core board, and enhances the interlayer bonding force.
Smart Images

Figure CN223503098U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of stepped plate pressing technology, and in particular to a stepped plate pressing stack structure. Background Technology
[0002] Stepped lamination is a key process in the production of multilayer PCBs. By laminating multiple layers, structural layer addition is achieved, which can meet the needs of complex circuit designs, enhance interlayer bonding, and improve electrical performance.
[0003] Existing stepped plate lamination structures are generally made by laminating prepreg and copper foil onto a core board. However, due to the smooth surface of the core board, the contact area between the prepreg and the core board is small, which easily leads to unstable lamination during the lamination process, resulting in poor performance. Furthermore, during use, the core board can only dissipate heat through its own ventilation holes, resulting in slow heat dissipation and poor heat dissipation effect. To address these issues, we propose a stepped plate lamination structure. Utility Model Content
[0004] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing a stepped plate pressing and stacking structure.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: a stepped plate pressing and stacking structure is designed, including a first semi-cured sheet and a second semi-cured sheet, a core plate is provided between the first semi-cured sheet and the second semi-cured sheet, and a release tape is provided on the side of the first semi-cured sheet and the second semi-cured sheet near the core plate, and the sides of the first semi-cured sheet and the second semi-cured sheet are adhered to the adhesive surface of the release tape.
[0006] The core board has grooves on both sides of its edge. A connecting frame is provided on the side of the first semi-cured sheet and the second semi-cured sheet away from the core board. When pressed together, the connecting frame presses the edges of the first semi-cured sheet, the second semi-cured sheet and the release tape into the grooves.
[0007] One side of each connecting frame is fixed to the side edge of the copper foil, and the first semi-cured sheet and the second semi-cured sheet are pressed and fixed together with the corresponding copper foil.
[0008] The side edge of the core board has a receiving groove, and a thermally conductive adhesive strip is installed inside the receiving groove.
[0009] Preferably, when the connecting frame is pressed into the groove, the sides of the first semi-cured sheet and the second semi-cured sheet are flush with the corresponding connecting frame.
[0010] Preferably, each connecting frame has several strip-shaped positioning blocks installed on the side near the core board, and several positioning grooves are opened at the end of the groove, with the strip-shaped positioning blocks matching the positioning grooves.
[0011] Preferably, during pressing, the smooth surface of the release tape contacts and connects with the surface of the core board.
[0012] Preferably, the release tape is the same size as the first and second prepreg sheets.
[0013] Preferably, the thermally conductive adhesive strip is made of thermally conductive silicone material.
[0014] Preferably, the connecting frame is made of copper.
[0015] The design scheme proposed in this utility model has the following beneficial effects in application:
[0016] By connecting the frame and the groove, the contact area between the first and second prepreg sheets and the core board can be increased, making the pressing more stable and improving the performance.
[0017] The thermally conductive adhesive strips can quickly dissipate some of the heat generated by the core board during operation. Furthermore, the connecting frame and copper foil can quickly dissipate the remaining heat generated by the core board into the surrounding environment, thus accelerating the heat dissipation rate and improving the heat dissipation effect. Attached Figure Description
[0018] Figure 1 This is the intended structural dispersion of the present invention;
[0019] Figure 2 This is a schematic diagram of the structure of the present invention after pressing;
[0020] Figure 3 This is a schematic diagram of the core board structure of this utility model;
[0021] Figure 4 This is a partial side sectional view of the structure of this utility model;
[0022] Figure 5 This is a schematic diagram of the structure of the isolation tape of this utility model.
[0023] In the diagram: 1. Copper foil; 2. Connecting frame; 3. First prepreg; 4. Isolation tape; 5. Core board; 6. Positioning groove; 7. Thermal conductive strip; 8. Strip positioning block; 9. Groove; 10. Receiving groove; 11. Adhesive surface; 12. Smooth surface; 13. Second prepreg. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0025] Reference Figures 1-5A stepped plate lamination structure includes a first semi-cured sheet 3 and a second semi-cured sheet 13, with a core board 5 disposed between the first semi-cured sheet 3 and the second semi-cured sheet 13. Both the first semi-cured sheet 3 and the second semi-cured sheet 13 have release tape 4 on the side closest to the core board 5. Figure 1 and Figure 5 As shown, the sides of the first semi-cured sheet 3 and the second semi-cured sheet 13 are both adhered to the adhesive surface 11 of the release tape 4, and during pressing, the smooth surface 12 of the release tape 4 contacts and connects with the surface of the core board 5. In this way, no residual adhesive from the release tape 4 will remain on the surface of the core board 5, thus improving the performance.
[0026] like Figure 1 and 4 As shown, grooves 9 are provided on both sides of the core board 5. A connecting frame 2 is provided on the side of the first semi-cured sheet 3 and the second semi-cured sheet 13 away from the core board 5. When pressed together, the connecting frame 2 presses the edges of the first semi-cured sheet 3, the second semi-cured sheet 13 and the release tape 4 into the grooves 9. Through the cooperation of the grooves 9 and the connecting frame 2, the connection area between the first semi-cured sheet 3 and the second semi-cured sheet 13 and the core board 5 can be increased, so that the pressing is stable and will not be separated.
[0027] It should be noted that, as Figure 1 and Figure 4 As shown, each connecting frame 2 has several strip positioning blocks 8 installed on the side near the core board 5, and several positioning grooves 6 are opened at the end of the groove 9. The strip positioning blocks 8 match the positioning grooves 6. In actual use, the connection area between the first semi-cured sheet 3 and the second semi-cured sheet 13 and the core board 5 can be increased by the positioning grooves 6 and the strip positioning blocks 8, which can further increase the stability of pressing.
[0028] It should be noted that the connecting frame 2 is made of copper or other materials with thermal conductivity. This way, some of the heat generated by the core board 5 can be dissipated to the external environment through the connecting frame 2, thus improving the heat dissipation effect.
[0029] like Figure 1 and Figure 2 As shown, one side of each connecting frame 2 is fixed to the side edge of the copper foil 1, and the first semi-cured sheet 3 and the second semi-cured sheet 13 are pressed and fixed together with the corresponding copper foil 1. By pressing the copper foil 1 together with the core board 5 and the first semi-cured sheet 3 and the second semi-cured sheet 13, the pressing process of the circuit board can be completed.
[0030] like Figure 3 and Figure 4As shown, a receiving groove 10 is provided on the side edge of the core board 5. A thermally conductive strip 7 is installed inside the receiving groove 10. The thermally conductive strip 7 can be made of thermally conductive silicone material or other materials with thermal conductivity. During use, part of the heat generated by the core board 5 can be transferred to the thermally conductive strip 7 and then dissipated to the external environment through the thermally conductive strip 7. In addition, part of the heat is also dissipated through the copper foil 1 and the connecting frame 2, thereby improving the heat dissipation effect.
[0031] Specifically, in use, the worker adheres the adhesive surface 11 of the isolation tape 4 to the sides of the corresponding first semi-cured sheet 3 and second semi-cured sheet 13. Then, the first semi-cured sheet 3 and second semi-cured sheet 13 are placed on both sides of the core board 5, so that the two sides of the core board 5 are in contact with the smooth surfaces 12 of the two isolation tapes 4. Then, the connecting frame 2 is moved into the corresponding groove 9, so that the strip positioning block 8 pushes the corresponding first semi-cured sheet 3, second semi-cured sheet 13 and isolation tape 4 into the corresponding positioning groove 6. Then, the copper foil 1 is covered on the surface of the corresponding first semi-cured sheet 3 and second semi-cured sheet 13, and then pressed together, which makes the pressing more stable. In addition, a heat-conducting strip 7 is set in the receiving groove 10 opened on the edge of the core board 5. The heat-conducting strip 7 can quickly dissipate part of the heat generated by the core board 5 to the external environment. The remaining heat can be quickly dissipated to the surrounding environment through the copper foil 1 and the connecting frame 2, thereby improving the heat dissipation effect.
[0032] Furthermore, such as Figure 2 and Figure 4 As shown, when the connecting frame 2 is pressed into the groove 9, the sides of the first semi-cured sheet 3 and the second semi-cured sheet 13 are flush with the corresponding connecting frame 2, so that the connecting frame 2 will not hinder the pressing of the copper foil 1 during connection.
[0033] Furthermore, such as Figure 1 As shown, the release tape 4 is the same size as the first semi-cured sheet 3 and the second semi-cured sheet 13. This allows the release tape 4 to bend and cover the surfaces of the first semi-cured sheet 3 and the second semi-cured sheet 13. This ensures that the release tape can effectively isolate the adhesive residue between the first semi-cured sheet 3 and the second semi-cured sheet 13 and the core board 5 during the pressing process, while avoiding contamination of the bottom of the stepped groove.
[0034] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A stepped plate laminate, comprising a first prepreg (3) and a second prepreg (13), characterized in that: A core board (5) is provided between the first semi-cured sheet (3) and the second semi-cured sheet (13). The first semi-cured sheet (3) and the second semi-cured sheet (13) are both provided with a release tape (4) on the side of the core board (5), and the sides of the first semi-cured sheet (3) and the second semi-cured sheet (13) are both adhered to the adhesive surface (11) of the release tape (4). The core board (5) has grooves (9) on both sides of its edge. A connecting frame (2) is provided on the side of the first semi-cured sheet (3) and the second semi-cured sheet (13) away from the core board (5). When pressed, the connecting frame (2) presses the edges of the first semi-cured sheet (3), the second semi-cured sheet (13) and the isolation tape (4) into the grooves (9). One side of each connecting frame (2) is fixed to the side edge of the copper foil (1), and the first semi-cured sheet (3) and the second semi-cured sheet (13) are pressed and fixed together with the corresponding copper foil (1); The side edge of the core board (5) is provided with a receiving groove (10), and a heat-conducting adhesive strip (7) is installed inside the receiving groove (10).
2. The stepped plate pressing and laminating structure according to claim 1, characterized in that: When the connecting frame (2) is pressed into the groove (9), the sides of the first semi-cured sheet (3) and the second semi-cured sheet (13) are flush with the corresponding connecting frame (2).
3. The stepped plate pressing and laminating structure according to claim 2, characterized in that: Each connecting frame (2) has several strip positioning blocks (8) installed on the side near the core plate (5), and several positioning grooves (6) are opened at the end of the groove (9), with the strip positioning blocks (8) matching the positioning grooves (6).
4. The stepped plate pressing and laminating structure according to claim 1, characterized in that: During pressing, the smooth surface (12) of the release tape (4) contacts and connects with the surface of the core board (5).
5. The stepped plate pressing and laminating structure according to claim 1, characterized in that: The isolation tape (4) has the same dimensions as the first semi-cured sheet (3) and the second semi-cured sheet (13).
6. The stepped plate pressing and laminating structure according to claim 1, characterized in that: The thermally conductive strip (7) is made of thermally conductive silicone material.
7. The stepped plate pressing and laminating structure according to claim 1, characterized in that: The connecting frame (2) is made of copper.