Camera module and electronic equipment

Abstract

The utility model provides a camera module and electronic equipment. The camera module comprises a lens assembly; the light filtering assembly is arranged on one side, in the first direction, of the lens assembly, and the light filtering assembly comprises a light filter and a support which are connected with each other; the circuit board assembly is arranged on the side, away from the lens assembly, of the light filtering assembly, the circuit board assembly comprises a circuit board and a photosensitive chip which are connected with each other, the photosensitive chip is arranged on the side, facing the light filter, of the circuit board, the support is connected with the circuit board, and a cavity is formed between the photosensitive chip and the light filter; and the immersion liquid is arranged in the cavity, and the refractive index of the immersion liquid is larger than that of air.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a camera module and an electronic device. Background Technology

[0002] In a CCM (Compact Camera Module) module that uses a CMOS (Complementary Metal-Oxide Semiconductor) image sensor, the main modules also include a flexible circuit board, a filter, a motor, and an optical lens. Light passes through the optical lens and the filter before reaching the CMOS image sensor.

[0003] In related technologies, there is an air gap between the filter and the CMOS image sensor. Because the refractive index of the filter is different from that of air, the incident light will be refracted before it reaches the CMOS image sensor, which will cause crosstalk stray light and halo formation, thus affecting the image quality. Utility Model Content

[0004] This application provides a camera module and an electronic device that can improve the problem of image quality being affected by crosstalk and stray light forming halos due to light refraction between the filter and the photosensitive chip in the prior art.

[0005] In a first aspect, embodiments of this application provide a camera module, including: a lens assembly; a filter assembly disposed on one side of the lens assembly in a first direction, the filter assembly including a filter and a bracket connected to each other; a circuit board assembly disposed on the side of the filter assembly away from the lens assembly, the circuit board assembly including a circuit board and a photosensitive chip connected to each other, the photosensitive chip being disposed on the side of the circuit board facing the filter, the bracket being connected to the circuit board, and a cavity being formed between the photosensitive chip and the filter; and an immersion liquid disposed within the cavity, the refractive index of the immersion liquid being greater than the refractive index of air.

[0006] Secondly, embodiments of this application provide an electronic device, including a housing and a camera module as described in the first aspect embodiment.

[0007] Thus, in the camera module and electronic device provided in this application embodiment, the camera module includes a lens assembly, a filter assembly, a circuit board assembly, and an immersion liquid. The filter assembly is disposed on one side of the lens assembly in a first direction so that incident light reaches the filter after passing through the lens assembly. The filter assembly includes a filter and a bracket connected to each other. The bracket is used to support and protect the filter. The circuit board assembly is disposed on the side of the filter assembly away from the lens assembly. The circuit board assembly includes a circuit board and a photosensitive chip connected to each other. The photosensitive chip is disposed on the side of the circuit board facing the filter so that incident light reaches the photosensitive chip after passing through the filter. The bracket and the circuit board are connected to fix the components in the circuit and the filter assembly. There is a cavity for accommodating the immersion liquid between the photosensitive chip and the filter. The refractive index of the immersion liquid is greater than the refractive index of air so that incident light can pass through the lens assembly, the filter, and the immersion liquid to reach the photosensitive chip.

[0008] Therefore, in this embodiment of the application, by filling the cavity between the photosensitive chip and the filter with an immersion liquid with a refractive index greater than that of air, the degree of light refraction between the filter and the photosensitive chip is reduced, thereby improving the problem of crosstalk stray light caused by light refraction between the filter and the photosensitive chip, which forms halos and other issues affecting image quality. Attached Figure Description

[0009] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is an exploded view of a portion of the structure of a camera module according to some embodiments of this application;

[0011] Figure 2 This is a schematic diagram of the structure of a camera module according to some embodiments of this application;

[0012] Figure 3 This is a schematic diagram of the structure of a camera module according to some embodiments of this application;

[0013] Figure 4 This is a schematic diagram of the structure of a camera module according to other embodiments of this application;

[0014] Figure 5 This is an exploded view of a portion of the structure of a camera module according to some embodiments of this application;

[0015] Figure 6 This is a schematic diagram of the structure of a camera module according to some embodiments of this application.

[0016] Explanation of icon numbers:

[0017] 100. Camera module;

[0018] 110. Lens assembly;

[0019] 120. Filter assembly; 121. Filter; 122. Support; 1221. End plate; 1222. Side plate; 1231. First adhesive part; 1232. Second adhesive part; 124. Connecting hole; 125. Waterproof and breathable membrane;

[0020] 130. Circuit board assembly; 131. Circuit board; 132. Photosensitive chip; 1321. Connection area; 1322. Photosensitive area; 133. Insulating part; 134. Waterproof antireflective film; 135. Conductive component;

[0021] 141. Cavity; 142. Immersion fluid;

[0022] X, the first direction. Detailed Implementation

[0023] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0024] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0025] In the description of this application, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "middle", "rear", "left", "right", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0026] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0027] Please see Figure 1 and Figure 2 , Figure 1 This is an exploded view of a portion of the structure of a camera module according to some embodiments of this application; Figure 2 This is a schematic diagram of the structure of a camera module according to some embodiments of this application.

[0028] Firstly, such as Figure 1 and Figure 2 As shown, this application embodiment provides a camera module 100, which includes a lens assembly 110, a filter assembly 120, a circuit board assembly 130, and an immersion liquid 142. The filter assembly 120 is disposed on one side of the lens assembly 110 in a first direction X, and includes a filter 121 and a bracket 122 connected to each other. The circuit board assembly 130 is disposed on the side of the filter assembly 120 away from the lens assembly 110, and includes a circuit board 131 and a photosensitive chip 132 connected to each other. The photosensitive chip 132 is disposed on the side of the circuit board 131 facing the filter 121. The bracket 122 is connected to the circuit board 131, and a cavity 141 is formed between the photosensitive chip 132 and the filter 121. The immersion liquid 142 is disposed in the cavity 141, and the refractive index of the immersion liquid 142 is greater than that of air.

[0029] In the camera module 100 and electronic device provided in this application embodiment, the camera module 100 includes a lens assembly 110, a filter assembly 120, a circuit board assembly 130, and an immersion liquid 142. The filter assembly 120 is disposed on one side of the lens assembly 110 in a first direction X, so that incident light passes through the lens assembly 110 and reaches the filter 121. The filter assembly 120 includes the filter 121 and a bracket 122 connected to each other. The bracket 122 is used to support and protect the filter 121. The circuit board assembly 130 is disposed on the side of the filter assembly 120 away from the lens assembly 110. The 0 includes a circuit board 131 and a photosensitive chip 132 connected to each other. The photosensitive chip 132 is disposed on the side of the circuit board 131 facing the filter 121 so that incident light reaches the photosensitive chip 132 after passing through the filter 121. A bracket 122 is connected to the circuit board 131 to fix the components in the circuit and the filter assembly 120. There is a cavity 141 between the photosensitive chip 132 and the filter 121 to accommodate an immersion liquid 142. The refractive index of the immersion liquid 142 is greater than that of air so that incident light can pass through the lens assembly 110, the filter 121 and the immersion liquid 142 to reach the photosensitive chip 132. By filling the cavity 141 between the photosensitive chip 132 and the filter 121 with an immersion liquid 142 having a refractive index greater than that of air, the degree of light refraction between the filter 121 and the photosensitive chip 132 is reduced, thereby improving problems such as halo formation caused by crosstalk and stray light due to light refraction between the filter 121 and the photosensitive chip 132, which affect the image quality.

[0030] Lens assembly 110 is an optical device for generating images. Photosensitive chip 132 is disposed opposite to the lens. Photosensitive chip 132 is used to receive the light collected by lens assembly 110 and perform photoelectric conversion to realize the recording function of camera module 100. Photosensitive chip 132 can be CCD (Charge Coupled Device) or CMOS (Complementary Metal-Oxide Semiconductor).

[0031] Optionally, the first direction X is the optical axis direction of the lens assembly 110.

[0032] The filter assembly 120 includes a filter 121 and a support 122 connected to each other. Specifically, the support 122 is disposed around the filter 121. For example, the support 122 is made of black resin to reduce the impact of stray light on the photosensitive chip 132, or the support 122 is made of metal to improve the structural strength of the support 122.

[0033] The circuit board assembly 130 includes a circuit board 131 and a photosensitive chip 132. The photosensitive chip 132 and the circuit board 131 are electrically connected by gold wires. The circuit board 131 can be a flexible circuit board 131.

[0034] The bracket 122 and the circuit board 131 are connected together by means of bonding, welding or snap-fitting, and the photosensitive chip 132 and the filter 121 are arranged facing each other along the first direction X. The incident light reaches the photosensitive chip 132 after passing through the filter 121.

[0035] The photosensitive chip 132 and the filter 121 are spaced apart to form a cavity 141, which is a sealed space to contain the immersion liquid 142. The incident light passes through the filter 121 and then through the immersion liquid 142 to reach the photosensitive chip 132.

[0036] Optionally, the specific shape and size of the cavity 141 can be designed by the user. For example, the cavity 141 is cubic or cylindrical.

[0037] In related technologies, incident light passes through the filter 121 and then through an air gap to reach the photosensitive chip 132. The refractive index difference between the filter 121 and air is relatively large, resulting in a greater degree of refraction of the incident light. However, in this embodiment, the immersion liquid 142 fills the cavity 141 between the filter 121 and the photosensitive chip 132. After passing through the filter 121, the incident light enters the immersion liquid 142. The refractive index of the immersion liquid 142 is greater than that of air. In other words, the refractive index difference between the filter 121 and the immersion liquid 142 is smaller than the refractive index difference between the filter 121 and air. This reduces the degree of refraction of the incident light after it exits the filter 121, thereby mitigating the halo problem caused by stray light crosstalk due to light refraction.

[0038] The immersion fluid 142 fills the cavity 141 and removes air bubbles and impurities from the immersion fluid 142 to ensure the purity of the immersion fluid 142 and avoid the impurities in the immersion fluid 142 from affecting the imaging quality.

[0039] Since the immersion liquid 142 fills the space between the photosensitive chip 132 and the filter 121, the immersion liquid 142 can conduct and disperse the heat of the photosensitive chip 132 to improve the performance of the camera module 100.

[0040] Optionally, a microlens structure is provided on the surface of the photosensitive chip 132. After the incident light passes through the filter 121, it reaches the microlens structure. The refractive index of the immersion liquid 142 is close to that of the filter 121 and the microlens, so that the incident light passes through the immersion liquid 142 in a manner with almost no refraction after passing through the filter 121 and enters the photosensitive chip 132.

[0041] The portions of the filter assembly 120 and the circuit board assembly 130 that come into contact with the immersion liquid 142 will not react with the immersion liquid 142 and are made of waterproof materials.

[0042] The immersion liquid 142 can be placed during the formation of the cavity 141, or injected after the cavity 141 is formed.

[0043] Optionally, the dimension L of the cavity 141 in the first direction X satisfies L≥3mm to reduce the machining difficulty of the cavity 141. For example, L is 3mm, 4mm, or 5mm, etc.

[0044] In some embodiments, the immersion liquid 142 is deionized water. After incident light passes through the light filter 121, it passes through the deionized water before entering the photosensitive chip 132. This reduces the degree of light refraction between the filter 121 and the photosensitive chip 132, and improves the problem of crosstalk and stray light caused by light refraction between the filter 121 and the photosensitive chip 132, which can lead to halos and other issues affecting image quality.

[0045] For example, the refractive index of filter 121 is generally around 1.4, the refractive index of air is generally around 1.0, and the refractive index of deionized water is generally around 1.33, in order to reduce the refractive index difference between the immersion liquid 142 and filter 121.

[0046] In some embodiments, such as Figure 1 and Figure 2 As shown, the photosensitive chip 132 includes a connection area 1321 and a photosensitive area 1322. The orthographic projection of the photosensitive area 1322 in the first direction X is located within the filter 121. The circuit board assembly 130 also includes a conductive element 135 and an insulating portion 133. The conductive element 135 is connected between the connection area 1321 and the circuit board 131. The insulating portion 133 is disposed between the connection area 1321 and part of the circuit board 131, and the insulating portion 133 covers the conductive element 135.

[0047] In these embodiments, the photosensitive chip 132 includes a connection area 1321 and a photosensitive area 1322. The photosensitive area 1322 is used to receive light passing through the filter 121. The circuit board assembly 130 also includes a conductive element 135, which is connected between the connection area 1321 and the circuit board 131 to make the photosensitive chip 132 and the circuit board 131 electrically connected. The insulating portion 133 covers the conductive element 135 to insulate the conductive element 135 from the immersion liquid 142, thereby reducing the risk of short circuit in the circuit board assembly 130 due to the immersion liquid 142 and improving the reliability of the camera module 100.

[0048] Optionally, the photosensitive chip 132 includes a photosensitive area 1322 and a connecting area 1321. A microlens structure is disposed within the photosensitive area 1322, which is positioned directly opposite the filter 121. Incident light passes through the filter 121 and then enters the photosensitive area 1322. The connecting area 1321 is located on both sides of the photosensitive area 1322, or the connecting area 1321 surrounds the outer periphery of the photosensitive area 1322. Several conductive elements 135 are connected at one end to the connecting area 1321 of the photosensitive chip 132, and at the other end to the circuit board 131, so that the circuit board 131 and the photosensitive chip 132 are electrically connected.

[0049] For example, conductive element 135 may be a gold wire or a gold-plated support, etc.

[0050] A cavity 141 is formed between the photosensitive chip 132 and the filter 121 to accommodate the immersion liquid 142. At this time, the conductive element 135 is located in the cavity 141. In order to reduce the risk of the immersion liquid 142 causing the conductive element 135 to short-circuit, an insulating part 133 is provided to cover the conductive element 135 in this embodiment of the application to isolate the immersion liquid 142 and the conductive element 135.

[0051] Specifically, the insulating portion 133 covers the portion of the conductive element 135 exposed on the circuit board 131 and the photosensitive chip 132, and covers the connection points of the conductive element 135, the circuit board 131, and the connection area 1321.

[0052] Optionally, a waterproof layer is provided on the surface of the circuit board 131 and the photosensitive area 1322, so that the immersion liquid 142 will not penetrate into the circuit board 131 and the photosensitive area 1322, and the photosensitive chip 132 is bonded to the circuit board 131, so that the immersion liquid 142 will not seep in from the gap between the photosensitive chip 132 and the circuit board 131.

[0053] Optionally, the photosensitive area 1322 includes stacked pixel chips and logic chips, and an insulating portion 133 is disposed around the photosensitive area 1322 to cover the outer periphery of the pixel chips and logic chips to prevent the immersion liquid 142 from seeping into it through the gap between the two chips.

[0054] Optionally, the insulating part 133 is an insulating colloid, and the insulating part 133 is bonded to the circuit board 131 and the photosensitive chip 132.

[0055] Optionally, the insulating part 133 is disposed on the connection area 1321 and part of the circuit board 131. The insulating part 133 is an insulating colloid, and the bracket 122 is bonded to the circuit board assembly 130 through the insulating part 133.

[0056] In some embodiments, such as Figure 1 and Figure 2 As shown, the circuit board assembly 130 also includes a waterproof anti-reflective film 134, which covers the photosensitive area 1322.

[0057] In these embodiments, the circuit board assembly 130 also includes a waterproof and anti-reflective film 134 covering the photosensitive area 1322. The waterproof and anti-reflective film 134 can reduce the risk of the immersion liquid 142 penetrating into the photosensitive chip 132 and causing a short circuit inside the circuit board assembly 130.

[0058] Specifically, a waterproof antireflective membrane 134 covers the photosensitive area 1322, and the cavity 141 is formed by the waterproof antireflective membrane 134, the insulating part 133, and the filter assembly 120 to reduce the risk of short circuit in the circuit board assembly 130 caused by the immersion liquid 142.

[0059] Please see Figure 3 , Figure 3 This is a schematic diagram of the structure of a camera module according to some embodiments of this application.

[0060] In some embodiments, such as Figure 2 and Figure 3 As shown, the insulating part 133 is disposed around the photosensitive area 1322. The insulating part 133 extends along the first direction X and abuts against the bracket 122 to form a cavity 141. The filter assembly 120 also includes a first adhesive part 1231. One end of the insulating part 133 near the filter 121 is connected to the bracket 122 through the first adhesive part 1231.

[0061] In these embodiments, the insulating portion 133 is disposed around the photosensitive area 1322 and extends along the first direction X, so that the insulating portion 133 and the photosensitive area 1322 form a groove that can accommodate the immersion liquid 142. The insulating portion 133 and the support 122 abut against each other, that is, the support 122 covers the opening of this groove to form a cavity 141 that stably accommodates the immersion liquid 142, thereby reducing the risk of the immersion liquid 142 invading other components and causing equipment failure. The end of the insulating portion 133 near the filter 121 is connected to the support 122 through the first adhesive portion 1231 to maintain the connection stability of the insulating portion 133 and the filter 121.

[0062] Optionally, the insulating part 133 is an insulating colloid. The insulating colloid is applied around the photosensitive area 1322 and cured after reaching a preset thickness. The cured insulating colloid and the photosensitive area 1322 form a groove. The bracket 122 covers the opening of the groove to form a cavity 141. Then, the bracket 122 and the cured insulating colloid are connected by the first adhesive part 1231 to form a stable cavity 141. The size of the cavity 141 can be easily adjusted by controlling the amount of insulating colloid applied. For example, the immersion liquid 142 can be injected into the groove during its formation, and then the bracket 122 can be placed over the groove opening; or the immersion liquid 142 can be injected into the cavity 141 after the bracket 122 and the insulating part 133 are connected to form the cavity.

[0063] Optionally, the distance between the end of the insulating part 133 and the bracket 122 that abuts and the photosensitive area 1322 in the first direction X is greater than or equal to 3 mm, or the thickness of the insulating part 133 is greater than or equal to 3 mm.

[0064] For example, the support 122 is a flat plate disposed on the outer periphery of the filter 121, and the flat plate support 122 abuts against the end of the insulating part 133 facing the filter 121.

[0065] Optionally, the first adhesive portion 1231 is disposed around the bracket 122, thereby increasing the contact area between the first adhesive portion 1231, the bracket 122, and the insulating portion 133 to improve the connection reliability of the bracket 122 and the insulating portion 133. For example, as shown... Figure 3 As shown, the first adhesive portion 1231 is disposed between the insulating portion 133 and the bracket 122 along the first direction X, or, as... Figure 2 As shown, the first adhesive portion 1231 is connected to the outer peripheral side of the bracket 122 and the insulating portion 133.

[0066] Please see Figures 4 to 6 , Figure 4 This is a schematic diagram of the structure of a camera module according to other embodiments of this application; Figure 5 This is an exploded view of a portion of the structure of a camera module according to some embodiments of this application; Figure 6 This is a schematic diagram of the structure of a camera module according to some embodiments of this application.

[0067] In some embodiments, such as Figures 4 to 6 As shown, the bracket 122 includes an end plate 1221 and a side plate 1222. The end plate 1221 is arranged around the filter 121. The side plate 1222 is connected to the end plate 1221. The side plate 1222 extends along the first direction X and is connected to the circuit board assembly 130.

[0068] In these embodiments, the bracket 122 includes an end plate 1221 and a side plate 1222. The end plate 1221, which surrounds the filter 121, serves to fix the filter 121. The side plate 1222 is connected to the end plate 1221 and is connected to the circuit board assembly 130 along the first direction X. The side plate 1222 serves to support the filter 121.

[0069] Optionally, the side plates 1222 are continuously extended around the end plate 1221 to improve the overall structural strength of the bracket 122; or multiple side plates 1222 are spaced apart along the circumferential direction of the end plate 1221 to reduce the weight of the bracket 122 and reduce the weight of the equipment.

[0070] Optionally, the side plate 1222 and the end plate 1221 are integrally formed to improve the structural strength of the bracket 122, or the side plate 1222 and the end plate 1221 are manufactured independently and connected together to facilitate the adjustment of the size and shape of the bracket 122.

[0071] In some embodiments, such as Figure 4 As shown, the insulating portion 133 is disposed around the photosensitive area 1322. The insulating portion 133 extends along the first direction X and abuts against the end plate 1221 to form a cavity 141. The side plate 1222 abuts against the outer peripheral surface of the insulating portion 133. The filter assembly 120 also includes a second adhesive portion 1232. The side plate 1222 is connected to the circuit board assembly 130 through the second adhesive portion 1232.

[0072] In these embodiments, the insulating portion 133 is disposed around the photosensitive area 1322 and extends along the first direction X, so that the insulating portion 133 and the photosensitive area 1322 form a groove that can accommodate the immersion liquid 142. The insulating portion 133 abuts against the end plate 1221, that is, the end plate 1221 covers the opening of this groove to form a cavity 141 that stably accommodates the immersion liquid 142, thereby reducing the risk of the immersion liquid 142 invading other components and causing equipment failure. The second adhesive portion 1232 is bonded to the side plate 1222 and the circuit board assembly 130, which can not only stably connect the bracket 122 and the circuit board assembly 130, but also reduce the difficulty of setting the second adhesive portion 1232.

[0073] The insulating part 133 is an insulating colloid. The insulating colloid is applied around the photosensitive area 1322. After the insulating colloid reaches a preset thickness, it is cured. The cured insulating colloid and the photosensitive area 1322 form a groove. The end plate 1221 covers the groove opening to form a cavity 141. Then, the side plate 1222 and the insulating part 133 or the circuit board 131 are connected through the second adhesive part 1232 to form a stable cavity 141.

[0074] Optionally, multiple side plates 1222 are spaced apart along the circumferential direction of the end plate 1221. The second adhesive portion 1232 keeps the end plate 1221 and the insulating portion 133 relatively fixed through the side plates 1222, reducing the risk of leakage of the immersion liquid 142. Alternatively, the side plates 1222 can be continuously extended along the circumferential direction of the end plate 1221. By increasing the connection area of ​​the side plates 1222 and the second adhesive portion 1232, the end plate 1221 and the insulating portion 133 can be stably connected, further reducing the risk of leakage of the immersion liquid 142.

[0075] Optionally, the side plate 1222 extends continuously along the circumferential direction of the end plate 1221. The side plate 1222 surrounding and fitting the outer periphery of the insulating part 133 can extend the sealing path of the bracket 122 and the insulating part 133, thereby improving the sealing reliability of the cavity 141.

[0076] For example, the side panel 1222 can be bonded to the insulating part 133 or the circuit board 131 via the second adhesive part 1232.

[0077] In some embodiments, such as Figure 5 and Figure 6 As shown, the side plate 1222 is arranged around the end plate 1221, and the cavity 141 is located between the end plate 1221 and the photosensitive chip 132.

[0078] In these embodiments, a side plate 1222 is disposed around an end plate 1221 and is connected to a circuit board assembly 130, so that a cavity 141 is formed between the end plate 1221 and the photosensitive chip 132, which helps to increase the size of the cavity 141, reduce the size requirement of the insulation portion 133, and reduce the material cost of the camera module 100.

[0079] Optionally, the insulating portion 133 is disposed around the photosensitive chip 132, the insulating portion 133 is an insulating colloid, and the side plate 1222 is connected to the insulating portion 133 to keep the bracket 122 and the circuit board assembly 130 fixed; or the insulating portion 133 covers the conductive element 135, and the side plate 1222 is connected to the circuit board assembly 130 through a third adhesive portion.

[0080] Optionally, the volume of the cavity 141 can be adjusted by adjusting the size of the side plate 1222 in the first direction X. For example, the size of the side plate 1222 in the first direction X is greater than or equal to 3 mm.

[0081] In some embodiments, such as Figure 5 and Figure 6 As shown, the bracket 122 also includes a connecting hole 124 that penetrates the end plate 1221, and the connecting hole 124 is connected to the cavity 141.

[0082] In these embodiments, the support 122 also includes a through end plate 1221 and a communication hole 124 communicating with the cavity 141, the communication hole 124 facilitating the injection of the immersion liquid 142 into the cavity 141.

[0083] The side plate 1222 and the circuit board assembly 130 are connected to form a cavity 141, and an immersion liquid 142 is injected into the cavity 141 through a connecting hole 124.

[0084] Optionally, the end plate 1221 is provided with two connecting holes 124 at intervals. The two connecting holes 124 are an injection hole and an overflow hole, respectively. After the filter assembly 120 and the insulating part 133 are bonded to form a cavity 141, the immersion liquid 142 is injected into the cavity 141 through the injection hole. The gas in the cavity 141 is discharged through the overflow hole. The immersion liquid 142 is continuously injected until the immersion liquid 142 overflows from the overflow hole. At this time, the immersion liquid 142 fills the cavity 141.

[0085] The specific shape and size of the connecting hole 124 can be flexibly designed. For example, the connecting hole 124 can be a round hole or a square hole.

[0086] Optionally, depending on actual needs, the filling amount of the immersion liquid 142 can be precisely controlled through the connecting hole 124.

[0087] In some embodiments, such as Figure 5 and Figure 6 As shown, the filter assembly 120 also includes a waterproof and breathable membrane 125, which covers the connecting hole 124.

[0088] In these embodiments, a waterproof and breathable membrane 125 covers at least one connecting hole 124 to form one-way waterproofing at the connecting hole 124, preventing the immersion liquid 142 from overflowing into the cavity 141 during subsequent assembly and use of the camera module 100.

[0089] Optionally, both connecting holes 124 are provided with waterproof and breathable membranes 125 to prevent the immersion liquid 142 from overflowing; or the connecting holes 124 are sealed with colloid to prevent the immersion liquid 142 from overflowing.

[0090] Secondly, embodiments of this application provide an electronic device, including a housing and a camera module as described in the first aspect embodiment.

[0091] Since the electronic device provided in the second aspect of this application includes the camera module of any of the embodiments of the first aspect described above, the electronic device provided in the second aspect of this application has the beneficial effects of the camera module of any of the embodiments of the first aspect described above, which will not be repeated here.

[0092] The electronic devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, laptops, televisions, dashcams, and other devices with camera functions.

[0093] The above description is merely a specific implementation of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

Claims

1. A camera module, characterized in that, include: Lens assembly; A filter assembly is disposed on one side of the lens assembly in a first direction, the filter assembly including a filter and a bracket connected to each other; A circuit board assembly is disposed on the side of the filter assembly facing away from the lens assembly. The circuit board assembly includes a circuit board and a photosensitive chip connected to each other. The photosensitive chip is disposed on the side of the circuit board facing the filter. The bracket is connected to the circuit board. A cavity is formed between the photosensitive chip and the filter. An immersion liquid is disposed within the cavity, and the refractive index of the immersion liquid is greater than that of air.

2. The camera module according to claim 1, characterized in that, The photosensitive chip includes a connection area and a photosensitive area, and the orthographic projection of the photosensitive area in the first direction is located within the filter. The circuit board assembly further includes a conductive element and an insulating portion. The conductive element is connected between the connection area and the circuit board, and the insulating portion is disposed in the connection area and a portion of the circuit board, and the insulating portion covers the conductive element.

3. The camera module according to claim 2, characterized in that, The circuit board assembly also includes a waterproof antireflective film covering the photosensitive area.

4. The camera module according to claim 2, characterized in that, The insulating portion is disposed around the photosensitive area, and the insulating portion extends along the first direction and abuts against the bracket to form the cavity. The filter assembly further includes a first adhesive portion, and the end of the insulating portion near the filter is connected to the bracket through the first adhesive portion.

5. The camera module according to claim 2, characterized in that, The bracket includes an end plate and a side plate. The end plate is arranged around the filter, and the side plate is connected to the end plate. The side plate extends along the first direction and is connected to the circuit board assembly.

6. The camera module according to claim 5, characterized in that, The insulating portion is disposed around the photosensitive area, extends along the first direction and abuts against the end plate to form the cavity, and the side plate abuts against the outer peripheral surface of the insulating portion. The filter assembly further includes a second adhesive portion, through which the side plate is connected to the circuit board assembly.

7. The camera module according to claim 5, characterized in that, The side plate is arranged around the end plate, and the cavity is located between the end plate and the photosensitive chip.

8. The camera module according to claim 7, characterized in that, The bracket also includes a connecting hole penetrating the end plate, and the connecting hole communicates with the cavity.

9. The camera module according to claim 8, characterized in that, The filter assembly also includes a waterproof and breathable membrane that covers the communicating hole.

10. An electronic device, characterized in that, It includes the housing and the camera module as described in any one of claims 1-9.

Images