Novel sputtering film forming machine table
By improving the surface structure of the liner plate of the sputtering film forming machine, the problem of dust particle shedding was solved, the product appearance and performance yield were improved, the maintenance cycle was extended, and the utilization rate and production efficiency of the equipment were increased.
Patent Information
- Application Number
- CN202423047802.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-12-11
AI Technical Summary
The protective liner of a traditional sputtering film forming machine is prone to dust particles breaking and falling off during use, which leads to a decrease in film quality and performance yield, and frequent replacement, affecting equipment utilization and production capacity.
Sandblasting, micro-machining, or coating with a film layer can be performed on the surface of the liner of the sputtering film forming machine to improve surface roughness and adhesion, increase the adhesion of dust particles, and extend the service life of the liner.
By improving the surface structure of the liner, the impact of dust on the product is reduced, the product appearance and performance yield are improved, the maintenance cycle is extended, and the equipment utilization rate and production capacity are increased.
Smart Images
Figure CN223509943U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of sputtering film forming machines, and in particular relates to a novel sputtering film forming machine. Background Technology
[0002] Traditional sputtering machines have metal protective liner plates installed inside the cavity to prevent excess dust particles from adhering to the inner wall of the machine during sputtering and causing damage to the machine's movement and vacuum equipment. However, as the sputtering operation time increases, the particle layer adhering to the protective liner plate becomes thicker. Due to thermal stress, the powder layer on the liner plate can crack and detach, and the fragmented particles can scatter onto the wafer during the film deposition process, resulting in a decrease in film quality. On the one hand, particulate matter leads to low film appearance yield. On the other hand, the reduced film quality also leads to a decrease in product performance, resulting in a loss of performance yield.
[0003] The current standard solution to this problem is to periodically replace the protective liner inside the cavity to minimize the reduction in product appearance and performance yield caused by particulate matter deposition. However, the existing liners have a short service life, increasing the frequency of liner replacement and reducing equipment utilization and production output per unit time. Utility Model Content
[0004] To address the problem of poor dust particle adhesion in existing protective liner plates, this invention provides a novel sputtering film forming machine. By improving the metal liner plate inside the cavity, the machine enhances the ability to adhere particulate matter, improves product appearance and yield, extends maintenance cycles, and increases production capacity.
[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: a novel sputtering film forming machine, including a machine cavity, a roller is provided at the center of the machine cavity, the outer surface of the roller is used to mount a wafer, at least one sputtering pool is provided on the side wall of the machine cavity, and a liner is provided on the inner wall of the machine cavity, the surface of the liner facing the roller is uneven.
[0006] Furthermore, the surface of the liner facing the roller is treated with a sandblasting process.
[0007] Furthermore, the surface of the liner facing the roller has regular or irregular grooves.
[0008] Furthermore, the groove can be rectangular, square, or circular.
[0009] Furthermore, the surface of the liner facing the roller is provided with a film layer.
[0010] Furthermore, the coating layer is an alloy material, or Al, or a ceramic material.
[0011] Furthermore, the coating layer is a NiCrAlY alloy.
[0012] The advantages of this utility model compared with the prior art are as follows.
[0013] 1. This utility model differs from the traditional sputtering film forming equipment. By improving the metal liner, it enhances the adhesion of dust particles during the film forming process, thereby reducing the impact of dust on the product, improving the product's appearance and performance yield, extending the maintenance cycle, and increasing production capacity.
[0014] 2. The liner of this utility model has a long service life and a low replacement frequency, thereby extending the maintenance cycle of the entire sputtering film forming machine, increasing production operation time, and thus improving production capacity.
[0015] 3. The substrate of this invention is easy to manufacture and has low cost, resulting in significant economic value. Furthermore, the substrate of this invention can be applied to all sputtering film deposition equipment and is suitable for film deposition processes in the semiconductor industry. Actual application in filter production has shown that, before and after substrate surface treatment, product appearance yield increased from 70% to over 90%; performance yield increased from 85% to over 95%; and maintenance cycle increased from 5 days to 15 days. Attached Figure Description
[0016] The present invention will be further described below with reference to the accompanying drawings.
[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model.
[0018] Figure 2 This is a cross-sectional schematic diagram of the liner in Example 1.
[0019] Figure 3 This is a cross-sectional schematic diagram of the liner plate in Example 2.
[0020] Figure 4 This is a cross-sectional schematic diagram of the liner in Example 3.
[0021] Figure 5 Images showing abnormal appearance of dust particles during the film formation process.
[0022] Figure 6 This is a photograph showing the normal appearance of the film formed after the liner of this utility model is applied.
[0023] Figure 7 This is a comparison chart of the performance of devices with normal appearance and those with abnormal appearance.
[0024] In the figure, 1 is the machine cavity, 2 is the roller, 3 is the wafer, 4 is the sputtering pool, 5 is the liner, 51 is the groove, and 52 is the coating layer. Detailed Implementation
[0025] like Figure 1 As shown, a novel sputtering film deposition machine includes a machine cavity 1, a roller 2 disposed at the center of the machine cavity 1, a wafer 3 mounted on the outer surface of the roller 2, at least one sputtering pool 4 disposed on the side wall of the machine cavity 1, and a liner 5 disposed on the inner wall of the machine cavity 1, the surface of the liner 5 facing the roller 2 being uneven.
[0026] This invention improves the surface of the liner 5 by making it uneven, thereby enhancing the adhesion of the liner 5 to dust particles during the film formation process, preventing dust from falling off, and thus improving the product's appearance and performance yield.
[0027] The requirement for the surface of the liner 5 is that it be uneven, but there is no specific structural limitation, as long as it can increase the adhesion of the liner 5 surface. To help those skilled in the art better understand this utility model, several specific embodiments are described below. Example
[0028] like Figure 2 As shown, the surface of the liner 5 facing the roller 2 is treated with sandblasting. Sandblasting improves the surface roughness of the metal liner 5, resulting in stronger surface activity and increased roughness. Compared to a smooth surface, particulate dust is more easily adhered to the surface of the metal liner 5 during sputtering film formation, thus improving product appearance and performance yield. Example
[0029] The surface of the liner 5 facing the roller 2 has regular or irregular grooves 51. Micro-machining is performed on the metal liner 5, cutting its surface to create regular or irregular grooves 51. This enhances the adhesion of the metal liner 5, allowing it to adhere more particulate dust during sputtering, extending the maintenance cycle of the metal liner 5, and improving product appearance and performance yield. In this embodiment, the groove morphology after surface micro-machining is not limited to regular rectangles, circles, polygons, other geometric shapes, or some irregular shapes. Example
[0030] A film layer 52 is provided on the surface of the liner 5 facing the roller 2. The surface of the metal liner 5 is subjected to a fusion-spraying treatment. The fusion-spraying materials of this invention include metals (NiCrAlY alloys, Al and its alloys, etc.) and ceramic materials (Al2O3, Cr2O3, etc.). After fusion-spraying treatment, the surface roughness of the metal liner 5 is improved, and the wetting angle between the fusion-sprayed film and dust particles is small, resulting in stronger adhesion of dust particles, thereby improving the product's appearance and performance yield. The thickness of the fusion-sprayed material is 3-30 μm.
[0031] In addition to using the three embodiments above individually, Implementation Case 1 and Implementation Case 3 can be combined, with surface treatment performed first followed by melt spraying. The two methods are superimposed to improve particulate adhesion. Figure 4 and Figure 5 The comparison clearly shows that the appearance of the film is significantly improved after adopting the liner 5 structure of this utility model.
[0032] Figure 7 This is a comparison chart of filter RF performance. The red curve represents the RF curve of the filter during the film formation process using existing methods, which involves dust particles. The blue curve represents the RF curve of the filter during the normal film formation process of this invention. Figure 7 As can be seen, the performance of filters with dust particles is significantly lower than that of filters with normal membrane layers.
[0033] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.
Claims
1. A novel sputtering film deposition apparatus, comprising an apparatus cavity (1), a roller (2) disposed at the center of the apparatus cavity (1), the outer surface of the roller (2) being used to mount a wafer (3), and at least one sputtering pool (4) disposed on the side wall of the apparatus cavity (1), characterized in that: The inner wall of the machine cavity (1) is provided with a liner (5), and the surface of the liner (5) facing the roller (2) is uneven.
2. The novel sputtering film forming machine according to claim 1, characterized in that: The surface of the liner (5) facing the roller (2) is treated with sandblasting.
3. The novel sputtering film forming machine according to claim 1, characterized in that: The surface of the liner (5) facing the roller (2) has regular or irregular grooves (51).
4. A novel sputtering film deposition machine according to claim 3, characterized in that: The groove (51) is rectangular, square, or circular.
5. A novel sputtering film deposition machine according to claim 1, characterized in that: The liner (5) has a film layer (52) on the side facing the roller (2).
6. A novel sputtering film forming machine according to claim 5, characterized in that: The coating layer (52) is an alloy material, or AL, or a ceramic material.
7. A novel sputtering film deposition machine according to claim 6, characterized in that: The coating layer (52) is a NiCrAlY alloy.