Wafer ultrasonic cleaning head and ultrasonic cleaning system

Abstract

The utility model provides a wafer ultrasonic cleaning head, an ultrasonic cleaning system and wafer processing equipment. The wafer ultrasonic cleaning head is provided with a liquid outlet and a liquid suction port; in the liquid flow cleaning direction of the wafer ultrasonic cleaning head, the liquid suction port is located at the downstream end of the liquid outlet, a first cleaning area is defined by the liquid suction port and the liquid outlet, or a second cleaning area is defined by the liquid suction port, and the liquid outlet is located in the second cleaning area. The ultrasonic cleaning system is provided with the wafer ultrasonic cleaning head, the wafer processing equipment is provided with the ultrasonic cleaning system, and the wafer ultrasonic cleaning head is higher in capability of removing impurity particles on the surface of the wafer and can effectively prevent the impurity particles from polluting the surface of the wafer secondarily.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field, concretely relates to a wafer ultrasonic cleaning head and ultrasonic cleaning system with the wafer ultrasonic cleaning head. BACKGROUND

[0002] In the wafer production and processing process, the wafer needs to be cleaned multiple times to remove the impurity particles (such as dust, metal chips, etc.) remaining on the wafer surface and the organic matter pollution on the wafer surface, so as to ensure the manufacturing quality and yield of the wafer. Figure 1 and Figure 2 As shown in the prior art wafer processing equipment 9, it includes a rotary actuator 91, a chuck 92 and an ultrasonic cleaning system 93. The ultrasonic cleaning system 93 includes a wafer ultrasonic cleaning head 931, a moving actuator, etc. The driving end of the rotary actuator 91 is connected with the chuck 92 to drive the chuck 92 to rotate around the axis of the chuck 92; the chuck 92 is used to adsorb and fix the wafer 90 and drive the wafer 90 to rotate synchronously; the driving end of the moving actuator is connected with the wafer ultrasonic cleaning head 931 to drive the wafer ultrasonic cleaning head 931 to move relative to the wafer 90 and move to the upper side of the wafer 90 when cleaning the wafer 90; the bottom of the wafer ultrasonic cleaning head 931 is provided with a water outlet 9311, so that when the wafer ultrasonic cleaning head 931 moves to the upper side of the wafer 90, the water outlet 9311 is arranged towards the wafer 90. When cleaning the wafer 90, the chuck 92 adsorbs and fixes the back surface of the wafer 90, and then the moving actuator drives the wafer ultrasonic cleaning head 931 to move to the designated position above the wafer 90; then the ultrasonic cleaning system 93 sprays pure water to the wafer 90 through the water outlet 9311 of the wafer ultrasonic cleaning head 931, and the ultrasonic generator of the wafer ultrasonic cleaning head 931 starts to work to generate high-frequency vibration and cooperate with the pure water to clean the wafer 90, while the rotary actuator 91 drives the chuck 92 to drive the wafer 90 to rotate; when the cleaning is completed, the water outlet 9311 of the wafer ultrasonic cleaning head 931 stops spraying pure water, the moving actuator drives the wafer ultrasonic cleaning head 931 to reset, and at the same time, the chuck 92 can be continuously driven by the rotary actuator 91 to drive the wafer 90 to rotate to spin dry the water remaining on the wafer 90.

[0003] The prior art wafer processing equipment 9 has the following disadvantages when cleaning the wafer 90:

[0004] During the cleaning process, although the ultrasonic high-frequency oscillation generated by the wafer ultrasonic cleaning head 931 can make the impurity particles on the surface of the wafer 90 separate from the wafer 90 and enter the pure water, they may also be deposited in other areas of the wafer 90 with the water flow, making it difficult to completely remove the impurity particles on the surface of the wafer 90, and ultimately leading to the generation of bubbles in the bonding interface between the wafers 90, affecting the product yield. SUMMARY

[0005] To solve the above problems, the main purpose of the utility model is to provide a kind of wafer ultrasonic cleaning head, and the impurity particle removal ability of wafer surface is stronger, and effectively avoid the secondary pollution of impurity particle wafer surface.

[0006] Another purpose of the utility model is to provide a kind of ultrasonic cleaning system with the above wafer ultrasonic cleaning head.

[0007] To realize the main purpose of the utility model, the utility model provides a kind of wafer ultrasonic cleaning head, is equipped with liquid outlet, wherein, wafer ultrasonic cleaning head is also equipped with suction port;Along the liquid flow cleaning direction of wafer ultrasonic cleaning head, suction port is located at the downstream end of liquid outlet, and suction port and liquid outlet form first cleaning area, or suction port itself forms second cleaning area, and liquid outlet is located in second cleaning area.

[0008] As can be seen from the above, by adding suction port and designing the relative position of suction port and liquid outlet, the waste liquid generated during wafer cleaning can be extracted and recycled by suction port, so as to avoid the flow of waste liquid to other areas of wafer, prevent the impurity particles mixed in waste liquid from moving from one place of wafer to another place of wafer, and further better avoid the generation of bubbles at the bonding interface between wafers due to impurity particles during wafer bonding, thereby improving product yield.

[0009] Further scheme is that suction port and liquid outlet are both arranged on the bottom surface of wafer ultrasonic cleaning head.

[0010] As can be seen from the above, the design can ensure the synchronization of extracting and recycling waste liquid, so as to better avoid the surface of wafer remaining impurities, particles and the like.

[0011] One preferred scheme is that when suction port and liquid outlet form first cleaning area, liquid outlet extends along a part of the contour of the bottom surface of wafer ultrasonic cleaning head, and suction port extends along another part of the contour of the bottom surface of wafer ultrasonic cleaning head.

[0012] As can be seen from the above, the extension of liquid outlet and suction port along the contour of the bottom surface of wafer ultrasonic cleaning head can maximize the cleaning area of wafer ultrasonic cleaning head on wafer, and ensure that the cleaning liquid (such as pure water) sprayed by liquid outlet can flow through the whole cleaning area, while ensuring that suction port can reliably extract and recycle waste liquid.

[0013] Further scheme is that the first extension length of liquid outlet is less than or equal to the second extension length of suction port.

[0014] As can be seen from the above, under the premise of ensuring that the cleaning liquid sprayed from the liquid outlet can flow through the entire cleaning area, making the second extension length of the liquid suction port greater than the first extension length of the liquid outlet can ensure the extraction and recovery of the waste liquid and the impurity particles mixed in the waste liquid, and prevent the waste liquid and the impurity particles mixed therein from flowing to another part of the wafer.

[0015] Further, the wafer ultrasonic cleaning head is in the shape of a quadrangular prism, the quadrangular bottom surface of the wafer ultrasonic cleaning head has a first side, a second side, a third side and a fourth side connected in sequence, the liquid outlet extends along the first side and the second side, and the liquid suction port extends along the third side and the fourth side, or the liquid outlet extends along the first side, and the liquid suction port extends along the second side, the third side and the fourth side.

[0016] As can be seen from the above, the wafer ultrasonic cleaning head has a flexible and variable shape design, and can be suitable for different use requirements and wafers of different sizes.

[0017] Another preferred scheme is that when the liquid suction port itself surrounds the second cleaning area, the liquid suction port extends around the bottom surface of the wafer ultrasonic cleaning head.

[0018] Further, the wafer ultrasonic cleaning head is in the shape of a prism or a cylinder.

[0019] As can be seen from the above, the design can maximize the cleaning area of the wafer ultrasonic cleaning head on the wafer, and enable the liquid suction port to more comprehensively extract and recover the waste liquid generated in the cleaning process.

[0020] Further, the liquid outlet and the liquid suction port are formed on the wafer ultrasonic cleaning head, the wafer ultrasonic cleaning head is provided with a liquid supply channel and a liquid discharge channel, the liquid supply channel is in communication with the liquid outlet, and the liquid discharge channel is in communication with the liquid suction port.

[0021] As can be seen from the above, the liquid outlet and the liquid suction port can be integrally formed on the wafer ultrasonic cleaning head to improve the compactness of the wafer ultrasonic cleaning head as a whole, simplify the assembly mechanism of the wafer ultrasonic cleaning head and reduce the production cost of the wafer ultrasonic cleaning head; of course, the liquid outlet and the liquid suction port can also be formed on related accessories, and then assembled to the body to form the wafer ultrasonic cleaning head as a whole, which is conducive to the maintenance and replacement of the wafer ultrasonic cleaning head, and is conducive to reducing the maintenance and replacement cost of the wafer ultrasonic cleaning head.

[0022] To achieve another purpose of the present application, the utility model provides an ultrasonic cleaning system, including mobile actuator, wherein, still including wafer ultrasonic cleaning head as above, the drive end of mobile actuator is connected with wafer ultrasonic cleaning head.

[0023] From the above, the ultrasonic cleaning system is provided with the wafer ultrasonic cleaning head, which can extract and recycle the waste liquid generated during the cleaning of the wafer, so as to avoid the flow of the waste liquid to other areas of the wafer, prevent the mixed impurity particles in the waste liquid from moving from one place of the wafer to another place of the wafer, and further better avoid the generation of bubbles at the bonding interface between the wafers due to the impurity particles during the bonding of the wafers, thereby improving the product yield.

[0024] Further, when the wafer ultrasonic cleaning head is cleaning, the liquid outlet and the liquid suction port are located above the wafer; the wafer ultrasonic cleaning head has a spacing with the wafer, and the distance between the liquid suction port and the cleaned surface of the wafer is less than or equal to 5 mm.

[0025] From the above, the design can ensure the reliability of the liquid suction port for extracting and recycling the waste liquid, and ensure the synchronization of the extraction and recycling of the waste liquid, thereby better avoiding the surface of the wafer from being left with impurities and particles. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a structural schematic view of the wafer processing equipment in the first perspective after omitting part of the components.

[0027] Figure 2 is a structural schematic view of the wafer processing equipment in the second perspective after omitting part of the components.

[0028] Figure 3 is a structural schematic view of the wafer processing equipment in the first perspective after omitting part of the components of the first embodiment of the utility model.

[0029] Figure 4 is a structural schematic view of the wafer processing equipment in the second perspective after omitting part of the components of the first embodiment of the utility model.

[0030] Figure 5 is a schematic view of the liquid flow cleaning direction t of the wafer processing equipment of the first embodiment of the utility model.

[0031] Figure 6 is a structural schematic view of the wafer processing equipment of the second embodiment of the utility model after omitting part of the components.

[0032] Figure 7 This is a structural schematic diagram of the third embodiment of the wafer processing equipment of this utility model, with some components omitted.

[0033] The present invention will be further described below with reference to the accompanying drawings and embodiments. Detailed Implementation

[0034] First embodiment of wafer processing equipment

[0035] Combination Figure 3 and Figure 4 The wafer processing equipment 100 includes an ultrasonic cleaning system 101, a chuck 102, and a rotary actuator 103.

[0036] The ultrasonic cleaning system 101 includes a wafer ultrasonic cleaning head 1 and a moving actuator 102. The driving end of the moving actuator 102 is connected to the wafer ultrasonic cleaning head 1. The moving actuator 102 is used to drive the wafer ultrasonic cleaning head 1 to move between an initial position and a cleaning position. When the wafer ultrasonic cleaning head 1 is in the cleaning position, the wafer ultrasonic cleaning head 1 is located above the wafer 104, and there is a gap between the wafer ultrasonic cleaning head 1 and the wafer 104 to accommodate the cleaning fluid (such as pure water).

[0037] The wafer ultrasonic cleaning head 1 is provided with a liquid outlet 11 and a liquid suction port 12, which are preferably both located on the bottom surface of the wafer ultrasonic cleaning head 1. The liquid outlet 11 is used to spray cleaning fluid onto the wafer 104 when the wafer ultrasonic cleaning head 1 cleans the wafer 104. The liquid outlet 11 is also used to extract and recover the wastewater generated during the cleaning process of the wafer ultrasonic cleaning head 1 cleaning the wafer 104, and to extract and recover the impurity particles mixed in the wastewater together, so as to prevent the wastewater from flowing outside the cleaning area of ​​the wafer 104, and to prevent the wastewater and the impurity particles mixed in it from moving from one place of the wafer 104 to another place of the wafer 104, and to prevent bubbles from forming at the bonding interface between the wafers 104 due to impurity particles during the bonding process of the wafers 104.

[0038] In this embodiment, as Figure 5 As shown, along the liquid flow cleaning direction t of the wafer ultrasonic cleaning head 1, the suction port 12 is located downstream of the outlet port 11, and the suction port 12 and the outlet port 11 form a first cleaning area 10. Preferably, the outlet port 11 extends along a portion of the contour of the bottom surface of the wafer ultrasonic cleaning head 1, while the suction port 12 extends along another portion of the contour of the bottom surface of the wafer ultrasonic cleaning head 1. This design maximizes the cleaning area of ​​the wafer 104 by the wafer ultrasonic cleaning head 1, ensures that the cleaning liquid sprayed from the outlet port 11 can flow through the entire cleaning area, and ensures that the suction port 12 can reliably extract and recover waste liquid.

[0039] In addition, the first extension length of the liquid outlet 11 is less than or equal to the second extension length of the liquid inlet 12. As in the present embodiment, the wafer ultrasonic cleaning head 1 is in a quadrangular prism shape, preferably, the wafer ultrasonic cleaning head 1 is in a rectangular prism shape, so that the quadrangular bottom surface of the wafer ultrasonic cleaning head 1 has a first side, a second side, a third side and a fourth side connected in sequence. The liquid outlet 11 extends along the first side and the second side, and correspondingly, the liquid inlet 12 extends along the third side and the fourth side. Based on this design, the first extension length of the liquid outlet 11 is equal to the second extension length of the liquid inlet 12. Of course, as another alternative, in other embodiments, the liquid outlet 11 also extends along the first side, and correspondingly, the liquid inlet 12 extends along the second side, the third side and the fourth side, wherein the first side is a long side to ensure the liquid supply of the liquid outlet 11. Based on this design, the first extension length of the liquid outlet 11 is less than the second extension length of the liquid inlet 12. Under the premise of ensuring that the cleaning liquid sprayed by the liquid outlet 11 can flow through the entire first cleaning area 10, making the second extension length of the liquid inlet 12 greater than the first extension length of the liquid outlet 11 can ensure the extraction and recovery of waste liquid and impurity particles mixed in the waste liquid, so as to better prevent the waste liquid and the impurity particles mixed therein from flowing to another place of the wafer 104.

[0040] It should be noted that the liquid outlet 11 and the liquid inlet 12 are preferably long strip-shaped water outlets. The long strip-shaped liquid outlet 11 and the long strip-shaped liquid inlet 12 can be a single opening, i.e. the long strip-shaped liquid outlet 11 extends along the corresponding side of the quadrangular bottom surface of the wafer ultrasonic cleaning head 1 (such as extending along the first side and the second side in the present embodiment), and the long strip-shaped liquid inlet 12 extends along the corresponding side of the quadrangular bottom surface of the wafer ultrasonic cleaning head 1 (such as extending along the third side and the fourth side in the present embodiment). Of course, as another alternative, the liquid outlet 11 can have a plurality of first openings for discharging cleaning liquid, and the plurality of first openings are distributed and extended along the corresponding side of the quadrangular bottom surface of the wafer ultrasonic cleaning head 1. Similarly, the liquid inlet 12 has a plurality of second openings for entering waste liquid, and the plurality of second openings are distributed and extended along the corresponding side of the quadrangular bottom surface of the wafer ultrasonic cleaning head 1. The first openings can be long strip holes or circular holes, and similarly, the second openings can be long strip holes or circular holes.

[0041] Further, as one of the optional solutions, the liquid outlet 11 can be directly formed on the wafer ultrasonic cleaning head 1, and the liquid suction port 12 can be directly formed on the wafer ultrasonic cleaning head 1, for example, the liquid outlet 11 and the liquid suction port 12 are directly formed on the body (such as a shell) of the wafer ultrasonic cleaning head 1; wherein the wafer ultrasonic cleaning head 1 is provided with a liquid supply channel and a liquid discharge channel, the liquid supply channel is in communication with the liquid outlet 11, and the liquid discharge channel is in communication with the liquid suction port 12; this design can improve the compactness of the wafer ultrasonic cleaning head 1 as a whole, and simplify the assembly mechanism and production cost of the wafer ultrasonic cleaning head 1. As another optional solution, the wafer ultrasonic cleaning head 1 can also include a body, a liquid supply member, and a liquid discharge member, wherein the liquid supply member and the liquid discharge member are both mounted on the body, and the liquid outlet 11 is formed on the liquid supply member, and the liquid suction port 12 is formed on the liquid discharge member; by forming the liquid outlet 11 and the liquid suction port 12 on the related accessories, and then assembling the accessories to the body to form the wafer ultrasonic cleaning head 1 as a whole, it is beneficial to the maintenance and replacement of the wafer ultrasonic cleaning head 1, and it is beneficial to reduce the maintenance and replacement cost of the wafer ultrasonic cleaning head 1.

[0042] When the liquid outlet 11 and the liquid suction port 12 are directly formed on the wafer ultrasonic cleaning head 1, the wafer ultrasonic cleaning head 1 is connected to the liquid supply circuit of the ultrasonic cleaning system 101 through the liquid supply channel, so that the cleaning liquid can be sprayed out of the liquid outlet 11 through the liquid supply channel, and the wafer ultrasonic cleaning head 1 is connected to the recovery circuit of the ultrasonic cleaning system 101 through the liquid discharge channel, so that the recovery circuit can extract and recover the waste liquid after cleaning through the liquid suction port 12 and the liquid discharge channel. When the liquid outlet 11 is formed on the liquid supply member and the liquid suction port 12 is formed on the liquid discharge member, the wafer ultrasonic cleaning head 1 is connected to the liquid supply circuit through the liquid supply member and connected to the recovery circuit through the liquid discharge member.

[0043] The chuck 102 is used to adsorb and fix the back of the wafer 104, the driving end of the rotary actuator 103 is connected to the chuck 102, the rotary actuator 103 is used to drive the chuck 102 to rotate around the rotation axis of the chuck 102, and then the chuck 102 drives the wafer 104 to rotate relative to the wafer ultrasonic cleaning head 1, so that the wafer ultrasonic cleaning head 1 can clean each area of the wafer 104.

[0044] The process of cleaning the wafer 104 by the wafer processing equipment 100 is described as follows:

[0045] When the wafer 104 is cleaned, the chuck 102 adsorbs the back of the wafer 104, and then the moving actuator 102 drives the wafer ultrasonic cleaning head 1 to move to a designated position above the wafer 104, so that the liquid outlet 11 and the liquid suction port 12 are both located above the wafer 104. Preferably, the wafer ultrasonic cleaning head 1 has a spacing with the wafer 104 to avoid direct contact between the wafer ultrasonic cleaning head 1 and the wafer 104, so as to ensure the flow space of the cleaning liquid (such as pure water), and the distance between the liquid suction port 12 and the cleaned surface of the wafer 104 is preferably less than or equal to 5 mm, so as to ensure the reliability of the liquid suction port 12 in extracting and recycling the waste liquid, and ensure the synchronization of the extraction and recycling of the waste liquid; then the ultrasonic cleaning system 101 sprays the cleaning liquid to the wafer through the liquid outlet 11 of the wafer ultrasonic cleaning head 1, and the ultrasonic generator of the wafer ultrasonic cleaning head 1 starts to work to generate high-frequency vibration and cooperate with the cleaning liquid to clean the wafer 104, while the rotating actuator 103 drives the chuck 102 to rotate the wafer 104, and the liquid suction port 12 extracts and recycles the waste liquid generated during the cleaning; when the cleaning is completed, the liquid outlet 11 of the wafer ultrasonic cleaning head 1 stops spraying pure water, and the liquid suction port 12 stops extracting and recycling the waste liquid (or the liquid suction port 12 continues to extract and recycle the waste liquid for a set period of time), and then the moving actuator 102 drives the wafer ultrasonic cleaning head 1 to reset, and at the same time, the rotating actuator 103 can continue to drive the chuck 102 to rotate the wafer 104 to spin dry the residual water on the wafer 104.

[0046] As can be seen from the above, through the design of the wafer ultrasonic cleaning head 1 of the wafer processing equipment 100, the waste liquid generated during the cleaning of the wafer can be extracted and recycled by the liquid suction port 12 on the wafer ultrasonic cleaning head 1, so as to avoid the flow of the waste liquid to other areas of the wafer, prevent the mixed impurity particles in the waste liquid from moving from one place of the wafer to another place of the wafer, and better avoid the generation of bubbles at the bonding interface between the wafers due to the impurity particles during the bonding of the wafers, thereby improving the product yield. In addition, the design of the wafer ultrasonic cleaning head 1 can also make the liquid flow faster during the cleaning, so as to enhance the ability to remove impurity particles.

[0047] Second embodiment of wafer processing equipment

[0048] Reference Figure 6 The difference between the present embodiment and the first embodiment of the wafer processing equipment is the shape of the wafer ultrasonic cleaning head and the distribution of the liquid outlet and the liquid suction port. Specifically, in the present embodiment:

[0049] The wafer ultrasonic cleaning head 3 is in a shape of a triangular prism, the liquid outlet 31 extends along the first side of the triangular base of the wafer ultrasonic cleaning head 3, and the liquid suction port 32 extends along the second side and the bottom of the triangular base of the wafer ultrasonic cleaning head 3.

[0050] It can be seen from the embodiment that the shape of the wafer ultrasonic cleaning head is flexible and changeable, and the wafer ultrasonic cleaning head can be suitable for different use requirements, wafers of different sizes, and the like.

[0051] Wafer processing equipment third embodiment

[0052] Reference Figure 7 The difference between the embodiment and the wafer processing equipment first embodiment is the shape of the wafer ultrasonic cleaning head and the distribution of the liquid outlet and the liquid suction port. Specifically, in the embodiment, the wafer ultrasonic cleaning head 4 is a cylinder, and the liquid suction port 42 surrounds the contour of the bottom surface of the wafer ultrasonic cleaning head 4.

[0053] The liquid suction port 42 itself surrounds the second cleaning area, and the liquid outlet 41 is located in the second cleaning area 40. Preferably, the liquid suction port 42 extends around the contour of the bottom surface of the wafer ultrasonic cleaning head 4. In the embodiment, the wafer ultrasonic cleaning head 4 is a cylinder. Of course, as another optional solution, in other embodiments, the wafer ultrasonic cleaning head 4 can also be a prism, such as a triangular prism, a quadrangular prism, a hexagonal prism, and the like. Through the above design, the wafer ultrasonic cleaning head 4 can maximize the cleaning area of the wafer, and the liquid suction port can more comprehensively extract and recycle the waste liquid generated in the cleaning process.

[0054] Finally, it should be emphasized that the above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer ultrasonic cleaning head provided with a liquid outlet, characterized in that: the wafer ultrasonic cleaning head is further provided with a liquid suction port; along the liquid flow cleaning direction of the wafer ultrasonic cleaning head, the liquid suction port is located at the downstream end of the liquid outlet, the liquid suction port and the liquid outlet enclose a first cleaning area, or the liquid suction port itself encloses a second cleaning area, and the liquid outlet is located in the second cleaning area.

2. The wafer ultrasonic cleaning head according to claim 1, characterized in that: the liquid suction port and the liquid outlet are both arranged on the bottom surface of the wafer ultrasonic cleaning head.

3. The wafer ultrasonic cleaning head according to claim 2, characterized in that: when the liquid suction port and the liquid outlet enclose a first cleaning area, the liquid outlet extends along a part of the contour of the bottom surface of the wafer ultrasonic cleaning head, and the liquid suction port extends along another part of the contour of the bottom surface of the wafer ultrasonic cleaning head.

4. The wafer ultrasonic cleaning head according to claim 3, characterized in that: the first extension length of the liquid outlet is less than or equal to the second extension length of the liquid suction port.

5. The wafer ultrasonic cleaning head according to claim 4, characterized in that: the wafer ultrasonic cleaning head is in the shape of a quadrangular prism, the quadrangular bottom surface of the wafer ultrasonic cleaning head has a first side, a second side, a third side and a fourth side connected in sequence, the liquid outlet extends along the first side and the second side, and the liquid suction port extends along the third side and the fourth side, or the liquid outlet extends along the first side, and the liquid suction port extends along the second side, the third side and the fourth side; or the wafer ultrasonic cleaning head is in the shape of a triangular prism, the liquid outlet extends along the first side of the triangular bottom surface of the wafer ultrasonic cleaning head, and the liquid suction port extends along the second side and the bottom side of the triangular bottom surface.

6. The wafer ultrasonic cleaning head according to claim 2, characterized in that: when the liquid suction port itself encloses a second cleaning area, the liquid suction port extends around the bottom surface of the wafer ultrasonic cleaning head.

7. The wafer ultrasonic cleaning head according to claim 6, characterized in that: the wafer ultrasonic cleaning head is in the shape of a prism or a cylinder.

8. The wafer ultrasonic cleaning head according to any one of claims 1 to 7, characterized in that: the liquid outlet and the liquid suction port are both formed on the wafer ultrasonic cleaning head, the wafer ultrasonic cleaning head is provided with a liquid supply channel and a liquid discharge channel, the liquid supply channel is in communication with the liquid outlet, and the liquid discharge channel is in communication with the liquid suction port; or the wafer ultrasonic cleaning head comprises a body, a liquid supply member and a liquid discharge member, the liquid supply member and the liquid discharge member are both mounted on the body, the liquid outlet is formed on the liquid supply member, and the liquid suction port is formed on the liquid discharge member.

9. The wafer ultrasonic cleaning head according to any one of claims 1 to 8, characterized in that: the driving end of the moving actuator is connected with the wafer ultrasonic cleaning head.

10. The ultrasonic cleaning system according to claim 9, characterized in that: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 9. An ultrasonic cleaning system comprising a mobile actuator, characterized in that, ​ ​ The liquid outlet and the liquid suction port are located above the wafer when the wafer ultrasonic cleaning head is used to clean the wafer. The wafer ultrasonic cleaning head has a spacing from the wafer, and the distance between the liquid suction port and the surface to be cleaned of the wafer is less than or equal to 5 mm.

Images