Circuit board pattern transfer dry film pressing device
By introducing a tension adjustment component and a pressing component into the circuit board pattern transfer dry film lamination device, the problem of dry film slack is solved, achieving high precision and high quality in pattern transfer and improving the stability and efficiency of circuit board production.
Patent Information
- Application Number
- CN202422980350.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-12-04
AI Technical Summary
In existing technologies, dry film is prone to loosening during the circuit board pattern transfer process, which affects the transfer accuracy and quality of the pattern.
A circuit board pattern transfer dry film lamination device was designed. By setting up tension adjustment components and lamination components, the dry film is ensured to maintain appropriate tension during the conveying and lamination process. The device includes a combination of a first fixing ring, a second fixing ring, a support rod, a conveying roller, and a buffer spring. With the use of a cylinder and a heating plate, the device achieves tight adhesion and uniform heating of the dry film.
It improves the accuracy and quality of pattern transfer, avoids pattern blurring, missing or deformed patterns caused by dry film relaxation, and ensures the production accuracy and efficiency of circuit boards.
Smart Images
Figure CN223503114U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of circuit board manufacturing technology, and specifically relates to a circuit board pattern transfer dry film lamination device. Background Technology
[0002] Applying developing dry film refers to the process of attaching a photosensitive, developing, anti-plating, and anti-etching dry film to a clean board surface using a heat-pressing method. In PCB manufacturing, dry film is mainly used to form outer layer circuitry, which is then transferred to the PCB board through subsequent exposure and development steps.
[0003] A search revealed that CN212851241U discloses a laminating device for high-density printed circuit board processing. In this patent, the dry film reaches the top of the circuit board through the rotation of the first and second conveyor rollers, and is then pressed onto the surface of the circuit board by a pressure plate. It is convenient to use. However, the dry film is prone to loosening during the laminating process, which will affect the transfer accuracy and quality of the pattern. In view of this, a dry film laminating device for circuit board pattern transfer was designed. Utility Model Content
[0004] To address the aforementioned technical problems, this utility model provides a circuit board pattern transfer dry film lamination device, which aims to solve to some extent the technical problem in the prior art where the dry film is prone to loosening during the lamination process, which affects the transfer accuracy and quality of the pattern.
[0005] The technical solution of this utility model is: a circuit board pattern transfer dry film laminating device, including a frame, wherein a tension adjustment component is provided on the frame for adjusting the tension of the dry film;
[0006] The top of the frame is fixedly connected to a pressing assembly, which is used to apply pressure and heat to the circuit board and adhere the dry film to the circuit board.
[0007] The tension adjustment assembly includes a first fixing ring and a second fixing ring, which are respectively fixed on the frame, with the first fixing ring located above the second fixing ring;
[0008] A support rod is rotatably connected to the inner side of the first fixed ring, a fixed seat is fixedly connected to one end of the support rod, and a conveying roller is rotatably connected to the inner side of the fixed seat.
[0009] An inclined buffer spring is connected between the support rod and the second fixing ring.
[0010] Furthermore, the frame includes a base plate, and support rods are fixedly connected to the four corners of the top of the base plate, with a top plate fixedly connected to the top of each support rod.
[0011] Furthermore, the first fixing ring and the second fixing ring are respectively fixedly sleeved on the outer surface of the support rod.
[0012] Furthermore, the pressing assembly includes a cylinder, which is fixedly connected to the top plate. A heating plate is fixedly connected to the output end of the cylinder, and a heat-conducting plate is fixedly connected to the bottom of the heating plate.
[0013] Furthermore, limit rods are fixedly connected to the four corners of the top of the heating plate, and limit sleeves are embedded in the four corners of the top of the top plate, with the limit rods slidably connected inside the limit sleeves.
[0014] Furthermore, it also includes a winding assembly, which is fixedly connected to the top of the top plate;
[0015] The winding assembly includes a drive motor, and the output end of the drive motor is fixedly connected to a winding roller.
[0016] Furthermore, the fixing component includes a fixing frame, which is fixedly connected to the top of the base plate. The fixing frame has fixing grooves at the four corners of the top of the fixing frame. A sliding rod is fixedly connected inside the fixing groove. A sliding sleeve and a thrust spring are respectively fitted on the outer surface of the sliding rod. A connecting rod is fixedly connected to the outer surface of the sliding sleeve.
[0017] The four corners of the inner sidewall of the fixed frame are provided with sliding grooves, which are connected to the fixed grooves. One end of the connecting rod passes through the sliding groove and extends into the interior of the fixed frame. One end of the connecting rod is fixedly connected to a fixed plate.
[0018] Furthermore, one end of the thrust spring abuts against the sliding sleeve, and the other end of the thrust spring abuts against the inner wall of the fixing groove.
[0019] Furthermore, a fixing pad is fixedly connected to the inner side of the fixing plate.
[0020] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages: by setting up the first fixing ring, the second fixing ring, the support rod, the fixing seat, the conveying roller and the buffer spring, the tightness of the dry film can be adjusted to ensure that the dry film maintains a suitable tension during the conveying and pressing process, thereby improving the transfer accuracy and quality of the pattern and avoiding the problems of blurry, missing or deformed patterns caused by the loosening of the dry film. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the structure of this utility model;
[0023] Figure 2 This is a bottom view of the structure of this utility model;
[0024] Figure 3 This is a schematic diagram of the tension adjustment component of this utility model;
[0025] Figure 4 This is a schematic diagram of the fixing component structure of this utility model;
[0026] Figure 5 This is a partial structural diagram of the fixing component of this utility model.
[0027] In the attached image:
[0028] 100. Frame; 101. Base plate; 102. Support rod; 103. Top plate; 200. Tension adjustment assembly; 201. First fixing ring; 202. Second fixing ring; 203. Support rod; 204. Fixing seat; 205. Conveyor roller; 206. Buffer spring; 300. Pressing assembly; 301. Cylinder; 302. Heating plate; 303. Heat conducting plate; 304. Limiting rod; 400. Winding assembly; 401. Drive motor; 402. Winding roller; 500. Fixing assembly; 501. Fixing frame; 502. Fixing groove; 503. Slide rod; 504. Slide sleeve; 505. Thrust spring; 506. Connecting rod; 507. Slide groove; 508. Fixing plate; 509. Fixing pad. Detailed Implementation
[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0030] It should be noted that all directional indications in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0031] The following disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.
[0032] In the electronics manufacturing industry, circuit board production is a crucial step. As a core component of electronic devices, the quality and performance of circuit boards directly affect the operational efficiency and stability of the entire device. With the continuous development of electronic technology, circuit board designs have become increasingly complex, placing ever higher demands on the precision and efficiency of the production process.
[0033] In the circuit board manufacturing process, pattern transfer is a crucial step. Pattern transfer refers to transferring the designed circuit pattern from the original drawing or film to the circuit board so that subsequent processes such as etching and electroplating can be performed, ultimately forming a circuit board with a specific circuit structure. Traditional pattern transfer methods have many shortcomings, such as complex operation, low precision, and low efficiency, which seriously restrict the development of circuit board manufacturing.
[0034] To address these issues, researchers began developing more efficient and precise pattern transfer methods, with dry film lamination technology gradually becoming a mainstream choice. Dry film lamination involves hot-pressing a photosensitive, developing, electroplating-resistant, and etching-resistant dry film onto a clean board surface to form the outer circuitry. Subsequent exposure and development steps then transfer the circuitry pattern to the PCB board.
[0035] If the dry film is not tightly fitted between the conveyor rollers during the conveying process, it will be subjected to uneven tension, which will lead to slack. The slack will affect the transfer accuracy and quality of the pattern.
[0036] This application is described below with reference to the accompanying drawings and specific embodiments:
[0037] This utility model provides a circuit board pattern transfer dry film lamination device. By setting the tension adjustment component 200, the tension of the dry film can be adjusted to ensure that the dry film maintains appropriate tension during the transfer and lamination process, thereby improving the transfer accuracy and quality of the pattern and avoiding the problems of pattern blurring, missing or deformed patterns caused by dry film loosening.
[0038] Specifically:
[0039] like Figures 1-3As shown, a circuit board pattern transfer dry film laminating device includes a frame 100, on which a tension adjustment component 200 is provided for adjusting the tension of the dry film.
[0040] A pressing assembly 300 is fixedly connected to the top of the frame 100 for applying pressure and heat to the circuit board to adhere the dry film to the circuit board;
[0041] The tension adjustment assembly 200 includes a first fixing ring 201 and a second fixing ring 202, which are respectively fixed on the frame 100, with the first fixing ring 201 located above the second fixing ring 202. A support rod 203 is rotatably connected to the inner side of the first fixing ring 201, and a fixing seat 204 is fixedly connected to one end of the support rod 203. A conveying roller 205 is rotatably connected to the inner side of the fixing seat 204. An inclined buffer spring 206 is connected between the support rod 203 and the second fixing ring 202, which can adjust the tension of the dry film and ensure that the dry film maintains appropriate tension during conveying and pressing, thereby improving the transfer accuracy and quality of the pattern and avoiding problems such as blurry, missing, or deformed patterns caused by dry film loosening.
[0042] like Figure 1 and Figure 2 As shown, the frame 100 includes a base plate 101, and support rods 102 are fixedly connected to the four corners of the top of the base plate 101. A top plate 103 is fixedly connected to the top of the support rods 102. A first fixing ring 201 and a second fixing ring 202 are respectively fixedly sleeved on the outer surface of the support rods 102.
[0043] like Figure 1 and Figure 2 As shown, the lamination assembly 300 includes a cylinder 301, which is fixedly connected to the top plate 103. A heating plate 302 is fixedly connected to the output end of the cylinder 301, and a heat-conducting plate 303 is fixedly connected to the bottom of the heating plate 302. The operation of the cylinder 301 pushes the heating plate 302 and the heat-conducting plate 303, causing the heat-conducting plate 303 to adhere the dry film to the circuit board. The heat generated by the heating plate 302 after being energized is quickly and evenly transferred to the dry film and the circuit board through the heat-conducting plate 303, helping to soften the adhesive in the dry film and better adhere it to the circuit board, thereby improving the quality of pattern transfer. Furthermore, by adjusting the output force of the cylinder 301, it can be ensured that the dry film receives uniform and stable pressure during the lamination process, thus preventing the dry film from breaking due to excessive pressure or loosening due to insufficient pressure.
[0044] like Figure 1 and Figure 2As shown, limit rods 304 are fixedly connected to the four corners of the top of the heating plate 302, and limit sleeves are embedded in the four corners of the top of the top plate 103. The limit rods 304 are slidably connected in the limit sleeves. During the operation of the cylinder 301 to push the heating plate 302 and the heat-conducting plate 303, the limit rods 304 will slide in the limit sleeves, ensuring the stability of the movement of the heating plate 302 and the heat-conducting plate 303.
[0045] In some embodiments, the pressing assembly 300 is also provided with an emergency stop device and a pressure sensor to ensure that the cylinder 301 can stop operating quickly in case of abnormal conditions during the pressing process, thereby protecting the safety of equipment and personnel.
[0046] like Figure 1 and Figure 2 As shown, a winding assembly 400 is fixedly connected to the top of the top plate 103. The winding assembly 400 includes a drive motor 401. The output end of the drive motor 401 is fixedly connected to a winding roller 402. One end of the dry film passes through the bottom of the conveyor roller 205 and is fixed on the winding roller 402. When the drive motor 401 runs, it will drive the winding roller 402 to rotate, thereby pulling and winding the dry film.
[0047] like Figure 1 , Figure 4 and Figure 5 As shown, the fixing component 500 includes a fixing frame 501, which is fixedly connected to the top of the base plate 101. The fixing frame 501 has fixing grooves 502 at the four corners of the top of the fixing frame 501. A sliding rod 503 is fixedly connected inside the fixing groove 502. A sliding sleeve 504 and a thrust spring 505 are respectively fitted on the outer surface of the sliding rod 503. One end of the thrust spring 505 abuts against the sliding sleeve 504, and the other end of the thrust spring 505 abuts against the inner wall of the fixing groove 502. A connecting rod 506 is fixedly connected to the outer surface of the sliding sleeve 504.
[0048] Each of the four corners of the inner wall of the fixed frame 501 is provided with a sliding groove 507, which communicates with the fixed groove 502. One end of the connecting rod 506 passes through the sliding groove 507 and extends into the interior of the fixed frame 501. One end of the connecting rod 506 is fixedly connected to a fixed plate 508. When the circuit board is placed between the two fixed plates 508, the rebound force of the thrust spring 505 pushes the sliding sleeve 504, which in turn drives the fixed plates 508 to move through the connecting rod 506. This causes the two fixed plates 508 to move closer together to position and fix the circuit board, ensuring the stability of the circuit board during the lamination process and adapting to circuit boards of different sizes, thus improving versatility.
[0049] The inner side of the fixing plate 508 is fixedly connected to the fixing pad 509, which is made of soft and wear-resistant material, such as rubber or silicone. When fixing the circuit board, the fixing pad 509 can fit tightly on the circuit board, playing a role in cushioning and protection.
[0050] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0051] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A circuit board pattern transfer dry film laminating device, comprising a frame (100), characterized in that: The frame (100) is provided with a tension adjustment assembly (200) for adjusting the tension of the dry film; The top of the frame (100) is fixedly connected to a pressing assembly (300) for applying pressure and heat to the circuit board to adhere the dry film to the circuit board; The tension adjustment assembly (200) includes a first fixing ring (201) and a second fixing ring (202), the first fixing ring (201) and the second fixing ring (202) are respectively fixed on the frame (100), and the first fixing ring (201) is located above the second fixing ring (202); The inner side of the first fixed ring (201) is rotatably connected to a support rod (203), one end of the support rod (203) is fixedly connected to a fixed seat (204), and the inner side of the fixed seat (204) is rotatably connected to a conveying roller (205). An inclined buffer spring (206) is connected between the support rod (203) and the second fixing ring (202).
2. The circuit board pattern transfer dry film lamination apparatus as described in claim 1, characterized in that, The frame (100) includes a base plate (101), and support rods (102) are fixedly connected to the four corners of the top of the base plate (101). A top plate (103) is fixedly connected to the top of the support rods (102).
3. The circuit board pattern transfer dry film lamination apparatus as described in claim 2, characterized in that, The first fixing ring (201) and the second fixing ring (202) are respectively fixedly sleeved on the outer surface of the support rod (102).
4. The circuit board pattern transfer dry film lamination apparatus as described in claim 2, characterized in that, The pressing assembly (300) includes a cylinder (301), which is fixedly connected to the top plate (103). A heating plate (302) is fixedly connected to the output end of the cylinder (301), and a heat-conducting plate (303) is fixedly connected to the bottom of the heating plate (302).
5. The circuit board pattern transfer dry film lamination apparatus as described in claim 4, characterized in that, Limiting rods (304) are fixedly connected to the four corners of the top of the heating plate (302), and limiting sleeves are embedded in the four corners of the top of the top plate (103). The limiting rods (304) are slidably connected in the limiting sleeves.
6. The circuit board pattern transfer dry film lamination apparatus as described in claim 1, characterized in that, It also includes a winding assembly (400), which is fixedly connected to the top of the top plate (103); The winding assembly (400) includes a drive motor (401), and the output end of the drive motor (401) is fixedly connected to a winding roller (402).
7. The circuit board pattern transfer dry film lamination apparatus as described in claim 2, characterized in that, It also includes a fixing component (500), which includes a fixing frame (501) fixedly connected to the top of the base plate (101). The fixing frame (501) is provided with fixing grooves (502) at the four corners of the top of the fixing frame (501). A sliding rod (503) is fixedly connected inside the fixing groove (502). A sliding sleeve (504) and a thrust spring (505) are respectively fitted on the outer surface of the sliding rod (503). A connecting rod (506) is fixedly connected to the outer surface of the sliding sleeve (504). The four corners of the inner sidewall of the fixed frame (501) are provided with sliding grooves (507), the sliding grooves (507) are connected to the fixed grooves (502), one end of the connecting rod (506) passes through the sliding grooves (507) and extends into the interior of the fixed frame (501), and one end of the connecting rod (506) is fixedly connected to a fixing plate (508).
8. The circuit board pattern transfer dry film lamination apparatus as described in claim 7, characterized in that, One end of the thrust spring (505) abuts against the sliding sleeve (504), and the other end of the thrust spring (505) abuts against the inner wall of the fixing groove (502).
9. The circuit board pattern transfer dry film lamination apparatus as described in claim 8, characterized in that, A fixing pad (509) is fixedly connected to the inner side of the fixing plate (508).