Series liquid cooling flow channel for frequency converter

Abstract

The utility model discloses a series liquid cooling flow channel for a frequency converter. The series liquid cooling flow channel comprises a first liquid flow cavity arranged on a liquid cooling plate; the second liquid flow cavity is arranged at the top of the liquid cooling plate and is positioned below the silicon carbide power unit; the third liquid flow cavity is arranged in the liquid cooling plate and is positioned below the capacitor; the fourth liquid flow cavity is arranged at the top of the first placing block and is positioned above the direct-current reactor; the fifth liquid flow cavity is arranged in the liquid cooling plate and is positioned below the rectifier bridge; the sixth liquid flow cavity is arranged at the top of the second placing block and is positioned below the input reactor; the seventh liquid flow cavity is arranged in the liquid cooling plate and is used for allowing the cooling liquid to flow out; and cooling liquid flows in from the cooling liquid inlet, sequentially flows through the plurality of liquid flow cavities which are connected in series and then flows out from the cooling liquid outlet, and is used for cooling the electrical elements according to a sequence of heating values from high to low. According to the utility model, heat dissipation can be carried out on electrical elements on the frequency converter according to the sequence of heat productivity from high to low, and the heat dissipation effect is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic device heat dissipation technical field especially relates to a series liquid cooling runner for frequency converter. BACKGROUND

[0002] With the power of frequency converter bigger and bigger, the heat quantity of each component inside it is also higher and higher, if these heat cannot be dissipated in time, the frequency converter will heat and alarm and stop. The frequency converter often adopts the form of air cooling heat dissipation to dissipate heat, but the air cooling heat dissipation is greatly influenced by outside temperature, and the heat dissipation effect is unstable, and the frequency converter is easy to malfunction due to overheating, in order to improve the efficiency of air cooling heat dissipation, it is necessary to use high-power centrifugal fan, and the bigger the power of centrifugal fan is, the bigger its volume is, so the volume of frequency converter is bigger and bigger, not only occupies space, but also increases cost. Therefore, the application provides a series liquid cooling runner for frequency converter to solve the problems of the heat dissipation device of the existing frequency converter, such as big volume, occupying space, poor heat dissipation effect and unstable heat dissipation effect. SUMMARY

[0003] In view of the above defects or deficiencies in the prior art, it is expected to provide a series liquid cooling runner for frequency converter, which can dissipate heat to electrical elements on the frequency converter in order from high to low heat quantity, and improve the heat dissipation effect.

[0004] The utility model provides a series liquid cooling runner for frequency converter, the frequency converter includes liquid cooling board and electrical element, the top of liquid cooling board is integrally formed with first placing block and second placing block, the electrical element includes support capacitor and direct current reactor installed in first placing block, input reactor installed in second placing block, silicon carbide power unit and rectifier bridge installed on the top of liquid cooling board, silicon carbide power unit, support capacitor, direct current reactor, rectifier bridge and input reactor are arranged in descending order of heat quantity, characterized by, the liquid cooling runner includes:

[0005] First liquid flow cavity for cooling liquid inflow is arranged in liquid cooling board;

[0006] Second liquid flow cavity for dissipating heat to silicon carbide power unit is arranged on the top of liquid cooling board below silicon carbide power unit;

[0007] Third liquid flow cavity for dissipating heat to support capacitor is arranged in liquid cooling board below capacitor;

[0008] Fourth liquid flow cavity for dissipating heat to direct current reactor is arranged on the top of first placing block above direct current reactor;

[0009] A fifth liquid flow cavity is arranged in the liquid cooling plate below the rectifier bridge for heat dissipation of the rectifier bridge;

[0010] A sixth liquid flow cavity is arranged in the second placement block below the input reactor for heat dissipation of the input reactor;

[0011] A seventh liquid flow cavity is arranged in the liquid cooling plate for outflow of the cooling liquid;

[0012] The first liquid flow cavity, the second liquid flow cavity, the third liquid flow cavity, the fourth liquid flow cavity, the fifth liquid flow cavity, the sixth liquid flow cavity and the seventh liquid flow cavity are connected in series;

[0013] One end of the first liquid flow cavity is communicated with a cooling liquid inlet arranged on the liquid cooling plate, and one end of the seventh liquid flow cavity is communicated with a cooling liquid outlet arranged on the liquid cooling plate; the cooling liquid flows in from the cooling liquid inlet, sequentially flows through the first liquid flow cavity, the second liquid flow cavity, the third liquid flow cavity, the fourth liquid flow cavity, the fifth liquid flow cavity, the sixth liquid flow cavity and the seventh liquid flow cavity, and then flows out from the cooling liquid outlet, for heat dissipation of the electrical elements in order of heat generation from high to low; wherein,

[0014] The seventh liquid flow cavity is below the input reactor for heat dissipation of the input reactor;

[0015] The cooling liquid inlet and the cooling liquid outlet are arranged on the same side of the liquid cooling plate.

[0016] Preferably, a first liquid outlet is arranged at one end of the first liquid flow cavity away from the cooling liquid inlet, and a first liquid inlet is arranged at one end of the third liquid flow cavity, and the first liquid outlet and the first liquid inlet are both communicated with the second liquid flow cavity;

[0017] A second liquid outlet is arranged at the other end of the third liquid flow cavity, and a second liquid inlet is arranged at one end of the fifth liquid flow cavity, and the second liquid outlet and the second liquid inlet are both communicated with the fourth liquid flow cavity;

[0018] A third liquid outlet is arranged at the other end of the fifth liquid flow cavity, and a third liquid inlet is arranged at one end of the seventh liquid flow cavity away from the cooling liquid outlet, and the third liquid outlet and the third liquid inlet are both communicated with the sixth liquid flow cavity.

[0019] Preferably, a first flow guide channel and a second flow guide channel are arranged in the first placement block on both sides of the fourth liquid flow cavity and communicated with the fourth liquid flow cavity, the first flow guide channel is communicated with the second liquid outlet, and the second flow guide channel is communicated with the second liquid inlet;

[0020] The third flow guide channel and the fourth flow guide channel are arranged on both sides of the sixth liquid flow cavity in the second placing block, the third flow guide channel is communicated with the third liquid outlet, and the fourth flow guide channel is communicated with the third liquid inlet.

[0021] Preferably, the first placing block is provided with a first placing cavity for mounting the support capacitor and a second placing cavity for mounting the direct-current reactor, and the second placing block is provided with a third placing cavity for mounting the input reactor.

[0022] Preferably, the first liquid flow cavity is provided with a chamfer at one end close to the cooling liquid inlet, and the seventh liquid flow cavity is provided with a chamfer at one end close to the cooling liquid outlet.

[0023] Compared with the prior art, the utility model has the beneficial effects that:

[0024] The utility model discloses a first liquid flow cavity, a second liquid flow cavity, a third liquid flow cavity, a fifth liquid flow cavity and a seventh liquid flow cavity arranged on the liquid cooling plate, a fourth liquid flow cavity arranged on the first placing block and a sixth liquid flow cavity arranged on the second placing block, the first liquid flow cavity, the second liquid flow cavity, the third liquid flow cavity, the fourth liquid flow cavity, the fifth liquid flow cavity, the sixth liquid flow cavity and the seventh liquid flow cavity are connected in series according to the heat generation of electrical components from high to low, cooling liquid flows in from the cooling liquid inlet, and flows through the first liquid flow cavity, the second liquid flow cavity, the third liquid flow cavity, the fourth liquid flow cavity, the fifth liquid flow cavity, the sixth liquid flow cavity and the seventh liquid flow cavity in turn according to the heat generation of electrical components from high to low, and then flows out from the cooling liquid outlet, in the flowing process, the second liquid flow cavity is used for radiating the silicon carbide power unit, the third liquid flow cavity is used for radiating the capacitor, the fourth liquid flow cavity is used for radiating the direct-current reactor, the fifth liquid flow cavity is used for radiating the rectifier bridge, and the sixth liquid flow cavity and the seventh liquid flow cavity are used for radiating the input reactor, the series liquid cooling flow channel of the application radiates the electrical components according to the heat generation from high to low through the connected liquid flow cavities, the problem of too large temperature difference of the liquid flow cavity is avoided, and the radiating effect is improved, the liquid flow cavity is directly arranged on the liquid cooling plate, the liquid cooling radiating device is smaller than the traditional air cooling radiating device, the liquid cooling radiating is less influenced by the external environment, and the radiating effect is better and more stable.

[0025] It should be understood that the content described in the utility model part is not intended to limit the key or important features of the embodiments of the utility model, nor is it intended to limit the scope of the utility model. Other features of the utility model will become apparent through the following description. BRIEF DESCRIPTION OF DRAWINGS

[0026] Other features, objects and advantages of the utility model will become more apparent through reading the detailed description of the non-limiting embodiments made with reference to the following drawings:

[0027] Figure 1 is a perspective view of the utility model;

[0028] Figure 2 is a front view of the utility model;

[0029] Figure 3 is a top view of the utility model;

[0030] Figure 4 is a structure schematic view of installing electrical components of the utility model;

[0031] Reference signs in the drawing: 1, liquid cooling plate; 2, first placing block; 3, second placing block; 4, silicon carbide power unit; 5, supporting capacitor; 6, direct current reactor; 7, rectifier bridge; 8, input reactor;

[0032] 11, first liquid flow cavity; 12, second liquid flow cavity; 13, third liquid flow cavity; 14, fourth liquid flow cavity; 15, fifth liquid flow cavity; 16, sixth liquid flow cavity; 17, seventh liquid flow cavity; 18, cooling liquid inlet; 19, cooling liquid outlet;

[0033] 21, first flow guide channel; 22, second flow guide channel;

[0034] 31, third flow guide channel; 32, fourth flow guide channel;

[0035] 111, first liquid outlet;

[0036] 131, first liquid inlet; 132, second liquid outlet;

[0037] 151, second liquid inlet; 152, third liquid outlet;

[0038] 171, third liquid inlet. DETAILED DESCRIPTION

[0039] The utility model will be further explained in detail below by combining with the drawings and embodiments. It can be understood that the specific embodiments described here are only used to explain the related utility model, and not limit the utility model. In addition, it needs to be explained that, for the convenience of description, only the parts related to the utility model are shown in the drawings.

[0040] It needs to be explained that, in the case of no conflict, the embodiments in the utility model and the features in the embodiments can be combined with each other. The utility model will be explained in detail below by combining with the drawings and embodiments.

[0041] Please refer to Figures 1-4The utility model discloses a series liquid cooling flow channel for frequency converter, wherein the frequency converter comprises a liquid cooling plate 1 and electrical elements arranged on the top of the liquid cooling plate 1, wherein the top of the liquid cooling plate 1 is integrally formed with a first placing block 2 and a second placing block 3, the electrical elements comprise a support capacitor 5 and a direct-current reactor 6 installed in the first placing block 2, an input reactor 8 installed in the second placing block 3, a silicon carbide power unit 4 and a rectifier bridge 7 installed on the top of the liquid cooling plate 1, and the silicon carbide power unit 4, the support capacitor 5, the direct-current reactor 6, the rectifier bridge 7 and the input reactor 8 are arranged in descending order of heat generation;

[0042] Specifically, the heat generation and the sensitivity to temperature of the silicon carbide power unit 4, the support capacitor 5, the direct-current reactor 6, the rectifier bridge 7 and the input reactor 8 are simulated in the heat dissipation simulation software, and according to the simulation data, it is known that the heat generation of the silicon carbide power unit 4 is the largest, followed by the support capacitor 5, and then the direct-current reactor 6, the rectifier bridge 7 and the input reactor 8 in turn, so the silicon carbide power unit 4, the support capacitor 5, the direct-current reactor 6, the rectifier bridge 7 and the input reactor 8 are cooled in the order from high to low of the heat generation of the electrical elements;

[0043] Preferably, the series liquid cooling flow channel comprises a first liquid flow cavity 11, a second liquid flow cavity 12, a third liquid flow cavity 13, a fourth liquid flow cavity 14, a fifth liquid flow cavity 15, a sixth liquid flow cavity 16 and a seventh liquid flow cavity 17, the first liquid flow cavity 11 is arranged in the liquid cooling plate 1 and is used for flowing in the cooling liquid;

[0044] The second liquid flow cavity 12 is arranged below the silicon carbide power unit 4 on the top of the liquid cooling plate 1 and is used for cooling the silicon carbide power unit 4; specifically, the second liquid flow cavity 12 is arranged on the inner top of the liquid cooling plate 1, and the silicon carbide power unit 4 is fixedly connected to the outer top of the liquid cooling plate 1 through bolts, and the cylindrical pin of the silicon carbide power unit 4 is embedded into the second liquid flow cavity 12;

[0045] The third liquid flow cavity 13 is arranged below the support capacitor 5 in the liquid cooling plate 1 and is used for cooling the support capacitor 5; preferably, the first placing block 2 is provided with a first placing cavity for installing the support capacitor 5; specifically, the support capacitor 5 is embedded into the first placing cavity and is fixed after embedding;

[0046] The fourth liquid flow cavity 14 is arranged above the direct-current reactor 6 on the top of the first placing block 2 and is used for cooling the direct-current reactor 6; preferably, the first placing block 2 is provided with a second placing cavity for installing the direct-current reactor 6; specifically, the direct-current reactor 6 is embedded into the second placing cavity and is also fixed after embedding;

[0047] The fifth liquid flow cavity 15 is arranged in the liquid cooling plate 1 below the rectifier bridge 7 and is used for heat dissipation of the rectifier bridge 7; specifically, the rectifier bridge 7 is fixed on the top of the liquid cooling plate 1 and corresponds to the position of the fifth liquid flow cavity 15;

[0048] The sixth liquid flow cavity 16 is arranged on the top of the second placing block 2 below the input reactor 8 and is used for heat dissipation of the input reactor 8; preferably, the third placing cavity for mounting the input reactor 8 is arranged on the second placing block 3; specifically, the input reactor 8 is embedded into the third placing cavity and is fixed by pouring the heat-conducting glue after embedding;

[0049] The seventh liquid flow cavity 17 is arranged in the liquid cooling plate 1 below the input reactor 8 and is used for outflow of the cooling liquid and heat dissipation of the input reactor 8;

[0050] Preferably, the first liquid flow cavity 11, the second liquid flow cavity 12, the third liquid flow cavity 13, the fourth liquid flow cavity 14, the fifth liquid flow cavity 15, the sixth liquid flow cavity 16 and the seventh liquid flow cavity 17 are connected in series;

[0051] One end of the first liquid flow cavity 11 is communicated with the cooling liquid inlet 18 arranged on the liquid cooling plate 1, and one end of the seventh liquid flow cavity 17 is communicated with the cooling liquid outlet 19 arranged on the liquid cooling plate 1; the cooling liquid flows into from the cooling liquid inlet 18, sequentially flows through the first liquid flow cavity 11, the second liquid flow cavity 12, the third liquid flow cavity 13, the fourth liquid flow cavity 14, the fifth liquid flow cavity 15, the sixth liquid flow cavity 16 and the seventh liquid flow cavity 17, and then flows out from the cooling liquid outlet 19, which is used for heat dissipation of the electrical elements in the order from high to low; wherein,

[0052] The seventh liquid flow cavity 17 is arranged below the input reactor 8 and is used for heat dissipation of the input reactor 8; the sixth liquid flow cavity 17 and the seventh liquid flow cavity 17 both heat dissipate the input reactor 8;

[0053] The cooling liquid inlet 18 and the cooling liquid outlet 19 are arranged on the same side of the liquid cooling plate 1; specifically, the cooling liquid inlet 18 and the cooling liquid outlet 19 are both connected with an external container containing the cooling liquid, so as to realize the circulation of the cooling liquid; and the cooling liquid inlet 18 and the cooling liquid outlet 19 are both arranged on the side edge of the same side of the liquid cooling plate 1, so that the first liquid flow cavity 11, the second liquid flow cavity 12, the third liquid flow cavity 13, the fourth liquid flow cavity 14, the fifth liquid flow cavity 15, the sixth liquid flow cavity 16 and the seventh liquid flow cavity are connected in series like a three-dimensional ring, which reduces the space of the layout of the liquid flow cavities compared with the linear series connection mode;

[0054] When dissipating heat, the cooling liquid flows in from the cooling liquid inlet 18, flows through the first liquid flow cavity 11, the second liquid flow cavity 12, the third liquid flow cavity 13, the fourth liquid flow cavity 14, the fifth liquid flow cavity 15, the sixth liquid flow cavity 16 and the seventh liquid flow cavity 17 in turn according to the order of the heat generated by the electrical components from high to low, and then flows out from the cooling liquid outlet 19, in the process of flowing, the silicon carbide power unit 4, the support capacitor 5, the direct-current reactor 6, the rectifier bridge 7 and the input reactor 8 are cooled according to the order of the heat generated from high to low, so that the problem of too large temperature difference between liquid flow cavities is avoided, and the heat dissipation effect is improved; the plurality of liquid flow cavities are directly arranged on the liquid cooling plate 1, so that the volume of the heat dissipation device is reduced compared with the traditional air cooling heat dissipation device; and the liquid cooling heat dissipation is less affected by the external environment, and the heat dissipation effect is better and more stable.

[0055] In a preferred embodiment, as shown in Figure 3 the first liquid flow cavity 11 is provided with a first liquid outlet 111 at one end away from the cooling liquid inlet 18, and the third liquid flow cavity 13 is provided with a first liquid inlet 131 at one end, and the first liquid outlet 111 and the first liquid inlet 131 are both in communication with the second liquid flow cavity 12;

[0056] the other end of the third liquid flow cavity 13 is provided with a second liquid outlet 132, and one end of the fifth liquid flow cavity 15 is provided with a second liquid inlet 151, and the second liquid outlet 132 and the second liquid inlet 151 are both in communication with the fourth liquid flow cavity 14;

[0057] the other end of the fifth liquid flow cavity 15 is provided with a third liquid outlet 152, and one end of the seventh liquid flow cavity 17 away from the cooling liquid outlet 19 is provided with a third liquid inlet 171, and the third liquid outlet 152 and the third liquid inlet 171 are both in communication with the sixth liquid flow cavity 16.

[0058] Preferably, the first placing block 2 is provided with a first flow guide channel 21 and a second flow guide channel 22 in communication with the fourth liquid flow cavity 14 on both sides thereof, the first flow guide channel 21 is in communication with the second liquid outlet 132, and the second flow guide channel 22 is in communication with the second liquid inlet 151; specifically, the first flow guide channel 21, the fourth liquid flow cavity 14 and the second flow guide channel 22 are in communication in a "U" shape, the cooling liquid flowing out of the second liquid outlet 132 flows into the first flow guide channel 21, then flows into the fourth liquid flow cavity 14 from bottom to top in the first flow guide channel 21, flows into the second flow guide channel 22 from top to bottom after passing through the fourth liquid flow cavity 14, and then flows into the fifth liquid flow cavity 15 from the second liquid inlet 151 after passing through the second flow guide channel 22;

[0059] Preferably, the second placing block 3 is provided with a third flow channel 31 and a fourth flow channel 32 on both sides of the sixth liquid flow cavity 16, the third flow channel 31 is in communication with the third liquid outlet 152, and the fourth flow channel 32 is in communication with the third liquid inlet 171. Specifically, the third flow channel 31, the sixth liquid flow cavity 16 and the fourth flow channel 32 are in communication in a "U" shape, the cooling liquid flowing out of the third liquid outlet 152 flows into the third flow channel 31, then flows into the sixth liquid flow cavity 16 from bottom to top in the third flow channel 31, flows into the fourth flow channel 32 from top to bottom after passing through the sixth liquid flow cavity 16, and flows into the seventh liquid flow cavity 17 from the third liquid inlet 171 after passing through the fourth flow channel 32.

[0060] Preferably, the first liquid flow cavity 11 is provided with a chamfer at one end close to the cooling liquid inlet 18, and the seventh liquid flow cavity is provided with a chamfer at one end close to the cooling liquid outlet 19. Specifically, the chamfer is used to guide the cooling liquid to flow into the first liquid flow cavity 11 and flow out of the seventh liquid flow cavity 17.

[0061] It should be noted that the liquid cooling flow channel in the present application can also be used for heat dissipation of other heat-generating electrical components, and is not limited to heat dissipation of the silicon carbide power unit 4, the support capacitor 5, the direct-current reactor 6, the rectifier bridge 7 and the input reactor 8. Other electrical components that need to be cooled are installed in the corresponding liquid flow cavity in order of heat generation from high to low. When cooling, the cooling liquid flows in the liquid flow cavities arranged in series in order of heat generation from high to low, thereby better cooling the electrical components.

[0062] In the description of the present application, the terms "connection", "installation", "fixation" and the like should be understood in a broad sense, for example, "connection" can be fixed connection, can also be detachable connection, or integrally connected; can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0063] In the description of the present application, the terms "one embodiment", "some embodiments" and the like mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0064] The above merely provides preferred embodiments of the present application, and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the principles and technical scope of the present application shall fall into the scope of the present application.

Claims

1. A series liquid cooling flow channel for a frequency converter, the frequency converter comprising a liquid cooling plate and electrical elements, a first placement block and a second placement block being integrally formed on a top of the liquid cooling plate, the electrical elements comprising a support capacitor and a DC reactor installed in the first placement block, an input reactor installed in the second placement block, a silicon carbide power unit and a rectifier bridge installed on the top of the liquid cooling plate, the silicon carbide power unit, the support capacitor, the DC reactor, the rectifier bridge and the input reactor being arranged in descending order of heat generation, characterized in that, The liquid cooling flow channel comprises: a first liquid flow cavity provided in the liquid cooling plate for the cooling liquid to flow in; a second liquid flow cavity provided on the top of the liquid cooling plate below the silicon carbide power unit for heat dissipation of the silicon carbide power unit; a third liquid flow cavity provided in the liquid cooling plate below the capacitor for heat dissipation of the support capacitor; a fourth liquid flow cavity provided on the top of the first placement block above the DC reactor for heat dissipation of the DC reactor; a fifth liquid flow cavity provided in the liquid cooling plate below the rectifier bridge for heat dissipation of the rectifier bridge; a sixth liquid flow cavity provided on the top of the second placement block below the input reactor for heat dissipation of the input reactor; a seventh liquid flow cavity provided in the liquid cooling plate for the cooling liquid to flow out; the first liquid flow cavity, the second liquid flow cavity, the third liquid flow cavity, the fourth liquid flow cavity, the fifth liquid flow cavity, the sixth liquid flow cavity and the seventh liquid flow cavity are connected in series; one end of the first liquid flow cavity is communicated with a cooling liquid inlet provided on the liquid cooling plate, and one end of the seventh liquid flow cavity is communicated with a cooling liquid outlet provided on the liquid cooling plate; the cooling liquid flows in from the cooling liquid inlet, sequentially flows through the first liquid flow cavity, the second liquid flow cavity, the third liquid flow cavity, the fourth liquid flow cavity, the fifth liquid flow cavity, the sixth liquid flow cavity and the seventh liquid flow cavity, and then flows out from the cooling liquid outlet, for heat dissipation of the electrical elements in the order from high to low according to the heat generation; the seventh liquid flow cavity is below the input reactor for heat dissipation of the input reactor; the cooling liquid inlet and the cooling liquid outlet are provided on the same side of the liquid cooling plate.

2. The series liquid cooling flow channel for a frequency converter according to claim 1, characterized in that, a first liquid outlet is provided at one end of the first liquid flow cavity away from the cooling liquid inlet, a first liquid inlet is provided at one end of the third liquid flow cavity, and the first liquid outlet and the first liquid inlet are both communicated with the second liquid flow cavity; a second liquid outlet is provided at the other end of the third liquid flow cavity, a second liquid inlet is provided at one end of the fifth liquid flow cavity, and the second liquid outlet and the second liquid inlet are both communicated with the fourth liquid flow cavity; a third liquid outlet is provided at the other end of the fifth liquid flow cavity, and a third liquid inlet is provided at one end of the seventh liquid flow cavity away from the cooling liquid outlet, and the third liquid outlet and the third liquid inlet are both communicated with the sixth liquid flow cavity.

3. The series liquid cooling flow channel for a frequency converter according to claim 2, characterized in that, first and second flow guide channels are provided in the first placement block on both sides of the fourth liquid flow cavity and communicated with the fourth liquid flow cavity, the first flow guide channel is communicated with the second liquid outlet, and the second flow guide channel is communicated with the second liquid inlet; third and fourth flow guide channels are provided in the second placement block on both sides of the sixth liquid flow cavity and communicated with the sixth liquid flow cavity, the third flow guide channel is communicated with the third liquid outlet, and the fourth flow guide channel is communicated with the third liquid inlet.

4. The series liquid cooling flow channel for a frequency converter according to claim 1, wherein The first placement block is provided with a first placement cavity for mounting the support capacitor and a second placement cavity for mounting the DC reactor, and the second placement block is provided with a third placement cavity for mounting the input reactor.

5. The series liquid cooling flow channel for a frequency converter according to claim 1, wherein The first liquid flow cavity is provided with a chamfer near one end of the cooling liquid inlet, and the seventh liquid flow cavity is provided with a chamfer near one end of the cooling liquid outlet.

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