Composite insulating epoxy board

Abstract

The utility model discloses a composite insulating epoxy board, which relates to the technical field of epoxy boards and comprises a substrate, two sides of the substrate are respectively connected with a first protective board and a second protective board, and positioning grooves are arranged above one side of the first protective board and below one side of the second protective board. Through the arrangement of the first protective plates, the second protective plates, the positioning plates and the positioning grooves, the four edges of the base plate, the first surface layer and the second surface layer are wrapped through the first protective plates and the second protective plates, firstly, in the subsequent stacking and transporting process, the first protective plates and the second protective plates on the multiple epoxy plates make contact with each other, and the first surface layer and the second surface layer are not prone to falling off; the phenomenon of abrasion caused by contact friction between the first surface layers and the second surface layers on the multiple epoxy plates due to jolting and other motions is avoided, and the phenomenon that the corners of the first surface layers and the second surface layers tilt up is avoided through the edge covering structures; abrasion of the copper foil in the transportation process is avoided, quality is improved, follow-up cutting and waste transportation of circuit board manufacturers are not needed, and cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of epoxy board technology, specifically a composite insulating epoxy board. Background Technology

[0002] Epoxy board, also known as epoxy resin board, is one of the base materials for making circuit boards. It has good insulation properties. When making circuit boards using epoxy boards, composite epoxy boards are usually used. For example, copper foil is fixed on one or two sides of the epoxy board by adhesive and pressure bonding. Various fibers such as glass fiber are added inside the epoxy board to increase its strength and function.

[0003] During transportation, existing epoxy boards are usually stacked. Due to the bumps and jostling during transportation, the relative movement between the copper foils causes friction, which can easily lead to wear on the copper foil surface and may affect the quality of subsequent circuit boards. In addition, existing epoxy boards are usually manufactured as a large board. After that, the circuit board manufacturer performs etching and other operations on the large board to produce multiple circuit boards at the same time. Finally, the circuit boards are cut off from the epoxy board. The waste generated from cutting must be transported to recycling stations or epoxy board manufacturers for reuse, which increases costs due to transportation issues. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide a composite insulating epoxy board to solve the technical problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a composite insulating epoxy board, comprising a substrate, wherein a first protective plate and a second protective plate are respectively connected to both sides of the substrate, and positioning grooves are provided on the upper side of one side of the first protective plate and the lower side of one side of the second protective plate, and positioning plates are connected to the lower side of one side of the first protective plate and the upper side of one side of the second protective plate; a slot is provided on the other side of the first protective plate, and a locking block is fixed on the other side of the second protective plate; and wear-resistant layers are connected to the outer surfaces and backs of the first and second protective plates.

[0006] By adopting the above technical solution, the first and second protective plates wrap the four edges of the substrate, the first surface layer, and the second surface layer. Firstly, during subsequent stacking and transportation, the first and second protective plates on multiple epoxy boards contact each other, preventing wear caused by friction from bumps and other movements. Secondly, the edge-wrapping structure prevents the corners of the first and second surface layers from lifting, further increasing structural stability. Furthermore, during production, the substrate, the first surface layer, and the second surface layer are pre-processed to the customer's desired dimensions, and the waste generated after cutting by the epoxy board manufacturer is directly recycled, saving significant transportation costs. Then, adhesives are used to connect the first and second protective plates to the substrate and to each other. Simultaneously, positioning plates and positioning grooves increase the contact surface between the first and second protective plates, thereby increasing the stability of the adhesion.

[0007] Furthermore, a second surface layer is connected to the outer surface of the substrate, and a first surface layer is connected to the back of the substrate.

[0008] By adopting the above technical solution, the substrate provides insulation, and then the first and second surface layers are etched to form a circuit to facilitate the transmission of current and electrical signals.

[0009] Furthermore, both the first and second surface layers are copper foils, and both the first and second surface layers are fixedly connected to the substrate by pressing with an adhesive.

[0010] By adopting the above technical solution, after the substrate is made with epoxy resin, adhesive is brushed onto both sides of the substrate, and then copper foil is attached to the substrate. After high-pressure pressing, a first surface layer and a second surface layer are formed on both sides of the substrate.

[0011] Furthermore, there are two of each of the first and second protective plates, with the two first protective plates and the two second protective plates being vertically distributed.

[0012] By adopting the above technical solution, the first and second protective plates wrap the four sides of the substrate, the first surface layer, and the second surface layer. Firstly, during subsequent stacking and transportation, the first and second protective plates on multiple epoxy boards come into contact with each other, avoiding wear caused by contact friction between the first and second surface layers on multiple epoxy boards due to bumps and other movements. Secondly, the edge wrapping structure prevents the corners of the first and second surface layers from lifting up, further increasing the structural stability.

[0013] Furthermore, the two first protective plates and the two second protective plates are fixedly connected by adhesive.

[0014] By adopting the above technical solution, during production, the substrate, the first surface layer and the second surface layer are pre-processed to the size desired by the customer. The waste generated after the epoxy board manufacturer cuts the board is directly recycled, saving a lot of transportation costs. Then, the first and second protective plates are connected to the substrate and the first protective plate is connected to the second protective plate by adhesive.

[0015] Furthermore, the positioning plate and the positioning groove are provided in four sets, and the positioning plate and the positioning groove are adapted to each other.

[0016] By adopting the above technical solution, the positioning plate and positioning groove increase the contact surface between the first guard plate and the second guard plate, thereby increasing the stability of the adhesion.

[0017] Furthermore, both the card slot and the card block are trapezoidal, and the card block and the card slot are interference-fitted.

[0018] By adopting the above technical solution, multiple epoxy boards can be spliced ​​together using clips and slots, which facilitates simultaneous etching and other operations on multiple epoxy boards, avoiding the phenomenon that epoxy boards can only be processed individually due to pre-customized dimensions, thus affecting efficiency.

[0019] Furthermore, multiple card slots and card blocks are provided, and the multiple card slots and card blocks are distributed at equal intervals.

[0020] By adopting the above technical solution, the number of card blocks and card slots is increased, thereby increasing the contact surface after splicing two epoxy boards, thus increasing the stability of the connection.

[0021] Furthermore, the wear-resistant layer is made of polytetrafluoroethylene (PTFE).

[0022] By adopting the above technical solution, the surface roughness of the first and second protective plates is reduced by setting the wear-resistant layer, thereby reducing the wear on the first and second protective plates and extending the service life of the structure.

[0023] Furthermore, the wear-resistant layer is provided in four groups, with two wear-resistant layers forming one group, and the four groups of wear-resistant layers are distributed in a ring array.

[0024] By adopting the above technical solution and setting four sets of polytetrafluoroethylene wear-resistant layers, both sides of the two first protective plates and the two second protective plates can be protected, reducing wear during stacking.

[0025] In summary, the present invention has the following main advantages:

[0026] 1. This utility model, through the arrangement of a first protective plate, a second protective plate, a positioning plate, and a positioning groove, wraps the four sides of the substrate, the first surface layer, and the second surface layer with the first and second protective plates. Firstly, during subsequent stacking and transportation, the first and second protective plates on multiple epoxy boards contact each other, preventing wear caused by friction from bumps or other movements. Secondly, the edge-wrapping structure prevents the corners of the first and second surface layers from lifting, further increasing structural stability. Furthermore, during production, the substrate, the first surface layer, and the second surface layer are pre-processed to the customer's desired dimensions. Waste generated after cutting at the epoxy board manufacturer is directly recycled, saving significant transportation costs. Then, adhesives are used to connect the first and second protective plates to the substrate and to each other. Simultaneously, the positioning plate and positioning groove increase the contact surface between the first and second protective plates, thereby increasing the stability of the adhesion. This prevents wear on the copper foil during transportation, improving quality, and eliminates the need for subsequent cutting and transportation of waste materials from the circuit board manufacturer, reducing costs.

[0027] 2. This utility model reduces the surface roughness of the first and second protective plates by setting a wear-resistant layer, thereby reducing the wear on the first and second protective plates and extending the service life of the structure; further reducing wear.

[0028] 3. This utility model, through the setting of slots and blocks, allows multiple epoxy boards to be spliced ​​together, thereby facilitating simultaneous etching and other operations on multiple epoxy boards. This avoids the phenomenon that epoxy boards can only be processed individually due to pre-customized dimensions, which affects efficiency; it also facilitates large-scale simultaneous processing. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of this utility model;

[0030] Figure 2 This is a top-section structural diagram of the present invention;

[0031] Figure 3 This is a schematic diagram of the first protective plate structure of this utility model;

[0032] Figure 4 This is a schematic diagram of the second protective plate structure of this utility model;

[0033] Figure 5 This is a schematic diagram of the exploded structure of the first protective plate of this utility model.

[0034] In the diagram: 1. Substrate; 2. First surface layer; 3. Second surface layer; 4. First protective plate; 5. Second protective plate; 6. Positioning plate; 7. Positioning groove; 8. Wear-resistant layer; 9. Card slot; 10. Card block. Detailed Implementation

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0036] The embodiments of this utility model will be described below based on its overall structure. Example 1:

[0037] A composite insulating epoxy board, such as Figures 1-5 As shown, the substrate includes a base plate 1, with a first protective plate 4 and a second protective plate 5 connected to both sides of the base plate 1. Two first protective plates 4 and two second protective plates 5 are provided, with the two first protective plates 4 and the two second protective plates 5 vertically distributed. The two first protective plates 4 and the two second protective plates 5 are fixedly connected by adhesive. The first protective plates 4 and the second protective plates 5 wrap around the four sides of the base plate 1, the first surface layer 2, and the second surface layer 3. This serves two purposes: firstly, during subsequent stacking and transportation, the first protective plates 4 and the second protective plates 5 on multiple epoxy boards contact each other, preventing damage from bumps or other movements. The first layer 2 and the second layer 3 on the oxygen plate come into contact and rub against each other, causing wear. Secondly, the edge-wrapping structure prevents the corners of the first layer 2 and the second layer 3 from lifting, further increasing the structural stability. Positioning grooves 7 are provided on the upper side of the first protective plate 4 and the lower side of the second protective plate 5. Positioning plates 6 are connected to the lower side of the first protective plate 4 and the upper side of the second protective plate 5. There are four sets of positioning plates 6 and positioning grooves 7. The positioning plates 6 and positioning grooves 7 are adapted to each other. The positioning plates 6 and positioning grooves 7 increase the contact surface between the first protective plate 4 and the second protective plate 5, thereby increasing the stability of the adhesion.

[0038] See Figure 1 and Figure 2 In the above embodiment, a second surface layer 3 is connected to the outer surface of the substrate 1, and a first surface layer 2 is connected to the back of the substrate 1. Both the first surface layer 2 and the second surface layer 3 are copper foils, and both the first surface layer 2 and the second surface layer 3 are fixedly connected to the substrate 1 by means of adhesive pressing. Example 2:

[0039] Based on the above embodiment one, in order to further reduce wear, the following settings are now implemented.

[0040] See Figures 1-5In the above embodiment, the outer surface and back of the first protective plate 4 and the second protective plate 5 are both connected with wear-resistant layers 8. The wear-resistant layers 8 are made of polytetrafluoroethylene material. There are four sets of wear-resistant layers 8, with two wear-resistant layers 8 forming one set. The four sets of wear-resistant layers 8 are distributed in a ring array. By setting the wear-resistant layers 8, the surface roughness of the first protective plate 4 and the second protective plate 5 is reduced, thereby reducing the wear on the first protective plate 4 and the second protective plate 5 and extending the service life of the structure. Example 3:

[0041] Based on the above embodiment one, the following settings are now adopted to facilitate batch processing.

[0042] See Figures 1-5 In the above embodiment, a slot 9 is provided on the other side of the first guard plate 4, and a block 10 is fixed on the other side of the second guard plate 5. Both the slot 9 and the block 10 are trapezoidal, and the block 10 is interference-fitted with the slot 9. Multiple slots 9 and blocks 10 are provided, and the multiple slots 9 and blocks 10 are equidistantly distributed. Workers can splice multiple epoxy boards together through the blocks 10 and slots 9, avoiding the phenomenon that epoxy boards can only be processed individually due to pre-customized dimensions, which affects efficiency. In addition, the interference fit between the blocks 10 and the slots 9 increases the stability of the splicing and avoids the phenomenon of multiple epoxy boards separating when drilling with kinetic energy.

[0043] The implementation principle of this utility model is as follows: First, during production, the staff of the epoxy board manufacturer pre-process the substrate 1, the first surface layer 2, and the second surface layer 3 into the size desired by the customer. The waste generated after the epoxy board manufacturer cuts the substrate is directly recycled, without the need for the circuit board manufacturer to cut and transport it back for recycling, saving a lot of transportation costs. Then, the staff of the epoxy board manufacturer use adhesive to connect the first protective plate 4 and the second protective plate 5 to the substrate 1, and to connect the first protective plate 4 and the second protective plate 5. At the same time, the positioning plate 6 and the positioning groove 7 increase the contact surface between the first protective plate 4 and the second protective plate 5, thereby increasing the stability of the adhesion.

[0044] When epoxy boards are transported from epoxy board manufacturers to circuit board manufacturers, or transferred between processes within circuit board manufacturers, the four edges of the substrate 1, the first surface layer 2, and the second surface layer 3 are wrapped by the first protective plate 4 and the second protective plate 5. Firstly, during subsequent stacking and transportation, the first protective plates 4 and 5 on multiple epoxy boards come into contact with each other, preventing wear caused by friction from bumps or other movements. Furthermore, the wear-resistant layer 8 reduces the surface roughness of the first protective plates 4 and 5, thus reducing wear and extending the structural lifespan. Secondly, the edge-wrapping structure prevents the corners of the first surface layer 2 and the second surface layer 3 from lifting, further increasing structural stability.

[0045] When a circuit board manufacturer needs to perform etching, drilling, and other processing on multiple circuit boards simultaneously, the manufacturer's staff can use the clip 10 and the slot 9 to splice multiple epoxy boards together. This avoids the situation where epoxy boards can only be processed individually due to pre-customized dimensions, which affects efficiency. Furthermore, the interference fit between the clip 10 and the slot 9 increases the stability of the splicing and prevents the epoxy boards from separating during drilling operations where kinetic energy is involved.

[0046] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A composite insulating epoxy board, comprising a substrate (1), characterized in that: The substrate (1) is connected to a first protective plate (4) and a second protective plate (5) on both sides respectively. A positioning groove (7) is provided on the upper side of the first protective plate (4) and the lower side of the second protective plate (5). A positioning plate (6) is connected to the lower side of the first protective plate (4) and the upper side of the second protective plate (5). A slot (9) is provided on the other side of the first protective plate (4), and a locking block (10) is fixed on the other side of the second protective plate (5). A wear-resistant layer (8) is connected to the outer surface and back of the first protective plate (4) and the second protective plate (5).

2. The composite insulating epoxy board according to claim 1, characterized in that: The outer surface of the substrate (1) is connected to a second surface layer (3), and the back of the substrate (1) is connected to a first surface layer (2).

3. The composite insulating epoxy board according to claim 2, characterized in that: The first surface layer (2) and the second surface layer (3) are both copper foils, and the first surface layer (2) and the second surface layer (3) are fixedly connected to the substrate (1) by means of adhesive pressing.

4. The composite insulating epoxy board according to claim 1, characterized in that: There are two of each of the first guard plate (4) and the second guard plate (5), with the two first guard plates (4) being vertically distributed and the two second guard plates (5) being vertically distributed.

5. A composite insulating epoxy board according to claim 4, characterized in that: The two first guard plates (4) and the two second guard plates (5) are fixedly connected by adhesive.

6. The composite insulating epoxy board according to claim 1, characterized in that: The positioning plate (6) and positioning groove (7) are each provided in four sets, and the positioning plate (6) and positioning groove (7) are adapted to each other.

7. The composite insulating epoxy board according to claim 1, characterized in that: Both the slot (9) and the block (10) are trapezoidal, and the block (10) and the slot (9) are interference fit.

8. A composite insulating epoxy board according to claim 7, characterized in that: Multiple card slots (9) and card blocks (10) are provided, and the multiple card slots (9) and card blocks (10) are distributed at equal intervals.

9. A composite insulating epoxy board according to claim 1, characterized in that: The wear-resistant layer (8) is made of polytetrafluoroethylene material.

10. A composite insulating epoxy board according to claim 9, characterized in that: The wear-resistant layer (8) is provided in four groups, with two wear-resistant layers (8) forming one group, and the four groups of wear-resistant layers (8) are distributed in a ring array.

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