UV (ultraviolet) viscosity-reducing film curing device for semiconductor cutting

Abstract

The utility model relates to the technical field of UV viscosity-reducing film processing, and discloses a UV viscosity-reducing film curing device for semiconductor cutting, which comprises a processing box, the top of the processing box is provided with a bearing seat, and the top of the bearing seat is provided with a viscosity-reducing film curing device. The adhesive film reducing and curing device comprises a containing disc, a connecting column piece, a containing frame, an LED lamp, a connecting strip plate, a connecting piece, a rotating shaft rod, a magnetic suction wafer, a magnet circular base, a vertical block, a containing plate piece and a reflecting mirror. According to the UV viscosity-reducing film curing device for semiconductor cutting, the viscosity-reducing film curing device is arranged, an LED lamp can be turned on during processing, then a whole circle of reflecting mirrors are matched to reflect and further focus light rays, and a plurality of reflecting mirrors which face the center and are adjustable in angle are arranged, so that the light rays cover a viscosity-reducing film more uniformly and with high intensity; through the synergistic effect of the reflectors, the irradiation effect of the UV light is continuously enhanced and optimized, and the curing efficiency and quality of the viscosity-reducing film are improved.

Description

Technical Field

[0001] This utility model relates to the field of UV anti-adhesion film processing technology, specifically a UV anti-adhesion film curing device for semiconductor cutting. Background Technology

[0002] In the semiconductor manufacturing industry, as chip integration continues to increase and wafer size gradually increases, the semiconductor wafer dicing process becomes increasingly critical. During wafer dicing, in order to protect the chips on the wafer surface from damage by the mechanical forces of dicing and to ensure that the diced chips can be picked up and transferred smoothly, a UV anti-sticking film is usually attached to the wafer surface.

[0003] Existing technology discloses a UV anti-adhesion film curing device (publication number CN219926661U), relating to the field of UV anti-adhesion films. The device includes a base, with multiple sets of threaded rods rotatably connected to the inner wall of the base. Each set of threaded rods has a set of sliders extending to the outside of the base threadedly connected to its outer wall. Each set of sliders has a set of clamps fixedly connected to one end outside the base. This device allows multiple clamps to be simultaneously moved towards the center by rotating a gear when the workpiece to be cured is placed under the curing lamp. This ensures the workpiece is always fixed in the same position, guaranteeing the curing effect. Furthermore, the height of the curing lamp can be adjusted by pulling a sliding rod out from inside the sleeve during curing. This allows for adjustment of the curing height according to different workpieces, thereby adjusting the irradiation intensity of the curing lamp and adapting to workpieces of varying thicknesses.

[0004] The aforementioned UV anti-adhesion film curing device for semiconductor cutting can drive multiple sets of chucks to move towards the center simultaneously by rotating the first gear, thereby ensuring that the workpiece to be cured can be fixed in the same position each time, thus guaranteeing the curing effect of the workpiece. However, the aforementioned UV anti-adhesion film curing device for semiconductor cutting is equipped with multiple layers of center-oriented and angle-adjustable reflectors, which cannot enhance and optimize the irradiation effect of UV light, improve the curing efficiency and quality of the anti-adhesion film, and the effect in use is not good, so it needs to be improved. Utility Model Content

[0005] The purpose of this invention is to provide a UV anti-adhesion film curing device for semiconductor cutting, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a UV anti-adhesion film curing device for semiconductor cutting, comprising a processing box, a support seat being provided on the top of the processing box, an anti-adhesion film curing device being provided on the top of the support seat, and an airflow circulation optimization device being provided on the surface of the anti-adhesion film curing device.

[0007] The anti-adhesion film curing device includes a placement tray, connecting column, placement frame, LED light, connecting strip, connecting piece, rotating shaft, magnetic disc, magnetic base, upright block, placement plate, and reflector. The placement tray is fixedly connected to the top of the support base. The connecting column is fixedly connected to the top center of the placement tray. The placement frame is fixedly connected to the surface of the connecting column. The LED light is fixedly connected to the surface of the placement frame. The connecting strip is fixedly connected to the top of the placement tray. The connecting piece is fixedly connected to the top of the connecting strip. The rotating shaft is slidably connected to the inside of the connecting piece. The placement plate is fixedly connected to the surface of the rotating shaft. The magnetic disc is fixedly connected to the left side of the rotating shaft. The upright block is fixedly connected to the top left side of the connecting strip. The magnetic base is fixedly connected to the top of the upright block. The magnetic disc is slidably connected to the inside of the magnetic base. The reflector is fixedly connected to the back of the placement plate.

[0008] Preferably, the airflow circulation optimization device includes a connecting plate, a mounting ring, a sealing cover, a hollow plate, and a fan component. The fan component is fixedly connected to the left and right sides of the top of the placement plate, the mounting ring is fixedly connected to the surface of the connecting plate, the sealing cover is inserted into the top of the connecting plate, the hollow plate is fixedly connected to the top of the sealing cover, and the fan component is fixedly connected to the inside of the hollow plate.

[0009] Preferably, the bottom of the fan component extends through the top of the sealing cover and connects to the inside of the sealing cover.

[0010] Preferably, the top of the mounting ring is provided with an annular docking slot, and the bottom area of ​​the sealing cover is adapted to the area of ​​the annular docking slot.

[0011] Preferably, the interior of the magnet base has a circular groove with a diameter that matches the diameter of the magnet base. The magnetic disc is magnetically connected to the magnet base and rotates within the magnet base. The magnetic disc is magnetically connected to the magnet base and remains in contact with the inner wall of the magnet base during adjustment, thus forming a quick self-locking mechanism after adjustment. This facilitates angle adjustment and locking after adjustment.

[0012] Preferably, a connecting bearing is fixedly connected to the side of the connecting piece, and the rotating shaft is fixedly connected to the inner ring of the connecting bearing. The connecting bearing allows the rotating shaft to rotate smoothly while ensuring that the rotating shaft is always in a horizontal state, thus ensuring the normal use of the device.

[0013] Preferably, the connecting piece has a through hole inside, and the diameter of the through hole is adapted to the inner diameter of the connecting bearing.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. This UV anti-adhesion film curing device for semiconductor cutting, by setting up an anti-adhesion film curing device, allows the LED light to be turned on during processing, and then a whole circle of reflectors to reflect and further focus the light. Multiple reflectors with adjustable angles and facing the center are set up so that the light covers the anti-adhesion film more evenly and with high intensity. Through the synergistic effect of the reflectors, the UV light irradiation effect is continuously enhanced and optimized, improving the curing efficiency and quality of the anti-adhesion film.

[0016] 2. The UV anti-sticking film curing device for semiconductor cutting is equipped with an airflow circulation optimization device. The sealing cover is inserted into the inside of the mounting ring, and then the fan on the top of the sealing cover is activated to form an airflow circulation, forming a uniform airflow layer on the surface of the anti-sticking film. This airflow layer can carry away the heat generated during the curing process and prevent the anti-sticking film from degrading or deforming due to overheating. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the sealing cover of this utility model in the closed state;

[0018] Figure 2 This is a schematic diagram of the structure of the sealing cover of this utility model in the open state;

[0019] Figure 3 This utility model Figure 2 Enlarged structural diagram at point A in the middle;

[0020] Figure 4 This is a three-dimensional structural diagram of the anti-sticking film curing device of this utility model;

[0021] Figure 5 This utility model Figure 4 Enlarged structural diagram at point B.

[0022] In the diagram: 1. Processing box; 2. Bearing seat; 3. Anti-adhesion film curing device; 301. Placement tray; 302. Connecting column; 303. Placement rack; 304. LED light; 305. Connecting strip; 306. Connecting piece; 307. Rotating shaft; 308. Magnetic disc; 309. Magnet base; 310. Stand block; 311. Placement plate; 312. Reflector; 4. Airflow circulation optimization device; 401. Connecting plate; 402. Mounting ring; 403. Sealing cover; 404. Hollow plate; 405. Fan component. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-5 The present invention provides the following technical solution:

[0025] A UV anti-adhesion film curing device for semiconductor cutting includes a processing box 1, a support base 2 is provided on the top of the processing box 1, an anti-adhesion film curing device 3 is provided on the top of the support base 2, and an airflow circulation optimization device 4 is provided on the surface of the anti-adhesion film curing device 3.

[0026] The anti-adhesion film curing device 3 includes a placement tray 301, a connecting column 302, a placement rack 303, an LED light 304, a connecting strip 305, a connecting piece 306, a rotating shaft 307, a magnetic disc 308, a magnetic base 309, a stand 310, a placement plate 311, and a reflector 312. The placement tray 301 is fixedly connected to the top of the support base 2, the connecting column 302 is fixedly connected to the top center of the placement tray 301, and the placement rack 303 is fixedly connected to the surface of the connecting column 302. Lamp 304 is fixedly connected to the surface of the placement rack 303, connecting strip 305 is fixedly connected to the top of the placement tray 301, connecting piece 306 is fixedly connected to the top of the connecting strip 305, rotating shaft 307 is slidably connected to the inside of the connecting piece 306, placement plate 311 is fixedly connected to the surface of the rotating shaft 307, magnetic disc 308 is fixedly connected to the left side of the rotating shaft 307, upright block 310 is fixedly connected to the top left side of the connecting strip 305, and magnetic base 309 is fixedly connected to upright block 304. At the top of the 10, a magnetic disc 308 is slidably connected to the inside of a magnet base 309. A reflector 312 is fixedly connected to the back of the placement plate 311. A through hole is formed inside the connecting piece 306, the diameter of which matches the inner diameter of the connecting bearing. A circular groove is formed inside the magnet base 309, the diameter of which matches the diameter of the magnet base 309. The magnetic disc 308 is magnetically connected to the magnet base 309. The magnetic disc 308 rotates within the magnet base 309, and the magnetic disc... 308 is magnetically connected to the magnetic base 309, and during the adjustment process, the magnetic disc 308 is always in contact with the inner wall of the magnetic base 309, which can form a quick self-lock after adjustment, facilitating angle adjustment and locking after adjustment. A connecting bearing is fixedly connected to the side of the connecting piece 306, and the rotating shaft 307 is fixedly connected to the inner ring of the connecting bearing. The setting of the connecting bearing allows the rotating shaft 307 to rotate smoothly, while ensuring that the rotating shaft 307 is always in a horizontal state, ensuring the normal use of the device.

[0027] The airflow circulation optimization device 4 includes a connecting plate 401, a mounting ring 402, a sealing cover 403, a hollow plate 404, and a fan 405. The fan 405 is fixedly connected to the top left and right sides of the placement plate 301. The mounting ring 402 is fixedly connected to the surface of the connecting plate 401. The sealing cover 403 is inserted into the top of the connecting plate 401. The hollow plate 404 is fixedly connected to the top of the sealing cover 403. The fan 405 is fixedly connected to the inside of the hollow plate 404. The bottom of the fan 405 extends through the top of the sealing cover 403 and connects to the inside of the sealing cover 403. The top of the mounting ring 402 has an annular docking slot. The bottom area of ​​the sealing cover 403 is adapted to the area of ​​the annular docking slot.

[0028] In use, the UV anti-adhesion film for semiconductor cutting to be cured is placed on top of the placement tray 301, with a cutout in the center aligned with the center of the connecting post 302. A placement rack 303 for holding LED lights 304 and the connecting post 302 are located at the center of the top of the placement tray 301. A ring-shaped array of reflectors 312 is also located on the top of the placement tray 301. An angle adjustment mechanism is located below the reflectors 312, allowing adjustment of the reflection point as needed. During adjustment, the placement plate 311 can be held and flipped up and down. Flipping causes the rotating shaft 307 to rotate inside the connecting piece 306. The rotation of the rotating shaft 307 causes the magnetic disc 308 on the left side to rotate inside the magnet base 309. The magnetic disc 308 and the magnet base 309 are magnetically connected, and during adjustment, the magnetic disc 308 remains in contact with the inner wall of the magnet base 309, maintaining a magnetic connection. After adjustment without external force, it can quickly form a magnetic self-locking mechanism to complete the angle adjustment, ensuring that the reflected angle is aligned with the UV anti-adhesion film for semiconductor cutting to be cured. During processing, the LED light 304 can be turned on, and then a full circle of reflectors 312 can be used to reflect and further focus the light. Multiple reflectors 312 with adjustable angles towards the center are set up, so that the light covers the anti-adhesion film more evenly and with high intensity. Through the synergistic effect of the reflectors 312, the UV light irradiation effect is continuously enhanced and optimized, improving the curing efficiency and quality of the anti-adhesion film. The effect is good. When using, the sealing cover 403 can be inserted into the inside of the mounting ring 402, and then the fan 405 on the top of the sealing cover 403 can be turned on to form an airflow circulation, forming a uniform airflow layer on the surface of the anti-adhesion film. This airflow layer can carry away the heat generated during the curing process, preventing the anti-adhesion film from degrading or deforming due to overheating.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A UV anti-adhesion film curing apparatus for semiconductor cutting, comprising a processing chamber (1), characterized in that: The top of the processing box (1) is provided with a support seat (2), the top of the support seat (2) is provided with a non-stick film curing device (3), and the surface of the non-stick film curing device (3) is provided with an airflow circulation optimization device (4). The anti-adhesion film curing device (3) includes a placement tray (301), a connecting column (302), a placement rack (303), an LED light (304), a connecting strip (305), a connecting piece (306), a rotating shaft (307), a magnetic disc (308), a magnetic base (309), a standing block (310), a placement plate (311), and a reflector (312). The placement tray (301) is fixedly connected to the top of the support base (2). The connecting column (302) is fixedly connected to the top center of the placement tray (301). The placement rack (303) is fixedly connected to the surface of the connecting column (302). The LED light (304) is fixedly connected to the surface of the placement rack (303). The connecting strip (305) is fixedly connected to the surface of the placement rack (306). 05) The connecting piece (306) is fixedly connected to the top of the placement plate (305), the connecting piece (306) is fixedly connected to the top of the connecting strip (305), the rotating shaft (307) is slidably connected to the inside of the connecting piece (306), the placement plate (311) is fixedly connected to the surface of the rotating shaft (307), the magnetic disc (308) is fixedly connected to the left side of the rotating shaft (307), the standing block (310) is fixedly connected to the top left side of the connecting strip (305), the magnetic seat (309) is fixedly connected to the top of the standing block (310), the magnetic disc (308) is slidably connected to the inside of the magnetic seat (309), and the reflector (312) is fixedly connected to the back of the placement plate (311).

2. The UV anti-adhesion film curing device for semiconductor cutting according to claim 1, characterized in that: The airflow circulation optimization device (4) includes a connecting plate (401), a mounting ring (402), a sealing cover (403), a hollow plate (404), and a fan (405). The fan (405) is fixedly connected to the top left and right sides of the placement plate (301). The mounting ring (402) is fixedly connected to the surface of the connecting plate (401). The sealing cover (403) is inserted into the top of the connecting plate (401). The hollow plate (404) is fixedly connected to the top of the sealing cover (403). The fan (405) is fixedly connected to the inside of the hollow plate (404).

3. The UV anti-adhesion film curing device for semiconductor cutting according to claim 2, characterized in that: The bottom of the fan component (405) extends through the top of the sealing cover (403) and connects to the interior of the sealing cover (403).

4. The UV anti-adhesion film curing device for semiconductor cutting according to claim 2, characterized in that: The top of the mounting ring (402) is provided with an annular docking slot, and the bottom area of ​​the sealing cover (403) is adapted to the area of ​​the annular docking slot.

5. The UV anti-adhesion film curing apparatus for semiconductor cutting according to claim 1, characterized in that: The magnet base (309) has a circular groove inside, the diameter of which is adapted to the diameter of the magnet base (309), and the magnetic disc (308) is magnetically connected to the magnet base (309).

6. The UV anti-adhesion film curing apparatus for semiconductor cutting according to claim 1, characterized in that: The connecting piece (306) is fixedly connected to a connecting bearing component on its side, and the rotating shaft (307) is fixedly connected to the inner ring of the connecting bearing component.

7. The UV anti-adhesion film curing apparatus for semiconductor cutting according to claim 6, characterized in that: The connecting piece (306) has a through hole inside, and the diameter of the through hole is adapted to the inner diameter of the connecting bearing.

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