Four-station whole solar silicon wafer printing machine

Abstract

The utility model discloses a four-station whole solar silicon wafer printing machine. The four-station whole solar silicon wafer printing machine comprises a base, and a plate feeding guide rail, a detection camera assembly, a turntable assembly, a lifting module, a UVW deviation rectifying and aligning mechanism and a plate discharging guide rail which are arranged on the base, the UVW deviation rectifying and aligning mechanism comprises two Y-axis modules, an X-axis module, a printing platform, a steel mesh frame and a printing scraper kit, the two Y-axis modules and the X-axis module are installed at the lower end of the printing platform, the driving ends of the Y-axis modules and the driving ends of the X-axis modules are connected to the steel mesh frame, and the printing scraper kit moves on the printing platform in the left-right direction. According to the four-station full-wafer solar silicon wafer printing machine, the two Y-axis modules and the X-axis module are matched with the detection camera assembly to achieve rotation movement with any point on the plane as the center and translation (X, Y and theta three-axis movement) in any direction, alignment of a steel mesh and a silicon wafer is met, and printing in the left-right direction is different from existing front-back printing.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer production, especially to a four-station whole piece solar silicon wafer printing machine. BACKGROUND

[0002] Photovoltaic solar silicon wafer is the core part of the solar power generation system, and is also the highest value part in the solar power generation system. The role of the silicon wafer is to convert solar energy into electric energy, and the electric energy is stored by the storage battery or directly loaded for work. In the current printing machine, the steel mesh is usually matched with the silicon wafer by the joint of X-axis (control left and right), Y-axis (control front and back) and T-axis (control rotation), which uses too many structures, resulting in poor precision. In addition, the front and back movement of the scraper is controlled by using a motor matched with a screw rod, which is low in efficiency and affects the process. SUMMARY

[0003] One purpose of the utility model is to provide a four-station whole piece solar silicon wafer printing machine, which reduces the structure of the T-axis, adopts the movement of two groups of Y-axis modules and one group of X-axis modules to be responsible for the rotation on the T-axis, saves the structure, improves the efficiency, and at the same time, the lifting part adopts a new lifting structure to replace the mechanism composed of splines, ball screws, synchronous wheels, synchronous belts and servo motors.

[0004] To achieve this purpose, the utility model adopts the following technical scheme:

[0005] A four-station whole piece solar silicon wafer printing machine, comprising a base and a plate feeding guide rail, a detection camera assembly, a turntable assembly, a lifting module, a UVW deviation correction alignment mechanism and a plate discharging guide rail installed on the base; the plate feeding guide rail and the plate discharging guide rail are respectively located on both sides of the base, the turntable assembly is in the middle of the base, the detection camera assembly is above the turntable assembly, two lifting modules are respectively located on both sides of the rear of the turntable assembly, and the lifting module is connected below the UVW deviation correction alignment mechanism; the UVW deviation correction alignment mechanism comprises two groups of Y-axis modules, one group of X-axis modules, a printing platform, a steel mesh frame and a printing scraper suite, the two groups of Y-axis modules and the group of X-axis modules are all installed at the lower end of the printing platform, the driving end of the Y-axis module and the driving end of the X-axis module are both connected to the steel mesh frame, a transverse scraper module is installed on the printing platform, the driving end of the transverse scraper module is connected to the printing scraper suite, and the printing scraper suite moves on the printing platform along the left-right direction.

[0006] As a preferred technical scheme, the X-axis module and the Y-axis module adopt the same module mechanism, the module mechanism comprises a module base plate, a module motor, an adjusting lead screw and an adjusting sliding table, the driving end of the module motor is in transmission connection with the adjusting lead screw, the adjusting lead screw is in threaded connection with an adjusting nut under the adjusting sliding table, the adjusting sliding table slides along the length direction of the adjusting lead screw, a connecting bearing is arranged on the adjusting sliding table, the connecting bearing slides on the adjusting sliding table, the moving direction of the connecting bearing is perpendicular to the moving direction of the adjusting sliding table, and the edge of the steel mesh frame is locked in the connecting bearing.

[0007] As a preferred technical scheme, the plate feeding guide rail is provided with a clamping motor, the driving end of the clamping motor is in key connection with a clamping synchronous wheel, the clamping synchronous wheel is in transmission connection with a clamping synchronous belt, the clamping synchronous belt is fixed with a clamping plate, and the clamping plate is rotatably connected with a clamping wheel.

[0008] As a preferred technical scheme, the rotating disc assembly comprises a circular rotating disc, an electrical integrated slip ring and a rotating disc motor, four groups of workstations are arranged on the periphery of the circular rotating disc, each group of the workstations is provided with a whole piece printing position, the driving end of the rotating disc motor is vertically upwardly connected with the electrical integrated slip ring, the middle part of the circular rotating disc is connected with the electrical integrated slip ring, the lower end of the circular rotating disc is rotatably connected with a paper roll conveying component, the paper roll conveying component comprises an unwinding shaft and a winding shaft, a paper roll is in transmission connection between the unwinding shaft and the winding shaft, the paper roll passes through the whole piece printing position and carries a silicon wafer, plays a role of conveying the silicon wafer, the paper roll has air permeability, the paper roll conveying component conveys the silicon wafer to the workstations of the circular rotating disc and to the whole piece printing position.

[0009] As a preferred technical scheme, the positions between the four groups of the workstations of the circular rotating disc form a fan-shaped area, together with the middle position of the circular rotating disc, stores a device and a control assembly, and then covers a protective cover, each of the whole piece printing positions is provided with an air-permeable negative pressure plate, a plurality of air-permeable holes are arranged on the air-permeable negative pressure plate, and the air-permeable holes pass through the paper roll to adsorb and fix the silicon wafer on the whole piece printing position.

[0010] As a preferred technical scheme, the detection camera assembly comprises an in-plate vision module and an out-plate vision module, the in-plate vision module is provided with one in-plate camera and four mark point cameras, the upper end of the mark point camera is adjusted on the in-plate vision module along the front-rear direction, the out-plate vision module is provided with one out-plate camera, and the upper end of the out-plate camera is adjusted on the out-plate vision module along the front-rear direction.

[0011] As a preferred technical scheme, the lower end of the printing doctor blade set is connected with a slurry doctor blade, the upper end of the printing doctor blade set is installed with a doctor blade motor, the doctor blade motor controls the slurry doctor blade to move along the vertical direction through a ball screw and a ball nut, the lower end of the printing doctor blade set is also connected with a ink return doctor blade, the upper end of the printing doctor blade set is also installed with an ink return motor, the ink return motor also controls an ink return doctor seat with the ink return doctor blade to move along the vertical direction through a ball screw and a ball nut, and the two ends of the ink return doctor blade are locked on the two ends of the ink return doctor seat respectively.

[0012] As a preferred technical scheme, the lifting module comprises side supports, the upper end of the side support is installed with a lifting servo motor, the driving end of the lifting servo motor is connected with a lifting ball screw, the two sides of the printing module are connected with lifting plates, the outer side of the lifting plate is fixed with a lifting ball nut, the lifting ball screw is in threaded transmission connection with the lifting ball nut, the lifting plate slides on the side support along the vertical direction, the side support is installed with a lifting guide rail, and the outer side of the lifting plate is fixed with a lifting sliding block which slides on the lifting guide rail.

[0013] As a preferred technical scheme, the broken piece lifting cylinder is installed on the plate discharging guide rail, the driving end of the broken piece lifting cylinder is connected upward with a broken piece lifting plate, the two sides of the broken piece lifting plate are located on the outer side of the plate discharging guide rail, the rear end of the plate discharging guide rail is installed with a detection support, the top of the detection support is installed with a sensor, the sensor is located above the plate discharging guide rail, and the sensor is used for sensing whether the back drying furnace or sintering furnace is blocked.

[0014] The four-station whole-silicon wafer printing machine can realize rotation movement and arbitrary direction translation (X, Y and θ three-axis movement) with any point on a plane as the center, meets the alignment between the steel net and the silicon wafer, and distinguishes the printing in the left and right directions from the existing printing in the front and back directions. BRIEF DESCRIPTION OF DRAWINGS

[0015] The utility model will be further explained in detail in the basis of the drawings and examples.

[0016] Figure 1 The first structure schematic view of the four-station whole-silicon wafer printing machine is described in the examples;

[0017] Figure 2 The second structure schematic view of the four-station whole-silicon wafer printing machine is described in the examples;

[0018] Figure 3 Structure diagram of the plate-in guide rail described in the embodiment;

[0019] Figure 4 Structure diagram of the detection camera assembly described in the embodiment;

[0020] Figure 5 First structure diagram of the turntable assembly described in the embodiment;

[0021] Figure 6 Second structure diagram of the turntable assembly described in the embodiment;

[0022] Figure 7 Structure diagram of the turntable motor described in the embodiment;

[0023] Figure 8 Combined structure diagram of the UVW deviation correction alignment mechanism and the lifting module described in the embodiment;

[0024] Figure 9 Structure diagram of the UVW deviation correction alignment mechanism described in the embodiment;

[0025] Figure 10 Exploded diagram of the X-axis module described in the embodiment;

[0026] Figure 11 Structure diagram of the lifting module described in the embodiment;

[0027] Figure 12 Structure diagram of the printing squeegee kit described in the embodiment;

[0028] Figure 13 Exploded diagram of the printing squeegee kit described in the embodiment;

[0029] Figure 14 Structure diagram of the plate-out guide rail described in the embodiment.

[0030] Figures 1 to 14 In the embodiment:

[0031] 1, plate-in guide rail; 2, detection camera assembly; 3, turntable assembly; 4, lifting module; 5, UVW deviation correction alignment mechanism; 6, plate-out guide rail; 7, base;

[0032] 101, clamping motor; 102, clamping plate; 103, clamping wheel;

[0033] 201, plate-in vision module; 202, plate-out vision module; 203, mark point camera; 204, plate-out camera;

[0034] 301. Circular turntable; 302. Electrically integrated slip ring; 303. Turntable motor; 304. Printing position; 305. Unwinding shaft; 306. Rewinding shaft; 307. Protective cover; 308. Ventilated negative pressure plate;

[0035] 401. Side bracket; 402. Lifting servo motor; 403. Lifting ball screw; 404. Lifting plate; 405. Lifting guide rail;

[0036] 501. Y-axis module; 502. X-axis module; 503. Printing platform; 504. Steel mesh frame; 505. Printing squeegee kit; 506. Horizontal squeegee module; 507. Module base plate; 508. Module motor; 509. Adjusting screw; 510. Adjusting slide; 511. Connecting bearing; 512. Slurry squeegee; 513. Squeegee motor; 514. Ink return blade; 515. Ink return motor; 516. Ink return blade holder;

[0037] 601. Fragment lifting cylinder; 602. Fragment lifting plate; 603. Detection bracket; 604. Sensor. Detailed Implementation

[0038] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0039] like Figures 1 to 14 As shown in this embodiment, a four-station solar silicon wafer printing machine includes a base 7 and an infeed guide rail 1, a detection camera assembly 2, a turntable assembly 3, a lifting module 4, a UVW alignment mechanism 5, and an output guide rail 6 mounted on the base 7. The infeed guide rail 1 and the output guide rail 6 are located on both sides of the base 7, the turntable assembly 3 is located in the middle of the base 7, the detection camera assembly 2 is located above the turntable assembly 3, and the two lifting modules 4 are located on both sides behind the turntable assembly 3. The lifting modules 4 are connected to the lower part of the UVW alignment mechanism 5.

[0040] The front end places the silicon wafer onto the infeed guide rail 1, which then transfers the wafer onto the turntable assembly 3. The detection camera assembly 2 performs visual alignment, and the turntable assembly 3 rotates the wafer to the rear. The two sets of Y-axis modules 501 and one set of X-axis modules 502 on the UVW alignment mechanism 5 control the alignment in the X-axis, Y-axis, and T-axis directions, ensuring that the UVW alignment mechanism 5 with the stencil is aligned with the position of the silicon wafer. The lifting module 4 controls the stencil to move down onto the silicon wafer, scraping the paste onto the wafer. After lifting the UVW alignment mechanism 5, the turntable assembly 3 transfers the silicon wafer to the output guide rail 6 for output.

[0041] The UVW deviation correction alignment mechanism 5 is a high-precision moving structure, which is specially designed for high-precision alignment equipment, and is also commonly referred to as an XXY platform. As a three-axis parallel motion mechanism, the UVW deviation correction alignment mechanism 5 can realize rotation movement with any point in the plane as the center and translation in any direction (three-axis movement of X, Y and θ in the plane) by controlling the parallel movement of three linear moving structures. The UVW deviation correction alignment mechanism 5 can realize high-precision alignment function in cooperation with the visual module described below, and can be applied in the printing industry.

[0042] More specifically, the implementation process of the UVW deviation correction alignment mechanism 5 includes determining the conversion matrix from the camera coordinate system to the UVW platform coordinate system through a visual calibration method, and obtaining the x, y and θ offset between the marker template position and the object to be corrected through the visual module based on the coordinate value of the origin coordinate system of the UVW deviation correction alignment mechanism 5. Then, according to the formula, the initial coordinates of the three axes are input, the rotation center is set to (0, 0), the θ offset is input, the new coordinate values of the UVW three-axis and the new coordinates of the object to be corrected, and the corresponding feed amount of the three motors are obtained. This series of operations disassembles the movement process into translation and rotation parts, respectively calculates the motor feed amount, so as to realize accurate automatic positioning, and the alignment accuracy can reach microns.

[0043] The specific structure is as follows:

[0044] The UVW deviation correction alignment mechanism 5 includes two groups of Y-axis modules 501, one group of X-axis modules 502, a printing platform 503, a steel mesh frame 504 and a printing squeegee set 505. The two groups of Y-axis modules 501 and the group of X-axis modules 502 are both installed at the lower end of the printing platform 503. The driving end of the Y-axis module 501 and the driving end of the X-axis module 502 are both connected to the steel mesh frame 504. The printing platform 503 is installed with a transverse squeegee module 506, the driving end of which is connected with the printing squeegee set 505, and the printing squeegee set 505 moves on the printing platform 503 along the left-right direction.

[0045] The X-axis module 502 and the Y-axis module 501 use the same module mechanism. The module mechanism includes a module base plate 507, a module motor 508, an adjusting screw 509, and an adjusting slide 510. The drive end of the module motor 508 is connected to the adjusting screw 509. The adjusting screw 509 is threadedly connected to the adjusting nut under the adjusting slide 510. The adjusting slide 510 slides along the length of the adjusting screw 509. A connecting bearing 511 is provided on the adjusting slide 510. The connecting bearing 511 slides on the adjusting slide 510, and the direction of movement of the connecting bearing 511 is perpendicular to the direction of movement of the adjusting slide 510. The edge of the steel mesh frame 504 is locked in the connecting bearing 511. Two sets of Y-axis modules 501 and one set of X-axis modules 502 jointly control the T-axis rotation of a steel mesh frame 504. An auxiliary bearing is provided on the steel mesh frame 504. An auxiliary X-axis slide rail is provided on the UVW alignment mechanism 5. An auxiliary X-axis slider slides on the auxiliary X-axis slide rail. An auxiliary Y-axis slider is fixed on the auxiliary X-axis slider. The auxiliary Y-axis slider is slidably connected to the auxiliary Y-axis slide rail. The auxiliary bearing is installed on the auxiliary Y-axis slide rail. Together with the two sets of X-axis modules 502 and Y-axis modules 501, the T-axis of the steel mesh frame 504 is adjusted.

[0046] A snapping motor 101 is installed on the feed guide rail 1. The drive end of the snapping motor 101 is keyed to a snapping synchronous pulley. The snapping synchronous pulley is driven by a snapping synchronous belt. A snapping plate 102 is fixed on the snapping synchronous belt. A snapping wheel 103 is rotatably connected to the snapping plate 102. When the silicon wafer being transported from the front is not in a flat position, the snapping motor 101 controls the snapping synchronous pulley to rotate, which in turn drives the snapping synchronous belt to make the snapping plates 102 on both sides of the feed guide rail 1 move towards the middle, flattening the silicon wafer in the middle position of the feed guide rail 1. The snapping wheel 103 reduces the hard collision between the snapping plate 102 and the side of the silicon wafer.

[0047] The turntable assembly 3 includes a circular turntable 301, an integrated electro-optical slip ring 302, and a turntable motor 303. Four workstations are installed around the circular turntable 301, and each workstation has a whole-piece printing position 304. The drive end of the turntable motor 303 is vertically connected to the integrated electro-optical slip ring 302. The middle part of the circular turntable 301 is connected to the integrated electro-optical slip ring 302. The lower end of the circular turntable 301 is rotatably connected to a roll paper transport component. The roll paper transport component includes an unwinding shaft 305 and a rewinding shaft 306. A roll of paper is driven between the unwinding shaft 305 and the rewinding shaft 306. The roll of paper passes through the whole-piece printing position 304 and carries the silicon wafer, thus transporting the silicon wafer. The roll of paper is breathable. The roll paper transport component conveys the silicon wafer to the workstations of the circular turntable 301 and to the whole-piece printing position 304.

[0048] The positions between the four groups of workstations of the circular turntable 301 form a sector area, and the middle position of the circular turntable 301 jointly stores the electrical components and control assemblies, and then a protective cover 307 is covered, and each whole piece printing position 304 is provided with a breathable negative pressure plate 308, and the breathable negative pressure plate 308 is provided with a plurality of breathable holes, and the breathable holes are used to adsorb and fix the silicon wafer on the whole piece printing position 304 through the paper roll.

[0049] The silicon wafer in the plate feeding guide rail 1 is placed on the whole piece printing position 304, and the circular turntable 301 is driven to rotate in the horizontal direction by the power provided by the turntable motor 303 and the electrical integrated slip ring 302, so as to drive the silicon wafer to move below the steel mesh frame 504, and at the same time, the printed silicon wafer is moved from below the steel mesh frame 504 to the front of the plate discharging guide rail 6, and the winding shaft 306 and the unwinding shaft 305 are synchronously rotated to clean the whole piece printing position 304.

[0050] The detection camera assembly 2 includes a plate feeding vision module 201 and a plate discharging vision module 202, the plate feeding vision module 201 is provided with one plate feeding camera and four mark point cameras 203, the four mark point cameras 203 are located around the plate feeding vision module 201, and one plate feeding camera is located in the middle of the plate feeding vision module 201, the plate feeding camera is used for detecting whether there is a fragment, and the mark point camera 203 is used for detecting the current position of the silicon wafer, and the upper end of the mark point camera 203 is adjusted on the plate feeding vision module 201 along the front-rear direction, and the plate discharging vision module 202 is provided with one plate discharging camera 204, and the upper end of the plate discharging camera 204 is adjusted on the plate discharging vision module 202 along the front-rear direction.

[0051] The silicon wafer conveyed from the plate feeding guide rail 1 is brought to the whole piece printing position 304 under the action of the paper roll, the plate feeding vision module 201 above shoots and positions the silicon wafer, according to the position of the silicon wafer, the steel mesh of the UVW deviation correction alignment mechanism 5 is independently adjusted in the XYT direction to meet the position requirement of the silicon wafer, and when the plate is discharged, the plate discharging vision module 202 shoots the printing of the silicon wafer again, and after finishing, the paper roll assists the silicon wafer to leave the whole piece printing position 304 and enters the plate discharging guide rail 6.

[0052] The lifting module 4 includes a side support 401, the upper end of the side support 401 is provided with a lifting servo motor 402, the driving end of the lifting servo motor 402 is connected with a lifting ball screw 403, the two sides of the printing module are connected with a lifting plate 404, the outer side of the lifting plate 404 is fixed with a lifting ball nut, the lifting ball screw 403 is in threaded transmission connection with the lifting ball nut, the lifting plate 404 slides on the side support 401 along the vertical direction, the side support 401 is provided with a lifting guide rail 405, the outer side of the lifting plate 404 is fixed with a lifting sliding block, and the lifting sliding block slides on the lifting guide rail 405.

[0053] When the UVW deviation correction and alignment mechanism 5 is lifted, the lifting servo motor 402 controls the lifting ball screw 403 to rotate, the lifting plate 404 with the lifting ball nut drives the UVW deviation correction and alignment mechanism 5 to move along the direction of the lifting guide rail 405, the accuracy is improved, and the moving speed is also faster.

[0054] The lower end of the printing doctor blade set 505 is connected with the slurry doctor blade 512, the upper end of the printing doctor blade set 505 is installed with the doctor blade motor 513, the doctor blade motor 513 controls the slurry doctor blade 512 to move along the vertical direction through the ball screw and the ball nut, the lower end of the printing doctor blade set 505 is also connected with the ink return blade 514, the upper end of the printing doctor blade set 505 is also installed with the ink return motor 515, the ink return motor 515 also controls the ink return blade holder 516 with the ink return blade 514 to move along the vertical direction through the ball screw and the ball nut, and the two ends of the ink return blade 514 are respectively locked on the two ends of the ink return blade holder 516.

[0055] When the slurry is scraped, the doctor blade motor 513 controls the slurry doctor blade 512 to move downward to the steel mesh, the transverse doctor blade module 506 moves forward and backward, and the printing doctor blade set 505 moves in linkage, so that the slurry doctor blade 512 moves forward and backward to scrape the slurry from the steel mesh to the silicon wafer.

[0056] The broken piece lifting cylinder 601 is installed on the plate ejection guide rail 6, the driving end of the broken piece lifting cylinder 601 is upwardly connected with the broken piece lifting plate 602, the two sides of the broken piece lifting plate 602 are located outside the plate ejection guide rail 6, the rear end of the plate ejection guide rail 6 is installed with the detection bracket 603, the top of the detection bracket 603 is installed with the sensor 604, the sensor 604 is located above the plate ejection guide rail 6, and the sensor 604 is used for sensing whether the broken piece exists in the rear drying furnace or sintering furnace.

[0057] When the silicon wafer needs to be transferred or detected on the plate ejection guide rail 6, the broken piece lifting cylinder 601 can lift the broken piece lifting plate 602 to separate the silicon wafer for operation, the sensor 604 is used for sensing the existence of the silicon wafer at the tail end of the plate ejection guide rail 6, and the subsequent butt joint is prepared.

[0058] It should be noted that the above specific embodiments are only preferred embodiments of the present application and the technical principles applied, and any changes or replacements easily thought by those skilled in the art within the technical range disclosed by the present application should be covered in the protection range of the present application.

Claims

1. A four-station whole wafer solar silicon wafer printer characterized by, The application relates to a printing device, which comprises a base, an in-plate guide rail, a detection camera assembly, a rotating disc assembly, a lifting module, a UVW deviation rectifying and aligning mechanism and an out-plate guide rail.

2. A four-station whole wafer solar silicon printing machine according to claim 1, wherein, The X-axis module and the Y-axis module adopt the same module mechanism, which comprises a module base plate, a module motor, an adjusting screw rod and an adjusting sliding table.

3. A four-station, whole-wafer, solar silicon wafer printer according to claim 1, wherein, The in-plate guide rail is provided with a clamping motor, the driving end of the clamping motor is key-connected with a clamping synchronous wheel, the clamping synchronous wheel is transmission-connected with a clamping synchronous belt, the clamping synchronous belt is fixed with a clamping plate, and the clamping plate is rotationally connected with a clamping wheel.

4. The four-station, whole-wafer, solar silicon wafer printer of claim 1, wherein, The rotating disc assembly comprises a circular rotating disc, an electrical integrated sliding ring and a rotating disc motor.

5. A four-station, whole-wafer, solar silicon wafer printer according to claim 4, wherein, The positions between the four groups of the work stations of the circular rotating disc form a sector area, which, together with the middle position of the circular rotating disc, stores an electric element and a control assembly, and then a protective cover is covered. Each of the whole-printing positions is provided with a breathable negative pressure plate, the breathable negative pressure plate is provided with a plurality of breathable holes, the silicon wafer is adsorbed and fixed on the whole-printing position through the breathable holes and the roll paper.

6. A four-station, whole-wafer, solar silicon wafer printer according to claim 1, wherein, The detection camera assembly comprises an incoming plate vision module and an outgoing plate vision module, the incoming plate vision module is provided with one incoming plate camera and four mark point cameras, the upper ends of the mark point cameras are adjusted on the incoming plate vision module along the front-back direction, the outgoing plate vision module is provided with one outgoing plate camera, the upper end of the outgoing plate camera is adjusted on the outgoing plate vision module along the front-back direction.

7. A four-station, whole-wafer, solar silicon wafer printer according to claim 1, wherein, The lower end of the printing doctor blade set is connected with a slurry doctor blade, the upper end of the printing doctor blade set is installed with a doctor blade motor, the doctor blade motor controls the slurry doctor blade to move along the vertical direction through the ball screw and the ball nut, the lower end of the printing doctor blade set is also connected with an ink return blade, the upper end of the printing doctor blade set is also installed with an ink return motor, the ink return motor also controls the ink return blade holder with the ink return blade to move along the vertical direction through the ball screw and the ball nut, the two ends of the ink return blade are respectively locked on the two ends of the ink return blade holder.

8. A four-station, whole-wafer, solar silicon wafer printer according to claim 1, wherein, The lifting module comprises a side support, the upper end of the side support is installed with a lifting servo motor, the driving end of the lifting servo motor is connected with a lifting ball screw, the two sides of the UVW deviation correction alignment mechanism are connected with lifting plates, the outer side of the lifting plate is fixed with a lifting ball nut, the lifting ball screw and the lifting ball nut are in threaded transmission connection, the lifting plate slides on the side support along the vertical direction, the side support is installed with a lifting guide rail, the outer side of the lifting plate is fixed with a lifting sliding block, the lifting sliding block slides on the lifting guide rail.

9. The four-station, whole-wafer, solar silicon printing machine of claim 1, wherein, The outgoing plate guide rail is installed with a broken piece lifting cylinder, the driving end of the broken piece lifting cylinder is connected upward with a broken piece lifting plate, the two sides of the broken piece lifting plate are located on the outer side of the outgoing plate guide rail, the rear end of the outgoing plate guide rail is installed with a detection support, the top of the detection support is installed with a sensor, the sensor is located above the outgoing plate guide rail, the sensor is used to sense whether the rear drying furnace or sintering furnace exists the situation of blocking pieces.

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