Laser grinding device

Abstract

The utility model discloses a laser grinding device which comprises a body, a grinding assembly is arranged in the body, and the grinding assembly comprises a portal frame fixed to a base; the moving part is fixed to the base through a middle part, and the moving part comprises an X displacement module and a Y displacement module which are stacked; and the objective table is fixed to the X displacement module and is far away from the Y displacement module, a plurality of positioning parts are arranged on the side, far away from the X displacement module, of the objective table, the positioning parts surround a transparent substrate, and the transparent substrate is used for containing workpieces to be machined. Through the improvement of the mechanism of the objective table, the substrate can be quickly positioned, so that the economical efficiency of processing is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser processing, in particular to a laser grinding device for processing workpieces made of diamond material. BACKGROUND

[0002] Traditional planar processing technology mostly uses tools with higher hardness than the workpiece being processed for milling or grinding. Recently, there have been laser ablation devices. Since such devices do not have automatic feeding and discharging, an operator needs to replace the workpiece every certain time (e.g., about half an hour to one hour) during processing. For irregular workpieces, it takes time to replace the workpiece, and the processing state of the workpiece is not easy to observe.

[0003] Therefore, there is a need for a new laser grinding device. CONTENT OF THE INVENTION

[0004] To overcome the above-mentioned shortcomings, the purpose of the present application is to provide a new laser grinding device which improves efficiency, reduces manual participation and processing cost when in operation.

[0005] In order to achieve the above purpose, the present application adopts the following technical solutions:

[0006] A laser grinding device, comprising a body, a grinding assembly arranged in the body, the grinding assembly comprising:

[0007] a gantry fixed on a base;

[0008] a moving part fixed on the base by an intermediate part, the moving part comprising a stacked X displacement module and a Y displacement module;

[0009] a stage fixed on the X displacement module and away from the Y displacement module side, a plurality of positioning parts being arranged on the side of the stage away from the X displacement module, the positioning parts surrounding a transparent substrate for placing a workpiece to be processed.

[0010] In an embodiment, the positioning part is provided with a through hole, and a connecting piece fixes the positioning part on the stage through the through hole.

[0011] In an embodiment, the connecting piece comprises a bolt or a pin shaft.

[0012] In an embodiment, the transparent substrate fixes the workpiece to be processed by an adhesive.

[0013] In an embodiment, the X displacement module and the Y displacement module are respectively provided with a linear motor, which is respectively electrically connected to a control module, and the stage moves in the X / Y direction based on the driving of the control module.

[0014] In an embodiment, the moving component is provided with a rotating component, the object table is fixed to the rotating component through an intermediate component, the transparent substrate is placed on the object table, and the positioning component surrounds the transparent substrate.

[0015] In an embodiment, the rotating component comprises a DD motor, and an output end of the DD motor is connected to the object table.

[0016] In an embodiment, one side of the top of the gantry is provided with a driving part, the driving part comprises a driving motor, the driving motor is fixed to one side of the top of the gantry through a support, and an output end of the driving motor is connected to a lead screw.

[0017] The support is provided with a guide rail, the lead screw is provided with a shaft sleeve, the shaft sleeve is fixed to the side plate, the same side of the shaft sleeve is provided with a sliding block, and the sliding block is slidably fixed to the guide rail.

[0018] In an embodiment, the side plate is provided with a laser generator, a focal point of laser emitted by the laser generator falls on the surface of the workpiece to be processed to ablate the surface of the workpiece.

[0019] In an embodiment, the side plate is provided with a measuring mechanism, the measuring mechanism is used to measure the processing depth.

[0020] The measuring mechanism comprises an optical range finder, the optical range finder scans the surface height of the workpiece based on an instruction and feeds back scanning information to a control module.

[0021] Beneficial effects:

[0022] The laser grinding device provided in the application can quickly position the substrate through the improvement of the mechanism of the object table. When processing a single workpiece with different shapes or large size, the workpiece can be fixed on the transparent substrate in advance, and the transparent substrate can be quickly placed on the object table during processing. Since the substrate is made of transparent material, it can be quickly positioned on the object table, and the processing state of the workpiece can be quickly checked, thereby improving the economy of processing. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings, wherein:

[0024] Figure 1 FIG. 1 is a structural schematic view of a grinding assembly of a laser grinding device according to an embodiment of the application;

[0025] Figure 2A structural schematic diagram of a grinding assembly in a perspective view of an embodiment of the present application;

[0026] Figure 3 A structural schematic diagram of a workpiece placed on a stage in an embodiment of the present application;

[0027] Figure 4 A schematic diagram of a workpiece fixed to a transparent substrate in an embodiment of the present application. DETAILED DESCRIPTION

[0028] The above solutions are further described below in conjunction with specific embodiments. It should be understood that these embodiments are used to illustrate but not to limit the scope of the present application. The implementation conditions used in the embodiments can be further adjusted as the specific manufacturer's conditions, and the implementation conditions not mentioned are usually the conditions in the conventional experiments.

[0029] The present application discloses a laser grinding device, comprising a body, a grinding assembly is arranged in the body, the grinding assembly comprises: a gantry fixed on a base, a moving part fixed on the base through an intermediate piece, the moving part comprises a stacked X displacement module and a Y displacement module, a stage fixed on the X displacement module and away from the Y displacement module side, a plurality of positioning parts are arranged on the side away from the X displacement module of the stage, the positioning parts are used to surround a transparent substrate, and the transparent substrate is used to place a workpiece to be processed. The laser grinding device can be used for processing the surface of a workpiece of diamond material. Through the improvement of the mechanism of the stage, the positioning parts are arranged, the substrate can be quickly positioned through the positioning parts, when a special-shaped or large-sized workpiece is processed individually, the workpiece can be fixed on the transparent substrate in advance, the transparent substrate is quickly placed on the stage during processing, and the size of the transparent substrate or the shape of the workpiece to be processed can be adjusted through the positioning parts. Since the substrate is made of transparent material, the substrate can be quickly positioned on the stage, and the processing state of the workpiece can be quickly observed, and the economy of processing is improved.

[0030] Next, the laser grinding device of the embodiment of the present application will be described in detail in conjunction with the accompanying Figures 1-4

[0031] The laser grinding device comprises a body, a grinding assembly 100 is arranged in the body, the grinding assembly 100 comprises: a gantry 110 fixed on a base 111,

[0032] A moving part 140 is fixed on the base 111 through an intermediate piece, the moving part 140 comprises a stacked X displacement module 141 and a Y displacement module 142, a linear motor is arranged on the X displacement module 141 and the Y displacement module 142 respectively, the linear motor is electrically connected to a control module (not shown in the figure), and the stage is driven to move to a target position in the X / Y direction based on the control module. ​

[0033] The positioning component 151 is used to fix the transparent substrate 162. When fixing the transparent substrate 162, one positioning component 151 can be removed first, and then the transparent substrate 162 is placed and fixed, and then the positioning component 151 is installed. The transparent substrate 162 can be used to realize rapid fixing, and the transparent substrate 162 can be conveniently observed during processing. In the embodiment, the workpiece 161 is fixed to the transparent substrate 162 by an adhesive (such as glue or double-sided tape) before processing, and is removed after processing. In this way, the workpiece is simplified during single workpiece processing. In other embodiments, the movable platform is fixed to the Y displacement module, and the movable platform is provided with a plurality of positioning components on the side away from the X displacement module.

[0034] In an embodiment, the moving component 140 is provided with a rotating component (not shown in the figure), and the movable platform 150 is fixed to the rotating component through an intermediate component. The transparent substrate 162 is placed on the movable platform 150, and the positioning components 151 are arranged around the transparent substrate 162 to prevent the transparent substrate 162 from flying out during rotation. Preferably, the rotating component includes a DD motor, and the output end of the DD motor is connected to the movable platform 150.

[0035] One side of the top of the gantry 110 is provided with a driving part 120, and the driving part 120 includes a driving motor 121. The driving motor 121 is fixed to one side of the top of the gantry 110 through a support 124. The support 124 is provided with a guide rail 122. The output end of the driving motor 121 is connected to the lead screw 122. The lead screw 122 is provided with a shaft sleeve (not shown in the figure). The shaft sleeve is fixed to the side plate 130. The same side of the shaft sleeve is provided with a sliding block 131. The sliding block 131 is slidably fixed to the guide rail 122. The driving motor 121 drives the lead screw to rotate. The lead screw drives the side plate 130 to move (i.e., moves in the Z direction).

[0036] The side plate 130 is provided with a laser generator (not shown in the figure). The focal point of the laser emitted by the laser generator falls on the surface of the workpiece to be processed (such as diamond material), so as to ablate the surface of the workpiece. Based on the movement of the X displacement module 141 and the Y displacement module 142, the workpiece is moved in the X and Y directions to realize the grinding of the surface of the workpiece. Based on the driving motor 121, the workpiece is moved in the Z direction to realize the grinding of a certain thickness of the workpiece.

[0037] The laser grinding device is also provided with a control module electrically connected to the moving component 140, the driving part 120 and the laser generator, which controls the operation of the laser grinding device.

[0038] In an embodiment, the side plate 130 further comprises a measuring mechanism for measuring the machining size. Preferably, the measuring mechanism comprises an optical distance meter which scans the surface height of the workpiece based on the instruction and feeds back the scanning information to the control module. Preferably, the optical distance meter comprises a 0.1 micron grating ruler.

[0039] An embodiment of the present application provides a laser grinding device which is equipped with the above grinding assembly.

[0040] In an embodiment, the laser grinding device has a display module which is electrically connected to the control module for displaying the operation information.

[0041] In the present application, the terms "upper", "lower", "inner", "middle" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not intended to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0042] The above embodiments are only for illustrating the technical concepts and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent transformation or modification made in the spirit and essence of the present application should be covered within the protection scope of the present application.

Claims

1. A laser polishing apparatus, characterized by, The laser grinding device comprises: a body, a grinding assembly arranged in the body, the grinding assembly comprising: a gantry fixed on a base; a moving component fixed on the base through an intermediate component, the moving component comprising a stacked X displacement module and a Y displacement module; a stage fixed on the X displacement module and away from the Y displacement module side, the stage away from the X displacement module side being provided with a plurality of positioning components, or the stage being fixed on the Y displacement module and away from the X displacement module side, the stage away from the Y displacement module side being provided with a plurality of positioning components, the positioning components being used to surround a transparent substrate for placing a workpiece to be processed.

2. The laser grinding device according to claim 1, wherein a through hole is arranged on the positioning component, and a connecting piece is used to fix the positioning component on the stage through the through hole.

3. The laser grinding device according to claim 2, wherein the connecting piece comprises a bolt or a pin.

4. The laser grinding device according to claim 1, wherein the transparent substrate is used to fix the workpiece to be processed through an adhesive.

5. The laser grinding device according to claim 1, wherein the X displacement module and the Y displacement module are respectively provided with a linear motor, and the linear motors are respectively electrically connected to a control module, so that the stage moves in the X / Y direction based on the driving of the control module.

6. The laser grinding device according to claim 1, wherein a rotating component is arranged on the moving component, the stage is fixed on the rotating component through an intermediate component, the transparent substrate is placed on the stage, and the positioning components surround the transparent substrate.

7. The laser grinding device according to claim 6, wherein the rotating component comprises a DD motor, and an output end of the DD motor is connected to the stage.

8. The laser grinding device according to claim 1, wherein a driving part is arranged on one side of the top of the gantry, the driving part comprises a driving motor, the driving motor is fixed on one side of the top of the gantry through a support, and an output end of the driving motor is connected to a lead screw, a guide rail is arranged on the support, a shaft sleeve is arranged on the lead screw, the shaft sleeve is fixed on a side plate, a sliding block is arranged on the same side of the shaft sleeve, and the sliding block is slidably fixed on the guide rail.

9. The laser grinding device according to claim 8, wherein a laser generator is arranged on the side plate, a focal point of the laser emitted by the laser generator falls on the surface of the workpiece to be processed, so as to ablate the surface of the workpiece.

10. The laser grinding device according to claim 8, wherein a measuring mechanism is arranged on the side plate, the measuring mechanism is used to measure the processing depth, the measuring mechanism comprises an optical range finder, the optical range finder scans the surface height of the workpiece based on an instruction, and feeds back scanning information to a control module.

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