Robot and sensor integration module thereof

Abstract

The utility model discloses a robot and a sensor integrated module thereof, and relates to the technical field of sensors. The sensor integration module comprises a supporting assembly, a laser detection circuit board used for carrying out laser emission and receiving laser signals, and a video signal processing circuit board used for receiving and processing video signals. Wherein the laser detection circuit board and the video signal processing circuit board are both installed on the supporting assembly, and a non-zero included angle is formed between the video signal processing circuit board and the laser detection circuit board. And the heat dissipation capability of the sensor integrated module is high.

Description

TECHNICAL FIELD

[0001] The utility model relates to sensor technical field more specifically, relate to a kind of sensor integrated module. In addition, the utility model further relates to a kind of robot comprising the above-mentioned sensor integrated module. BACKGROUND

[0002] Robot is a kind of intelligent machine capable of semi-autonomous or fully autonomous work, and robot can execute tasks such as work or movement by programming and automatic control, and robot generally needs to identify the surrounding environment to run smoothly and prevent collision.

[0003] To realize the identification of environment, robot often carries laser radar and camera and other sensors, but when the number of sensors is large, the space on the robot body that can be arranged with sensors may be insufficient, and if multiple sensors are integrated into a module to reduce the volume, heat dissipation problems may occur.

[0004] In summary, how to improve the heat dissipation efficiency of the sensor integrated module is a problem that needs to be solved by the technical personnel in the field. UTILITY MODEL CONTENT

[0005] Therefore, the utility model aims to provide a sensor integrated module with good heat dissipation effect.

[0006] Another object of the utility model is to provide a robot comprising the above-mentioned sensor integrated module.

[0007] To achieve the above-mentioned object, the utility model provides the following technical scheme:

[0008] A sensor integrated module comprises a support assembly, a laser detection circuit board for emitting and receiving laser signals, and a video signal processing circuit board for receiving and processing video signals.

[0009] The laser detection circuit board and the video signal processing circuit board are both installed on the support assembly, and the video signal processing circuit board and the laser detection circuit board have a non-zero included angle.

[0010] Preferably, the video signal processing circuit board is perpendicular to the laser detection circuit board.

[0011] Preferably, the laser detection circuit board comprises a laser emission circuit board for emitting laser and a laser receiving circuit board for receiving laser, the laser emission circuit board and the laser receiving circuit board are arranged in layers, and the projection of the laser emission circuit board and the laser receiving circuit board on the plane where the front surface of the laser emission circuit board is located is at least partially staggered.

[0012] Preferably, the number of the laser emission circuit boards is two, and the laser receiving circuit board is located between the two laser emission circuit boards.

[0013] Preferably, the laser detection circuit board further comprises a radar signal processing circuit board for processing laser signals, and the laser emission circuit board and the laser receiving circuit board are stacked and spaced apart from the radar signal processing circuit board.

[0014] Preferably, the radar signal processing circuit board, the laser emission circuit board and the laser receiving circuit board are arranged in sequence along the thickness direction of the sensor integrated module, and each of the radar signal processing circuit board and the laser emission circuit board and the laser emission circuit board and the laser receiving circuit board has a heat dissipation space.

[0015] Preferably, the support assembly comprises a shell.

[0016] The laser detection circuit board and the video signal processing circuit board are both mounted inside the shell, the inner side of the back plate of the back of the shell is provided with a heat conduction part for conducting heat, and the free end of the heat conduction part abuts against the laser emission circuit board and the laser receiving circuit board close to the back plate; and / or the video signal processing circuit board is provided with a shielding cover, the power device in the video signal processing circuit board for processing video signals is covered inside the shielding cover to shield electromagnetic interference, and the free end of the shielding cover abuts against the shell wall to conduct heat to the shell.

[0017] Preferably, the support assembly further comprises a support plate.

[0018] The laser detection circuit board, the laser receiving circuit board and the video signal processing circuit board are all mounted on the support plate.

[0019] The laser detection circuit board and the laser receiving circuit board are both parallel to the support plate, and the video signal processing circuit board has a non-zero included angle with the support plate.

[0020] Preferably, the top of the support plate has a first limiting part and a second limiting part, the top end of the first limiting part and the top end of the second limiting part both protrude from the top end of the support plate, and a mounting gap for inserting a camera is left between the first limiting part and the second limiting part.

[0021] The first side edge of the video signal processing circuit board is arranged on the top end of the support plate, and the first side edge of the video signal processing circuit board has an avoiding gap, and the first limiting part and the second limiting part are inserted into the avoiding gap.

[0022] And / or, the back plate of the back of the shell has a gas permeable hole, a gas permeable valve is inserted in the gas permeable hole, the air inlet end of the gas permeable valve is inserted into the inner cavity of the shell, and the air outlet end of the gas permeable valve is communicated with the external environment of the shell.

[0023] A robot comprising the sensor integrated module of any one of the preceding claims.

[0024] The sensor integrated module provided by the utility model, laser detection circuit board and video signal processing circuit board are all installed on the support assembly, wherein the laser detection circuit board is used for emitting and receiving laser signals, and the video signal processing circuit board is used for receiving and processing video signals; the video signal circuit board is at an angle with the laser detection circuit board, so that the distance between the power devices on the laser detection circuit board and the video signal processing circuit board is increased, heat radiation between the power devices on the two circuit boards is effectively prevented, and the sensor integrated module has good heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only the embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative labor.

[0026] Figure 1 It is a front view of the specific embodiment provided by the utility model;

[0027] Figure 2 It is a rear view of the specific embodiment provided by the utility model;

[0028] Figure 3 It is a local schematic view of the specific embodiment provided by the utility model;

[0029] Figure 4 It is a local schematic view of the specific embodiment provided by the utility model from another angle;

[0030] Figure 5 It is a local schematic view of the specific embodiment provided by the utility model from still another angle;

[0031] Figure 6 It is a structural schematic view of the rear cover of the specific embodiment provided by the utility model.

[0032] Reference signs:

[0033] 1-support assembly; 11-housing; 111-front shell; 1111-light transmission hole; 112-rear cover; 1121-heat conduction part; 1122-air permeable hole; 12-supporting flat plate; 13-first limiting part; 14-second limiting part; 15-lens; 16-mounting column;

[0034] 2-laser detection circuit board, 21-laser emission circuit board; 22-laser receiving circuit board; 23-radar signal processing circuit board;

[0035] 3-video signal processing circuit board; 31-avoidance gap;

[0036] 4-shielding cover;

[0037] 5-air permeable valve;

[0038] 6-laser emission lens; 7-laser receiving lens; 8-camera. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0040] The core of the present application is to provide a sensor integrated module which has good heat dissipation effect. Another core of the present application is to provide a robot comprising the above-mentioned sensor integrated module.

[0041] Please refer to Figure 1 The present application provides a sensor integrated module, which comprises a support assembly 1, a laser detection circuit board 2 for emitting and receiving laser signals, and a video signal processing circuit board 3 for receiving and processing video signals. The laser detection circuit board 2 and the video signal processing circuit board 3 are both installed on the support assembly 1, and the video signal processing circuit board 3 has a non-zero angle with the laser detection circuit board 2.

[0042] As Figures 3 to 5As shown, both the laser detection circuit board 2 and the video signal processing circuit board 3 are mounted on the support assembly 1. The laser detection circuit board 2 is used to emit and receive laser signals, and the video signal processing circuit board 3 is used to receive and process video signals. The laser detection circuit board 2 and the video signal processing circuit board 3 with the above-mentioned corresponding functions can refer to the prior art. The video signal processing circuit board 3 is above the laser detection circuit board 2, and the video signal processing circuit board is at an angle of 30 degrees, 60 degrees, 45 degrees or 90 degrees relative to the laser detection circuit board 2. In this sensor integrated module, the laser detection circuit board 2 and the video signal processing circuit board 3 are staggered, which effectively prevents the heat from radiating between the power devices on the two circuit boards. The heat dissipation effect of this sensor integrated module is good.

[0043] It should be noted that the relative positional relationship between the video signal processing circuit board 3 and the laser detection circuit board 2 is not limited, as long as the above installation requirements are met. For example, the video signal processing circuit board 3 can be located on the side of the laser detection circuit board 2, or the video signal processing circuit board 3 can pass through the through hole in the middle of the laser detection circuit board 2.

[0044] In some specific embodiments, the laser detection circuit board 2 is equipped with both a laser transmitter and a laser receiver, that is, one circuit board performs the function of both emitting and receiving lasers. In this example, the sensor integrated module includes two circuit boards, namely the video signal processing circuit board 3 and the laser detection circuit board 2.

[0045] Based on the above embodiments, the video signal processing circuit board 3 is perpendicular to the laser detection circuit board 2, as shown below. Figures 3 to 5 As shown, this configuration helps to further reduce the size of the sensor integrated module while ensuring heat dissipation.

[0046] Based on the above embodiments, the laser detection circuit board 2 includes a laser emitting circuit board 21 for emitting laser and a laser receiving circuit board 22 for receiving laser. The laser emitting circuit board 21 and the laser receiving circuit board 22 are stacked, and the projections of the laser emitting circuit board 21 and the laser receiving circuit board 22 on the plane where the front side of the laser emitting circuit board 21 is located are at least partially offset.

[0047] like Figures 3 to 5 As shown, in this embodiment, the laser detection circuit board 2 includes at least one laser emitting circuit board 21 and at least one laser receiving circuit board 22. It should be noted that the laser emitting circuit board 21 is equipped with a laser emitter, such as a laser or a laser emitting sensor, to emit a detection laser, while the laser receiving circuit board 22 is equipped with a laser receiver, such as an optical receiver or a laser receiving sensor, to receive the reflected detection laser.

[0048] Furthermore, the laser emitting circuit board 21 and the laser receiving circuit board 22 are stacked, and a portion or the entire board of the laser emitting circuit board 21 is offset from a portion or the entire board of the laser receiving circuit board 22. For example, the portion of the laser emitting circuit board 21 where the main power devices are located is offset from the portion of the laser receiving circuit board 22 where the main power devices are located, while the portion of the laser emitting circuit board 21 used for connecting data cables is stacked with the portion of the laser receiving circuit board 22 used for connecting data cables, or the entire board of the laser emitting circuit board 21 is offset from the entire board of the laser receiving circuit board 22. This arrangement can effectively reduce the mutual radiation of heat generated by the main power devices on each circuit board.

[0049] It should be noted that the relative positional relationship between the laser emitting circuit board 21, the laser receiving circuit board 22, and the video signal processing circuit board 3 is not limited, as long as the installation requirements are met. In some specific embodiments, refer to... Figure 3 and Figure 4 In some embodiments, the laser emitting circuit board 21, the laser receiving circuit board 22, and the video signal processing circuit board 3 are arranged sequentially from left to right. Alternatively, in other specific embodiments, the laser emitting circuit board 21 and the laser receiving circuit board 22 are arranged sequentially from left to right, while the video signal processing circuit board 3 is located above the laser emitting circuit board 21 and the laser receiving circuit board 22. Of course, the number and arrangement of the laser emitting circuit board 21, the laser receiving circuit board 22, and the video signal processing circuit board 3 are not limited to the array types mentioned above, as long as heat dissipation can be guaranteed.

[0050] Based on the above embodiment, there are two laser emitting circuit boards 21, and the laser receiving circuit board 22 is located between the two laser emitting circuit boards 21.

[0051] like Figure 3 and Figure 4 As shown, in this embodiment, the laser detection circuit board 2 consists of two laser emitting circuit boards 21 and one laser receiving circuit board 22. One laser emitting circuit board 21 is located on the left side of the support component 1, and the other laser emitting circuit board 21 is located on the right side of the support component 1. The laser receiving circuit board 22 is located in the middle of the support component 1. This arrangement helps to ensure the heat dissipation effect while ensuring the laser detection effect.

[0052] In some embodiments, the two laser emitting circuit boards 21 are located on different layers. Preferably, in other embodiments, the two laser emitting circuit boards 21 are located on the same layer, which helps to reduce the size of the sensor integrated module.

[0053] On the basis of the above-mentioned embodiments, the laser detection circuit board 2 further comprises a radar signal processing circuit board 23 for processing the laser signal, and the laser transmission circuit board 21 and the laser receiving circuit board 22 are stacked and spaced apart from the radar signal processing circuit board 23.

[0054] As shown in Figure 3 and Figure 4 , in this embodiment, the laser detection circuit board 2 further comprises a radar signal processing circuit board 23 for receiving and processing the laser signal transmitted by the laser receiving circuit board 22, thereby realizing laser radar detection. In order to ensure the heat dissipation effect and reduce the volume of the sensor integrated module, the radar signal processing circuit board 23, the laser receiving circuit board 22 and the laser transmission circuit board 21 are parallel to each other, the radar signal processing circuit board 23 is stacked with the laser receiving circuit board 22, the radar signal processing circuit board 23 is stacked with the laser transmission circuit board 21, and the gap between each layer is provided for heat dissipation. The layout of each circuit board in the sensor integrated module is reasonable, and the heat dissipation capacity is high.

[0055] It should be noted that the relative position relationship of the stacked laser transmission circuit board 21, laser receiving circuit board 22 and radar signal processing circuit board 23 is not limited, as long as the above-mentioned stacking relationship is met. For example, in some embodiments, as shown in Figure 3 and Figure 4 , the laser transmission circuit board 21 is located in the layer gap between the laser receiving circuit board 22 and the radar signal processing circuit board 23, or in other embodiments, the radar signal processing circuit board 23 is located in the layer gap between the laser receiving circuit board 22 and the laser transmission circuit board 21, etc.

[0056] As shown in Figure 3 and Figure 4 , on the basis of the above-mentioned embodiments, the radar signal processing circuit board 23, the laser transmission circuit board 21 and the laser receiving circuit board 22 are arranged in turn along the thickness direction of the sensor integrated module, and there is a heat dissipation space between the radar signal processing circuit board 23 and the laser transmission circuit board 21, and between the laser transmission circuit board 21 and the laser receiving circuit board 22. Such arrangement is conducive to further improving the heat dissipation effect.

[0057] Optionally, in some specific embodiments, the radar signal processing circuit board 23 is located on the side away from the laser transmission circuit board 21 for transmitting laser, and on the side away from the laser receiving circuit board 22 for receiving laser.

[0058] On the basis of the above-mentioned embodiments, the support assembly 1 comprises a shell 11; the laser detection circuit board 2, the video signal processing circuit board 3 and the radar signal processing circuit board 23 are all installed in the interior of the shell 11, and a heat conduction part 1121 for conducting heat is installed on the inner side of the back plate of the back of the shell 11, and the free end of the heat conduction part 1121 abuts against the laser emission circuit board 21 and the laser receiving circuit board 22 close to the back plate; and / or, the video signal processing circuit board 3 is provided with a shielding cover 4, and the power device for processing the video signal in the video signal processing circuit board 3 is installed in the interior of the shielding cover 4 to shield electromagnetic interference, and the free end of the shielding cover 4 abuts against the shell wall of the shell 11 to conduct heat to the shell 11.

[0059] As shown in Figure 1 , Figure 2 and Figure 6 , the shell 11 is a hollow thin shell structure, and the laser detection circuit board 2, the video signal processing circuit board 3 and the radar signal processing circuit board 23 are all installed in the inner cavity of the shell 11 to protect the laser detection circuit board 2, the video signal processing circuit board 3 and the radar signal processing circuit board 23.

[0060] Preferably, the shell 11 comprises a front shell 111 and a back cover 112, and the back of the front shell 111 and the front of the back cover 112 are both provided with openings, and the back cover 112 is buckled at the opening of the back of the front shell 111, so that the back cover 112 and the front shell 111 form a hollow thin shell structure, and the above-mentioned panel refers to the end plate of the front shell 111 away from the back cover 112, and the above-mentioned back plate refers to the end plate of the back cover 112 away from the front shell 111.

[0061] Secondly, the heat conduction part 1121 is fixed on the inner side of the back plate of the shell 11, and the heat conduction part 1121 can be fixed on the shell 11 in a heat conduction structure by bonding or one-piece forming, such as a metal block or a heat conduction gasket or a heat conduction graphite sheet, etc., as shown in Figure 3 and Figure 4 , the radar signal processing circuit board 23 is located on the side of the laser emission circuit board 21 for emitting laser and the side of the laser receiving circuit board 22 for receiving laser, and in cooperation, a through hole is usually opened at the position opposite to the laser emission circuit board 21 and a through hole is usually opened at the position opposite to the laser receiving circuit board 22 on the radar signal processing circuit board 23 to allow laser to pass through, and the laser emission circuit board 21 and the laser receiving circuit board 22 are located on the side close to the back plate, and after assembly, the heat conduction part 1121 abuts against the laser emission circuit board 21 and the laser receiving circuit board 22 to conduct the heat generated by the operation of the laser emission circuit board 21 and the laser receiving circuit board 22 to the back shell, and then to the outside of the shell 11.

[0062] It should be noted that the type and number of the heat conduction part 1121 are not limited as long as the above functions can be achieved. For example, the heat conduction part 1121 can be a rigid heat conduction part 1121, and the laser emitting circuit board 21 and the laser receiving circuit board 22 abut against one or two heat conduction parts 1121. Alternatively, the heat conduction part 1121 can be an elastic heat conduction part 1121, and the laser emitting circuit board 21 and the laser receiving circuit board 22 abut against the same heat conduction part 1121.

[0063] Furthermore, with reference to the orientation shown in Figure 1 、 Figure 2 and Figure 5 , the power device for processing the video signal on the video signal processing circuit board 3 is located on the side far away from the laser detector and close to the top of the shell 11, and a shielding cover 4 is arranged outside the power device for processing the video signal on the video signal processing circuit board 3. The shielding cover 4 can be a rectangular or circular cover, which can shield electromagnetic interference. Further, the shielding cover 4 abuts against the shell 11, and the shielding cover 4 can be a metal cover or a diamond cover, which can conduct the heat generated by the power device on the video signal processing circuit board 3 to the back shell and then to the outside of the shell 11.

[0064] As shown in Figures 3 to 5 , on the basis of the above embodiment, the support assembly 1 further comprises a support plate 12; the radar signal processing circuit board 23, the laser detection circuit board 2, the laser receiving circuit board 22 and the video signal processing circuit board 3 are all installed on the support plate 12; and the radar signal processing circuit board 23, the laser detection circuit board 2 and the laser receiving circuit board 22 are all parallel to the support plate 12, and the video signal processing circuit board 3 is at an angle of 30 degrees, 60 degrees or 90 degrees with the support plate 12. In this way, the heat dissipation effect can be ensured while facilitating assembly.

[0065] It should be noted that the mounting mode of the radar signal processing circuit board 23, the laser detection circuit board 2, the laser receiving circuit board 22 and the video signal processing circuit board 3 on the support flat plate 12 is not limited, as long as the installation requirement can be met, for example, in some specific embodiments, a plurality of mounting columns 16 perpendicular to the support flat plate 12 are arranged on the support flat plate 12, the mounting columns 16 can be double-headed studs, press-in rivet nut columns or column bodies with threaded holes at the tail ends, etc., the mounting columns 16 can be fixed on the support flat plate 12 by a threaded structure or welding, etc., to connect the laser emitting circuit board 21 and the corresponding mounting column 16 by a threaded structure, to connect the laser receiving circuit board 22 and the corresponding mounting column 16 by a threaded structure, and the support plate is provided with threaded holes to connect the radar signal processing circuit board 23 and the support flat plate 12 by a threaded structure; or in another specific embodiment, the radar signal processing circuit board 23, the laser emitting circuit board 21 and the laser receiving circuit board 22 are all mounted on the support flat plate 12 by a plurality of mounting columns 16.

[0066] On the basis of the above-mentioned embodiments, the top of the support flat plate 12 is provided with a first limiting portion 13 and a second limiting portion 14, the top end of the first limiting portion 13 and the top end of the second limiting portion 14 are both protruded from the top end of the support flat plate 12, and a mounting gap for inserting the camera 8 is left between the first limiting portion 13 and the second limiting portion 14; the first side edge of the video signal processing circuit board 3 is arranged on the top end of the support flat plate 12, and the first side edge of the video signal processing circuit board 3 is provided with an avoiding gap 31, and the first limiting portion 13 and the second limiting portion 14 are inserted into the avoiding gap 31.

[0067] As shown in Figure 5 , the first limiting portion 13 and the second limiting portion 14 are fixed on one side of the top edge of the support flat plate 12, the first limiting portion 13 and the second limiting portion 14 can adopt a block structure or a frame structure in the shape of a triangle or a ladder, etc., and the first limiting portion 13 and the second limiting portion 14 can be the same or different, the first limiting portion 13 and the second limiting portion 14 are distributed along the horizontal direction, and a space with a rectangular or circular cross-sectional shape is left between the first limiting portion 13 and the second limiting portion 14 as a mounting gap to mount the camera 8.

[0068] Correspondingly, the left end of the video signal processing circuit board 3 is arranged above the support flat plate 12 to be fixedly connected by a vertically extending threaded structure, etc., and the left side edge of the video signal processing circuit board 3 is provided with a groove with a rectangular or trapezoidal longitudinal cross-sectional shape as an avoiding gap 31 to provide a mounting space for the first limiting portion 13 and the second limiting portion 14, and such arrangement is conducive to reducing the volume of the sensor integrated module.

[0069] Further, as shown in Figure 5As shown, the support flat plate 12 is provided with a plurality of mounting through holes in the shape of circles or rectangles, for inserting the corresponding laser emitting lens 6 and laser receiving lens 7.

[0070] Further, as shown, Figure 1 As shown, the panel of the shell 11 is provided with a through hole in the shape of a circle or a rectangle as a light transmission hole 1111, for allowing light to pass through, the laser emitted by the laser emitter can pass through the light transmission hole 1111 to the outside of the shell 11, and the laser outside the shell 11 can pass through the light transmission hole 1111 to the laser receiver to be received, and the camera 8 can shoot the external environment of the shell 11 through the light transmission hole 1111.

[0071] Further, the panel of the shell 11 is provided with a lens 15 outside, and the lens 15 is shielded on the light transmission hole 1111, so that the light can pass through while protecting the components installed inside the shell 11, and a heating sheet is installed on the top of the lens 15, preferably, the heating sheet is annularly arranged around the light transmission hole 1111, and the panel of the shell 11 is provided with a through hole in the shape of a long strip or a rectangle as a wire hole, so that the wire harness can pass through to electrically connect the heating sheet, thereby controlling the heating sheet to heat the lens 15 to achieve defogging.

[0072] On the basis of the above-mentioned embodiments, the back plate of the back of the shell 11 has a ventilation hole 1122, and a ventilation valve 5 is inserted into the ventilation hole 1122, the air inlet end of the ventilation valve 5 is inserted into the inner cavity of the shell 11, and the air outlet end is communicated with the external environment of the shell 11.

[0073] As shown, Figure 6 As shown, the back plate of the shell 11 is provided with a through hole in the shape of a circle or a rectangle as a ventilation hole 1122, and a ventilation valve 5 is inserted into the ventilation hole 1122, the air inlet end of the ventilation valve 5 extends into the inner cavity of the shell 11, and the air outlet end is located outside the shell 11, so as to communicate the inner cavity of the shell 11 and the external environment of the shell 11 through the ventilation valve 5, thereby balancing the air pressure inside and outside the shell 11.

[0074] On the basis of the above-mentioned embodiments, the laser emitting circuit board 21 is electrically connected to the laser receiving circuit board 22, the laser receiving circuit board 22 is electrically connected to the radar signal processing circuit board 23, the radar signal processing circuit board 23 is electrically connected to the video signal processing circuit board 3, and one of the radar signal processing circuit board 23 and the video signal processing circuit board 3 is provided with a connector, so as to connect an external device through an output data line, then the sensor integrated module can transmit data to the main control board of the robot and other external devices outside the sensor integrated module through the connector of one of the radar signal processing circuit board 23 and the video signal processing circuit board 3 through one or a bundle of output data lines.

[0075] In addition to the above sensor integrated module, the utility model also provides a kind of robot comprising the sensor integrated module disclosed in the above embodiment, the structure of other parts of the robot please refer to prior art, this paper will not repeat.

[0076] It should be noted that the relationship terms such as "first" and "second" described above are only used to distinguish one entity from other entities, and do not necessarily require or imply any such actual relationship or order between the entities; the "upper surface, lower surface, top, bottom" and the orientation words "up, down, left, right" described above are defined based on the drawings.

[0077] Each embodiment in the specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments, and the same or similar parts between each embodiment can be referred to each other.

[0078] The robot and its sensor integrated module provided by the utility model are described in detail above. The principle and implementation of the utility model are described by applying specific examples in this paper, and the above embodiment is only used to help understand the method and core idea of the utility model. It should be pointed out that, for ordinary skilled person in the art, without departing from the principle of the utility model, the utility model can be improved and modified in several ways, and these improvements and modifications also fall within the protection scope of the utility model.

Claims

1. A sensor integrated module, characterized by, The application relates to a sensor integrated module. The sensor integrated module comprises a support assembly (1), a laser detection circuit board (2) for laser emission and laser signal receiving, and a video signal processing circuit board (3) for video signal receiving and processing. The laser detection circuit board (2) and the video signal processing circuit board (3) are both mounted on the support assembly (1), and the video signal processing circuit board (3) and the laser detection circuit board (2) have a non-zero included angle.

2. The sensor integrated module according to claim 1, characterized in that, The video signal processing circuit board (3) is perpendicular to the laser detection circuit board (2).

3. The sensor integrated module according to claim 1, wherein The laser detection circuit board (2) comprises a laser emission circuit board (21) for laser emission and a laser receiving circuit board (22) for laser receiving, the laser emission circuit board (21) and the laser receiving circuit board (22) are arranged in a stack, and the projection of the laser emission circuit board (21) and the laser receiving circuit board (22) on the plane where the front surface of the laser emission circuit board (21) is located is at least partially staggered.

4. The sensor integrated module according to claim 3, characterized in that, The number of the laser emission circuit boards (21) is two, and the laser receiving circuit board (22) is located between the two laser emission circuit boards (21).

5. The sensor integrated module according to claim 4, wherein The laser detection circuit board (2) further comprises a radar signal processing circuit board (23) for processing laser signals, and the laser emission circuit board (21) and the laser receiving circuit board (22) are both arranged in a stack and are spaced apart from the radar signal processing circuit board (23).

6. The sensor integrated module according to claim 5, wherein The radar signal processing circuit board (23), the laser emission circuit board (21) and the laser receiving circuit board (22) are sequentially arranged along the thickness direction of the sensor integrated module, and the radar signal processing circuit board (23) and the laser emission circuit board (21) and the laser emission circuit board (21) and the laser receiving circuit board (22) both have heat dissipation spaces.

7. The sensor integrated module according to claim 6, wherein The support assembly (1) comprises a shell (11). The laser detection circuit board (2) and the video signal processing circuit board (3) are both mounted in the shell (11), the inner side of the back plate of the back surface of the shell (11) is provided with a heat conduction part (1121) for conducting heat, the free end of the heat conduction part (1121) abuts against the laser emission circuit board (21) and the laser receiving circuit board (22) close to the back plate, and / or the video signal processing circuit board (3) is provided with a shielding cover (4), the power device for processing video signals in the video signal processing circuit board (3) is covered in the shielding cover (4) to shield electromagnetic interference, and the free end of the shielding cover (4) abuts against the shell wall of the shell (11) to conduct heat to the shell (11).

8. The sensor integrated module according to claim 7, wherein The support assembly (1) further comprises a support flat plate (12). The laser detection circuit board (2), the laser receiving circuit board (22) and the video signal processing circuit board (3) are all mounted on the support flat plate (12). And the laser detection circuit board (2) and the laser receiving circuit board (22) are parallel to the support flat plate (12), and the video signal processing circuit board (3) has a non-zero angle with the support flat plate (12).

9. The sensor integrated module according to claim 8, wherein The top of the support flat plate (12) has a first limiting part (13) and a second limiting part (14), the top end of the first limiting part (13) and the top end of the second limiting part (14) are protruded from the top end of the support flat plate (12), and the first limiting part (13) and the second limiting part (14) are provided with a mounting gap for inserting the camera (8); The first side edge of the video signal processing circuit board (3) is arranged on the top end of the support flat plate (12), and the first side edge of the video signal processing circuit board (3) has an avoiding gap (31), and the first limiting part (13) and the second limiting part (14) are inserted into the avoiding gap (31); And / or, the back plate of the back of the shell (11) has a breathable hole (1122), the breathable hole (1122) is provided with a breathable valve (5), the air inlet end of the breathable valve (5) is inserted into the inner cavity of the shell (11), and the air outlet end of the breathable valve (5) is communicated with the external environment of the shell (11).

10. A robot, characterized in that The sensor integrated module comprises the sensor integrated module according to any one of claims 1-9. The sensor integrated module comprises the sensor integrated module according to any one of claims 1-9.

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