Fin radiator coupled with latent heat energy storage

Abstract

The utility model discloses a finned radiator coupled with latent heat energy storage. The finned radiator comprises a radiator substrate, a heat conduction material, a radiator cover plate and radiating fins, one side of the heat conduction material is connected with the to-be-cooled chip, and the other side of the heat conduction material is embedded in the bottom of the radiator substrate and used for transversely expanding heat of the to-be-cooled chip to the radiator substrate; the radiator substrate is of a hollow structure, a foamy copper framework filled with phase change energy storage materials is arranged in the radiator substrate, and the upper portion of the radiator substrate is connected with the radiator cover plate. A passive energy storage scheme is introduced for chip power consumption fluctuation through a phase change energy storage material, so that the thermal failure risk is reduced, and the inherent safety is improved; therefore, the calculation burden of CPU temperature control adjustment is reduced, system control and calculation resources are saved, and the product service performance is improved. Meanwhile, foamy copper is used as a phase change energy storage material framework, so that the heat diffusion uniformity in the substrate of the heat dissipation module is effectively improved, the heat dissipation heat resistance of the substrate is reduced, the cost is low, and the heat dissipation efficiency is high.

Description

Technical Field

[0001] This application relates to the field of heat sinks, and more specifically to a finned heat sink that couples latent heat storage. Background Technology

[0002] Currently, most air-cooled heat dissipation solutions for electronic devices use either ordinary extruded aluminum heat sinks or a combination of heat pipe heat sinks and fans. Thermal optimization mainly focuses on improving the heat sink's structural design to reduce air resistance, optimizing its thermal conductivity to improve temperature uniformity, and optimizing fan speed curves to enhance the cooling effect of forced air-cooled devices, thereby achieving temperature control targets and further optimizing noise and energy efficiency. Furthermore, the combined design of heat sinks and fans needs to handle the maximum instantaneous heat generated by the electronic chip during operation, often requiring over-configuration of either the heat sink or fan to meet the cooling demands of extreme operating conditions. In current high-performance electronic devices, such as high-end servers and data center switches, the massive heat pipe heat sinks equipped with the internal main chips occupy most of the internal space to meet cooling requirements, significantly restricting the layout design of core functional modules and limiting the miniaturization and weight reduction of the devices.

[0003] However, electronic devices do not always operate at full capacity. Depending on the business characteristics, the heat generated by electronic devices will vary. In particular, the ASICs of data center switches that currently carry large AIGC model training network traffic exhibit obvious periodic peaks and troughs in business characteristics. Cooling fans and heat sinks configured according to the heat generation during business peaks have significant problems in terms of heat dissipation energy consumption, wind noise, and encroachment on the internal space of the chassis. Utility Model Content

[0004] To address the aforementioned issues, this application proposes a finned heat sink with coupled latent heat storage, comprising: a heat sink substrate, a thermally conductive material, a heat sink cover plate, and heat dissipation fins; one side of the thermally conductive material is connected to the chip to be cooled, and the other side is embedded in the bottom of the heat sink substrate, for laterally extending the heat from the chip to be cooled to the heat sink substrate; the heat sink substrate has a hollow structure, and its interior is a foamed copper skeleton filled with phase change energy storage material, and the top of the heat sink substrate is connected to the heat sink cover plate; heat dissipation fins are disposed on the heat sink cover plate.

[0005] In one example, the thermally conductive material is a heat pipe.

[0006] In one example, the heat pipe and the substrate heat-conducting groove are filled with an interface material for welding.

[0007] In one example, the heat pipe and the chip to be cooled are connected by an interface material.

[0008] In one example, the foamed copper skeleton is brazed into the hollow cavity of the radiator substrate.

[0009] In one example, the thermally conductive material is a VC vapor chamber.

[0010] In one example, the heat sink substrate is welded to the heat sink cover.

[0011] The method proposed in this application can bring the following beneficial effects: by introducing a passive energy storage solution for chip power consumption fluctuations through phase change energy storage materials, the risk of thermal failure is reduced, and inherent safety is improved; thereby reducing the computational burden of CPU temperature control and regulation, saving system control and computing resources, and improving product performance. At the same time, using copper foam as the framework of phase change energy storage materials effectively improves the uniformity of heat diffusion within the heat dissipation module substrate, reduces the substrate's thermal resistance, and is low in cost and high in heat dissipation efficiency. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0013] Figure 1 This is a schematic diagram of the installation of a finned heat sink according to an embodiment of this application;

[0014] Figure 2 This is a simplified structural diagram of a finned heat sink according to an embodiment of this application;

[0015] Figure 3 This is a schematic diagram of a specific structure of a finned heat sink in an embodiment of this application;

[0016] Figure 4 This is a schematic diagram of the installation of a thermally conductive material embedded in a heat sink substrate according to an embodiment of this application.

[0017] Among them, 1. Finned heat sink, 2. Chip to be cooled, 3. PCB board, 4. Heat sink substrate, 5. Heat sink cover plate, 6. Heat sink fins, 7. Thermally conductive material, 8. Foamed copper skeleton filled with phase change energy storage material, and 9. Interface material. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] The technical solutions provided by the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0020] like Figure 1 The diagram shows the installation of a coupled latent heat storage heat pipe finned heat sink 1 for chip cooling. The installation method is consistent with that of a traditional heat pipe finned heat sink 1, which can minimize replacement costs and maintain the same maintenance and engineering installation convenience as traditional heat sinks. An appropriate interface material 9 (such as thermal grease, thermal adhesive, or thermal pad) can be selected between the chip 2 (e.g., IC chip) to be cooled on the PCB board 3 and the heat sink substrate 4 to reduce the interface thermal resistance between the chip and the heat sink module.

[0021] Figure 2 This is a simplified structural diagram of the coupled latent heat storage heat pipe finned heat sink 1. Similar to a regular finned heat sink 1, the heat generated by the chip diffuses laterally in the substrate and then undergoes heat exchange through the heat dissipation fins 6 arranged above the substrate under the action of forced airflow driven by the fan. The heat dissipation fins 6 are welded to the heat sink cover plate 5.

[0022] Figure 3 This paper presents a detailed exploded view of a finned heat sink 1 with coupled latent heat storage proposed in this application. The heat dissipation module provided in this application mainly includes a heat sink base plate 4, a thermally conductive material 7, a foamed copper skeleton filled with phase change energy storage material, heat dissipation fins 6, and a heat sink cover plate 5. The biggest difference from ordinary heat sinks is that the heat sink base plate 4 of this application adopts a hollow structure, with a foamed copper skeleton 8 filled with phase change energy storage material inside. In the actual manufacturing process, the foamed copper skeleton can be welded to the hollow cavity of the base plate by various methods such as brazing. Using foamed copper as the skeleton of phase change energy storage material can effectively improve the thermal diffusivity of the base plate and reduce the thermal resistance of the heat sink. In addition, the phase change energy storage material filled inside the hollow structure of the foamed copper can better support the phase change energy storage material during the solid-liquid phase change process, and avoid the internal flow of the lower phase change energy storage material after liquefaction, which would affect the phase change energy storage effect. The heat of the heat sink is similar to that of a traditional heat sink, and the heat is finally exchanged with the airflow through the heat dissipation fins 6.

[0023] The heat sink base plate 4 has heat-conducting grooves and embedded heat-conducting material 7, and its specific installation method is as follows: Figure 4 As shown. It should be noted that, Figure 4 The heat sink substrate 4 described herein is the bottom surface of the substrate. A rectangular interface material 9 is provided above the thermally conductive material 7 for heat exchange with the chip 2 to be cooled. Embedded thermal conductivity can improve the lateral heat diffusion efficiency within the heat sink substrate 4, thereby enhancing the energy storage and fin heat dissipation efficiency of the heat sink module. This example... Figure 4An embedded heat pipe solution is provided. Specifically, the form and structure of the embedded heat pipe can be optimized according to the heat dissipation requirements. In extreme heat dissipation conditions, a VC heat sink can be used to replace the embedded heat pipe. The embedded heat pipe and the heat conduction groove of the substrate are filled with a low thermal resistance interface material for welding. The heat sink substrate 4 is welded to the heat sink cover plate 5.

[0024] To address the shortcomings of existing heat pipe finned heat sink modules in heat dissipation of high-performance chips carrying cyclical business, this application proposes a novel finned heat sink module with coupled latent heat storage, which can be applied to the aforementioned invention CN202311769223.X. It can achieve more convenient industrial production while effectively reducing the thermal resistance of the heat sink, and improve the economy and engineering of the heat sink design.

[0025] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0026] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A finned heat sink with coupled latent heat storage, characterized in that, include: Heat sink base plate, thermally conductive material, heat sink cover plate and heat sink fins; One side of the thermally conductive material is connected to the chip to be cooled, and the other side is embedded in the bottom of the heat sink substrate, which is used to laterally extend the heat of the chip to be cooled to the heat sink substrate. The heat sink substrate has a hollow structure and the interior is a foamed copper skeleton filled with phase change energy storage material. The heat sink substrate is connected to the heat sink cover plate at the top. The radiator cover plate is provided with heat dissipation fins.

2. The finned radiator with coupled latent heat storage according to claim 1, characterized in that, The thermally conductive material is a heat pipe.

3. The finned radiator with coupled latent heat storage according to claim 2, characterized in that, The heat pipe and the substrate heat-conducting groove are filled with interface material and then welded.

4. The finned radiator with coupled latent heat storage according to claim 2, characterized in that, The heat pipe and the chip to be cooled are connected by an interface material.

5. The finned radiator with coupled latent heat storage according to claim 1, characterized in that, The foamed copper skeleton is brazed into the hollow cavity of the radiator substrate.

6. The finned radiator with coupled latent heat storage according to claim 1, characterized in that, The thermally conductive material is a VC heat exchanger plate.

7. The finned radiator with coupled latent heat storage according to claim 1, characterized in that, The heat sink base plate is welded to the heat sink cover plate.

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