Insoluble anode with surface concave-convex structure
By designing an uneven structure on the surface of the insoluble anode, the problems of uneven electric field distribution and poor coating adhesion were solved, thereby improving the uniformity of electroplating and the durability of the anode.
Patent Information
- Application Number
- CN202423043215.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-12-10
AI Technical Summary
Existing insoluble anodes suffer from large differences in electric field distribution density and poor coating adhesion during electroplating, resulting in decreased electroplating uniformity and shortened service life.
The insoluble anode surface is designed with an uneven structure to increase the anode specific surface area, improve the electric field distribution, and enhance the coating adhesion.
It improves the uniformity of electroplating, extends the service life of insoluble anodes, and reduces processing costs.
Smart Images
Figure CN223510027U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of design and processing of electroplating device, especially to insoluble anode structure, and particularly to insoluble anode with surface concave-convex structure. BACKGROUND
[0002] Compared with the traditional use of metal ball (for example, copper ball) anode, insoluble anode has higher electroplating precision, electroplating efficiency and electroplating uniformity in electroplating processing procedure such as circuit board electroplating processing, and almost no anode mud is produced, effectively reducing processing cost, especially maintenance cost.
[0003] Currently, insoluble anode electroplating technology is also used for pulse electroplating. The current of pulse electroplating is non-DC, and there is a current with a certain frequency of direction switching over time. Since the current of pulse electroplating is in the positive direction, the anode is the electroplating anode, and when the current is switched to the reverse direction, the anode becomes the cathode. This repetition results in greater consumption of insoluble anode.
[0004] Currently, insoluble anodes generally use titanium plates, titanium plate coated with noble metal, and other insoluble anodes with strong inertness, which are all set as plate-shaped insoluble anodes or tubular insoluble anodes with smooth surfaces or mesh structures. In the electroplating process, the size of the cathode is generally smaller than that of the anode (for example, the circuit board is the cathode, and its size is smaller than that of the anode), which provides complete coverage of the electric field for the cathode. However, it is easy to produce the phenomenon that the edge electric field has a greater "attractive" effect than the center electric field, resulting in a smaller center electric field density than the edge electric field density, which easily causes the problem of thicker electroplating at the edge of the cathode, thereby reducing the overall electroplating uniformity. In addition, if the surface of the insoluble anode with inert metal coating is too smooth, it is easy to produce the problem of poor adhesion of the coating with a large area at the same time, and even cause the coating to fall off, affecting the service life of the insoluble anode.
[0005] Therefore, based on the above background technology and problems, the insoluble anode with surface concave-convex structure is provided to improve the electric field distribution and coating adhesion of the insoluble anode. SUMMARY
[0006] The utility model provides an insoluble anode with surface concave-convex structure to solve the problem of large difference in electric field distribution density and poor coating adhesion of the surface smooth insoluble anode in the prior art during application. The insoluble anode is used in electroplating equipment, and the electroplating equipment further includes a cathode and a rectifier. The insoluble anode and the cathode are both electrically connected to the rectifier. At least one side of the insoluble anode has a plurality of concave-convex structures.
[0007] Further, one side of the insoluble anode facing the cathode has a plurality of concave-convex structures.
[0008] Further, the concave-convex structures are perpendicular or parallel to the edge of the insoluble anode; optionally, the concave-convex structures are uniformly distributed on the surface of the insoluble anode.
[0009] Further, the concave-convex structures are a plurality of strip structures independently distributed on the surface of the insoluble anode.
[0010] Further, the strip structures are continuously distributed in a wave structure.
[0011] Further, the concave-convex structures are a plurality of independent convex structures distributed on the surface of the plate.
[0012] Further, the surface of each independent convex structure is triangular, square, rectangular, rhombic or cylindrical; or the vertical cross section is triangular, square, rectangular, trapezoidal, arcuate or semicircular.
[0013] Further, the concave-convex structures are embossing structures on the surface.
[0014] Further, the insoluble anode is a solid plate structure, a mesh plate structure or a cylindrical structure.
[0015] Further, the material of the insoluble anode is lead, carbon, platinum, graphite, graphene, nickel, stainless steel, titanium, titanium alloy, titanium plated with platinum, titanium plated with iridium, titanium plated with iridium and tantalum, titanium plated with ruthenium and iridium, or titanium plated with rhodium.
[0016] The technical scheme of the utility model makes concave-convex structures on the surface of the insoluble anode, increases the specific surface area of the anode, improves the density of the unit electric field distribution, enhances the effect of the electric field scattering in more directions, prevents the electric field from being excessively concentrated in one direction, and thus improves the uniformity of electroplating; for the insoluble anode with a coating on the surface, the concave-convex structures can increase the adhesion of the coating and prolong the service life of the insoluble anode. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained from the structures shown in the drawings without creative labor for those skilled in the art.
[0018] Figure 1 It is a planar structural schematic view of the first insoluble anode with a surface concave-convex structure of the embodiment.
[0019] Figure 2 It is a planar structural schematic view of the second insoluble anode with a surface concave-convex structure of the embodiment. Figure 1Schematic diagram of the AA section structure;
[0020] Figure 3 This is a schematic diagram of the planar structure of the second type of insoluble anode with an uneven surface in this embodiment;
[0021] Figure 4 for Figure 3 Schematic diagram of the BB cross-section structure;
[0022] Figure 5 This is a schematic diagram of the cross-sectional structure of the third type of insoluble anode with an uneven surface in this embodiment;
[0023] Figure 6 This is a schematic diagram of the planar structure of the fourth insoluble anode with a surface unevenness in this embodiment;
[0024] Figure 7 for Figure 6 A schematic diagram of the CC section structure;
[0025] Figure 8 This is a schematic diagram of the planar structure of the fifth type of insoluble anode with an uneven surface in this embodiment;
[0026] Figure 9 for Figure 8 Schematic diagram of the DD cross-section structure;
[0027] Figure 10 This is a schematic diagram of the planar structure of the sixth type of insoluble anode with an uneven surface in this embodiment;
[0028] Figure 11 for Figure 10 Schematic diagram of the EE cross-section structure;
[0029] Figure 12 This is a schematic diagram of the planar structure of the seventh type of insoluble anode with an uneven surface in this embodiment;
[0030] Figure 13 for Figure 12 Schematic diagram of the EE cross-section structure;
[0031] Figure 14 This is a three-dimensional structural diagram of the cylindrical insoluble anode with an uneven surface structure according to this embodiment.
[0032] Attached image captions:
[0033]
[0034] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0036] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.
[0037] Furthermore, in this utility model, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0038] Please refer to the following: Figures 1 to 13 .
[0039] The insoluble anode with a surface uneven structure provided in this embodiment is used in an electroplating device, which also includes a cathode and a rectifier. Both the insoluble anode and the cathode are electrically connected to the rectifier. At least one side of the insoluble anode has a plurality of uneven structures.
[0040] Insoluble anodes do not dissolve during electroplating; they only serve to provide electrons for water electrolysis. The cations in the electroplating solution are generated by adding a separate solution containing metal ions (such as copper ions). Creating an uneven structure on the surface of the insoluble anode can increase the anode's specific surface area, improve the density of the electric field distribution per unit area, and enhance the effect of scattering the electric field in more directions, preventing excessive concentration of the electric field and thus improving the uniformity of electroplating.
[0041] For example, in the process of electroplating a circuit board, the circuit board to be electroplated is a cathode, and insoluble anodes are arranged on both sides of the circuit board. During electroplating, the insoluble anodes form an electric field towards the cathode, and copper ions move towards the cathode and obtain electrons at the cathode to realize the electroplating process. The area of the anode is generally larger than that of the cathode, and the cathode has an "adsorption" effect on the electric field, which can easily cause the electric field at the edge of the circuit board to be more concentrated, resulting in a thicker electroplated copper layer at the edge of the circuit board. The concave-convex structure on the surface can increase the specific surface area of the anode, and the relatively large uneven surface formed by the concave-convex structure can cause the electric field to scatter in more directions, thereby reducing the thickness of the electroplated copper layer at the edge of the circuit board.
[0042] On the other hand, since the insoluble anode generally needs to have a strong inert noble metal coating or noble metal oxide coating on its surface to improve corrosion resistance, electrochemical environment resistance, mechanical properties and other characteristics, the concave-convex surface structure on the substrate (e.g., titanium plate) of the insoluble anode can effectively improve the bonding force and bonding area of the coating and the substrate, thereby prolonging the service life of the insoluble anode.
[0043] In one embodiment, one side of the insoluble anode facing the cathode has a plurality of concave-convex structures.
[0044] Generally, the side facing the cathode is provided with a concave-convex structure to form a one-way change, and the processing cost can be reduced.
[0045] In one embodiment, the plurality of concave-convex structures are perpendicular or parallel to the edge of the insoluble anode.
[0046] In one embodiment, the plurality of concave-convex structures are uniformly distributed on the surface of the insoluble anode.
[0047] In this embodiment, the concave-convex structure can be of multiple types, generally uniformly distributed on the surface of the insoluble anode, and generally perpendicular or parallel to the edge of the insoluble anode, forming a uniform unit surface area, providing uniform electric field distribution, and reducing processing difficulty.
[0048] In some special application scenarios, the edge region of the insoluble anode can be set as a flat region, and the center region can be set as a concave-convex structure to improve the electric field density and heat dissipation effect of the center region, balance the electric field density of the edge and center regions, or finely adjust the unit specific surface area and electric field distribution, and the concave-convex structure distribution density of different regions can be set as a non-uniform distribution state according to actual needs.
[0049] Please continue to refer to Figures 1 to 4 ; Figure 1 This is a schematic diagram of a planar structure of the first insoluble anode with a surface concave-convex structure of the present embodiment; Figure 2 This is a schematic diagram of a planar structure of the second insoluble anode with a surface concave-convex structure of the present embodiment;Figure 1 Schematic diagram of the AA section structure; Figure 3 This is a schematic diagram of the planar structure of the second type of insoluble anode with an uneven surface in this embodiment; Figure 4 for Figure 3 A schematic diagram of the BB cross-section structure.
[0050] In one embodiment, the uneven structure is a plurality of strip-shaped structures independently distributed on the surface of the insoluble anode.
[0051] In the case where "the concave-convex structure is perpendicular or parallel to the edge of the insoluble anode", a strip structure can be simply designed and processed to form it. That is, a number of alternating first anode protrusions 110 and a number of first anode recesses 120 can be designed and manufactured on the surface of the first anode body 130 of the first insoluble anode 10, or a number of alternating second anode protrusions 210 and a number of second anode recesses 220 can be designed and manufactured on the surface of the second anode body 230 of the second insoluble anode 20; thereby increasing the specific surface area and the electric field distribution effect in a single direction.
[0052] Please continue reading. Figure 5 ; Figure 5 This is a schematic diagram of the cross-sectional structure of the third type of insoluble anode with an uneven surface in this embodiment.
[0053] In one embodiment, several of the strip structures are continuously distributed in a wave-like structure.
[0054] On the surface of the third anode body 330 of the third insoluble anode 30, several third anode protrusions 110 and several third anode recesses 120 are designed and fabricated to be alternately distributed. The third anode protrusions 110 and several third anode recesses 120 continuously alternate to form a wave structure. The wave structure can be a wave pattern perpendicular or parallel to the edge of the insoluble anode, or it can be a multiple wave pattern that is cross-distributed. This is more conducive to the formation of a concave-convex structure with a smooth buffer process on the surface, which is convenient for the production and adhesion of noble metal coatings or noble metal oxide coatings.
[0055] Please continue reading. Figures 6 to 13 ; Figure 6 This is a schematic diagram of the planar structure of the fourth insoluble anode with a surface unevenness in this embodiment; Figure 7 for Figure 6 A schematic diagram of the CC section structure; Figure 8 This is a schematic diagram of the planar structure of the fifth type of insoluble anode with an uneven surface in this embodiment; Figure 9 for Figure 8 Schematic diagram of the DD cross-section structure; Figure 10This is a schematic diagram of the planar structure of the sixth type of insoluble anode with an uneven surface in this embodiment; Figure 11 for Figure 10 Schematic diagram of the EE cross-section structure; Figure 12 This is a schematic diagram of the planar structure of the seventh type of insoluble anode with an uneven surface in this embodiment; Figure 13 for Figure 12 A schematic diagram of the EE cross-section structure.
[0056] In one embodiment, the concave-convex structure is a plurality of independent protrusions distributed on the surface of the plate.
[0057] Furthermore, the surface of each of the independent protrusions is triangular, square, rectangular, rhomboid, or cylindrical, or the vertical cross-section is triangular, square, rectangular, trapezoidal, slightly curved, or semi-circular.
[0058] Independent protruding structures can be made into triangular, square, rectangular, or rhomboid protrusions on the surface, or into irregular geometric shapes required for the application, including shapes with vertical cross-sections of triangles, squares, rectangles, trapezoids, minor arcs, or semicircles, etc.
[0059] Figure 6 and Figure 7 An insoluble anode structure with a square surface and independent protrusion structure is given, namely, the surface of the fourth anode body 430 of the fourth insoluble anode 40 is distributed with a number of fourth anode protrusions 410 and a number of fourth anode recesses 420.
[0060] Figure 8 and Figure 9 An insoluble anode structure with a rhomboid surface and an independent protrusion structure is provided, namely, the surface of the fifth anode body 530 of the fifth insoluble anode 50 is distributed with a number of fifth anode protrusions 510 and fifth anode recesses 520.
[0061] Figure 10 and Figure 11 An insoluble anode structure with a cylindrical surface and independent protrusion structure is provided, namely, the surface of the sixth anode body 630 of the sixth insoluble anode 60 is distributed with a number of sixth anode protrusions 610 and sixth anode recesses 620.
[0062] Figure 12 and Figure 13 An insoluble anode structure with a trapezoidal vertical cross-section and an independent protrusion structure is presented. Specifically, the surface of the seventh anode body 730 of the seventh insoluble anode 70 is distributed with a number of trapezoidal platform seventh anode protrusions 710 and seventh anode recesses 720.
[0063] Please refer to it again. Figure 9 .
[0064] In one embodiment, the concave-convex structure is a surface embossing embossing structure.
[0065] Figure 9 It can also be understood that the surface of the fifth anode body 530 of the fifth insoluble anode 50 is embossed to form the fifth anode protrusion 510 and the fifth anode depression 520, which are independent protrusion structures and have a vertical cross-section in the shape of several triangles (or rhombuses).
[0066] Please continue to refer to Figures 1 to 13 , and refer to Figure 14 ; Figure 14 is a schematic diagram of the three-dimensional structure of the cylindrical insoluble anode with a surface concave-convex structure according to the present embodiment.
[0067] In the present embodiment, the insoluble anode is a solid plate structure, a mesh plate structure, or a cylindrical structure. Preferably, the mesh plate structure is formed into a mesh by punching, milling, weaving, etc., and the mesh has a mesh count of 1 to 200, preferably 5, 16, 32, 48, 60, 100, or 120.
[0068] The surface concave-convex structure of the present embodiment can be applied to an anode with a solid plate structure, an anode with a mesh plate structure, or an anode with a cylindrical structure (i.e., a tubular anode). The mesh plate structure is advantageous in that it improves the uniformity of current distribution, reduces the interference of stray current, is light in structure, and has many mesh holes, thus being easy to install. The mesh surface can be coated with a surface coating on the inside and outside of the mesh holes, thus making it more corrosion-resistant.
[0069] In one embodiment, the insoluble anode is a cylindrical structure, i.e., a tubular anode 80, which can be obtained by bending and welding a plate-shaped anode. The cylindrical insoluble anode 80 has any of the above-mentioned surface concave-convex structures. Figure 14 The seventh anode protrusion 810 with a vertical cross-section in the shape of a triangle or a rhombus is shown in FIG. 8.
[0070] In the present embodiment, the material of the insoluble anode is lead, carbon, platinum, graphite, graphene, nickel, stainless steel, titanium, titanium alloy, titanium coated with platinum, titanium coated with iridium, titanium coated with iridium and tantalum, titanium coated with ruthenium and iridium, or titanium coated with rhodium.
[0071] The present embodiment can be realized for insoluble anodes made of various materials.
Claims
1. An insoluble anode with surface uneven structure, which is used in an electroplating device, the electroplating device further comprising a cathode and a rectifier, the insoluble anode and the cathode are electrically connected to the rectifier; characterized in that at least one side of the insoluble anode has a plurality of uneven structures.
2. The insoluble anode with surface uneven structure according to claim 1, characterized in that the side of the insoluble anode facing the cathode has a plurality of uneven structures.
3. The insoluble anode with surface uneven structure according to claim 1 or 2, characterized in that the plurality of uneven structures are perpendicular or parallel to the edge of the insoluble anode.
4. The insoluble anode with surface uneven structure according to claim 1 or 2, characterized in that the uneven structures are a plurality of strip structures independently distributed on the surface of the insoluble anode.
5. The insoluble anode with surface uneven structure according to claim 4, characterized in that the plurality of strip structures are continuously distributed in a wave structure.
6. The insoluble anode with surface uneven structure according to claim 1 or 2, characterized in that the uneven structures are a plurality of independent protruding structures distributed on the surface of the plate.
7. The insoluble anode with surface uneven structure according to claim 6, characterized in that the surface of each independent protruding structure is triangular, square, rectangular, rhombic or cylindrical; or the vertical cross section is triangular, square, rectangular, trapezoidal, arcuate or semicircular.
8. The insoluble anode with surface uneven structure according to claim 1 or 2, characterized in that the uneven structures are embossed structures on the surface.
9. The insoluble anode with surface uneven structure according to any one of claims 1 or 2, characterized in that the insoluble anode is a solid plate structure, a mesh plate structure or a cylindrical structure.
10. The insoluble anode with surface uneven structure according to any one of claims 1 or 2, characterized in that the material of the insoluble anode is lead, carbon, platinum, graphite, graphene, nickel, stainless steel, titanium, titanium alloy, titanium with platinum plating, titanium with iridium plating, titanium with iridium-tantalum plating, titanium with ruthenium-iridium plating or titanium with rhodium plating.