Power module driving test device capable of reducing stray inductance

Abstract

The utility model provides a power module drive testing device capable of reducing stray inductance, which relates to the technical field of module testing, and is characterized in that a plurality of drive board signal pin sleeves and a plurality of power module pin sleeves are arranged on a PCB (Printed Circuit Board), and each drive board signal pin sleeve is correspondingly and electrically connected with one power module pin sleeve; a plurality of signal terminal pins on the test driving board are respectively and correspondingly inserted into the driving board signal pin sleeves; and a plurality of power terminal pins of the power module to be tested are correspondingly inserted into the power module pin sleeves respectively. The beneficial effects are that traditional twisted pair fly wire connection is not used any more, stray inductance introduced by using a double-effect wire is reduced, test variables introduced by different lengths of twisted pairs are controlled, and the test efficiency is improved only by designing the positions of the drive board signal pin sleeve and the power module pin sleeve on the PCB. Therefore, the universal test driving board can be matched with power modules with different packages.

Description

Technical Field

[0001] This utility model relates to the field of module testing technology, and in particular to a power module drive testing device for reducing stray inductance. Background Technology

[0002] Power semiconductor devices are widely used in various fields such as switching control, power conversion, motor drive, lighting control, battery management and protection control, and play a key role in industries such as new energy charging piles, automotive electronics, photovoltaic energy storage, data centers, server communication power supplies, and industrial control automation. In recent years, emerging fields such as new energy vehicles and charging piles have become the driving force for its continued growth, and the industry outlook is promising.

[0003] For semiconductor device manufacturers, during the R&D and testing phase, they don't customize dedicated driver boards for various packaged power modules; instead, they use commercially available general-purpose driver boards. The biggest problem with general-purpose driver boards is that their signal terminals cannot directly match the signal terminals of power modules with different packages; they can only be connected via twisted-pair cables. However, using twisted-pair cables presents several issues:

[0004] 1. Using twisted-pair cables will introduce stray inductance;

[0005] 2. Uneven twisted-pair cable lengths will introduce test variables.

[0006] 3. The general-purpose driver board cannot be directly connected to the signal terminals or pins of the power module. During the test, there may be problems with module failure due to incorrect connection of the signal terminals of the power module and the signal terminals of the driver board. Utility Model Content

[0007] To address the problems existing in the prior art, this utility model provides a power module drive test device for reducing stray inductance, comprising:

[0008] The PCB board has a plurality of driver board signal pin sleeves and a plurality of power module pin sleeves, and each driver board signal pin sleeve is electrically connected to a corresponding power module pin sleeve.

[0009] A test driver board, wherein multiple signal terminal pins on the test driver board are respectively connected to and inserted into the signal pin sleeves of each driver board;

[0010] The multiple power terminal pins of the power module to be tested are respectively inserted into the pin sleeves of each power module.

[0011] Preferably, the signal terminal pins on the test driver board are distributed along the edge of the test driver board, and the signal pin sleeves on the PCB board are distributed along the edge of the PCB board, with each signal pin sleeve corresponding to the position of each signal terminal pin.

[0012] Preferably, the power terminal pins of the power module are distributed in the middle of the power module, and the power module pin sleeves on the PCB board are distributed in the middle of the PCB board, and the positions of each power module pin sleeve and each power terminal pin correspond to the positions of the power terminal pins.

[0013] Preferably, the power module is provided with at least one power unit, and each power unit includes a plurality of power terminal pins.

[0014] Preferably, the power unit includes:

[0015] The first IGBT transistor has its source connected to the drain of the second IGBT transistor.

[0016] The gate, drain, and source of the first IGBT transistor, as well as the gate and source of the second IGBT transistor, are all connected to a power terminal pin.

[0017] Preferably, the test driver board includes multiple drive test units, and each drive test unit includes multiple signal terminal pins.

[0018] Preferably, the PCB board and the test drive board are provided with positioning holes corresponding to their positions.

[0019] The above technical solution has the following advantages or beneficial effects:

[0020] A PCB board is set up between the test driver board and the power module to connect the two. The three are connected by a pin socket, eliminating the use of traditional twisted pair wire connections. This reduces stray inductance introduced by twisted pair wires, controls test variables introduced by varying twisted pair wire lengths, avoids potential connection errors with twisted pair wires, and allows a universal test driver board to be compatible with power modules of different packages simply by designing the positions of the driver board signal pin sockets and power module pin sockets on the PCB board. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a test drive board in a preferred embodiment of the present invention.

[0022] Figure 2 This is a schematic diagram of a PCB structure in a preferred embodiment of the present invention;

[0023] Figure 3 This is a schematic diagram of the structure of a power module in a preferred embodiment of the present invention;

[0024] Figure 4 A schematic diagram of a power module comprising multiple power units is shown in a preferred embodiment of the present invention.

[0025] Figure 5 The circuit diagram of the power unit is shown in a preferred embodiment of this utility model.

[0026] Figure 6 A schematic diagram of a PCB structure is shown in a preferred embodiment of this utility model.

[0027] Figure 7 This is a schematic diagram of the structure of a test driver board in a preferred embodiment of the present invention. Detailed Implementation

[0028] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. The present invention is not limited to this embodiment; other embodiments that conform to the spirit of the present invention may also fall within its scope.

[0029] In a preferred embodiment of this utility model, based on the above-mentioned problems existing in the prior art, a power module drive test device for reducing stray inductance is provided, comprising:

[0030] PCB board 1, the PCB board 1 is provided with a plurality of driver board signal pin sleeves 11 and a plurality of power module pin sleeves 12, each of the driver board signal pin sleeves 11 being electrically connected to a power module pin sleeve 12 respectively;

[0031] Multiple signal terminal pins 21 on the test drive board 2 are respectively inserted into the signal pin sleeves 11 of each drive board, and multiple power terminal pins 31 of the power module 3 to be tested are respectively inserted into the pin sleeves 12 of each power module.

[0032] In a preferred embodiment of this utility model, each of the signal terminal pins 21 on the test driver board 2 is distributed on the edge of the test driver board 2, and each of the driver board signal pin sleeves 11 on the PCB board 1 is distributed on the edge of the PCB board 1, and each of the driver board signal pin sleeves 11 corresponds to the position of each of the signal terminal pins 21.

[0033] In a preferred embodiment of the present invention, a plurality of power terminal pins 31 of the power module 3 are distributed in the middle of the power module 3, and each power module pin sleeve 12 on the PCB board 1 is distributed in the middle of the PCB board 1, and each power module pin sleeve 12 corresponds to the position of each power terminal pin 31.

[0034] Specifically, such as Figures 1-3 As shown, several corresponding electrical connection driver board signal pin sleeves 11 and power module pin sleeves 12 are set on the PCB board, which will... Figure 3 The power terminal pins 31 of the power module 3 are inserted accordingly. Figure 2 In the power module pin sleeve 12 of the middle PCB board 1, Figure 1 The signal terminal pins 21 on the test driver board 2 are inserted accordingly. Figure 2 In the signal pin sleeve 11 of the drive board of the PCB board 1, the power terminal pins 31 of the power module 3 and the signal terminal pins 21 on the test drive board 2 are electrically connected accordingly.

[0035] The traditional twisted-pair jumper connection is no longer used, which reduces the stray inductance introduced by the use of twisted-pair cables and controls the test variables introduced by the different lengths of twisted-pair cables. Furthermore, by designing the positions of the driver board signal pin sleeve 11 and the power module pin sleeve 12 on the PCB, the universal test driver board 2 can be matched with power modules 3 of different packages.

[0036] In a preferred embodiment of the present invention, the PCB board 1 and the test drive board 2 are provided with positioning holes 10 corresponding to their positions.

[0037] Specifically, positioning holes 10 with corresponding positions are provided on the PCB board 1 and the test drive board 2 to accurately position the pins during connection and prevent deviation.

[0038] In a preferred embodiment of the present invention, the power module 3 is provided with at least one power unit 32, and each power unit 32 includes a plurality of power terminal pins 31.

[0039] In a preferred embodiment of this utility model, such as Figure 5 As shown, the power unit 32 includes:

[0040] The first IGBT transistor is IGBT1, and the source of the first IGBT transistor IGBT1 is connected to the drain of the second IGBT transistor IGBT2.

[0041] The gate, drain, and source of the first IGBT transistor IGBT1, as well as the gate and source of the second IGBT transistor IGBT2, are all connected to a power terminal pin 31.

[0042] In a preferred embodiment of the present invention, the test driver board 2 includes a plurality of drive test units 22, and each drive test unit 22 includes a plurality of signal terminal pins 21.

[0043] Specifically, such as Figure 4-7 As shown, the power module 3 is provided with multiple power units 32, and correspondingly, the test driver board 2 includes multiple drive test units 22. The PCB board 1 is provided with several driver board signal pin sleeves 11 and several power module pin sleeves 12. This design allows for simultaneous drive testing of multiple power modules 3.

[0044] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model. Those skilled in the art should realize that any equivalent substitutions and obvious changes made using the content of this specification and illustrations should be included within the protection scope of the present utility model.

Claims

1. A power module drive test device for reducing stray inductance, characterized in that, include: The PCB board has a plurality of driver board signal pin sleeves and a plurality of power module pin sleeves, and each driver board signal pin sleeve is electrically connected to a corresponding power module pin sleeve. A test driver board, wherein multiple signal terminal pins on the test driver board are respectively connected to and inserted into the signal pin sleeves of each driver board; The multiple power terminal pins of the power module to be tested are respectively inserted into the pin sleeves of each power module.

2. The power module drive testing device according to claim 1, characterized in that, The signal terminal pins on the test driver board are distributed along the edge of the test driver board, and the signal pin sleeves on the PCB board are distributed along the edge of the PCB board, with each signal pin sleeve corresponding to the position of each signal terminal pin.

3. The power module drive testing device according to claim 1, characterized in that, The power module has multiple power terminal pins distributed in the middle of the power module, and the power module pin sleeves on the PCB board are distributed in the middle of the PCB board, with each power module pin sleeve corresponding to the position of each power terminal pin.

4. The power module drive testing device according to claim 1, characterized in that, The power module is provided with at least one power unit, and each power unit includes a plurality of power terminal pins.

5. The power module drive testing device according to claim 4, characterized in that, The power unit includes: The first IGBT transistor has its source connected to the drain of the second IGBT transistor. The gate, drain, and source of the first IGBT transistor, as well as the gate and source of the second IGBT transistor, are all connected to a power terminal pin.

6. The power module drive testing device according to claim 1, characterized in that, The test driver board includes multiple driver test units, and each driver test unit includes multiple signal terminal pins.

7. The power module drive testing device according to claim 1, characterized in that, The PCB board and the test driver board are provided with positioning holes corresponding to their positions.

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