Copper-clad ceramic substrate carrier

Abstract

The utility model discloses a copper-clad ceramic substrate carrier which comprises a placing shell, an insertion air bag is installed at the bottom of the placing shell, a fixing sleeve is fixedly installed on the outer side of the placing shell, movable rods are installed on the two sides of the placing shell in a sliding and penetrating mode, and a movable plate is installed at one end of each movable rod. An adjusting assembly used for driving the moving plate to move is installed on one side of the moving plate, a plurality of limiting plates are installed on one side of the moving plate, and a bearing air bag used for bearing the ceramic substrate is installed at the bottom of an inner cavity of the containing shell. The rotary knob is rotated to drive the threaded rod to rotate, so that the movable plate is driven to move in the installation direction of the movable rod, the limiting plates are driven to move, the distance between every two adjacent limiting plates can be changed, and the distance between every two adjacent limiting plates is adjusted to be matched with the thickness of a copper-coated ceramic substrate. Therefore, the copper-clad ceramic substrates with different thicknesses can be limited.

Description

TECHNICAL FIELD

[0001] The utility model relates to ceramic substrate carrier technical field, concretely is a kind of copper clad ceramic substrate carrier. BACKGROUND

[0002] In the field of electronic manufacturing, copper clad ceramic substrate as an important electronic component carrier, it needs to use carrier to ensure its stability and safety in production, transportation and storage process.

[0003] The limiting width of traditional carrier is usually fixed, it is difficult to adapt to copper clad ceramic substrate of different thicknesses, when different specifications of substrate need to be loaded in the production process, different carriers often need to be replaced, which not only increases cost, but also reduces production efficiency. For this purpose, a kind of copper clad ceramic substrate carrier is provided. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of copper clad ceramic substrate carrier to solve the problems raised in the above background.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of copper clad ceramic substrate carrier, including placing shell, the placing shell bottom is equipped with insertion air bag, the placing shell outer side is fixedly installed with fixed sleeve, the both sides of the placing shell are slidably penetrated and are equipped with movable rod, the movable rod one end is equipped with moving plate;

[0006] The moving plate one side is equipped with the adjusting assembly for driving moving plate movement, the moving plate one side is equipped with a plurality of limit plates, the placing shell inner chamber bottom is equipped with the load air bag for carrying ceramic substrate.

[0007] Preferably, the cross-sectional dimension of the insertion air bag matches the cross-sectional dimension of the placing shell inner chamber, and the inner side cross-sectional dimension of the fixed sleeve matches the outer side cross-sectional dimension of the placing shell.

[0008] Preferably, the adjusting assembly includes a threaded rod, the threaded rod is rotatably installed on the side of the moving plate, and the threaded rod is threaded through the placing shell.

[0009] Preferably, the threaded rod one end is fixedly installed with knob.

[0010] Preferably, a plurality of limit plates on the same side are distributed in a straight line at equal intervals on the side of the moving plate, and the limit plates on the two sides are staggered.

[0011] Preferably, the insertion air bag and the load air bag are made of PVC material, and the inner cavities of the insertion air bag and the load air bag are filled with air.

[0012] Compared with the prior art, the utility model has the beneficial effects that:

[0013] 1. The copper clad ceramic substrate carrier, the copper clad ceramic substrate is placed between the position of two adjacent limiting plates, the bottom surface of the copper clad ceramic substrate is in contact with the bearing air bag, the copper clad ceramic substrate is in a horizontal position, and the position is limited by two moving plates and two limiting plates; after the loading of one placing shell is completed, the other placing shell is covered on the top surface of the placing shell, so that the insertion air bag at the bottom of the upper placing shell enters the lower placing shell, and the fixing sleeve on the outer side of the upper placing shell is sleeved on the outer side of the lower placing shell; the insertion air bag at the bottom of the upper placing shell and the bearing air bag in the inner cavity of the lower placing shell limit the vertical position of the copper clad ceramic substrate, and the bearing air bag is soft, which can ensure the safety of the copper clad ceramic substrate during transportation.

[0014] 2. The copper clad ceramic substrate carrier, the threaded rod is driven to rotate by rotating the knob, so that the moving plate moves along the installation direction of the movable rod, thereby driving the limiting plate to move, and the spacing between the two adjacent limiting plates can be changed, and the spacing between the two adjacent limiting plates can be adjusted to adapt to the thickness of the copper clad ceramic substrate, so that the copper clad ceramic substrate of different thicknesses can be limited, and the universality of the carrier is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Fig. 2 It is a schematic diagram of the bottom structure of the utility model;

[0017] Fig. 3 It is a schematic diagram of the cross-sectional structure of the utility model.

[0018] In the figure: 1, placing shell; 2, fixing sleeve; 3, insertion air bag; 4, movable rod; 5, moving plate; 6, threaded rod; 7, knob; 8, limiting plate; 9, bearing air bag. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0020] Embodiment one

[0021] Please refer to Figs. 1-3 The utility model provides a copper clad ceramic substrate carrier, including placing shell 1, placing shell 1 bottom installs insertion air bag 3, placing shell 1 outer side fixed installation has fixed sleeve 2, and the both sides of placing shell 1 are slidably penetrated and installed movable rod 4, and movable rod 4 one end installs moving plate 5.

[0022] The adjusting assembly is arranged on one side of the moving plate 5, and a plurality of limiting plates 8 are arranged on one side of the moving plate 5; and a bearing air bag 9 for bearing the ceramic substrate is arranged at the bottom of the inner cavity of the placing shell 1.

[0023] Specifically, the threaded rod 6 is driven to rotate by rotating the knob 7, so that the moving plate 5 is driven to move along the direction in which the movable rod 4 is arranged, so that the limiting plate 8 is driven to move, and then the spacing between two adjacent limiting plates 8 can be changed, and the spacing between two adjacent limiting plates 8 is adjusted to be adapted to the thickness of the copper-clad ceramic substrate, so that the copper-clad ceramic substrates with different thicknesses can be limited.

[0024] The cross-sectional dimension of the insertion air bag 3 matches the cross-sectional dimension of the inner cavity of the placing shell 1, and the cross-sectional dimension of the inner side of the fixing sleeve 2 matches the cross-sectional dimension of the outer side of the placing shell 1, so that the insertion air bag 3 can pass through the inner cavity of the placing shell 1, and the fixing sleeve 2 can be sleeved on the outer side of the placing shell 1, so that the upper and lower placing shells 1 are more stable when being stacked.

[0025] The adjusting assembly comprises a threaded rod 6, the threaded rod 6 is rotatably arranged on one side of the moving plate 5, the threaded rod 6 is threaded through the placing shell 1, one end of the threaded rod 6 is fixedly provided with a knob 7, and the threaded rod 6 is driven to rotate by rotating the knob 7, so that the moving plate 5 is driven to move, and then the limiting plate 8 on the surface of the moving plate 5 is driven to move.

[0026] The plurality of limiting plates 8 on the same side are arranged in a straight line and at equal intervals on one side of the moving plate 5, and the limiting plates 8 on the two sides are arranged in a staggered manner, and two adjacent limiting plates 8 in the staggered manner can limit the copper-clad ceramic substrate.

[0027] The insertion air bag 3 and the bearing air bag 9 are made of PVC material, and the inner cavities of the insertion air bag 3 and the bearing air bag 9 are filled with air. The insertion air bag 3 and the bearing air bag 9 are soft in material and are internally filled with air, and when the ceramic substrate is limited, the ceramic substrate can be prevented from being damaged.

[0028] Working principle: the utility model discloses a copper-clad ceramic substrate carrier, when using, the copper-clad ceramic substrate is placed between two adjacent limiting plates 8, the bottom surface of the copper-clad ceramic substrate is in contact with the bearing air bag 9, the copper-clad ceramic substrate is in a horizontal position, is limited by two moving plates 5 and two limiting plates 8, after loading is finished to one placing shell 1, another placing shell 1 is covered on the top surface of the placing shell 1, so that the insertion air bag 3 at the bottom of the upper placing shell 1 enters the lower placing shell 1, and the fixing sleeve 2 on the outer side of the upper placing shell 1 is sleeved on the outer side of the lower placing shell 1, the insertion air bag 3 at the bottom of the upper placing shell 1 and the bearing air bag 9 in the inner cavity of the lower placing shell 1 limit the position of the copper-clad ceramic substrate in the vertical direction.

[0029] By rotating the knob 7 to drive the threaded rod 6 to rotate, the moving plate 5 is driven to move along the installation direction of the movable rod 4, thereby driving the limiting plate 8 to move, and then the spacing between the adjacent two limiting plates 8 can be changed, and the spacing between the adjacent two limiting plates 8 is adjusted to adapt to the thickness of the copper-clad ceramic substrate, so that the copper-clad ceramic substrates with different thicknesses can be limited.

[0030] The contents not described in detail in the description belong to the prior art known to those skilled in the art.

[0031] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacement to part of the technical features, and any modification, equivalent replacement, improvement, etc. within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A copper clad ceramic substrate carrier comprising a housing (1), characterized in that: The bottom of the placing shell (1) is provided with an inserting air bag (3), the outer side of the placing shell (1) is fixedly provided with a fixing sleeve (2), the both sides of the placing shell (1) are slidably penetratedly provided with movable rods (4), and one end of each movable rod (4) is provided with a moving plate (5). The moving plate (5) is provided with an adjusting assembly for driving the moving plate (5) to move, and the moving plate (5) is provided with a plurality of limiting plates (8) on one side, and the bottom of the inner cavity of the placing shell (1) is provided with a bearing air bag (9) for bearing the ceramic substrate.

2. The copper clad ceramic substrate carrier of claim 1, wherein: The cross-sectional size of the inserting air bag (3) matches the cross-sectional size of the inner cavity of the placing shell (1), and the cross-sectional size of the inner side of the fixing sleeve (2) matches the cross-sectional size of the outer side of the placing shell (1).

3. The copper clad ceramic substrate carrier of claim 1, wherein: The adjusting assembly comprises a threaded rod (6), the threaded rod (6) is rotatably installed on one side of the moving plate (5), and the threaded rod (6) is threadedly penetrated through the placing shell (1).

4. The copper clad ceramic substrate carrier of claim 3, wherein: One end of the threaded rod (6) is fixedly provided with a knob (7).

5. The copper clad ceramic substrate carrier of claim 1, wherein: The plurality of limiting plates (8) on the same side are linearly and equidistantly distributed on one side of the moving plate (5), and the limiting plates (8) on the both sides are staggered.

6. The copper clad ceramic substrate carrier of claim 1, wherein: The inserting air bag (3) and the bearing air bag (9) are made of PVC material, and the inner cavities of the inserting air bag (3) and the bearing air bag (9) are filled with air.

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