Silicon wafer box opening device

Abstract

The utility model discloses a silicon wafer box opening device, which belongs to the technical field of silicon wafer box opening and comprises a conveying line body used for conveying a box body. The mechanical arm is used for moving the box body to the conveying line body, and a cutter is arranged at the tail end of the mechanical arm so as to cut the adhesive tape on the box body; the box opening part is located on a conveying path of the conveying line body, the box opening part comprises an overturning air cylinder, an overturning plate and a box opening suction cup, the overturning air cylinder drives the overturning plate, and the box opening suction cup is installed on the overturning plate and overturns the box after adsorbing the box. According to the silicon wafer box opening device, rapid box opening treatment on the silicon wafers is achieved, compared with traditional manual operation, the box opening efficiency is improved, meanwhile, the labor intensity of operators is greatly reduced, manpower consumption is reduced, pollution or damage to the silicon wafers in the box body due to manual operation deviation is avoided, and the quality of the silicon wafers is guaranteed.

Description

Technical Field

[0001] This utility model belongs to the field of silicon wafer unpacking technology, and in particular relates to a silicon wafer unpacking device. Background Technology

[0002] Silicon wafers are thin sheets made of high-purity crystalline silicon. Currently, finished silicon wafers are usually stored in boxes. When the silicon wafers need to be used, they need to be unpacked. However, the unpacking of silicon wafers is usually done manually. The operator uses tools to cut and disassemble the boxes containing the silicon wafers. This method consumes a lot of manpower, greatly increases the labor intensity of the operator, and is inefficient. It is also easy to contaminate and damage the silicon wafers during the unpacking process, affecting the quality of the silicon wafers. Utility Model Content

[0003] This invention overcomes the shortcomings of the prior art and provides a silicon wafer unpacking device to solve the problems existing in the prior art.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a silicon wafer unpacking device, which opens the box containing silicon wafers, the unpacking device comprising...

[0005] A conveyor line that transports the box.

[0006] A robotic arm that moves the box onto the conveyor line, the robotic arm having a cutter at its end to cut the tape on the box;

[0007] The box opening section is located on the conveying path of the conveyor line. The box opening section includes a flipping cylinder, a flipping plate, and a box opening suction cup. The flipping cylinder drives the flipping plate, and the box opening suction cup is installed on the flipping plate to adsorb the box and flip it.

[0008] In a preferred embodiment of this invention, the end of the robotic arm is provided with several material-grabbing suction cups to adsorb the box body.

[0009] In a preferred embodiment of this invention, the cutter is connected to the robotic arm via a drive cylinder, which is mounted at the end of the robotic arm to drive the cutter.

[0010] In a preferred embodiment of this utility model, the number of the opening parts is four, and they are distributed sequentially along the circumference of the box body so that the box body can be opened from four directions.

[0011] In a preferred embodiment of this utility model, a misalignment cylinder is provided on the conveyor line, and the misalignment cylinder drives two sets of the opening parts to misalign the opening parts with the box body.

[0012] In a preferred embodiment of this utility model, a side-pressure cylinder is provided on the conveyor line to press the side of the box.

[0013] In a preferred embodiment of this utility model, one of the opening parts is mounted on the side pressure cylinder and moves synchronously with the side pressure cylinder.

[0014] In a preferred embodiment of the present invention, a side conveyor line is further included, which is located on one side of the conveyor line body and is used to receive the cover plate inside the box.

[0015] This utility model solves the defects existing in the background technology, and has the following beneficial effects:

[0016] The silicon wafer unpacking device of this invention enables rapid unpacking of silicon wafers. Compared with traditional manual operation, it improves unpacking efficiency, greatly reduces the labor intensity of operators, reduces manpower consumption, and prevents contamination or damage to the silicon wafers inside the box due to human error, thus ensuring the quality of the silicon wafers. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0018] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present utility model;

[0019] Figure 2 This is a partial structural schematic diagram of a preferred embodiment of the present invention;

[0020] Figure 3 for Figure 2 Enlarged view of section A in the middle;

[0021] Figure 4 This is a partial structural schematic diagram of a preferred embodiment of the present invention;

[0022] In the diagram: 100, box body;

[0023] 10. Conveyor line; 20. Robotic arm; 21. Cutter; 30. Box opening section; 31. Tilting cylinder; 32. Tilting plate; 33. Box opening suction cup; 40. Material picking suction cup; 50. Drive cylinder; 60. Misalignment cylinder; 70. Side pressure cylinder; 80. Side conveyor line. Detailed Implementation

[0024] The following drawings will disclose several embodiments of this utility model. For clarity, many physical details will be described in the following description. However, it should be understood that these physical details should not be used to limit this utility model. That is, in some embodiments of this utility model, these physical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0025] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described with the same technical terms and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0026] This embodiment provides a silicon wafer unpacking device that opens the box 100 containing silicon wafers. This silicon wafer unpacking device enables rapid unpacking of silicon wafers. Compared with traditional manual operation, it improves unpacking efficiency, greatly reduces the labor intensity of operators, reduces manpower consumption, and will not cause contamination or damage to the silicon wafers inside the box 100 due to human operation deviation, thus ensuring the quality of silicon wafers.

[0027] Combination Figures 1 to 4 As shown, the unpacking device of this embodiment includes a conveyor line 10, a robotic arm 20, and an unpacking section 30. The conveyor line 10 conveys the box 100, while the robotic arm 20 can move the box 100 onto the conveyor line 10. The unpacking section 30 can open the box 100 to complete the unpacking operation.

[0028] In this embodiment, the silicon wafer unpacking device also includes a side conveyor line 80, which is located on one side of the conveyor line body 10 and is used to receive the cover plate inside the box 100. In this embodiment, the box 100 is provided with a cover plate to cover the silicon wafer. Therefore, after unpacking, the cover plate needs to be transferred to the side conveyor line 80 by the robotic arm 20 to unload the cover plate for subsequent processing of the silicon wafer.

[0029] Combination Figures 1 to 3As shown, in this embodiment, the robotic arm 20 moves the box 100 onto the conveyor line 10. The end of the robotic arm 20 is equipped with a cutter 21 to cut the tape on the box 100. The end of the robotic arm 20 is also equipped with several material suction cups 40 to pick up the box 100. Under the driving action of the robotic arm 20, the material suction cups 40 pick up the box 100 and then transfer the box 100 onto the conveyor line 10. The robotic arm 20 operates the cutter 21 to cut the tape on the box 100. After cutting, the box 100 is in a semi-open state and needs to be further opened by the box opening section 30.

[0030] In this embodiment, the cutter 21 is connected to the robotic arm 20 via a drive cylinder 50. The drive cylinder 50 is installed at the end of the robotic arm 20 to drive the cutter 21. When the drive cylinder 50 drives the cutter 21 to retract, the cutter 21 and the material suction cup 40 are staggered to ensure that the material suction cup 40 stably adsorbs the box 100. When the drive cylinder 50 drives the cutter 21 to extend, the extended cutter 21 can cut the tape on the box 100 under the action of the robotic arm 20, thus completing the initial opening of the box 100.

[0031] Combination Figure 1 and Figure 4 As shown, the box opening section 30 in this embodiment is located on the conveying path of the conveyor line 10. The box opening section 30 includes a flipping cylinder 31, a flipping plate 32, and a box opening suction cup 33. The flipping cylinder 31 drives the flipping plate 32, and the box opening suction cup 33 is installed on the flipping plate 32. After adsorbing the box 100, it flips it. There are four sets of box opening sections 30 in this embodiment, which are distributed in sequence along the circumference of the box 100 so that the box 100 can be opened from four directions. The flipping cylinder 31 in this embodiment can drive the flipping plate 32 to flip 135 degrees, so that the flipping plate 32 can smoothly reach the top cover of the box 100. The box opening suction cup 33 adsorbs the top cover of the box 100, and then the flipping cylinder 31 resets and pulls the flipping plate 32. The box opening suction cup 33 adsorbs the top cover of the box 100, so that the box 100 will be opened and the box opening operation is completed.

[0032] In this embodiment, a misalignment cylinder 60 is provided on the conveyor line 10. The misalignment cylinder 60 drives two sets of opening sections 30 to misalign the opening sections 30 with the box body 100. The misalignment cylinder 60 can drive the two sets of opening sections 30 located on the conveying path of the conveyor line 10, so that the opening sections 30 are misaligned with the box body 100 during the conveying process. When the box body 100 reaches the opening position, the misalignment cylinder 60 pushes the opening section 30 to the side of the box body 100 so that the opening section 30 can open the box body 100. Therefore, the existence of the misalignment cylinder 60 enables the box body 100 to move to the opening position more smoothly before the opening operation is performed.

[0033] Furthermore, a side-pressure cylinder 70 is provided on the conveyor line 10 to squeeze the side of the box 100. An opening part 30 is installed on the side-pressure cylinder 70 and moves synchronously with the side-pressure cylinder 70. The side-pressure cylinder 70 can squeeze the foam inside the box 100 from the side of the box 100, thereby further positioning the box 100.

[0034] In actual use, the silicon wafer unpacking device of this embodiment operates the chuck 40 to pick up the box 100 and transfer the box 100 to the conveyor line 10. Then, the drive cylinder 50 drives the cutter 21 to extend. Under the action of the robot arm 20, the extended cutter 21 cuts the tape attached to the surface of the box 100 repeatedly, completing the initial unpacking of the box 100. Then, the conveyor line 10 transports the box 100 to the unpacking position, where four sets of unpacking units 30 operate to unpack the box 100 from four directions. The flipping cylinder 31 of the unpacking unit 30 drives the flipping plate 32 to approach the top cover of the box 100, and the unpacking chuck 33 picks up the top cover of the box 100. Then, the flipping cylinder 31 resets and opens the top cover of the box 100, completing the unpacking operation.

[0035] In summary, the silicon wafer unpacking device of this embodiment enables rapid unpacking of silicon wafers. Compared with traditional manual operation, it improves unpacking efficiency, greatly reduces the labor intensity of operators, reduces manpower consumption, and prevents contamination or damage to the silicon wafers inside the box 100 due to human error, thus ensuring the quality of the silicon wafers.

[0036] While the present invention has been described above with reference to various embodiments, it should be understood that many changes and modifications can be made without departing from the scope of the present invention. That is, the methods, systems, or devices discussed above are merely examples. Various configurations can be appropriately omitted, substituted, or added to various processes or components. For example, in alternative configurations, methods can be performed in a different order than described, and / or various stages can be added, omitted, and / or combined. Moreover, features described with respect to certain configurations can be combined in various other configurations. Different aspects and elements of the configuration can be combined in a similar manner. Furthermore, as technology develops, many elements are merely examples and do not limit the scope of this disclosure or the claims.

[0037] Specific details are provided in the specification to offer a thorough understanding of exemplary configurations, including implementations. However, configurations can be practiced without these specific details; for example, well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary detail to avoid obscuring the configuration. This description provides only exemplary configurations and does not limit the scope, applicability, or configuration of the claims. Rather, the foregoing description of the configurations will provide those skilled in the art with an enabling description for implementing the described techniques. Various changes can be made to the function and arrangement of the elements without departing from the spirit or scope of this disclosure.

[0038] Furthermore, although each operation can be described as a sequential process, many operations can be executed in parallel or simultaneously. Additionally, the order of operations can be rearranged. A process may have additional steps. Moreover, examples of methods can be implemented using hardware, software, firmware, middleware, code, hardware description languages, or any combination thereof. When implemented in software, firmware, middleware, or code, the program code or code segments used to perform the necessary tasks can be stored in a non-transitory computer-readable medium such as a storage medium and executed by a processor.

[0039] In summary, the above detailed description is intended to be exemplary rather than limiting, and it should be understood that the claims (including all equivalents) are intended to define the spirit and scope of this invention. These embodiments should be understood as illustrative only and not as limiting the scope of protection of this invention. After reading the description of this invention, those skilled in the art can make various alterations or modifications to it, and these equivalent changes and modifications also fall within the scope defined by the claims of this invention.

Claims

1. A silicon wafer unpacking device for opening a box (100) containing silicon wafers, characterized in that, The unpacking device includes A conveyor line (10) transports the housing (100); A robotic arm (20) moves the box (100) onto the conveyor line (10). The end of the robotic arm (20) is provided with a cutter (21) to cut the tape on the box (100). The box opening section (30) is located on the conveying path of the conveyor line (10). The box opening section (30) includes a flipping cylinder (31), a flipping plate (32), and a box opening suction cup (33). The flipping cylinder (31) drives the flipping plate (32), and the box opening suction cup (33) is installed on the flipping plate (32) to adsorb the box (100) and flip it.

2. The silicon wafer unpacking device according to claim 1, characterized in that, The robotic arm (20) is equipped with several material suction cups (40) at its end to adsorb the box (100).

3. The silicon wafer unpacking device according to claim 1, characterized in that, The cutter (21) is connected to the robotic arm (20) via a drive cylinder (50), which is mounted at the end of the robotic arm (20) to drive the cutter (21).

4. The silicon wafer unpacking device according to claim 1, characterized in that, The number of the opening section (30) is four, and they are distributed sequentially along the circumference of the box (100) so that the box (100) can be opened from four directions.

5. A silicon wafer unpacking device according to claim 4, characterized in that, The conveyor line (10) is equipped with a misalignment cylinder (60), which drives two sets of the opening section (30) to misalign the opening section (30) with the box body (100).

6. A silicon wafer unpacking device according to claim 1, characterized in that, The conveyor line (10) is equipped with a side-pressure cylinder (70) to press the side of the box (100).

7. A silicon wafer unpacking device according to claim 6, characterized in that, The opening part (30) is mounted on the side pressure cylinder (70) and moves synchronously with the side pressure cylinder (70).

8. A silicon wafer unpacking device according to claim 1, characterized in that, It also includes a side conveyor line (80), which is located on one side of the conveyor line body (10) and is used to receive the cover plate inside the box (100).

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