Pulse modulator

Abstract

The utility model discloses a pulse modulator comprising a housing, a circuit control board, a moving block, a semiconductor chilling plate and a driving mechanism, the housing is internally provided with the circuit control board, the circuit control board is provided with a circuit element and a first heat radiation fin, the moving block is provided with a first heat radiation fin, and the semiconductor chilling plate is provided with a second heat radiation fin. A heat conduction plate is arranged on the side, away from the circuit control board, of the first cooling fin, a moving block is arranged on the heat conduction plate in the length direction of the heat conduction plate in a reciprocating motion mode, a semiconductor chilling plate with the refrigeration face attached to the heat conduction plate is arranged in the moving block, and a power source used for powering on the semiconductor chilling plate is further arranged in the shell. Second heat dissipation fins are arranged on the heating face of the side, away from the heat conduction plate, of the semiconductor chilling plate, a fan with an outward air outlet is arranged on the side, close to the first heat dissipation fins, of the shell, and the driving mechanism is used for driving the movable block to move in a reciprocating mode.

Description

Technical Field

[0001] This utility model relates to the field of pulse modulator technology, specifically to a pulse modulator. Background Technology

[0002] A pulse modulator consists of four parts: a charging power supply section, an energy storage section, a switching section, and a pulse forming section. Pulse modulation has two meanings: it is the process of making the parameters of the pulse itself (amplitude, width, and phase) change according to the signal. When the pulse amplitude changes with the signal, it is called pulse amplitude modulation; when the pulse phase changes with the signal, it is called pulse phase modulation.

[0003] Chinese patent number CN218416339U discloses a high-voltage pulse modulator discharge switch using a reverse-conducting silicon controlled rectifier chip. The device dissipates heat from the inside of the housing by setting a cooling fan at the front end of the housing.

[0004] The applicant discovered the following technical problems when implementing the above-mentioned technical solution:

[0005] The device only dissipates heat from the inside of the housing through a cooling fan, which has a limited heat dissipation effect. When the gate adjustment switch is adjusted to the maximum, the pulse modulator always operates at maximum power. If the heat cannot be dissipated in time, it will affect its working performance.

[0006] Therefore, providing a pulse modulator that combines semiconductor components and a cooling fan for heat dissipation when the pulse modulator needs to operate at high power is a problem that this invention urgently needs to solve. Utility Model Content

[0007] To address the aforementioned technical problems, the purpose of this invention is to overcome the limitations of existing technologies that rely solely on a cooling fan to dissipate heat from the internal casing. In such cases, the heat dissipation effect is limited, and when the gate adjustment switch is adjusted to its maximum, the pulse modulator operates at maximum power continuously, failing to dissipate heat effectively and thus affecting its performance. Therefore, this invention provides a pulse modulator that utilizes a combination of semiconductor components and a cooling fan for heat dissipation, enabling combined cooling when the pulse modulator requires high-power operation.

[0008] To achieve the above objectives, this utility model provides a pulse modulator, which includes: a housing, a circuit control board, a moving block, a semiconductor cooling chip, and a driving mechanism. The circuit control board is disposed inside the housing, and circuit elements and a first heat dissipation fin are disposed on the circuit control board. A heat-conducting plate is disposed on the side of the first heat dissipation fin away from the circuit control board. A moving block is disposed on the heat-conducting plate and is reciprocating along its length. A semiconductor cooling chip with its cooling surface in contact with the heat-conducting plate is disposed inside the moving block. A power supply for energizing the semiconductor cooling chip is also disposed inside the housing. A second heat dissipation fin is disposed on the heating surface of the semiconductor cooling chip away from the heat-conducting plate. A fan with an outward air outlet is disposed on the side of the housing near the first heat dissipation fin. The driving mechanism is used to drive the moving block to reciprocate.

[0009] Preferably, the top of the housing is provided with a gate adjustment switch and an adjustment track corresponding to the gate adjustment switch; the circuit control board includes: an adjustable high-voltage gate circuit, a pulse transformer and a control processor.

[0010] Preferably, the heat-conducting plate is provided with a limiting slide rail along its length on the side away from the circuit control board, and the moving block is provided with a limiting slider adapted to the limiting slide rail on the side away from the second heat dissipation fin.

[0011] Preferably, the driving mechanism includes a drive motor and a lead screw. The drive motor is mounted on the heat-conducting plate, and its output end is coaxially mounted with a lead screw. The lead screw has a horizontal thread that passes through the moving block and is rotatably mounted on the heat-conducting plate.

[0012] Preferably, the movable block has a through hole on the side near the power source that is compatible with the wires on the semiconductor cooling chip.

[0013] Preferably, a filter screen is provided on the outside of the fan.

[0014] Preferably, the circuit control board is further provided with a display module, and the outer side of the housing is provided with a display screen that is electrically connected to the display module.

[0015] Preferably, a primary power connection post is provided on one side of the housing, and a load connection post is provided on the other side; the circuit control board further includes a charging module electrically connected to the primary power connection post.

[0016] According to the above technical solution, the beneficial effects of this utility model compared with the prior art are as follows: When the output power of the pulse modulator is low, we use a driving mechanism to drive the moving block to move to the side of the heat-conducting plate away from the first heat dissipation fin, and the fan dissipates heat from the first heat dissipation fin and the heat-conducting plate. When the output power of the pulse modulator increases to a certain level, in order to ensure that all components of the device can work normally, we use a driving mechanism to drive the moving block to move to the side of the heat-conducting plate close to the first heat dissipation fin. The first heat dissipation fin absorbs heat from the circuit control board to the heat-conducting plate. We power the semiconductor cooling chip through the power supply. Due to the Peltier effect, one side of the semiconductor cooling chip will cool and the other side will heat. The cooling side will quickly dissipate heat from the heat-conducting plate, and the heating side will transfer heat to the second heat dissipation fin. The fan will dissipate heat from the second heat dissipation fin, thereby realizing the selection of appropriate heat dissipation power according to different working states of the pulse modulator to ensure that the pulse modulator can work normally; the power supply can also supply power to other mechanisms such as the circuit control board.

[0017] Other features and advantages of this utility model will be described in detail in the following detailed description section; and all parts not covered in this utility model are the same as or can be implemented using existing technology. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the following detailed description to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0019] Figure 1 This is a perspective view of a pulse modulator provided in a preferred embodiment of the present invention.

[0020] Figure 2 This is a partial plane of a pulse modulator provided in a preferred embodiment of the present invention. Figure 1 .

[0021] Figure 3 This is a partial plane of a pulse modulator provided in a preferred embodiment of the present invention. Figure 2 .

[0022] Figure 4 This is a partial three-dimensional representation of a pulse modulator provided in a preferred embodiment of the present invention. Figure 1 .

[0023] Figure 5 This is a partial three-dimensional representation of a pulse modulator provided in a preferred embodiment of the present invention. Figure 2 .

[0024] Figure 6This is a partial three-dimensional representation of a pulse modulator provided in a preferred embodiment of the present invention. Figure 3 .

[0025] Figure 7 This is a partial plane of a pulse modulator provided in a preferred embodiment of the present invention. Figure 3 .

[0026] Explanation of reference numerals in the attached drawings: 1-Housing; 2-Circuit control board; 201-Circuit element; 202-First heat sink fin; 203-Heat conduction plate; 20301-Limiting slide rail; 3-Moving block; 301-Limiting slider; 302-Perforation; 4-Semiconductor cooling chip; 5-Drive mechanism; 501-Drive motor; 502-Lead screw; 6-Fan; 601-Filter screen; 7-Gate adjustment switch; 8-Adjustment rail; 9-Load connection post; 10-Power connection post; 11-Display screen; 12-Power supply; 13-Second heat sink fin; 14-Wire. Detailed Implementation

[0027] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.

[0028] In the description of the embodiments of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationships commonly used when the utility model product is in use. These are merely for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model. Furthermore, the terms "first," "second," and "third," etc., are only used for distinguishing descriptions and should not be construed as indicating or implying relative importance. Additionally, the terms "horizontal," "vertical," and "suspended," etc., do not indicate that the component is required to be absolutely horizontal or suspended, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0029] In the description of the embodiments of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] To further understand the features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments.

[0031] Reference Figure 1 , Figure 2 , Figure 3 and Figure 6 A pulse modulator includes: a housing 1, a circuit control board 2, a moving block 3, a semiconductor cooling chip 4, and a driving mechanism 5. The housing 1 houses the circuit control board 2, which has circuit elements 201 and a first heat dissipation fin 202. A heat-conducting plate 203 is disposed on the side of the first heat dissipation fin 202 away from the circuit control board 2. A moving block 3 is disposed on the heat-conducting plate 203, which is reciprocally movable along its length. A semiconductor cooling chip 4 with its cooling surface in contact with the heat-conducting plate 203 is disposed inside the moving block 3. A power supply 12 for energizing the semiconductor cooling chip 4 is also disposed inside the housing 1. A second heat dissipation fin 13 is disposed on the heating surface of the semiconductor cooling chip 4 away from the heat-conducting plate 203. A fan 6 with its air outlet facing outward is disposed on the side of the housing 1 near the first heat dissipation fin 202. The driving mechanism 5 drives the moving block 3 to reciprocate.

[0032] When the output power of the pulse modulator is low, the driving mechanism 5 drives the moving block 3 to move to the side of the heat-conducting plate 203 away from the first heat dissipation fin 202. The fan 6 then dissipates heat from the first heat dissipation fin 202 and the heat-conducting plate 203. When the output power of the pulse modulator increases to a certain level, in order to ensure that all components of the device can work normally, the driving mechanism 5 drives the moving block 3 to move to the side of the heat-conducting plate 203 close to the first heat dissipation fin 202. The first heat dissipation fin 202 absorbs heat from the circuit control board 2 and transfers it to the heat-conducting plate 203. The power supply 12 powers the semiconductor cooling chip 4. Due to the Peltier effect, one side of the semiconductor cooling chip 4 cools and the other side heats. The cooling side quickly dissipates heat from the heat-conducting plate 203, and the heating side transfers heat to the second heat dissipation fin 13. The fan 6 then dissipates heat from the second heat dissipation fin 13. This allows for the selection of appropriate heat dissipation power according to different working states of the pulse modulator to ensure that the pulse modulator can work normally. The power supply 12 can also power other mechanisms such as the circuit control board 2.

[0033] Reference Figure 1 The top of the housing 1 is provided with a gate adjustment switch 7 and an adjustment track 8 corresponding to the gate adjustment switch 7; the circuit control board 2 includes: an adjustable high voltage gate circuit, a pulse transformer and a control processor.

[0034] The structure and working principle of the gate adjustment switch 7 electrically connected to the adjustable high voltage gate circuit have been disclosed in Chinese Patent No. CN105846799A.

[0035] Reference Figure 4 and Figure 5 The heat-conducting plate 203 is provided with a limiting slide rail 20301 along its length on the side away from the circuit control board 2, and the moving block 3 is provided with a limiting slider 301 adapted to the limiting slide rail 20301 on the side away from the second heat dissipation fin 13.

[0036] This application uses this design to ensure that the moving block 3 can move stably back and forth on the heat-conducting plate 203.

[0037] Reference Figure 4 The driving mechanism 5 includes a drive motor 501 and a lead screw 502. The drive motor 501 is mounted on the heat-conducting plate 203, and the lead screw 502 is coaxially mounted on its output end. The lead screw 502 is horizontally threaded through the moving block 3 and is rotatably mounted on the heat-conducting plate 203.

[0038] This application achieves stable movement of the moving block 3 by starting the drive motor 501 to drive the lead screw 502 to rotate.

[0039] Reference Figure 2 and Figure 5 The movable block 3 is provided with a through hole 302 on the side near the power supply 12, which is adapted to the wire 14 on the semiconductor cooling chip 4.

[0040] This design allows the wire 14 to pass directly through the through hole 302, preventing the need for bending and pulling, and extending its service life.

[0041] Reference Figure 7 A filter screen 601 is provided on the outside of the fan 6.

[0042] This application uses this design to prevent foreign objects from entering the housing 1 and affecting the normal operation of other mechanisms.

[0043] Reference Figure 1 and Figure 7 The circuit control board 2 is also provided with a display module, and the outer side of the housing 1 is provided with a display screen 11 that is electrically connected to the display module.

[0044] This application, through this design, enables the display screen 11 to intuitively display parameters such as amplitude, pulse width, and phase.

[0045] Reference Figure 1 The housing 1 has a primary power connection post 10 on one side and a load connection post 9 on the other side; the circuit control board 2 also includes a charging module electrically connected to the primary power connection post 10.

[0046] This application enables the charging function of the pulse modulator through this design. The power supply 12 is charged by connecting to the primary power supply through the primary power connection post 10, and the power consumption component is connected through the load connection post 9.

[0047] When the output power of the pulse modulator is low, the device provided by this utility model can be used to move the moving block 3 to the side of the heat-conducting plate 203 away from the first heat dissipation fin 202 via the driving mechanism 5. Then, the fan 6 can dissipate heat from the first heat dissipation fin 202 and the heat-conducting plate 203. When the output power of the pulse modulator increases to a certain level, in order to ensure that all components of the device can work normally, the moving block 3 can be moved to the side of the heat-conducting plate 203 closer to the first heat dissipation fin 202 via the driving mechanism 5. The first heat dissipation fin 202 absorbs the circuit control... The heat from board 2 is transferred to heat conduction plate 203. We power the thermoelectric cooler 4 through power supply 12. Due to the Peltier effect, one side of thermoelectric cooler 4 will cool and the other side will heat. The cooling side will quickly dissipate heat from heat conduction plate 203, and the heating side will transfer heat to the second heat dissipation fin 13. Fan 6 will dissipate heat from the second heat dissipation fin 13, thereby achieving the selection of appropriate heat dissipation power according to the different working states of the pulse modulator to ensure that the pulse modulator can work normally. Power supply 12 can also supply power to other mechanisms such as circuit control board 2.

[0048] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, and these simple modifications all fall within the protection scope of the present invention.

[0049] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable way without contradiction. In order to avoid unnecessary repetition, this utility model will not describe the various possible combinations separately.

[0050] Furthermore, various different embodiments of this utility model can be combined in any way, as long as they do not violate the spirit of this utility model, they should also be regarded as the content disclosed by this utility model.

Claims

1. A pulse modulator, characterized in that, The pulse modulator includes: a housing (1), a circuit control board (2), a moving block (3), a semiconductor cooling chip (4), and a driving mechanism (5). The housing (1) contains the circuit control board (2), which has circuit elements (201) and a first heat dissipation fin (202). A heat-conducting plate (203) is provided on the side of the first heat dissipation fin (202) away from the circuit control board (2). A moving block is provided on the heat-conducting plate (203) that can reciprocate along its length. 3) The moving block (3) is provided with a semiconductor cooling chip (4) whose cooling surface is in contact with the heat-conducting plate (203). The housing (1) is also provided with a power supply (12) for energizing the semiconductor cooling chip (4). The heating surface of the semiconductor cooling chip (4) away from the heat-conducting plate (203) is provided with a second heat dissipation fin (13). The housing (1) is provided with a fan (6) with an outward air outlet on the side near the first heat dissipation fin (202). The driving mechanism (5) is used to drive the moving block (3) to move back and forth.

2. A pulse modulator according to claim 1, characterized in that, The top of the housing (1) is provided with a gate adjustment switch (7) and an adjustment track (8) corresponding to the gate adjustment switch (7); the circuit control board (2) includes: an adjustable high voltage gate circuit, a pulse transformer and a control processor.

3. A pulse modulator according to claim 1, characterized in that, The heat-conducting plate (203) is provided with a limiting slide rail (20301) along its length on the side away from the circuit control board (2), and the moving block (3) is provided with a limiting slider (301) adapted to the limiting slide rail (20301) on the side away from the second heat dissipation fin (13).

4. A pulse modulator according to claim 3, characterized in that, The driving mechanism (5) includes a drive motor (501) and a lead screw (502). The drive motor (501) is mounted on the heat-conducting plate (203), and the lead screw (502) is coaxially mounted on its output end. The lead screw (502) is threaded horizontally through the moving block (3) and is rotatably mounted on the heat-conducting plate (203).

5. A pulse modulator according to claim 1, characterized in that, The movable block (3) has a through hole (302) on the side near the power source (12) that is compatible with the wire (14) on the semiconductor cooling chip (4).

6. A pulse modulator according to claim 1, characterized in that, A filter screen (601) is provided on the outside of the fan (6).

7. A pulse modulator according to claim 1, characterized in that, The circuit control board (2) is also provided with a display module, and the outer side of the housing (1) is provided with a display screen (11) that is electrically connected to the display module.

8. A pulse modulator according to claim 1, characterized in that, The housing (1) has a primary power connection post (10) on one side and a load connection post (9) on the other side; the circuit control board (2) also includes a charging module electrically connected to the primary power connection post (10).

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