High-temperature lead-free solder plate

Abstract

According to the technical scheme, the high-temperature lead-free solder plate is characterized in that the high-temperature lead-free solder plate belongs to the field of lead-free solder plates, the high-temperature lead-free solder plate comprises a lead-free solder plate body, the outer end of the lead-free solder plate body is movably connected with a connecting mechanism, the connecting mechanism comprises strip-shaped material plates, the strip-shaped material plates are evenly distributed, and the strip-shaped material plates are connected with the lead-free solder plate body. The strip-shaped material plate is movably connected with the lead-free solder plate body, clamping blocks are installed at the two ends of the strip-shaped material plate, clamping grooves are formed in the outer ends of the clamping blocks, and the clamping grooves are located in the inner end of the lead-free solder plate body. The lead-free solder plate body of the arc-shaped structure and the strip-shaped material plates form a plurality of structures, the strip-shaped material plates and the lead-free solder plate body can be conveniently separated only by pulling the positioning rods in the using process, the structure can be matched with assemblies of different shapes for connection, adaptation is convenient and fast, and the cost is low. The inconvenience that flexible connection cannot be achieved due to the complex shape is avoided, and the practicability of the high-temperature lead-free solder plate is improved.

Description

Technical Field

[0001] This utility model relates to the field of lead-free solder boards, and in particular to a high-temperature lead-free solder board. Background Technology

[0002] The main function of lead-free solder boards is to provide strong and tough connections between different materials and meet lead-free environmental protection requirements. High-temperature lead-free solder boards have certain applications in many fields, such as automobiles, aerospace, and medical devices. Therefore, the use of high-temperature lead-free solder boards is very important.

[0003] Existing high-temperature lead-free solder boards have certain drawbacks in use. First, most high-temperature lead-free solder boards have a simple structure. When encountering soldering positions between different components, the simple shape of the high-temperature lead-free solder board cannot meet the connection of components with more complex shapes, which reduces the practicality of the high-temperature lead-free solder board and cannot meet different usage requirements. Therefore, we propose a high-temperature lead-free solder board. Utility Model Content

[0004] To overcome the shortcomings of existing technologies, the purpose of this utility model is to provide a high-temperature lead-free solder board. By setting strip-shaped solder plates and positioning rods, the high-temperature lead-free solder board, which has an arc-shaped lead-free solder board body and multiple strip-shaped solder plates, forms multiple structures when in use. Moreover, when in use, simply pulling multiple positioning rods allows the strip-shaped solder plates to be easily separated from the lead-free solder board body. This structure can be connected with components of different shapes, making it easy to adapt and avoiding the inconvenience of not being able to connect flexibly due to complex shapes, thus improving the practicality of the high-temperature lead-free solder board.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0006] A high-temperature lead-free solder board includes a lead-free solder board body, and a connecting mechanism is movably connected to the outer end of the lead-free solder board body.

[0007] The connecting mechanism includes strip-shaped plates that are evenly distributed. The strip-shaped plates are movably connected to the lead-free solder board body. Each end of the strip-shaped plate is equipped with a locking block. The outer end of the locking block has a locking groove located at the inner end of the lead-free solder board body. An assembly frame is movably connected to the upper end of the lead-free solder board body. Multiple positioning rods are slidably connected to the inner end of the assembly frame.

[0008] The practicality of this high-temperature lead-free solder board is improved by installing a strip plate and a positioning rod.

[0009] Furthermore, each positioning rod has a snap-fit ​​block installed at its bottom end, and a positioning frame is slidably connected to the outer end of the positioning rod.

[0010] Through the installation of the clamping block, the connection between the material plate structures is stable, and the material plate structures are convenient to take and transport.

[0011] Further, the outer end of the positioning rod is sleeved with a reset ring, and the outer side of the reset ring is movably connected with a guide ring.

[0012] Through the installation of the reset ring, the convenience of installation and disassembly between the structures is further improved.

[0013] Further, the guide ring is located at the outer end of the positioning rod.

[0014] Through the installation of the guide ring, the guide ring is installed at the outer end of the positioning rod, and the positioning rod can move simultaneously with the movement of the positioning rod, so that the movement of the positioning rod is stable.

[0015] Further, the outer end of the guide ring is provided with a movable slot, and the movable slot is located at the inner end of the positioning frame.

[0016] Through the installation of the movable slot, the connection convenience and stability between the strip-shaped material plate and the lead-free solder plate body are further improved.

[0017] Further, the lead-free solder plate body comprises a base body, and the outer end of the base body is provided with an alloy material.

[0018] Through the installation of the alloy material, the performance of the material plate is enhanced.

[0019] Further, the outer end of the alloy material is provided with a soldering layer, and the inner end of the alloy material is provided with a nano material.

[0020] Through the installation of the nano material, the use effect of the lead-free solder plate is further improved.

[0021] Further, the outer end of the soldering layer is provided with a protective coating.

[0022] Through the installation of the protective coating, the nano material is added in the alloy material to improve the electrical conductivity and thermal conductivity, so that the practicality of the alloy material is increased, and the mechanical strength of the high-temperature lead-free solder plate is increased.

[0023] In summary, the utility model has the following beneficial effects:

[0024] 1. By setting the strip-shaped material plate and the positioning rod, when the high-temperature lead-free solder plate is used, the lead-free solder plate body with an arc-shaped structure and a plurality of strip-shaped material plates form a plurality of structures, and when used, only the plurality of positioning rods need to be pulled, so that the strip-shaped material plate and the lead-free solder plate body can be conveniently separated, so that the structure can be connected with different shaped components, which is convenient to adapt, and the inconvenience of flexible connection due to complex shape is avoided, and the practicality of the high-temperature lead-free solder plate is improved.

[0025] 2, by setting nanometer material, nanometer material is added in alloy material, so as to improve the conductivity and thermal conductivity, increase the practicability of the alloy material, and further improve the use effect of the lead-free solder plate. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is the schematic view of the overall structure in the embodiment;

[0027] Figure 2 is the schematic view of the structure of the connection mechanism in the embodiment;

[0028] Figure 3 is the schematic view of the structure of the substrate body in the embodiment;

[0029] Figure 4 is the schematic view of the structure of the lead-free solder plate body in the embodiment Figure 3 is the schematic view of the structure of the plane at A in the embodiment;

[0030] Figure 5 is the schematic view of the structure of the lead-free solder plate body in the embodiment

[0031] In the figure, 1, lead-free solder plate body; 101, substrate body; 102, alloy material; 103, soldering layer; 104, nanometer material; 105, protective coating; 2, connection mechanism; 201, strip-shaped material plate; 202, clamping block; 203, clamping groove; 204, assembly frame; 205, positioning rod; 206, clamping block; 207, positioning frame; 208, reset ring; 209, guide ring; 210, movable groove. DETAILED DESCRIPTION

[0032] The utility model will be further described in detail below in combination with the drawings.

[0033] Wherein, same parts are denoted by same reference numerals. It should be noted that the words "front", "back", "left", "right", "up" and "down" used in the following description refer to the directions in the drawings, and the words "bottom surface" and "top surface", "inner" and "outer" refer to the directions towards or away from the geometric center of a particular part.

[0034] Referring to Figures 1-5 As shown in the figure, the utility model is a high-temperature lead-free solder plate, which comprises a lead-free solder plate body 1, and a connection mechanism 2 movably connected to the outer end of the lead-free solder plate body 1.

[0035] The connecting mechanism 2 comprises strip-shaped material plates 201 which are uniformly distributed and movably connected with the lead-free solder plate body 1, both ends of each strip-shaped material plate 201 are provided with a clamping block 202, an outer end of the clamping block 202 is provided with a clamping groove 203, the clamping groove 203 is located at an inner end of the lead-free solder plate body 1, an upper end of the lead-free solder plate body 1 is movably connected with an assembling frame 204, and an inner end of the assembling frame 204 is slidably connected with a plurality of positioning rods 205.

[0036] Referring to Figures 2-4 Further, a bottom end of each positioning rod 205 is provided with a clamping block 206, and an outer end of the positioning rod 205 is slidably connected with a positioning frame 207.

[0037] Referring to Figures 3-4 Further, an outer end of the positioning rod 205 is sleeved with a reset ring 208, and an outer side of the reset ring 208 is movably connected with a guide ring 209.

[0038] Referring to Figure 4 Further, the guide ring 209 is located at the outer end of the positioning rod 205.

[0039] Referring to Figure 4 Further, an outer end of the guide ring 209 is provided with a movable groove 210, and the movable groove 210 is located at an inner end of the positioning frame 207.

[0040] When the high-temperature lead-free solder plate is used, the arc-shaped lead-free solder plate body 1 and the plurality of strip-shaped material plates 201 form a plurality of structures, and when used, only the plurality of positioning rods 205 need to be pulled, the positioning rod 205 cooperates with the external reset ring 208 to adjust the position and drive the clamping block 206, the reset ring 208 can move together with the movable positioning rod 205, when the positioning rod 205 loses external force, the reset ring 208 can conveniently reset the positioning rod 205, the positioning rod 205 can drive the clamping block 206 to realize convenient positioning or contact positioning restriction, the clamping block 206 can be separated from the plurality of strip-shaped material plates 201, and the clamping block 206 can form a clamping structure at the top end of the strip-shaped material plate 201, the strip-shaped material plate 201 and the lead-free solder plate body 1 can be stably connected, the structure between the material plates can be conveniently taken and transported, the strip-shaped material plate 201 and the lead-free solder plate body 1 can be conveniently separated, the structure can be connected with different shaped components, and is convenient to adapt, and cannot be inconveniently flexibly connected due to complex shapes.

[0041] Referring to Figure 5 Further, the lead-free solder plate body 1 comprises a base body 101, and an outer end of the base body 101 is provided with an alloy material 102.

[0042] Referring to Figure 5As shown, further, the outer end of the alloy material 102 is provided with a soldering layer 103, and the inner end of the alloy material 102 is provided with a nano material 104.

[0043] Referring to Figure 5 As shown, further, the outer end of the soldering layer 103 is provided with a protective coating 105.

[0044] The lead-free alloy material 102 generally uses silver, copper, bismuth and other elements, which provide good melting characteristics and mechanical strength, and the nano material 104 is added to the alloy material 102 to improve electrical conductivity and thermal conductivity, thereby increasing the practicability of the alloy material 102.

[0045] Specific implementation process: when the material plate is used, the lead-free alloy material 102 generally uses silver, copper, bismuth and other elements, which provide good melting characteristics and mechanical strength, and the nano material 104 is added to the alloy material 102 to improve electrical conductivity and thermal conductivity, thereby increasing the practicability of the alloy material 102.

[0046] Finally, to adapt to the needs between different complex connection assemblies, the positioning rod 205 is pulled, the positioning rod 205 is matched with the external reset ring 208 to adjust the position and drive the clamping block 206, the reset ring 208 can be matched with the movable positioning rod 205 to move simultaneously, when the positioning rod 205 loses external force, the reset ring 208 allows the positioning rod 205 to reset conveniently, and the positioning rod 205 can drive the clamping block 206 to realize convenient positioning or contact positioning limitation, so that the clamping block 206 is separated from the plurality of strip-shaped material plates 201, that is, the strip-shaped material plates 201 and the lead-free solder plate body 1 can be conveniently separated, at this time, the lead-free solder plate body 1 in the arc-shaped structure and the plurality of strip-shaped material plates 201 can be conveniently adapted to different complex connection structures for use, and cannot be flexibly connected due to the complex shape.

[0047] The basic principles and main features of the present application are shown and described, and the advantages of the present application are shown and described. Those skilled in the art should understand that the present application is not limited to the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the present application, and various changes and improvements can be made without departing from the spirit and scope of the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A high-temperature lead-free solder sheet, characterized by: The application relates to a lead-free soldering material plate body (1), which is movably connected with a connecting mechanism (2) at the outer end. The connecting mechanism (2) comprises strip-shaped material plates (201) which are uniformly distributed and movably connected with the lead-free soldering material plate body (1); the two ends of each strip-shaped material plate (201) are provided with clamping blocks (202); the outer end of each clamping block (202) is provided with a clamping groove (203); the clamping groove (203) is located at the inner end of the lead-free soldering material plate body (1); the upper end of the lead-free soldering material plate body (1) is movably connected with an assembling frame (204); and the inner end of the assembling frame (204) is slidably connected with a plurality of positioning rods (205).

2. The high temperature lead-free solder sheet according to claim 1, wherein: The bottom end of each positioning rod (205) is provided with a clamping block (206); and the outer end of each positioning rod (205) is slidably connected with a positioning frame (207).

3. The high temperature lead-free solder sheet according to claim 2, wherein: The outer end of each positioning rod (205) is sleeved with a reset ring (208); and the outer side of the reset ring (208) is movably connected with a guide ring (209).

4. The high temperature lead-free solder sheet according to claim 3, wherein: The guide ring (209) is located at the outer end of the positioning rod (205).

5. The high temperature lead-free solder sheet according to claim 4, wherein: The outer end of the guide ring (209) is provided with a movable groove (210); and the movable groove (210) is located at the inner end of the positioning frame (207).

6. The high temperature lead-free solder sheet according to claim 1, wherein: The lead-free soldering material plate body (1) comprises a base material body (101); and the outer end of the base material body (101) is provided with an alloy material (102).

7. The high temperature lead-free solder sheet according to claim 6, wherein: The outer end of the alloy material (102) is provided with a soldering aid layer (103); and the inner end of the alloy material (102) is provided with a nano material (104).

8. The high temperature lead-free solder sheet according to claim 7, wherein: The outer end of the soldering aid layer (103) is provided with a protective coating (105).

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