Domain controller and vehicle

Abstract

The utility model provides a domain controller and a vehicle, the domain controller comprises a circuit board, and the circuit board is provided with an electronic device; the shell accommodates at least one part of the circuit board, and the shell is provided with a protruding part extending towards the electronic device; the first surface of the heat conduction piece is in contact with the protruding part, and the second surface of the heat conduction piece is in contact with the electronic device; the projection of the protruding part on the circuit board covers the electronic device and can exchange heat with the heat conduction piece.

Description

Technical Field

[0001] This disclosure belongs to the field of control device technology, specifically, this disclosure relates to a domain controller and a vehicle. Background Technology

[0002] As a core component of a vehicle's electronic system, the domain controller has a high power density of integrated electronic devices, which makes the requirements for heat dissipation increasingly stringent.

[0003] In related technologies, domain controllers mainly rely on the enclosure for passive heat dissipation. This heat dissipation method has low efficiency and cannot ensure the stability and reliability of the domain controller during operation. Utility Model Content

[0004] One object of this disclosure is to provide a new technical solution for domain controllers to solve the problem of low heat dissipation efficiency of domain controllers.

[0005] According to a first aspect of this disclosure, a domain controller is provided, comprising:

[0006] A circuit board on which electronic components are disposed;

[0007] A housing that houses at least a portion of the circuit board, the housing having a protrusion extending toward the electronic device;

[0008] A heat-conducting component, wherein a first surface of the heat-conducting component contacts the protrusion, and a second surface of the heat-conducting component contacts the electronic device;

[0009] The projection of the protrusion on the circuit board covers the electronic device and allows for heat exchange with the heat-conducting component.

[0010] Optionally, the thermal conductive component is a thermally conductive silicone grease layer, with the side of the electronic device away from the circuit board contacting one side of the thermally conductive silicone grease layer, and the side of the protrusion facing the electronic device contacting the other side of the thermally conductive silicone grease layer.

[0011] Optionally, the electronic device has a boss on the side away from the circuit board, and the protrusion has a recessed area on the side facing the electronic device;

[0012] The protrusion is positioned opposite to the recessed area.

[0013] Optionally, the housing has a plurality of heat-conducting sheets on the side opposite to the circuit board, and the plurality of heat-conducting sheets are arranged at intervals on the housing.

[0014] Optionally, the housing has a first heat-conducting area and a second heat-conducting area on the side opposite to the circuit board, the projection of the protrusion on the housing coincides with at least a portion of the first heat-conducting area, and the projection of the protrusion on the housing is offset from at least a portion of the second heat-conducting area;

[0015] The plurality of heat-conducting sheets include a plurality of first heat-conducting sheets and a plurality of second heat-conducting sheets. The plurality of first heat-conducting sheets are spaced apart in the first heat-conducting area, and the plurality of second heat-conducting sheets are spaced apart in the second heat-conducting area. The spacing between the plurality of first heat-conducting sheets is smaller than the spacing between the plurality of second heat-conducting sheets.

[0016] Optionally, it also includes a driving component, which is disposed in the second heat-conducting zone and has an air outlet;

[0017] A first gap is formed between the plurality of first heat-conducting sheets, and a second gap is formed between the plurality of second heat-conducting sheets. The first gap and the second gap are connected to the air outlet.

[0018] Optionally, it also includes a cover, which is connected to the side of the housing away from the circuit board and forms a receiving space between the housing and the housing, and the cover has a first opening and a second opening;

[0019] The heat-conducting plate and the driving member are located in the receiving space, the first opening is opposite to the air inlet of the driving member, and the second opening is located at the end of the first heat-conducting plate away from the driving member.

[0020] Optionally, it also includes a shielding element sandwiched between the housing and the circuit board.

[0021] Optionally, the housing includes a middle portion and an edge portion, the edge portion surrounding the middle portion and having an annular step;

[0022] The protrusion is located in the middle part, and the shield is disposed on the annular step and surrounds the electronic device.

[0023] Optionally, it also includes a connection port electrically connected to the electronic device and exposed between the circuit board and the housing;

[0024] The housing has a baffle wall, the projection of which on the circuit board overlaps the projection of the connection port on the circuit board.

[0025] Optionally, the edge of the baffle has a retaining edge that protrudes toward the side away from the connection port.

[0026] According to a second aspect of this disclosure, a vehicle is provided that includes the domain controller described in the first aspect.

[0027] According to an embodiment of this disclosure, the domain controller includes a circuit board on which electronic devices are disposed; a housing that accommodates at least a portion of the circuit board and has a protrusion extending toward the electronic devices; and a heat-conducting element, a first surface of which contacts the protrusion and a second surface of which contacts the electronic devices; wherein the projection of the protrusion onto the circuit board covers the electronic devices and enables heat exchange with the heat-conducting element, thereby increasing the heat dissipation efficiency of the electronic devices and ensuring the stability and reliability of the domain controller during operation.

[0028] Other features and advantages of this disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0029] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the present disclosure and, together with their description, serve to explain the principles of the present disclosure.

[0030] Figure 1 A perspective view of a domain controller provided in one embodiment of this disclosure;

[0031] Figure 2 for Figure 1 Cross-sectional view along plane AA;

[0032] Figure 3 for Figure 2 A magnified view of a section at point A in the middle;

[0033] Figure 4 for Figure 1 Cross-sectional view along the BB plane;

[0034] Figure 5 A top view (excluding the cover) of a domain controller provided in one embodiment of this disclosure;

[0035] Figure 6 A cross-sectional view of a domain controller provided in one embodiment of this disclosure;

[0036] Figure 7 for Figure 6 A magnified view of a section at point B in the middle;

[0037] Figure 8 A bottom view of the housing of a domain controller provided in one embodiment of this disclosure;

[0038] Figure 9 A side view of a domain controller provided for one embodiment of this disclosure.

[0039] The components are: 1. Circuit board; 11. Electronic component; 111. Boss; 2. Housing; 21. Protrusion; 211. Recessed area; 22. Heat-conducting plate; 221. First heat-conducting plate; 222. Second heat-conducting plate; 23. Middle part; 24. Edge part; 241. Annular step; 25. Baffle; 251. Baffle edge; 3. Heat-conducting component; 4. Driving component; 5. Cover; 51. First opening; 52. Second opening; 6. Shielding component; 7. Connection port. Detailed Implementation

[0040] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present disclosure.

[0041] The embodiments of this disclosure will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this disclosure, and should not be construed as limiting it. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure.

[0042] The terms "first" and "second" in this disclosure may explicitly or implicitly include one or more of the features. In the description of this disclosure, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0043] In the description of this disclosure, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0044] In the description of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure based on the specific circumstances.

[0045] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0046] The domain controller provided in this disclosure can be any device with control capabilities. For example, it can be various domain controllers applied in vehicles, including autonomous driving domain controllers, powertrain domain controllers, chassis domain controllers, and cockpit domain controllers, or it can be a domain controller applied in other fields. This disclosure does not limit the scope of the domain controller.

[0047] In the field of domain controller technology, with the development of high-performance computing, the power consumption of domain controller systems has increased significantly, making high temperature a key factor affecting the stability and performance of domain controller systems. When electronic components such as chips in a domain controller operate in a high-temperature environment, if the domain controller cannot effectively cool down, the system will face the risk of high-temperature failure or performance degradation, thereby affecting the overall operating efficiency and security of the equipment used by the domain controller.

[0048] This disclosure provides a domain controller with electronic components that are prone to heat generation mounted on its circuit board. The housing has a protrusion extending toward the electronic components. A heat-conducting component is placed between the protrusion and the electronic components, thus forming a heat transfer path between the electronic components, the heat-conducting component, and the protrusion. Furthermore, the projection of the protrusion onto the circuit board covers the projection of the electronic components onto the circuit board, increasing the heat dissipation efficiency of the electronic components and avoiding the risk of high-temperature failure or performance degradation of the domain controller, thereby ensuring the stability and reliability of the domain controller during operation.

[0049] In some embodiments, refer to Figure 1 and Figure 2 The domain controllers provided in this disclosure include:

[0050] Circuit board 1, on which electronic components 11 are disposed;

[0051] The housing 2 accommodates at least a portion of the circuit board 1 and has a protrusion 21 extending toward the electronic device 11.

[0052] The heat-conducting component 3 has a first surface that contacts the protrusion 21 and a second surface that contacts the electronic device 11.

[0053] The projection of the protrusion 21 on the circuit board 1 covers the electronic device 11 and can exchange heat with the heat-conducting component 3.

[0054] In this embodiment, a control area can be provided on the circuit board 1. The control area is used to set up electronic devices 11. The control area is provided with pins for mounting electronic devices 11 such as chips. These pins will be connected to the copper layer or other conductive components on the circuit board 1 by soldering or other means, thereby realizing the electrical connection of the chip and ensuring that the chip can receive and send electrical signals. While the chip is receiving and sending signals, it will dissipate heat. In order to ensure the stable operation of the chip, a structure that facilitates chip heat dissipation needs to be set in the domain controller.

[0055] See Figure 2 The housing 2 accommodating at least a portion of the circuit board 1 can be understood as the housing 2 covering at least one side surface of the circuit board 1, for example, the housing 2 covering the side surface on which the electronic device 11 is disposed, and the housing 2 having a protrusion 21 facing the electronic device 11, so as to increase heat transfer between the electronic device 11 and the housing 2 through the protrusion 21.

[0056] In this embodiment, the housing 2 can be a metal housing such as an aluminum alloy housing or a copper housing. The protrusion 21 for heat conduction can be integrally formed on the side of the housing 2 facing the electronic device 11 to ensure the heat transfer efficiency of the protrusion 21 and the housing 2.

[0057] See Figure 2 and Figure 3 The heat-conducting element 3 is disposed between the protrusion 21 and the electronic device 11. At the same time, the two side surfaces of the heat-conducting element 3 are in contact with the protrusion 21 and the electronic device 11, respectively. In order to increase the heat transfer area, the first surface of the heat-conducting element 3 can cover the side surface of the protrusion 21 facing the electronic device 11, and the second surface of the heat-conducting element 3 can cover the side surface of the electronic device 11 facing the protrusion 21.

[0058] In a specific embodiment, such as Figure 3As shown, the first surface of the heat-conducting element 3 can be the upper surface of the heat-conducting element 3, and the second surface of the heat-conducting element 3 can be the lower surface of the heat-conducting element 3. The upper surface of the heat-conducting element 3 is in contact with the protrusion 21, and the lower surface of the heat-conducting element 3 is in contact with the electronic device 11. A heat transfer path can be formed between the electronic device 11, the heat-conducting element 3, and the protrusion 21. The heat generated by the electronic device 11 during operation can be transferred to the housing 2 through the heat-conducting element 3 and the protrusion 21, realizing heat exchange between the protrusion 21 and the heat-conducting element 3. Then, the heat is dissipated to the outside through the housing 2, avoiding the electronic device 11 from overheating and affecting its normal use.

[0059] In this embodiment, a plurality of electronic devices 11 may be provided on the circuit board 1, and a portion of the electronic devices 11 may be provided with protrusions 21 on the housing 2. These electronic devices 11 may be electronic devices with relatively large heat generation and power consumption. The provision of protrusions 21 is conducive to heat dissipation of high power consumption electronic devices. Alternatively, a protrusion 21 may be provided on the housing 2 for each electronic device 11 to facilitate heat dissipation of each electronic device 11 and maintain the operating temperature of each electronic device 11.

[0060] In a specific embodiment, the area occupied by an electronic device 11 on the circuit board can be a first area, and the projection of the protrusion 21 of the electronic device 11 on the circuit board 1 can be a first coverage area. The first coverage area covers the first area so that the heat generated by the electronic device 11 can be conducted to the protrusion 21 through the heat conductor 3 as much as possible, thereby increasing the heat dissipation efficiency of the electronic device 11 and ensuring the stability and reliability of the domain controller in operation.

[0061] In some embodiments, the thermal conductive element 3 is a thermally conductive silicone grease layer, the side of the electronic device 11 away from the circuit board 1 is in contact with the side of the thermally conductive silicone grease layer, and the side of the protrusion 21 facing the electronic device 11 is in contact with the other side of the thermally conductive silicone grease layer.

[0062] In the above embodiment, a heat dissipation surface is formed on the side of the electronic device 11 away from the circuit board 1, and a heat-conducting surface is formed on the side of the protrusion 21 facing the electronic device 11. One side of the thermal grease layer is attached to the heat-conducting surface to ensure the strength of the bond between the protrusion 21 and the thermal grease layer. The other side of the thermal grease layer is in contact with the heat dissipation surface. Specifically, the close contact between the electronic device 11 and the thermal grease layer can be achieved by squeezing the circuit board 1 and the electronic device 11 to ensure the thermal conductivity between the electronic device 11 and the thermal grease layer.

[0063] In one specific embodiment, the thermal grease layer can be applied to the thermally conductive surface of the protrusion 21 by spraying or bonding. The thermal grease layer is connected to the high heat dissipation electronic device 11, and the heat generated by the electronic device 11 can be transferred to the protrusion 21 through the thermal grease layer. While ensuring that the thermal grease layer can be stably disposed between the protrusion 21 and the electronic device 11, it can provide a stable heat transfer path for the electronic device 11.

[0064] In some embodiments, see Figure 2 and Figure 3 The electronic device 11 has a boss 111 on the side away from the circuit board 1, and the protrusion 21 has a recessed area 211 on the side facing the electronic device 11.

[0065] The protrusion 111 is positioned opposite to the recessed area 211.

[0066] In the above embodiments, the protrusion 111 increases the surface area of ​​the electronic device 11 on the side away from the circuit board 1, thereby improving the heat dissipation efficiency of the electronic device 11. The protrusion 111 is positioned opposite the recessed area 211; for example, a portion of the protrusion 111 can be embedded into the recessed area 211, and a heat-conducting element 3 can be sandwiched between the recessed area 211. This ensures the tightness of the protrusion 21 and the electronic device 11 during assembly, thereby enhancing the stability and reliability of the heat-conducting element 3 connecting the protrusion 21 and the electronic device 11.

[0067] In one specific embodiment, the electronic device 11 includes a main chip, and the protrusion 21 contacts the main chip through a heat-conducting component 3. Because the main chip integrates a large number of circuits and components, it generates a large amount of heat during operation, especially when performing complex calculations or high-speed data transmissions, where the high power consumption of the main chip results in even greater heat generation.

[0068] In the embodiments provided in this disclosure, the protrusion 21 contacts the main chip through the heat-conducting component 3. The heat generated by the main chip can be transferred to the housing 2 through the heat-conducting component 3 and the protrusion 21, and then dissipated to the outside through the housing 2, so as to achieve the purpose of quickly dissipating heat from the main chip.

[0069] In some embodiments, see Figure 2 and Figure 5 The housing 2 has multiple heat-conducting plates 22 on the side opposite to the circuit board 1, and the multiple heat-conducting plates 22 are arranged at intervals on the housing 2.

[0070] In this embodiment, the heat-conducting sheet 22 can be integrally formed on the side of the housing 2 facing away from the circuit board 1 to ensure the structural integrity of the heat-conducting sheet 22 and the housing 2. When the electronic devices 11 on the circuit board 1 generate heat, this heat can be quickly transferred to the outside of the housing 2 through the housing 2 and the heat-conducting sheet 22 thereon. At the same time, the spaced arrangement of the heat-conducting sheets 22 helps to increase the heat dissipation area, thereby accelerating the heat dissipation speed and improving the overall heat dissipation efficiency of the domain controller.

[0071] In some embodiments, see Figure 5 The housing 2 has a first heat-conducting area and a second heat-conducting area on the side away from the circuit board 1. The projection of the protrusion 21 on the housing 2 coincides with at least a portion of the first heat-conducting area, and the projection of the protrusion 21 on the housing 2 is offset from at least a portion of the second heat-conducting area.

[0072] The plurality of heat-conducting plates 22 include a plurality of first heat-conducting plates 221 and a plurality of second heat-conducting plates 222. The plurality of first heat-conducting plates 221 are spaced apart in a first heat-conducting area, and the plurality of second heat-conducting plates 222 are spaced apart in a second heat-conducting area. The spacing between the plurality of first heat-conducting plates 221 is smaller than the spacing between the plurality of second heat-conducting plates 222.

[0073] In this embodiment, a portion of the first heat-conducting area and the protrusion 21 may be located on opposite sides of the housing 2. Since the projection of the protrusion 21 onto the housing 2 can coincide with a portion of the first heat-conducting area, the first heat-conducting sheet 221 on this portion of the first heat-conducting area can more directly conduct heat with the protrusion 21, reducing thermal resistance and improving the heat dissipation effect of the electronic device 11. The remaining portion of the first heat-conducting sheet 221 on the first heat-conducting area can transfer heat through the extension of the housing 2, further increasing the heat dissipation path of the electronic device 11. Alternatively, the entire first heat-conducting area and the protrusion 21 may be located on opposite sides of the housing 2, allowing the first heat-conducting sheet 221 on the first heat-conducting area to more directly transfer heat with the protrusion 21.

[0074] In this embodiment, the projection of the protrusion 21 onto the housing 2 can be offset from a portion of the second heat-conducting area. The second heat-conducting sheet 222 on this portion of the second heat-conducting area can play a role in heat transfer while simplifying the housing structure. Alternatively, the second heat-conducting area as a whole can be offset from the protrusion 21 on both sides of the housing 2. The first heat-conducting sheet 221 on the first heat-conducting area and the second heat-conducting sheet 222 on the second heat-conducting area cooperate with each other to ensure the heat dissipation effect of the electronic device 11.

[0075] In this embodiment, the density of the arrangement of the plurality of first heat-conducting sheets 221 is greater than the density of the arrangement of the plurality of second heat-conducting sheets 222. The dense arrangement of the first heat-conducting sheets 221 helps to conduct heat, and can more effectively conduct heat to the outside of the housing 2 through the protrusion 21. On the other hand, it can enhance the structural strength of the area.

[0076] In some embodiments, the height of the first heat-conducting sheet 221 on the first heat-conducting area can be in the range of 20mm-40mm, for example, the height of the first heat-conducting sheet 221 on the first heat-conducting area is 22mm, 25mm, 28mm, 32mm or 35mm, the thickness of the first heat-conducting sheet 221 can be in the range of 1mm-3mm, for example, the thickness of the first heat-conducting sheet 221 is 1.5mm, 2mm or 2.5mm, and the spacing between adjacent first heat-conducting sheets 221 can be in the range of 2mm-8mm, for example, the spacing between adjacent first heat-conducting sheets 221 is 2.5mm, 4mm or 6mm.

[0077] In one specific embodiment, the height of the first heat-conducting sheet 221 on the first heat-conducting area is 30mm, the thickness of the first heat-conducting sheet 221 is 2mm, and the spacing between adjacent first heat-conducting sheets 221 is 4mm. This arrangement can ensure the feasibility of molding while maintaining a high density of the arrangement of the first heat-conducting sheets 221, and ensure the heat dissipation effect of the electronic device 11.

[0078] In some embodiments, the height of the second heat-conducting sheet 222 on the second heat-conducting area can be in the range of 20mm-40mm, for example, the height of the second heat-conducting sheet 222 on the second heat-conducting area is 22mm, 25mm, 28mm, 32mm or 35mm, the thickness of the second heat-conducting sheet 222 can be in the range of 1mm-3mm, for example, the thickness of the second heat-conducting sheet 222 is 1.5mm, 2mm or 2.5mm, and the spacing between adjacent second heat-conducting sheets 222 can be in the range of 5mm-20mm, for example, the spacing between adjacent second heat-conducting sheets 222 is 6mm, 10mm or 15mm.

[0079] In one specific embodiment, the height of the second heat-conducting sheet 222 on the second heat-conducting area is 30mm, the thickness of the second heat-conducting sheet 222 is 2mm, and the spacing between adjacent second heat-conducting sheets 222 is 10mm. This arrangement can increase the heat dissipation path of the electronic device 11 while facilitating the forming of the second heat-conducting sheet 222.

[0080] In some embodiments, see Figure 4 and Figure 5 The domain controller also includes a driver 4, which is disposed in the second heat-conducting zone and has an air outlet;

[0081] A first gap is formed between multiple first heat-conducting plates 221, and a second gap is formed between multiple second heat-conducting plates 222. The first gap and the second gap are connected to the air outlet.

[0082] In the above embodiments, the driving component 4 can be a fan or blower or other component capable of outputting airflow. By cooperating with the driving component 4 and the second heat-conducting plate 222 and setting them in the second heat-conducting area, the driving component 4 can increase the airflow in the area where the first heat-conducting plate 221 and the second heat-conducting plate 222 are located, while ensuring that the first heat-conducting plate 221 and the second heat-conducting plate 222 transfer heat together. The airflow can more effectively remove the heat from the first heat-conducting plate 221 and the second heat-conducting plate 222, thereby achieving the purpose of timely heat dissipation for the electronic device 11.

[0083] In one embodiment, the first gap and the second gap are connected, with the second gap directly connected to the drive member 4. The air outlet of the drive member 4 first outputs airflow to the second gap, and then the airflow is transmitted to the first gap through the second gap, which increases the airflow between the multiple first heat-conducting plates 221 and the multiple second heat-conducting plates 222, and optimizes the airflow path. In another embodiment, both the first gap and the second gap are directly connected to the drive member 4. Part of the airflow output from the air outlet of the drive member 4 flows to the first gap, and the remaining airflow output from the air outlet of the drive member 4 flows to the second gap, which can dissipate heat from the multiple first heat-conducting plates 221 and the multiple second heat-conducting plates 222 in a timely manner.

[0084] In some embodiments, see Figure 4 The domain controller also includes a cover 5, which is connected to the side of the housing 2 away from the circuit board 1 and forms a receiving space between the housing 2 and the housing 2. The cover 5 has a first opening 51 and a second opening 52.

[0085] The heat-conducting plate 22 and the driving component 4 are located in the receiving space. The first opening 51 is opposite to the air inlet of the driving component 4, and the second opening 52 is located at the end of the first heat-conducting plate 221 away from the driving component 4.

[0086] In this embodiment, the cover 5 provides protection for the heat-conducting sheet 22; at the same time, the cover 5 can form a mesh structure at the first opening 51 and the second opening 52, so as to provide protection for the drive member 4 while facilitating the drive member 4 to draw air through the first opening 51, and at least part of the airflow output by the drive member 4 to exhaust air through the second opening 52 after passing through the first gap formed by the first heat-conducting sheet 221.

[0087] In a specific embodiment, such as Figure 4As shown, a first opening 51 is formed on the top of the cover 5, and a second opening 52 is formed on the side of the cover 5. The drive unit 4 draws relatively cool air from the top of the cover 5 and outputs it after pressurization. The output airflow is transmitted along the first gap between multiple first heat-conducting plates 221 and the second gap between multiple second heat-conducting plates 222, thereby blowing hot air out from the first gap and the second gap, realizing forced convection circulation in the heat-conducting plates 22, achieving the purpose of rapidly cooling the domain controller, and ensuring the stable performance of electronic devices.

[0088] In some embodiments, see Figure 6 The domain controller also includes a shield 6, which is sandwiched between the housing 2 and the circuit board 1.

[0089] In the above embodiments, a number of electronic devices 11 are arranged on the circuit board 1 to realize different functions of the domain controller. In addition to the circuit board 1 itself needing to have EMC (Electromagnetic Compatibility) protection, the electronic devices 11 also need to provide EMC protection so that electromagnetic crosstalk does not occur between the various electronic devices 11, thus ensuring the stability of the domain controller system.

[0090] On the contact surface between the housing 2 and the circuit board 1, in this embodiment of the present disclosure, a shielding member 6 is provided on the contact surface of the housing 2 or the contact surface of the circuit board 1, or a shielding member 6 is provided on both the contact surface of the housing 2 and the contact surface of the circuit board 1. After the shielding member 6 is pressed together with the exposed copper contact area of ​​the housing 2 and the circuit board 1, it is pressed tightly between the housing 2 and the circuit board 1, so that multiple electronic devices 11 in the circuit board 1 are all wrapped by the housing 2 and the shielding member 6. Figure 6 The shielding cavity enclosed by the dashed box shown can effectively prevent the electromagnetic waves generated by electronic device 11 from being emitted outward, as well as the influence of external electromagnetic devices on electronic device 11, thus ensuring the electromagnetic protection effect of the domain controller system.

[0091] In one specific embodiment, see Figure 8 The contact surface of housing 2 is first polished to increase its flatness. Then, conductive shielding adhesive is applied to the contact surface of housing 2 to form shielding component 6. The conductive shielding adhesive is set in a triangular pyramid shape. Finally, housing 2 is pressed with circuit board 1 to reduce the amount of adhesive applied while ensuring the shielding effect of the domain controller.

[0092] In another specific embodiment, conductive foam is provided between the contact surface of the housing 2 and the contact surface of the circuit board 1. The conductive foam sandwiched between the housing 2 and the circuit board 1 can also achieve the effect of electromagnetic shielding.

[0093] In some embodiments, see Figure 6 and Figure 7The housing 2 includes a middle portion 23 and an edge portion 24, the edge portion 24 surrounding the middle portion 23 and having an annular step 241;

[0094] The protrusion 21 is located in the middle part 23, and the shield 6 is disposed on the annular step 241 and surrounds the electronic device 11.

[0095] In this embodiment, the edge portion 24 can be integrally formed on the periphery of the middle portion 23 to ensure the structural integrity of the housing 2; the edge portion 24 can be bent toward one side of the middle portion 23 to form an accommodating space between the edge portion 24 and the middle portion 23, which facilitates the setting of the protrusion 21 and the accommodating of the electronic device 11.

[0096] See Figure 7 The annular step 241 of the edge portion 24 is set towards the circuit board 1 to increase the contact area between the housing 2 and the circuit board 1; while the shield 6 is set on the annular step 241 and is sealed between the housing 2 and the circuit board 1 when the housing 2 and the circuit board 1 are pressed together. At the same time, the shield 6 surrounds the periphery of multiple electronic devices 11 to ensure the electromagnetic sealing of the domain controller.

[0097] In some embodiments, see Figure 1 and Figure 9 The domain controller also includes a connection port 7, which is electrically connected to the electronics 11 and exposed between the circuit board 1 and the housing 2;

[0098] The housing 2 has a baffle 25, the projection of the baffle 25 on the circuit board 1 covering the projection of the connection port 7 on the circuit board.

[0099] The connection port 7 on the domain controller facilitates external connection of the domain controller and ensures signal transmission of the domain controller. The projection of the connection port 7 on the circuit board can be the second area, and the projection of the baffle 25 on the circuit board 1 can be the second coverage area. In order to avoid interference from dust, water droplets and other impurities on the connection port 7 and to ensure the connection stability of the connection port 7, the connection port 7 needs to achieve a waterproof rating of IPX2 or higher.

[0100] This embodiment of the present disclosure extends the housing 2 outward on one side of the domain controller where the connection port 7 is located, so that the second coverage area covers the second area. The baffle 25 formed by the outward extension of the housing 2 can protect the connection port 7, preventing impurities or water droplets from entering the circuit board 1 from the gap between the connection port 7 and the housing 2 and from the inside of the connection port 7, thus ensuring the functional effectiveness of the circuit board 1 and the connection port 7, while maintaining the structural simplicity of the housing 2.

[0101] In some embodiments, see Figure 1 and Figure 9The edge of the baffle 25 has a retaining edge 251, which protrudes toward the side away from the connection port 7.

[0102] In this embodiment, when the domain controller is installed, the baffle 25 is located above the connection port 7, and the baffle 251 extends upward from the edge of the baffle 25, which can prevent falling water droplets from flowing from the edge of the baffle 25 to the connection port 7, so as to block the water droplets outside the connection port 7; when the domain controller is installed at an angle of 0-15°, the waterproof effect of the domain controller can still be guaranteed.

[0103] This disclosure provides a vehicle that includes the domain controller described above.

[0104] In the above embodiments, the domain controller can be an autonomous driving domain controller, powertrain domain controller, chassis domain controller, or cockpit domain controller in the vehicle.

[0105] The housing of the vehicle's domain controller has a protrusion extending toward the electronic components. By placing a heat-conducting component between the protrusion and the electronic components, a heat transfer path can be formed between the electronic components, the heat-conducting component, and the protrusion. Moreover, the projection of the protrusion onto the circuit board covers the projection of the electronic components onto the circuit board, increasing the heat dissipation efficiency of the electronic components and avoiding the risk of high-temperature failure or performance degradation of the domain controller. This ensures the stability and reliability of the vehicle's control using the domain controller.

[0106] While specific embodiments of this disclosure have been described in detail by way of example, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this disclosure. The scope of this disclosure is defined by the appended claims.

Claims

1. A domain controller, characterized in that, include: A circuit board on which electronic components are disposed; A housing that houses at least a portion of the circuit board, the housing having a protrusion extending toward the electronic device; A heat-conducting component, wherein a first surface of the heat-conducting component contacts the protrusion, and a second surface of the heat-conducting component contacts the electronic device; The projection of the protrusion on the circuit board covers the electronic device and allows for heat exchange with the heat-conducting component.

2. The domain controller according to claim 1, characterized in that, The thermal conductive component is a thermally conductive silicone grease layer. The side of the electronic device away from the circuit board is in contact with one side of the thermally conductive silicone grease layer, and the side of the protrusion facing the electronic device is in contact with the other side of the thermally conductive silicone grease layer.

3. The domain controller according to claim 2, characterized in that, The electronic device has a boss on the side away from the circuit board, and the protrusion has a recessed area on the side facing the electronic device. The protrusion is positioned opposite to the recessed area.

4. The domain controller according to claim 1, characterized in that, The housing has multiple heat-conducting plates on the side opposite to the circuit board, and the multiple heat-conducting plates are arranged at intervals on the housing.

5. The domain controller according to claim 4, characterized in that, The housing has a first heat-conducting area and a second heat-conducting area on the side opposite to the circuit board. The projection of the protrusion on the housing coincides with at least a portion of the first heat-conducting area, and the projection of the protrusion on the housing is offset from at least a portion of the second heat-conducting area. The plurality of heat-conducting sheets include a plurality of first heat-conducting sheets and a plurality of second heat-conducting sheets. The plurality of first heat-conducting sheets are spaced apart in the first heat-conducting area, and the plurality of second heat-conducting sheets are spaced apart in the second heat-conducting area. The spacing between the plurality of first heat-conducting sheets is smaller than the spacing between the plurality of second heat-conducting sheets.

6. The domain controller according to claim 5, characterized in that, It also includes a driving component, which is disposed in the second heat-conducting zone and has an air outlet; A first gap is formed between the plurality of first heat-conducting sheets, and a second gap is formed between the plurality of second heat-conducting sheets. The first gap and the second gap are connected to the air outlet.

7. The domain controller according to claim 6, characterized in that, It also includes a cover, which is connected to the side of the housing away from the circuit board and forms a receiving space between the housing and the housing, and the cover has a first opening and a second opening; The heat-conducting plate and the driving member are located in the receiving space, the first opening is opposite to the air inlet of the driving member, and the second opening is located at the end of the first heat-conducting plate away from the driving member.

8. The domain controller according to claim 1, characterized in that, It also includes a shielding component sandwiched between the housing and the circuit board.

9. The domain controller according to claim 8, characterized in that, The housing includes a middle portion and an edge portion, the edge portion surrounding the middle portion and having an annular step; The protrusion is located in the middle part, and the shield is disposed on the annular step and surrounds the electronic device.

10. The domain controller according to claim 1, characterized in that, It also includes a connection port that is electrically connected to the electronic device and exposed between the circuit board and the housing; The housing has a baffle wall, the projection of which on the circuit board overlaps the projection of the connection port on the circuit board.

11. The domain controller according to claim 10, characterized in that, The edge of the baffle has a retaining edge that protrudes toward the side away from the connection port.

12. A vehicle, characterized in that, Includes the domain controller as described in any one of claims 1-11.

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