Novel anti-electromagnetic interference heat-conducting silica gel gasket

Abstract

The utility model discloses a novel anti-electromagnetic interference heat-conducting silica gel gasket, which comprises a lower gasket, an upper gasket is arranged above the lower gasket, a heat-conducting copper plate is arranged between the lower gasket and the upper gasket, and two ends of the heat-conducting copper plate are fixedly connected with a heat dissipation plate. A plurality of heat dissipation fins distributed at equal intervals are arranged on the side, away from the heat conduction copper plate, of the heat dissipation plate, the lower gasket comprises a first silica gel sheet, a reinforcing layer is arranged below the first silica gel sheet, a first heat conduction adhesive layer is arranged below the reinforcing layer, the upper gasket comprises a second silica gel sheet, and a second heat conduction adhesive layer is arranged below the second silica gel sheet. An anti-static layer is arranged on the side, close to the heat conduction copper plate, of the second silica gel sheet, and an anti-interference layer is arranged on the side, close to the heat conduction copper plate, of the anti-static layer. The heat conduction silica gel gasket is simple in structure, good in heat dissipation effect and high in anti-static and anti-interference capacity, and the phenomenon that elements cannot be normally used due to external objects is avoided.

Description

Technical Field

[0001] This utility model relates to the field of thermally conductive silicone pad technology, and in particular to a novel thermally conductive silicone pad that resists electromagnetic interference. Background Technology

[0002] To ensure that electronic components can maintain normal operation under ambient temperature, a thermally conductive insulating film is usually placed on the heat exchange interface of the relevant components as a thermal interface material to quickly transfer heat from the heat-generating components to the heat dissipation equipment, ensuring the normal operation of electronic equipment. Existing thermally conductive silicone pads only provide thermal conductivity, but they have high thermal resistance, which reduces the efficiency of heat conduction and dissipation, resulting in poor heat dissipation. Furthermore, existing thermally conductive silicone pads do not have anti-magnetic interference and anti-static properties, making the protected object susceptible to external factors and affecting the normal use of internal components. Therefore, we propose a new type of thermally conductive silicone pad with anti-electromagnetic interference properties. Utility Model Content

[0003] To address the aforementioned problems, this invention provides a novel thermally conductive silicone pad that resists electromagnetic interference. This invention solves the problems of existing thermally conductive silicone pads, which only provide heat conduction but have high thermal resistance, reducing heat conduction and dissipation efficiency and resulting in poor heat dissipation. Furthermore, existing thermally conductive silicone pads lack anti-magnetic interference and anti-static properties, making the protected object susceptible to external factors and affecting the normal operation of internal components.

[0004] This utility model discloses a novel thermally conductive silicone pad for resisting electromagnetic interference, comprising a lower pad, an upper pad above the lower pad, a thermally conductive copper plate between the lower and upper pads, both ends of the thermally conductive copper plate being fixedly connected to a heat sink, and a plurality of equidistantly arranged heat dissipation fins on the side of the heat sink away from the thermally conductive copper plate. The lower pad includes a first silicone sheet, a reinforcing layer below the first silicone sheet, and a first thermally conductive adhesive layer below the reinforcing layer. The upper pad includes a second silicone sheet, an antistatic layer on the side of the second silicone sheet near the thermally conductive copper plate, and an anti-interference layer on the side of the antistatic layer near the thermally conductive copper plate.

[0005] In the above scheme, a first protective layer is provided on the side of the first thermally conductive adhesive layer away from the reinforcing layer.

[0006] In the above scheme, multiple equidistant arc-shaped expansion ribs are provided below the heat-conducting copper plate, and an arc-shaped groove matching the arc-shaped expansion ribs is provided above the first silicone sheet.

[0007] In the above scheme, a second thermally conductive adhesive layer is provided between the thermally conductive copper plate and the first silicone sheet.

[0008] In the above scheme, both the first thermally conductive adhesive layer and the second thermally conductive adhesive layer are thermally conductive silicone cloth.

[0009] In the above scheme, a second protective layer is provided on the side of the second silicone sheet away from the antistatic layer.

[0010] The advantages and beneficial effects of this utility model are as follows: This utility model provides a novel thermally conductive silicone pad with anti-electromagnetic interference. The heat absorbed by the lower pad can be conducted to the thermally conductive copper plate. The heat absorbed by the thermally conductive copper plate can be diffused through the heat dissipation plates and heat dissipation fins on both sides of the thermally conductive copper plate, thereby effectively improving the heat dissipation speed of the thermally conductive silicone pad. The reinforcing layer effectively increases the overall structural strength of the thermally conductive silicone pad. The anti-static layer increases the anti-static capability of the thermally conductive silicone pad, avoiding the phenomenon of dust adsorbing due to static electricity. The anti-interference layer increases the anti-interference capability of the thermally conductive silicone pad. This thermally conductive silicone pad has a simple structure, good heat dissipation effect, strong anti-static and anti-interference capability, and avoids the phenomenon of external objects causing components to malfunction. Attached Figure Description

[0011] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0012] Figure 1 This is a schematic diagram of the structure of this utility model;

[0013] Figure 2 This is a cross-sectional view of the present invention;

[0014] Figure 3 This is a schematic diagram of part A of the present invention.

[0015] In the figure: 1. Lower pad 11. First silicone sheet 12. Reinforcing layer 13. First thermally conductive adhesive layer 14. First protective layer 15. Arc groove 2. Upper pad 21. Second silicone sheet 22. Antistatic layer 23. Anti-interference layer 24. First protective layer 3. Thermally conductive copper plate 4. Heat sink 5. Heat sink fins 6. Arc-shaped expansion rib 7. Second thermally conductive adhesive layer. Detailed Implementation

[0016] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings and examples. The following examples are only used to more clearly illustrate the technical solution of this utility model and should not be construed as limiting the scope of protection of this utility model.

[0017] like Figure 1-3As shown, this utility model is a novel thermally conductive silicone pad for electromagnetic interference resistance, comprising a lower pad 1, an upper pad 2 above the lower pad 1, and a thermally conductive copper plate 3 between the lower pad 1 and the upper pad 2. The two ends of the thermally conductive copper plate 3 are fixedly connected to a heat sink 4. The heat sink 4 has multiple equidistantly arranged heat dissipation fins 5 on the side away from the thermally conductive copper plate 3. Heat absorbed by the lower pad 1 can be conducted to the thermally conductive copper plate 3. The heat absorbed by the thermally conductive copper plate 3 can be diffused through the heat sink 4 and the heat dissipation fins 5 on both sides of the thermally conductive copper plate 3, thereby effectively improving the heat dissipation speed of the thermally conductive silicone pad. The lower pad 1 includes a first silicon... The first silicone pad 11 has a reinforcing layer 12 below it, which effectively increases the overall structural strength of the thermally conductive silicone pad. Below the reinforcing layer 12, there is a first thermally conductive adhesive layer 13. The upper pad 2 includes a second silicone pad 21. The second silicone pad 21 has an antistatic layer 22 on the side near the thermally conductive copper plate 3. The antistatic layer 22 increases the antistatic ability of the thermally conductive silicone pad and prevents the thermally conductive silicone pad from attracting dust due to static electricity. The antistatic layer 22 has an anti-interference layer 23 on the side near the thermally conductive copper plate 3, which increases the anti-interference ability of the thermally conductive silicone pad.

[0018] A first protective layer 14 is provided on the side of the first thermally conductive adhesive layer 13 away from the reinforcing layer 12, and the first protective layer 14 can protect the first thermally conductive adhesive layer 13.

[0019] The heat-conducting copper plate 3 has multiple equidistantly arranged arc-shaped expansion ribs 6 below it, and the first silicone sheet 11 has an arc-shaped groove 15 above it that matches the arc-shaped expansion ribs 6. The arrangement of the arc-shaped expansion ribs 6 and the arc-shaped groove 15 effectively increases the contact area between the heat-conducting copper plate 3 and the first silicone sheet 11, thereby further improving the heat exchange rate between the first silicone sheet 11 and the heat-conducting copper plate 3.

[0020] A second thermally conductive adhesive layer 7 is provided between the thermally conductive copper plate 3 and the first silicone sheet 11.

[0021] Both the first thermally conductive adhesive layer 13 and the second thermally conductive adhesive layer 7 are thermally conductive silicone cloth.

[0022] The second silicone sheet 21 has a second protective layer 24 on the side away from the antistatic layer 22, which can protect the upper surface of the second silicone sheet 21.

[0023] Specifically, in this invention, the heat absorbed by the lower pad 1 can be conducted to the heat-conducting copper plate 3. The heat absorbed by the heat-conducting copper plate 3 can be diffused through the heat dissipation plates 4 and heat dissipation fins 5 on both sides of the heat-conducting copper plate 3, thereby effectively improving the heat dissipation speed of the heat-conducting silicone pad. The reinforcing layer 12 effectively increases the overall structural strength of the heat-conducting silicone pad. The antistatic layer 22 increases the antistatic capability of the heat-conducting silicone pad, preventing the heat-conducting silicone pad from attracting dust due to static electricity. The anti-interference layer 23 increases the anti-interference capability of the heat-conducting silicone pad.

[0024] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel thermally conductive silicone pad for resisting electromagnetic interference, comprising a lower pad (1), characterized in that, An upper pad (2) is provided above the lower pad (1). A thermally conductive copper plate (3) is provided between the lower pad (1) and the upper pad (2). The two ends of the thermally conductive copper plate (3) are fixedly connected to the heat sink (4). The heat sink (4) has a plurality of equidistantly arranged heat sink fins (5) on the side away from the thermally conductive copper plate (3). The lower pad (1) includes a first silicone sheet (11). A reinforcing layer (12) is provided below the first silicone sheet (11). A first thermally conductive adhesive layer (13) is provided below the reinforcing layer (12). The upper pad (2) includes a second silicone sheet (21). An antistatic layer (22) is provided on the side of the second silicone sheet (21) close to the thermally conductive copper plate (3). An anti-interference layer (23) is provided on the side of the antistatic layer (22) close to the thermally conductive copper plate (3).

2. The novel thermally conductive silicone pad for electromagnetic interference resistance according to claim 1, characterized in that, A first protective layer (14) is provided on the side of the first thermally conductive adhesive layer (13) away from the reinforcing layer (12).

3. The novel thermally conductive silicone pad for electromagnetic interference resistance according to claim 1, characterized in that, The heat-conducting copper plate (3) has multiple equidistant arc-shaped expansion ribs (6) below it, and the first silicone sheet (11) has an arc-shaped groove (15) above it that matches the arc-shaped expansion ribs (6).

4. A novel thermally conductive silicone pad for resisting electromagnetic interference according to claim 1, characterized in that, A second thermally conductive adhesive layer (7) is provided between the thermally conductive copper plate (3) and the first silicone sheet (11).

5. A novel thermally conductive silicone pad for resisting electromagnetic interference according to claim 4, characterized in that, Both the first thermally conductive adhesive layer (13) and the second thermally conductive adhesive layer (7) are thermally conductive silicone cloth.

6. A novel thermally conductive silicone pad for resisting electromagnetic interference according to claim 1, characterized in that, The second silicone sheet (21) has a second protective layer (24) on the side away from the antistatic layer (22).

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