PCB component and wire controller

Abstract

The utility model relates to the technical field of wire controllers, and provides a PCB component and a wire controller, the PCB component comprises a board body, and the board body is provided with a temperature sensor and a plurality of heating devices; wherein the plate body is provided with a heat dissipation structure, and the heat dissipation structure is used for reducing heat transfer between the temperature sensor and the plurality of heating devices. The heat dissipation structure is arranged on the plate body, heat transfer between the temperature sensor and the heating device can be effectively reduced through the heat dissipation structure, the temperature sensor can be prevented from being affected by the heating device, heat interference of the heating device on the temperature sensor can be reduced, and the measurement accuracy and stability of the temperature sensor can be kept; the environment temperature measured by the temperature sensor is closer to reality, and the measurement precision of the temperature sensor is improved.

Description

Technical Field

[0001] This utility model relates to the field of wired controller technology, and in particular to a PCB component and a wired controller. Background Technology

[0002] In related technologies, taking a 3.1-inch TFT air conditioner controller as an example, the PCB board inside the controller is equipped with an NTC (thermistor) temperature sensor. The temperature sensor measures the ambient temperature and sends the data to the air conditioner to adjust the temperature. However, because the temperature sensor is easily affected by surrounding components, the measured value deviates from the actual value. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in related technologies. To this end, this invention proposes a PCB component that facilitates the measurement of ambient temperature by a temperature sensor to be closer to reality, thereby improving the measurement accuracy of the temperature sensor.

[0004] This utility model also proposes a wired controller.

[0005] The PCB component according to the first aspect of the present invention includes:

[0006] The plate body is equipped with a temperature sensor and multiple heating devices;

[0007] The plate is provided with a heat dissipation structure, which is used to reduce heat transfer between the temperature sensor and the multiple heat-generating devices.

[0008] According to the PCB component of this utility model embodiment, the heat dissipation structure on the board can effectively reduce the heat transfer between the temperature sensor and the heat-generating device, help prevent the temperature sensor from being affected by the heat-generating device, reduce the thermal interference caused by the heat-generating device to the temperature sensor, maintain the accuracy and stability of its measurement, make the ambient temperature measured by the temperature sensor closer to the actual temperature, and improve the measurement accuracy of the temperature sensor.

[0009] According to one embodiment of the present invention, the heat dissipation structure includes a first heat dissipation groove, which is formed on the plate and penetrates the plate along the thickness direction.

[0010] The first heat sink is located between the temperature sensor and at least part of the heat-generating device.

[0011] According to one embodiment of the present invention, the first heat dissipation groove is arranged along the length direction of the temperature sensor, and the length of the first heat dissipation groove is greater than the length of the temperature sensor.

[0012] According to one embodiment of the present invention, there are multiple first heat dissipation slots, which are arranged at intervals on the plate.

[0013] According to one embodiment of the present invention, the plurality of heating devices include at least a main control device and a power supply device, the power supply device having a first side and a second side opposite to the first side, the main control device being located on the first side of the power supply device, and the temperature sensor being located on the second side of the power supply device;

[0014] The first heat sink is located between the power supply device and the temperature sensor.

[0015] According to one embodiment of the present invention, the plurality of heating devices further include a touch chip, the touch chip being located on the second side of the power supply device, and a portion of the first heat sink being located between the touch chip and the power supply device.

[0016] According to one embodiment of the present invention, the heat dissipation structure further includes a second heat dissipation groove, which is formed on the plate and penetrates the plate along the thickness direction;

[0017] The second heat sink is located between the first heat sink and the temperature sensor.

[0018] According to one embodiment of the present invention, the second heat dissipation groove is arranged along the length direction of the temperature sensor, and the length of the second heat dissipation groove is greater than the length of the temperature sensor.

[0019] According to one embodiment of the present invention, the second heat dissipation groove has a semi-circular arc structure.

[0020] The wired controller according to a second aspect embodiment of the present invention includes:

[0021] case;

[0022] The PCB component described in the first aspect embodiment above is disposed inside the housing.

[0023] According to one embodiment of the present invention, the housing is provided with ventilation holes, which are arranged close to the location of the temperature sensor.

[0024] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a structural schematic diagram of the PCB component provided in an embodiment of the present invention.

[0027] Figure 2 This is a schematic diagram of the combined structure of the plate, heat dissipation structure and temperature sensor provided in this embodiment of the utility model.

[0028] Figure 3 yes Figure 2 An enlarged schematic diagram of the structure at point A in the middle.

[0029] Figure label:

[0030] 100. Board body; 110. Heat dissipation structure; 111. First heat dissipation slot; 112. Second heat dissipation slot; 120. Through-line recess; 200. Temperature sensor; 300. Main control device; 400. Power supply device; 500. Touch chip; 600. TFT screen interface; 700. Remote control infrared receiver; 800. Touch button. Detailed Implementation

[0031] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0032] In the description of the embodiments of this utility model, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0033] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0034] In this embodiment of the utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0035] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0036] In related technologies, taking a 3.1-inch TFT air conditioner wired controller as an example, an NTC (thermistor) temperature sensor 200 is installed on the PCB board 100 inside the controller. The temperature sensor 200 measures the ambient temperature and sends the data to the air conditioner to adjust the temperature. However, the temperature sensor 200 is easily affected by surrounding components, mainly due to the following influencing factors:

[0037] 1. TFT screen (display device): TFT screen devices generate heat when displaying, for example, related products have a heat generation power of about 500mW.

[0038] 2. The motherboard driving the TFT screen (main control device 300) has a high MCU clock speed because the TFT screen has a large resolution and a large amount of data needs to be transmitted and calculated. This phenomenon is similar to the overheating of a mobile phone.

[0039] 3. Power supply (power device 400): The conversion efficiency of the power supply itself is a factor. For example, if the conversion efficiency is 70%, then the excess 30% will be dissipated as heat.

[0040] 4. Other functional chips, such as the touch chip 500, also generate a certain amount of heat when they are working.

[0041] Therefore, these heating devices will cause the temperature sensor 200 to deviate from the actual value.

[0042] The following is combined with Figures 1 to 3 This application describes a PCB component and a wired controller to address the drawback of the temperature sensor 200 being easily affected by surrounding devices, causing the measured value to deviate from the actual value. In this embodiment, the wired controller is applied to an air conditioner. Of course, in some embodiments, the wired controller can also be applied to devices requiring temperature regulation, such as heaters, etc., and this is not a limitation.

[0043] Reference Figures 1 to 3 According to an embodiment of the present invention, a PCB component includes a board body 100, which is provided with a temperature sensor 200 and a plurality of heat-generating devices; wherein, a heat dissipation structure 110 is provided on the board body 100, which is used to reduce heat transfer between the temperature sensor 200 and the plurality of heat-generating devices.

[0044] According to the PCB component of this utility model embodiment, a heat dissipation structure 110 is provided on the board body 100. The heat dissipation structure 110 can effectively reduce the heat transfer between the temperature sensor 200 and the heat-generating device, help prevent the temperature sensor 200 from being affected by the heat-generating device, reduce the thermal interference caused by the heat-generating device to the temperature sensor 200, maintain its measurement accuracy and stability, make the ambient temperature measured by the temperature sensor 200 closer to the actual temperature, and improve the measurement accuracy of the temperature sensor 200.

[0045] It is understood that in this embodiment of the invention, the wired controller includes a housing and a PCB component, with the PCB component located inside the housing. This structure helps prevent the temperature sensor 200 from being affected by heat-generating devices, reducing thermal interference caused by these devices, maintaining the accuracy and stability of its measurements, and making the ambient temperature measured by the temperature sensor 200 closer to reality, thus improving the measurement accuracy of the temperature sensor 200.

[0046] Specifically, in this embodiment of the invention, a ventilation hole is provided on the housing, and the ventilation hole is arranged close to the location of the temperature sensor 200. In the product structure layout of the wired controller, the ventilation hole provided on the housing allows surrounding air to flow into the interior of the housing, which helps to ensure that the temperature sensor 200 is as close as possible to the actual environment.

[0047] It should be noted that in some embodiments of this utility model, the temperature sensor 200 is located at the lower left of the PCB component board 100, and correspondingly, the ventilation hole is located on the lower left side wall of the housing. Of course, in some embodiments, the temperature sensor 200 can also be located at the lower right of the PCB component board 100, and correspondingly, the ventilation hole is located on the lower right side wall of the housing, achieving the same effect, and is not limited here. Alternatively, in some embodiments, the temperature sensor 200 can be located at other positions on the PCB component board 100, and the position of the ventilation hole can be adjusted accordingly to allow ambient air to flow into the interior of the housing, which helps to ensure that the temperature sensor 200 is as close as possible to the actual environment.

[0048] In this embodiment, there are two ventilation holes, located on two adjacent side walls of the housing. These two ventilation holes allow the temperature sensor 200 to come into contact with the surrounding air, while also promoting heat dissipation. Of course, the number of ventilation holes is not limited here; it can also be one, three, or in some embodiments, the ventilation holes are located on the front of the housing.

[0049] It should also be noted that, in this embodiment, the shell is provided with multiple reinforcing ribs located within the ventilation holes. These reinforcing ribs are spaced apart, and their two ends are connected to the opposite side walls of the ventilation holes. The addition of reinforcing ribs increases the structural strength of the shell, effectively preventing deformation or damage caused by external pressure or vibration.

[0050] It is understood that in this embodiment of the utility model, the plate 100 and the shell are detachably snap-fitted together, which facilitates disassembly and maintenance.

[0051] Understandably, referring to Figures 1 to 3 In this embodiment of the present invention, the heat dissipation structure 110 includes a first heat dissipation groove 111, which is formed on the plate 100 and extends through the plate 100 along the thickness direction. The first heat dissipation groove 111 is located between the temperature sensor 200 and at least part of the heat-generating device.

[0052] With the above structure, by setting a first heat dissipation groove 111 between the temperature sensor 200 and at least part of the heat-generating device, the position of the first heat dissipation groove 111 provides an effective heat dissipation path, so that heat can be directly transferred from the heat-generating device to the environment. The groove can effectively reduce the heat transfer towards the temperature sensor 200, which helps to maintain the stable operating temperature of the temperature sensor 200 and the heat-generating device.

[0053] Specifically, refer to Figures 1 to 3 In this embodiment of the present invention, the first heat dissipation groove 111 is arranged along the length direction of the temperature sensor 200, and the length of the first heat dissipation groove 111 is greater than the length of the temperature sensor 200, which can provide a larger heat dissipation surface area, thereby maximizing the heat transfer to the surrounding environment and improving heat dissipation efficiency.

[0054] Of course, in some embodiments, the length of the first heat sink 111 is less than the length of the temperature sensor 200, or the length of the first heat sink 111 is equal to the length of the temperature sensor 200, which can help reduce the heat transfer between multiple heat-generating devices and the temperature sensor 200.

[0055] Specifically, refer to Figures 1 to 3 In this embodiment of the utility model, the first heat dissipation groove 111 is rectangular, which facilitates mold making; of course, in some embodiments, the first heat dissipation groove 111 can also be other shapes, such as circular, etc., which are not limited here.

[0056] Specifically, refer to Figure 1 and Figure 2 In this embodiment of the invention, there are four first heat dissipation slots 111, which are arranged at intervals on the board 100. Using this structure, multiple heat dissipation paths can be created, effectively increasing the surface area for heat transfer and facilitating faster and more efficient heat dissipation. Simultaneously, the intermittent slots ensure the strength of the PCB board 100 itself, preventing it from breaking during production.

[0057] Of course, in some embodiments, the first heat dissipation groove 111 may be one, two, or five, etc., and there is no limitation here. It should be noted that in this embodiment, the four first heat dissipation grooves 111 are arranged horizontally. Of course, the four first heat dissipation grooves 111 may be arranged along a horizontal straight line or partially staggered.

[0058] It should be noted that in this embodiment of the present invention, the cross-sectional areas of the four first heat dissipation slots 111 are not the same, or the cross-sectional areas of the four first heat dissipation slots 111 are the same. The shape and size of the corresponding first heat dissipation slots 111, as well as the spacing between adjacent first heat dissipation slots 111, can be reasonably set according to the device layout on the board 100, and are not limited here.

[0059] Understandably, referring to Figure 1 In this embodiment of the utility model, the plurality of heating devices include at least a main control device 300 and a power supply device 400. The power supply device 400 has a first side and a second side opposite to the first side. The main control device 300 is located on the first side of the power supply device 400, and the temperature sensor 200 is located on the second side of the power supply device 400. The first heat sink 111 is located between the power supply device 400 and the temperature sensor 200.

[0060] By adopting the above structure, and by rationally arranging multiple heat-generating devices and temperature sensors 200, and placing the first heat sink 111 between the power supply device 400 and the temperature sensor 200, the main heat-generating devices on the PCB board 100 and the temperature sensor 200 are separated by the first heat sink 111, thus optimizing the PCB layout design and enabling the temperature sensor 200 to obtain measurement values ​​that are closer to the actual values.

[0061] It should be noted that, referring to Figure 1 In this embodiment, it can be understood that the first side is the side of the power supply device 400 facing the upper part of the main control device 300, and the second side is the side of the power supply device 400 facing away from the lower part of the main control device 300.

[0062] Specifically, refer to Figure 1 and Figure 2 In this embodiment of the present invention, among the four first heat dissipation slots 111, the structures of the first heat dissipation slots 111 and the power supply device 400 are partially overlapped in the arrangement of the plate 100. This can be understood as, referring to... Figure 1 and Figure 2 Three of the first heat sinks 111 are located directly below the power supply device 400, and another first heat sink 111 is arranged correspondingly to the temperature sensor 200. The temperature sensor 200 further improves the heat dissipation effect, effectively utilizes space, makes the overall structure of the PCB component more compact, helps reduce the size of the PCB component, and makes heat transfer more compact and efficient, thereby improving heat dissipation efficiency. Of course, in some embodiments, when there is only one first heat sink 111, one end of the first heat sink 111 extends above the temperature sensor 200, and the other end extends directly below the power supply device 400; this is not a limitation.

[0063] It should be noted that, in this embodiment of the present invention, the PCB component 100 is further provided with a TFT screen interface 600 for connecting to the TFT screen and a remote control infrared receiver 700 located above the interface. The PCB component 100 has a wire-passing recess 120, which is located between the TFT screen interface 600 and the remote control infrared receiver 700. This not only facilitates wire passing but also aids in heat dissipation. It is understood that, in this embodiment, the end corners of the opposite sidewalls of the wire-passing recess 120 are chamfered to facilitate wire passing and to help prevent damage to the PCB component 100.

[0064] Specifically, refer to Figure 1 In this embodiment of the invention, the multiple heat-generating devices also include a touch chip 500, which is located on the second side of the power supply device 400. A portion of the first heat dissipation groove 111 is located between the touch chip 500 and the power supply device 400. Using this structure, the touch chip 500 can be cooled to a certain extent, improving the heat dissipation effect. This can be understood as referring to... Figure 1 and Figure 2 Of the four first heat sinks 111, one first heat sink 111 located between the touch chip 500 and the power device 400 is located at the end furthest from the temperature sensor 200. Of course, in some embodiments, when there is only one first heat sink 111, one end of the first heat sink 111 extends above the temperature sensor 200 and the other end extends above the touch chip 500, which is not a limitation.

[0065] Understandably, referring to Figures 1 to 3 In this embodiment of the invention, the heat dissipation structure 110 further includes a second heat dissipation groove 112, which is formed on the plate 100 and extends through the plate 100 along its thickness direction. The second heat dissipation groove 112 is located between the first heat dissipation groove 111 and the temperature sensor 200. This structure physically increases the number of heat dissipation paths, minimizing heat transfer to the heat-generating components of the plate 100 and physically separating the temperature sensor 200 as much as possible. This improves the measurement accuracy of the temperature sensor 200, allowing it to obtain a measurement value closer to the actual temperature. This measurement value is then sent to the air conditioning unit, which helps the unit regulate the indoor temperature, providing users with a more comfortable environment.

[0066] Specifically, refer to Figures 1 to 3 In this embodiment of the present invention, the second heat dissipation groove 112 is arranged along the length direction of the temperature sensor 200. The length of the second heat dissipation groove 112 is greater than the length of the temperature sensor 200, which can provide a larger heat dissipation surface area, thereby maximizing the heat transfer to the surrounding environment and improving heat dissipation efficiency.

[0067] Specifically, refer to Figures 1 to 3In this embodiment of the present invention, the second heat dissipation groove 112 has a semi-circular arc structure, which is simple in structure and easy to manufacture. It can be understood that in this embodiment, both ends of the second heat dissipation groove 112 protrude from each end face of the temperature sensor 200 along its length, so as to effectively isolate heat transfer to the temperature sensor 200 and improve the working stability of the temperature sensor 200.

[0068] It should be noted that in this embodiment, the second heat dissipation groove 112 is bent away from the temperature sensor 200. Of course, in some embodiments, the second heat dissipation groove 112 may also be bent towards the temperature sensor 200, which is not limited here. It can also be understood that the above-mentioned second heat dissipation groove 112 is not limited to a semi-circular arc structure, but may also be a rectangular structure, etc.

[0069] It should also be noted that, referring to Figure 1 In this embodiment of the utility model, the board 100 is provided with a plurality of touch buttons 800, and the second heat dissipation groove 112 is located between one of the touch buttons 800 and the temperature sensor 200. The second heat dissipation groove 112 is bent toward the touch button 800. The functional components on the board 100 of the PCB components are reasonably arranged, the layout is optimized, the heat dissipation effect is improved, and the temperature sensor 200 can obtain a measurement value that is closer to the actual value. The measurement value is sent to the air conditioning unit, which helps the air conditioning unit to regulate the indoor temperature and make the user obtain a more comfortable temperature.

[0070] Of course, in some embodiments, the heat dissipation structure 110 is not limited to the first heat dissipation groove 111 and the second heat dissipation groove 112. The heat dissipation structure 110 can also be a cooling fan, a heat sink, etc., as long as it can reduce the heat transfer between the temperature sensor 200 and the heat-generating device.

[0071] Finally, it should be noted that the above embodiments are only used to illustrate the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art should understand that various combinations, modifications, or equivalent substitutions of the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention and should be covered within the scope of the claims of the present invention.

Claims

1. A PCB component, characterized in that, include: The plate body is equipped with a temperature sensor and multiple heating devices; The plate body is provided with a heat dissipation structure, which is used to reduce heat transfer between the temperature sensor and the multiple heat-generating devices; The heat dissipation structure includes a first heat dissipation groove, which is formed on the plate and extends through the plate along the thickness direction. The first heat sink is located between the temperature sensor and at least part of the heat-generating device.

2. The PCB component according to claim 1, characterized in that, The first heat sink is arranged along the length of the temperature sensor, and the length of the first heat sink is greater than the length of the temperature sensor.

3. The PCB component according to claim 2, characterized in that, There are multiple first heat dissipation slots, which are arranged at intervals on the plate.

4. The PCB component according to any one of claims 1 to 3, characterized in that, The plurality of heating devices include at least a main control device and a power supply device, the power supply device having a first side and a second side opposite to the first side, the main control device being located on the first side of the power supply device, and the temperature sensor being located on the second side of the power supply device; The first heat sink is located between the power supply device and the temperature sensor.

5. The PCB component according to claim 4, characterized in that, The plurality of heat-generating devices also include a touch chip located on the second side of the power supply device, and a portion of the first heat sink is located between the touch chip and the power supply device.

6. The PCB component according to claim 5, characterized in that, The heat dissipation structure further includes a second heat dissipation groove, which is formed on the plate and extends through the plate along the thickness direction. The second heat sink is located between the first heat sink and the temperature sensor.

7. The PCB component according to claim 6, characterized in that, The second heat sink is arranged along the length of the temperature sensor, and the length of the second heat sink is greater than the length of the temperature sensor.

8. The PCB component according to claim 7, characterized in that, The second heat dissipation groove has a semi-circular arc structure.

9. A wired controller, characterized in that, include: case; The PCB component according to any one of claims 1 to 8, wherein the PCB component is disposed inside the housing.

10. The wired controller according to claim 9, characterized in that, The housing has ventilation holes, which are located close to the temperature sensor.

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