Leveling die for LED display screen circuit board

Abstract

The utility model discloses an LED display screen circuit board leveling die which comprises a machine frame and a leveling die, the machine frame comprises a base, a supporting frame fixedly installed on the upper surface of the base and a hydraulic leveling structure arranged in the supporting frame, and the leveling die comprises an upper die plate, a lower die plate and an assembling structure arranged on the surfaces of the upper die plate and the lower die plate. The hydraulic leveling structure comprises a hydraulic cylinder fixedly installed on the upper surface of the supporting frame, an upper leveling plate fixedly installed at the telescopic end of the hydraulic cylinder, a plurality of layers of connecting plates arranged in the supporting frame and linkage assemblies arranged on the two side faces of the connecting plates. By arranging the leveling die, compared with the prior art, multiple groups of upper die plates and lower die plates can be mounted by utilizing the multiple layers of connecting plates, and the multiple layers of connecting plates can be driven to synchronously descend and ascend by utilizing the linkage assembly, so that the multiple groups of upper die plates and lower die plates can be driven to ascend and descend, and a plurality of circuit boards can be leveled at one time; and the leveling efficiency of the circuit board is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of circuit board production especially relates to a LED display screen circuit board leveling mould. BACKGROUND

[0002] Circuit board flatness refers to the flatness degree of the circuit board surface, also called surface flatness. Circuit board flatness is one of the important factors affecting the running performance of electronic equipment, so when producing the LED display screen circuit board, the base material of the circuit board needs to be leveled.

[0003] China authorized announcement No. CN216182730U discloses a kind of LED display screen circuit board leveling mould, comprising: lower mould and upper mould, the top of the lower mould is fixedly connected with support column, the top of the lower mould is inlaid and is provided with stamping groove, the inner wall of the stamping groove is slidably connected with lifting plate, the top of the lifting plate is integrally connected with slide column, the outer wall of the support column is fixedly connected with horizontal plate, the bottom of the horizontal plate is fixedly connected with limiting column, the top of the slide column is fixedly connected with limiting plate.The LED display screen circuit board leveling mould, by being provided with lower mould, upper mould, support column, stamping groove, lifting plate, slide column, horizontal plate, limiting column and limiting plate, after the leveling mould is pressed and leveled to circuit board, the lifting plate is lifted by the rising of upper mould, the circuit board that is clamped in the inner wall of stamping groove is pushed up, the circuit board is clamped in the inner wall of stamping groove is avoided, the circuit board is conveniently taken out, and work efficiency is improved.

[0004] But the device has the following defects when in use: although the device is convenient to take out circuit board, the device can only level one circuit board at a time when leveling circuit board, so when leveling circuit board in large quantities, the circuit board leveling efficiency is low. In view of the above defects: therefore we propose a kind of LED display screen circuit board leveling mould. UTILITY MODEL CONTENTS

[0005] The utility model aims at solving the shortcomings in the prior art and provides a kind of LED display screen circuit board leveling mould.

[0006] In order to solve the problems existing in the prior art, the utility model adopts the following technical scheme: a kind of LED display screen circuit board leveling mould, comprising:

[0007] Rack, the rack includes base, support frame fixedly installed on the upper surface of base, and hydraulic leveling structure arranged in the support frame;

[0008] Leveling mould, the leveling mould includes upper die plate, lower die plate and assembly structure arranged on the surface of upper die plate and lower die plate;

[0009] The hydraulic leveling structure comprises a hydraulic cylinder fixedly installed on the upper surface of the support frame, an upper leveling plate fixedly installed on the telescopic end of the hydraulic cylinder, a plurality of link plates arranged in the support frame, and a linkage assembly arranged on the two side surfaces of the link plates.

[0010] Preferably, the upper surface of the base is fixedly installed with a guide rod, the surfaces of the link plates and the upper leveling plate are each provided with a guide groove for the guide rod to pass through, and the upper end of the guide rod is fixedly connected with the inner top wall of the support frame.

[0011] Preferably, the assembly structure comprises T-shaped blocks fixedly installed on the opposite surfaces of the upper mold plate and the lower mold plate respectively, T-shaped grooves provided on the upper surface of the base, the lower surface of the upper leveling plate and the opposite surfaces of the link plates respectively, and assembly bolts threadedly connected with the surfaces of the upper mold plate and the lower mold plate.

[0012] Preferably, the lower surface of the upper leveling plate, the upper surface of the base and the surface of the link plate are provided with threaded holes matched with the assembly bolts.

[0013] Preferably, the T-shaped groove allows the T-shaped block to be inserted.

[0014] Preferably, the linkage assembly comprises connecting rods, sliding grooves arranged on the two side surfaces of the base, the upper leveling plate and the link plates, and sliding blocks slidingly installed in the inner walls of the sliding grooves.

[0015] Preferably, the number of the connecting rods is multiple, and the two ends of the multiple connecting rods are respectively hinged with the surfaces of two adjacent sliding blocks.

[0016] Preferably, the multiple connecting rods connect the base, the plurality of link plates and the upper leveling plate into one body.

[0017] Compared with the prior art, the hydraulic leveling structure has the following advantages:

[0018] 1. By arranging the leveling mold, the upper mold plate and the lower mold plate are respectively installed on the base, the upper leveling plate and the link plate through the assembly structure, then the circuit board is placed on the lower mold plate, and then the hydraulic cylinder is driven to descend to drive the upper leveling plate and the link plate to move downward, so as to drive the multiple upper mold plates to be in contact with the multiple lower mold plates in turn and to level the circuit board. When the pressure is stabilized and leveled, the hydraulic cylinder is driven to ascend and the upper leveling plate and the plurality of link plates are driven to move upward through the linkage assembly, so as to drive the upper mold plate to separate from the lower mold plate, thereby the circuit board can be taken out. Compared with the prior art, the device can install multiple sets of upper mold plates and lower mold plates through the plurality of link plates, and can drive the plurality of link plates to descend and ascend synchronously through the linkage assembly, so as to drive multiple sets of upper mold plates and lower mold plates to ascend and descend, thereby multiple circuit boards can be leveled at one time, and the leveling efficiency of the circuit board is improved.

[0019] 2. By setting the assembly structure, when the T-shaped block is inserted into the T-shaped groove, then the assembly bolt is screwed into the threaded hole, so that the upper mold plate and the lower mold plate can be installed on the base, the upper leveling plate and the connecting plate, and the upper mold plate and the lower mold plate can be disassembled after the assembly bolt is loosened, so that the upper mold plate and the lower mold plate can be replaced according to different sizes of the circuit board, and the practicability of the device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] The drawings described herein are used to provide further understanding of the present application, and the schematic embodiments of the present application and the description thereof are used to explain the present application and do not constitute improper limitations. In the drawings:

[0021] Figure 1 It is a three-dimensional schematic view of the present application;

[0022] Figure 2 It is a three-dimensional schematic view of the rack of the present application;

[0023] Figure 3 It is a side cross-sectional schematic view of the present application;

[0024] Figure 4 It is a three-dimensional schematic view of the lower mold plate of the present application;

[0025] Figure 5 It is Figure 3 An enlarged schematic view of A in the middle.

[0026] In the drawing, serial number: 10 base, 11 support frame, 20 upper mold plate, 21 lower mold plate, 30 hydraulic cylinder, 31 upper leveling plate, 32 connecting plate, 40 guide rod, 50 T-shaped block, 51 assembly bolt, 60 connecting rod, 61 sliding block. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

[0028] Please refer to Figures 1-5 The present application provides a technical scheme: a LED display screen circuit board leveling mold, comprising: a rack and a leveling mold.

[0029] Referring to Figure 1 The rack comprises a base 10, a support frame 11 fixedly installed on the upper surface of the base 10, and a hydraulic leveling structure arranged in the support frame 11.

[0030] Referring to Figure 2The hydraulic leveling structure comprises a hydraulic cylinder 30 fixedly installed on the upper surface of the support frame 11, an upper leveling plate 31 fixedly installed on the telescopic end of the hydraulic cylinder 30, a plurality of link plates 32 arranged in the support frame 11, and a linkage assembly arranged on the two side surfaces of the link plates 32.

[0031] The upper surface of the base 10 is fixedly installed with a guide rod 40, the surfaces of the link plates 32 and the upper leveling plate 31 are each provided with a guide groove through which the guide rod 40 passes, and the upper end of the guide rod 40 is fixedly connected with the inner top wall of the support frame 11, so that the guide rod 40 can guide the link plates 32 and the upper leveling plate 31.

[0032] Referring to Figure 3 and Figure 5 , the linkage assembly comprises a plurality of connecting rods 60, a plurality of sliding grooves arranged on the two side surfaces of the base 10, the upper leveling plate 31 and the link plates 32, and a plurality of sliding blocks 61 slidingly installed on the inner walls of the sliding grooves, the two ends of each connecting rod 60 are hingedly connected with the surfaces of two adjacent sliding blocks 61, and the base 10, the plurality of link plates 32 and the upper leveling plate 31 are connected into an integrated whole by the plurality of connecting rods 60.

[0033] The driving of the hydraulic cylinder 30 to descend can drive the upper leveling plate 31 and the link plates 32 to move downward respectively by the transmission of the connecting rods 60, at this time, the sliding blocks 61 will slide along the sliding grooves and drive the connecting rods 60 to rotate, and when the hydraulic cylinder 30 rises, the upper leveling plate 31 and the plurality of link plates 32 can be driven to move upward synchronously by the connecting rods 60.

[0034] Referring to Figure 1 and Figure 4 , the leveling mold comprises an upper mold plate 20, a lower mold plate 21, and an assembly structure arranged on the surfaces of the upper mold plate 20 and the lower mold plate 21.

[0035] The assembly structure comprises a plurality of T-shaped blocks 50 fixedly installed on the opposite surfaces of the upper mold plate 20 and the lower mold plate 21 respectively, a plurality of T-shaped grooves respectively arranged on the upper surface of the base 10, the lower surface of the upper leveling plate 31 and the opposite surfaces of the link plates 32, and a plurality of assembly bolts 51 threadedly connected with the surfaces of the upper mold plate 20 and the lower mold plate 21, and the T-shaped grooves allow the T-shaped blocks 50 to be inserted.

[0036] The lower surface of the upper leveling plate 31, the upper surface of the base 10 and the surface of the link plates 32 are provided with threaded holes matched with the assembly bolts 51, after the T-shaped blocks 50 are inserted into the T-shaped grooves, the assembly bolts 51 are screwed into the threaded holes, so that the upper mold plate 20 and the lower mold plate 21 can be installed on the base 10, the upper leveling plate 31 and the link plates 32, and the upper mold plate 20 and the lower mold plate 21 can be disassembled after the assembly bolts 51 are loosened, so that the upper mold plate 20 and the lower mold plate 21 can be replaced according to the circuit boards of different sizes, and the practicability of the device is improved.

[0037] After the upper die plate 20 and the lower die plate 21 are respectively installed on the base 10, the upper leveling plate 31 and the link plate 32 by the assembly structure, then the circuit board is placed on the lower die plate 21, and then the hydraulic cylinder 30 is driven to descend, which can drive the plurality of upper die plates 20 to be in contact with the plurality of lower die plates 21 in turn, and the circuit board is leveled, when the voltage is stabilized and leveled, the hydraulic cylinder 30 is driven to ascend, and the linkage assembly can drive the upper leveling plate 31 and the multi-layer link plate 32 to move upward, so that the upper die plate 20 and the lower die plate 21 can be separated, and the circuit board can be taken out.

[0038] Compared with the prior art, the device can install a plurality of groups of upper die plates 20 and lower die plates 21 by using the multi-layer link plate 32, and the linkage assembly can drive the multi-layer link plate 32 to descend and ascend synchronously, so that the plurality of groups of upper die plates 20 and lower die plates 21 can be driven to ascend and descend, and then a plurality of circuit boards can be leveled at a time, and the leveling efficiency of the circuit board is improved.

[0039] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can make equivalent replacement or change according to the technical scheme and concept of the present application, which should be covered in the protection scope of the present application.

Claims

1. An LED display screen wiring board flattening mold characterized by, The utility model relates to a hydraulic leveling device for a machine frame, comprising: a machine frame, which comprises a base (10), a support frame (11) fixedly installed on the upper surface of the base (10), and a hydraulic leveling structure arranged inside the support frame (11); a leveling mold, which comprises an upper mold plate (20), a lower mold plate (21), and an assembly structure arranged on the surfaces of the upper mold plate (20) and the lower mold plate (21); the hydraulic leveling structure comprises a hydraulic cylinder (30) fixedly installed on the upper surface of the support frame (11), an upper leveling plate (31) fixedly installed on the telescopic end of the hydraulic cylinder (30), a plurality of layers of link plates (32) arranged inside the support frame (11), and a linkage assembly arranged on the two side surfaces of the link plates (32). 2.The LED display screen circuit board flattening mold of claim 1, wherein: The upper surface of the base (10) is fixedly installed with a guide rod (40), the surfaces of the link plates (32) and the upper leveling plate (31) are each provided with a guide groove through which the guide rod (40) passes, and the upper end of the guide rod (40) is fixedly connected with the inner top wall of the support frame (11). 3.The LED display screen circuit board flattening mold of claim 1, wherein: The assembly structure comprises T-shaped blocks (50) fixedly installed on the opposite surfaces of the upper mold plate (20) and the lower mold plate (21) respectively, T-shaped grooves respectively provided on the upper surface of the base (10), the lower surface of the upper leveling plate (31), and the opposite surfaces of the link plates (32), and assembly bolts (51) threadedly connected with the surfaces of the upper mold plate (20) and the lower mold plate (21).

4. The LED display screen circuit board flattening mold of claim 3, characterized in that: The lower surface of the upper leveling plate (31), the upper surface of the base (10), and the surface of the link plates (32) are each provided with a threaded hole matched with the assembly bolt (51).

5. The LED display screen circuit board flattening mold of claim 3, wherein: The T-shaped grooves allow the T-shaped blocks (50) to be inserted.

6. The LED display screen circuit board flattening mold of claim 5, wherein: The linkage assembly comprises connecting rods (60), sliding grooves provided on the two side surfaces of the base (10), the upper leveling plate (31), and the link plates (32), and sliding blocks (61) slidingly installed on the inner walls of the sliding grooves.

7. The LED display screen circuit board flattening mold of claim 6, wherein: The number of the connecting rods (60) is multiple, and the two ends of each of the multiple connecting rods (60) are hingedly connected with the surfaces of two adjacent sliding blocks (61). 8.The LED display screen circuit board flattening mold of claim 7, wherein: The multiple connecting rods (60) connect the base (10), the plurality of layers of link plates (32), and the upper leveling plate (31) into an integrated whole.

Images