Plastic packaging equipment for semiconductor chip production

Abstract

The utility model discloses plastic packaging equipment for semiconductor chip production. The plastic packaging equipment comprises a rack, the front end of the rack is rotationally connected with a supporting shaft, the middle of the outer arc face of the supporting shaft is slidably connected with a rotating frame, lower dies are arranged in the front end and the rear end of the rotating frame, a sliding strip is slidably connected in the upper end of the rack, the lower end of the sliding strip is fixedly connected with the upper surface of the feeding shell, an upper die is arranged at the lower end of the feeding shell, and the two lower dies are both matched with the upper die. The plastic packaging equipment for semiconductor chip production is provided with two lower molds which can rotate to change positions, and the other lower mold can perform material taking and material placing preparation work during plastic packaging, so that the plastic packaging efficiency of semiconductor chips is improved, the production cost is reduced, the production efficiency is improved, and the production cost is reduced. And the runner is cut off through the circular shaft above the upper die, so that the generation of waste materials is reduced, and the use convenience is good.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor chip production, specifically to a plastic package equipment of semiconductor chip production. BACKGROUND

[0002] The use of plastic package equipment is indispensable in semiconductor chip production, and in the prior art, a semiconductor chip plastic package device is disclosed in the patent with the authorized publication number CN220774285U, which comprises a fixed flat plate, a plastic package power unit, a chip fixing unit, a heating assembly fixed flat plate: the upper surface is provided with a plastic package power unit, the fixed shell inner bottom end surface is provided with a heating assembly in the plastic package power unit, the lower surface of the fixed flat plate is respectively fixedly connected with support legs, the chip fixing unit comprises a support fixing rod, a clamping plate, a lower plastic package mold, a sealing groove, an upper plastic package mold, a feeding pipeline and a sealing strip, which is convenient to disassemble and replace the plastic package mold without affecting the chip plastic package, and the plastic package device is more convenient to overhaul after plastic package, but only one lower plastic package mold is used in the processing process, which occupies a certain time for taking and placing materials, and the processing efficiency still has room for improvement, and the flow channel lacks a plugging structure, so that the material in the flow channel is in communication with the material in the mold during solidification, and a protrusion is easily generated after solidification, which needs to be removed in the later period. UTILITY MODEL CONTENT

[0003] The technical problem to be solved by the utility model is to overcome the defects of the prior art and provide a plastic package equipment for semiconductor chip production, which is provided with two lower molds that can rotate and change positions, so that the other lower mold can be used for taking and placing materials while plastic package is performed, thereby improving the plastic package efficiency of semiconductor chips, the flow channel is cut off by a circular shaft above the upper mold, thereby reducing the generation of waste materials, and the utility model is convenient to use and can effectively solve the problems in the background art.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a plastic package equipment for semiconductor chip production, comprising a rack;

[0005] The frame is rotationally connected with a support shaft at the front end, a rotating frame is slidingly connected with the middle part of the outer arc surface of the support shaft, the interiors of the front and rear ends of the rotating frame are respectively provided with a lower mold, the interior of the upper end of the frame is slidingly connected with a sliding bar, the lower end of the sliding bar is fixedly connected with the upper surface of the material adding shell, the lower end of the material adding shell is provided with an upper mold, the two lower molds are matched with the upper mold, the exterior of the sliding bar is slidingly connected with a support frame, the lower surface of the support frame is provided with uniformly distributed round shafts, the plurality of round shafts all penetrate through the material adding shell and are matched with the discharging holes on the upper surface of the upper mold, the two lower molds are provided with two lower molds which can rotate and change positions, alternately close with the upper mold to encapsulate the semiconductor chips, and then another lower mold can prepare for taking and discharging materials while encapsulating, so that the encapsulation efficiency of the semiconductor chips is improved, the round shafts are arranged above the upper mold to cut off the flow channel, so that the synchronous discharging and cutting off of the epoxy resin are facilitated, the generation of waste is reduced, and the use is convenient.

[0006] Further, the interior of the front end of the frame is provided with a PLC controller, the input end of the PLC controller is electrically connected with an external power source, and the automatic control of the electric appliance is facilitated.

[0007] Further, the lower end of the support shaft is provided with a worm gear, the lower end of the interior of the frame is rotationally connected with a worm, the lower end of the interior of the frame is provided with a motor, the output shaft of the motor is fixedly connected with the rear end of the worm, the input end of the motor is electrically connected with the output end of the PLC controller, and the rotation of the support shaft is facilitated.

[0008] Further, the middle part of the outer arc surface of the support shaft is provided with a pin shaft, the pin shaft is slidingly connected with the long sliding hole in the middle part of the rotating frame, the middle part of the outer arc surface of the support shaft is movably sleeved with a spring, and the spring is located between the upper surface of the front end of the frame and the rotating frame, so that the synchronous rotation of the rotating frame and the support shaft is ensured.

[0009] Further, the upper end of the sliding bar is provided with a large electric push rod, the telescopic end of the large electric push rod is fixedly connected with the upper surface of the frame, and the input end of the large electric push rod is electrically connected with the output end of the PLC controller, so that the up-and-down movement of the sliding bar is facilitated.

[0010] Further, the middle part of the sliding bar is provided with a small electric push rod, the telescopic end of the small electric push rod is fixedly connected with the upper surface of the support frame, and the input end of the small electric push rod is electrically connected with the output end of the PLC controller, so that the up-and-down movement of the support frame is facilitated.

[0011] Further, the middle part of the frame is provided with an electric heating sheet one, the electric heating sheet one is located below the lower mold on the rear side, the front end of the electric heating sheet one is provided with a temperature sensor two, the input end of the electric heating sheet one is electrically connected with the output end of the PLC controller, and the output end of the temperature sensor two is electrically connected with the input end of the PLC controller, so that the heating and the curing efficiency are improved.

[0012] Further, the left and right sides of the additive shell upper surface are provided with electric heating sheet two, the middle part of the additive shell upper surface is provided with temperature sensor one, the input end of electric heating sheet two is electrically connected with the output end of PLC controller, and the output end of temperature sensor one is electrically connected with the input end of PLC controller, so that the viscosity of epoxy resin is reduced and the fluidity is improved.

[0013] Compared with the prior art, the semiconductor chip production plastic packaging equipment has the following advantages:

[0014] 1. Two lower molds are arranged on the device, and the positions of the two lower molds can be rotated and replaced, so that the semiconductor chips are plastic packaged by the upper mold and the lower mold alternately, and meanwhile, the other lower mold can be used for taking and placing materials, so that the plastic packaging efficiency of the semiconductor chips is improved.

[0015] 2. The flow channel is cut off by the circular shaft above the upper mold, so that the synchronous discharge and cut-off of the epoxy resin are facilitated, the addition and curing of the epoxy resin in the mold cavity are facilitated, the generation of waste is reduced, and the convenience of the plastic packaging equipment in the production of semiconductor chips is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 It is a structural schematic view of the utility model;

[0017] Fig. 2 It is a right side sectional view of the utility model;

[0018] Fig. 3 It is an enlarged structural schematic view of the A place of the utility model.

[0019] In the figure: 1 rack, 2 support shaft, 3 rotating frame, 4 lower mold, 5 sliding bar, 6 additive shell, 7 upper mold, 8 circular shaft, 9 electric heating sheet two, 10 temperature sensor one, 11 support frame, 12 small electric push rod, 13 large electric push rod, 14 worm, 15 worm wheel, 16 motor, 17 pin shaft, 18 spring, 19 PLC controller, 20 electric heating sheet one, 21 temperature sensor two. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0021] Please refer to Figs. 1-3 The embodiment provides a technical scheme: a plastic packaging equipment for semiconductor chip production, which comprises a rack 1.

[0022] The frame 1: its front end is rotationally connected with a support shaft 2, the middle part of the outer arc surface of the support shaft 2 is slidably connected with a rotating frame 3, the interiors of the front and rear ends of the rotating frame 3 are each provided with a lower mold 4, the semiconductor chip is placed into the recess of the front lower mold 4, the interior of the upper end of the frame 1 is slidably connected with a sliding bar 5, the lower end of the sliding bar 5 is fixedly connected with the upper surface of a material adding shell 6, the lower end of the material adding shell 6 is provided with an upper mold 7, the two lower molds 4 are cooperatively arranged with the upper mold 7, the feeding port of the upper end of the material adding shell 6 is connected with an external injection pump, the external epoxy resin is injected into the material adding shell 6, then passes through the discharging hole in the upper surface of the upper mold 7 to enter between the upper mold 7 and the lower mold 4 to package the semiconductor chip, the exterior of the sliding bar 5 is slidably connected with a support frame 11, the lower surface of the support frame 11 is provided with evenly distributed circular shafts 8, the plurality of circular shafts 8 all penetrate through the material adding shell 6 and are cooperatively arranged with the discharging hole in the upper surface of the upper mold 7, the number of the circular shafts 8 is more than three, facilitating the interruption of multiple flow channels, the circular shafts 8 are slidably connected with the material adding shell 6 and are sealed, the support frame 11 drives the circular shafts 8 to move downward, the lower end of the circular shaft 8 is conical, the lower end of the circular shaft 8 is inserted into the discharging hole in the upper surface of the upper mold 7 and is blocked, the epoxy resin in the interiors of the upper mold 7 and the lower mold 4 is separated from the resin in the interior of the material adding shell 6, the interior of the front end of the frame 1 is provided with a PLC controller 19, the input end of the PLC controller 19 is electrically connected with an external power supply, the lower end of the support shaft 2 is provided with a worm gear 15, the lower end of the interior of the frame 1 is rotationally connected with a worm shaft 14, the lower end of the interior of the frame 1 is provided with a motor 16, the output shaft of the motor 16 is fixedly connected with the rear end of the worm shaft 14, the input end of the motor 16 is electrically connected with the output end of the PLC controller 19, the motor 16 operates, the output shaft of the motor 16 drives the worm shaft 14 to rotate, the worm shaft 14 drives the support shaft 2 to rotate through the worm gear 15, after the motor 16 controls the support shaft 2 to rotate by one hundred and eighty degrees, the motor 16 stops operating, the middle part of the outer arc surface of the support shaft 2 is provided with a pin shaft 17, the pin shaft 17 is slidably connected with the long sliding hole in the middle part of the rotating frame 3, the support shaft 2 drives the rotating frame 3 and the lower mold 4 to rotate through the pin shaft 17, the rotating frame 3 moves downward in the process of which the relative sliding with the pin shaft 17 and the support shaft 2 occurs, the middle part of the outer arc surface of the support shaft 2 movably sleeves the spring 18, the spring 18 is located between the upper surface of the front end of the frame 1 and the rotating frame 3 and pushes the rotating frame 3 to move upward and separate from the frame 1 in the compressed state, the upper end of the sliding bar 5 is provided with a large electric push rod 13, the telescopic end of the large electric push rod 13 is fixedly connected with the upper surface of the frame 1, the input end of the large electric push rod 13 is electrically connected with the output end of the PLC controller 19, the large electric push rod 13 operates, the telescopic end of the large electric push rod 13 contracts to drive the sliding bar 5 to move downward, the sliding bar 5 drives the upper mold 7 to move downward and close the lower mold 4 below through the material adding shell 6, the upper mold 7 will push the lower mold 4 and the rotating frame 3 to slide downward along the support shaft 2, the upper surface of the frame 1 contacts with the rotating frame 3 and provides support, the middle part of the sliding bar 5 is provided with a small electric push rod 12, the telescopic end of the small electric push rod 12 is fixedly connected with the upper surface of the support frame 11, the input end of the small electric push rod 12 is electrically connected with the output end of the PLC controller 19,The telescopic end of the small electric push rod 12 is extended to drive the support frame 11 to slide downward along the slide bar 5. The middle part of the rack 1 is provided with an electric heating sheet 20. The electric heating sheet 20 is located below the lower die 4 at the rear side. The lower die 4 is in contact with the electric heating sheet 20 for heat conduction. The front end of the electric heating sheet 20 is provided with a temperature sensor 21. The input end of the electric heating sheet 20 is electrically connected with the output end of the PLC controller 19. The output end of the temperature sensor 21 is electrically connected with the input end of the PLC controller 19. The electric heating sheet 20 works to generate heat to heat the lower die 4. The heating temperature is 80-120℃. The heating accelerates the solidification speed. The temperature sensor 21 converts the temperature information into an electric signal and transmits it to the PLC controller 19. When the temperature reaches the specified value, the PLC controller 19 controls the electric heating sheet 20 to stop working. The left and right sides of the upper surface of the material adding shell 6 are provided with electric heating sheets 9. The middle part of the upper surface of the material adding shell 6 is provided with a temperature sensor 10. The input end of the electric heating sheet 9 is electrically connected with the output end of the PLC controller 19. The output end of the temperature sensor 10 is electrically connected with the input end of the PLC controller 19. The electric heating sheet 9 works. The electric heating sheet 9 heats the material adding shell 6. The heating temperature is 40-50℃. It can reduce the viscosity of the epoxy resin and improve the fluidity. The temperature sensor 10 detects the temperature of the material adding shell 6.

[0023] The working principle of the plastic packaging equipment for semiconductor chip production is as follows: in use, the semiconductor chip is placed into the recess of the lower mold 4 on the front side, the PLC controller 19 is controlled, the motor 16 is operated, the output shaft of the motor 16 drives the worm 14 to rotate, the worm 14 drives the support shaft 2 to rotate through the worm gear 15, the support shaft 2 drives the rotary frame 3 and the lower mold 4 to rotate through the pin shaft 17, after the support shaft 2 is rotated by one hundred and eighty degrees controlled by the motor 16, the motor 16 stops operating, the speed reduction ratio of the worm 14 and the worm gear 15 is fixed, the motor 16 uses a servo motor, the PLC controller 19 controls the motor 16 to rotate a specified number of turns through an output pulse signal, so that the support shaft 2 stops rotating after being rotated by one hundred and eighty degrees, and then the lower mold 4 filled on the front side will be moved to the rear side, then the large electric push rod 13 is operated, the telescopic end of the large electric push rod 13 is retracted to drive the sliding bar 5 to move downward, the sliding bar 5 drives the upper mold 7 to move downward and close the corresponding lower mold 4 below through the feeding shell 6, at the same time, the upper mold 7 will push the lower mold 4 and the rotary frame 3 to slide downward along the support shaft 2, the upper surface of the rack 1 is in contact with the rotary frame 3 and provides support, the lower mold 4 is in contact with the electric heating sheet one 20 for heat conduction, the feeding port at the upper end of the feeding shell 6 is connected with an external injection pump, the external epoxy resin is injected into the feeding shell 6, then the epoxy resin enters between the upper mold 7 and the lower mold 4 through the discharge hole in the upper surface of the upper mold 7 to package the semiconductor chip, after being filled, the telescopic end of the small electric push rod 12 is extended to drive the support frame 11 to slide downward along the sliding bar 5, the support frame 11 drives the circular shaft 8 to move downward, the lower end of the circular shaft 8 is tapered, the lower end of the circular shaft 8 is inserted into the discharge hole in the upper surface of the upper mold 7 and is sealed, so that the epoxy resin in the upper mold 7 and the lower mold 4 is separated from the resin in the feeding shell 6, then the electric heating sheet one 20 generates heat to heat the lower mold 4, the heating temperature is 80-120 DEG C, the temperature sensor two 21 converts the temperature information into an electric signal and transmits the electric signal to the PLC controller 19, when the temperature reaches a specified value, the PLC controller 19 controls the electric heating sheet one 20 to stop working, at the same time of plastic packaging, the electric heating sheet two 9 works, the electric heating sheet two 9 heats the feeding shell 6, the heating temperature is 40-50 DEG C, which can reduce the viscosity of the epoxy resin and improve the fluidity, and the temperature sensor one 10 detects the temperature of the feeding shell 6, after a period of solidification, the telescopic end of the large electric push rod 13 is extended to drive the upper mold 7 to move upward and separate from the lower mold 4 on the lower side, at the same time, the spring 18 in the compressed state pushes the rotary frame 3 to move upward and separate from the rack 1, the motor 16 continues to drive the support shaft 2 to rotate by one hundred and eighty degrees, the two lower molds 4 can be closed with the upper mold 7 in turn to package the semiconductor chip, at the same time of plastic packaging of the lower mold 4 on the rear side, the feeding and discharging work of the lower mold 4 on the front side can be carried out, so that the preparation time is shortened and the processing efficiency is improved.

[0024] It is worth noting that the small electric push rod 12, the large electric push rod 13, the motor 16, the PLC controller 19, the electric heating sheet one 20, the temperature sensor two 21, the electric heating sheet two 9 and the temperature sensor one 10 disclosed in the above embodiment can be freely configured according to the actual application scene, the small electric push rod 12 can select the electric push rod of ANT-26 type, the large electric push rod 13 can select the electric push rod of ANT-52 type, the motor 16 can select the servo motor of ECMA-C20604RS type, the PLC controller 19 can select the PLC controller of FX3U-48MT / ES-A type, the electric heating sheet one 20 and the electric heating sheet two 9 can select the polyimide film electric heating film, the temperature sensor two 21 and the temperature sensor one 10 can select the temperature sensor of MS39 / BS-803 type, and the PLC controller 19 controls the small electric push rod 12, the large electric push rod 13, the motor 16, the electric heating sheet one 20, the temperature sensor two 21, the electric heating sheet two 9 and the temperature sensor one 10 to work by using the method commonly used in the prior art.

[0025] The above description is only an embodiment of the present application, and does not limit the patent range of the present application, and any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, which is based on the content of the present application specification and drawings, is also included in the patent protection range of the present application.

Claims

1. A molding compound for semiconductor chip manufacturing, characterized in that: It includes a rack (1); The front end of the rack (1) is internally provided with a PLC controller (19), and the input end of the PLC controller (19) is electrically connected with an external power supply.

2. The plastic packaging apparatus for semiconductor chip production according to claim 1, wherein: The lower end of the support shaft (2) is provided with a worm gear (15), the lower end of the inside of the rack (1) is rotatably connected with a worm (14), the lower end of the inside of the rack (1) is provided with a motor (16), the output shaft of the motor (16) is fixedly connected with the rear end of the worm (14), and the input end of the motor (16) is electrically connected with the output end of the PLC controller (19).

3. The plastic packaging apparatus for semiconductor chip production according to claim 2, wherein: The middle part of the outer arc surface of the support shaft (2) is provided with a pin shaft (17), the pin shaft (17) is slidably connected with the long sliding hole in the middle part of the rotating frame (3), and the middle part of the outer arc surface of the support shaft (2) is movably sleeved with a spring (18), which is located between the upper surface of the front end of the rack (1) and the rotating frame (3).

4. The plastic packaging apparatus for semiconductor chip production according to claim 1, wherein: The upper end of the slide bar (5) is provided with a large electric push rod (13), the telescopic end of the large electric push rod (13) is fixedly connected with the upper surface of the rack (1), and the input end of the large electric push rod (13) is electrically connected with the output end of the PLC controller (19).

5. The plastic packaging apparatus for semiconductor chip production according to claim 2, wherein: The middle part of the slide bar (5) is provided with a small electric push rod (12), the telescopic end of the small electric push rod (12) is fixedly connected with the upper surface of the support frame (11), and the input end of the small electric push rod (12) is electrically connected with the output end of the PLC controller (19).

6. The plastic packaging apparatus for semiconductor chip production according to claim 2, wherein: The middle part of the rack (1) is provided with an electric heating sheet one (20), which is located below the rear lower die (4), the front end of the electric heating sheet one (20) is provided with a temperature sensor two (21), the input end of the electric heating sheet one (20) is electrically connected with the output end of the PLC controller (19), and the output end of the temperature sensor two (21) is electrically connected with the input end of the PLC controller (19).

7. The plastic packaging apparatus for semiconductor chip production according to claim 2, wherein: The upper surface of the material adding shell (6) is provided with an electric heating sheet two (9) on the left and right sides, and the middle part of the upper surface of the material adding shell (6) is provided with a temperature sensor one (10), the input end of the electric heating sheet two (9) is electrically connected with the output end of the PLC controller (19), and the output end of the temperature sensor one (10) is electrically connected with the input end of the PLC controller (19).

8. The plastic packaging apparatus for semiconductor chip production according to claim 2, wherein: ​

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