Developer cleaning equipment

Abstract

The utility model relates to developing machine cleaning equipment which comprises a machine table shell and a reaction vessel arranged on the machine table shell, and a liftable silicon wafer and glass sheet adsorption rotating assembly is arranged in the reaction vessel. The device is reasonable in design and convenient to use, the lifting mechanism drives the silicon wafer and glass sheet adsorption rotating assembly to descend, so that a silicon wafer or a glass sheet is contacted and soaked with a quantitative developing solution in the reaction vessel, the lifting mechanism drives the silicon wafer and glass sheet adsorption rotating assembly to ascend, so that the silicon wafer or the glass sheet is moved out of the developing solution, and uniform development of the silicon wafer is ensured; the developing time and effect are controllable, and the developing working efficiency and quality are effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a developing machine cleaning equipment. BACKGROUND

[0002] Photoetching process is a very important process in semiconductor chip manufacturing, which is to transfer the pattern on the mask to the substrate by photoresist, and generally needs to go through substrate surface cleaning and drying, coating, photoresist coating, soft baking, alignment exposure, post-baking, development, hard baking, etching, detection and other procedures. At present, manual development is needed in the development process during the microfluidic chip manufacturing process. Manual development is not only low in efficiency, but also uncontrollable in development time and effect, and the operator is easy to cause artificial damage to the chip / silicon wafer. The existing spray type developing cleaning machine sprays the developing liquid downward to the silicon wafer by setting the developing liquid spray head above the silicon wafer. However, when the area of the silicon wafer is relatively large, the spray head cannot spray the developing liquid to all areas of the silicon wafer, causing uneven development on the silicon wafer. SUMMARY

[0003] The utility model improves the above problems, that is, the technical problem to be solved by the utility model is to provide a developing machine cleaning equipment to ensure uniform development of the silicon wafer, controllable development time and effect, and improve the development efficiency and effect.

[0004] The utility model is constituted as follows: it comprises a machine table shell and a reaction vessel arranged on the machine table shell, a silicon wafer glass sheet adsorption rotating assembly is arranged in the reaction vessel, the silicon wafer or glass sheet is in contact with the quantitative developing liquid in the reaction vessel when the silicon wafer glass sheet adsorption rotating assembly is lowered, and the silicon wafer or glass sheet is separated from the developing liquid when the silicon wafer glass sheet adsorption rotating assembly is raised.

[0005] Further, the silicon wafer glass sheet adsorption rotating assembly comprises a suction cup, a rotating part and a hollow shaft servo motor arranged in sequence from top to bottom, the suction cup is provided with a suction hole for adsorbing the silicon wafer, a suction pipe is arranged in the hollow shaft of the hollow shaft servo motor, the upper end of the suction pipe is connected with the suction hole of the suction cup, the lower end of the suction pipe is connected with a vacuum pump arranged outside through a vacuum pump pipeline, and the hollow shaft servo motor is used to drive the rotating part and the suction cup to rotate.

[0006] Further, a lifting mechanism is arranged below the silicon wafer glass sheet adsorption rotating assembly to drive the lifting of the silicon wafer glass sheet adsorption rotating assembly, the lifting mechanism comprises a cylinder mounting plate arranged at the bottom of the reaction vessel, a motor fixing plate is arranged in the cylinder mounting plate, the motor fixing plate is used to install the hollow shaft servo motor of the silicon wafer glass sheet adsorption rotating assembly, and sliding blocks are arranged on the two outer sides of the motor fixing plate to cooperate with the guide rails arranged on the two inner sides of the cylinder mounting plate.

[0007] Further, the motor fixing plate is fixed with a push plate below, the cylinder mounting plate is installed with a cylinder below, and the telescopic end of the cylinder is connected with the push plate by penetrating the cylinder mounting plate upwards.

[0008] Further, the front and rear parts of the cylinder mounting plate are provided with cylinder reinforcing plates.

[0009] Further, the reaction dish is provided with a ball cover fixing seat above, a hemispherical cover body is arranged on the ball cover fixing seat, and a spraying cleaning nozzle is arranged in the middle of the hemispherical cover body.

[0010] Further, the reaction dish is provided with a liquid inlet and a liquid outlet.

[0011] Further, the reaction dish is provided with a dry plate positioning plate at the upper part.

[0012] Compared with the prior art, the device has the following beneficial effects: the device is reasonable in design, simple in structure, convenient to use, controllable in developing time and effect, accurate in developing time, uniform in silicon wafer development, and improved in silicon wafer development efficiency; in the use process, the hemispherical cover body on the machine shell is opened, the silicon wafer is placed on the suction disc, the vacuum pump is started, the negative pressure generated by the vacuum pump adsorbs and fixes the silicon wafer on the suction disc, and the hemispherical cover body is closed; the developing solution enters the reaction dish from the liquid inlet and is quantitatively realized; after the quantitative input of the developing solution in the liquid immersion disc is completed, the hollow shaft servo motor and the motor fixing plate of the lifting mechanism are driven downward by the cylinder, the silicon wafer on the suction disc is also moved downward, the silicon wafer is soaked in the quantitative developing solution in the reaction dish for a period of time, the soaking time can be 3-4 seconds or other required time, when the silicon wafer is soaked, the suction disc and the silicon wafer on the suction disc are slowly rotated by the hollow shaft servo motor, so that the silicon wafer and the developing solution have relative flow, and uniform contact between the silicon wafer and the developing solution is ensured; after the developing work is completed, the hollow shaft servo motor and the motor fixing plate of the lifting mechanism are moved upward by the cylinder, the silicon wafer on the suction disc is also moved upward, and the silicon wafer on the suction disc is moved out of the developing solution; the developing solution in the reaction dish is discharged through the liquid discharge port, the silicon wafer on the suction disc is high-speed rotated by the hollow shaft servo motor, and the developing solution on the silicon wafer is centrifugally spun dry; the silicon wafer is uniformly sprayed with pure water by the spraying cleaning nozzle on the hemispherical cover body, and the silicon wafer is cleaned, after the cleaning is completed, the silicon wafer on the suction disc is high-speed rotated by the hollow shaft servo motor, and the water on the silicon wafer is spun dry; finally, the hemispherical cover body is opened, the vacuum pump is closed, and the silicon wafer is taken out. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 THREE-DIMENSIONAL VIEW OF THE EMBODIMENT OF THE PRESENT INVENTION Figure 1 ;

[0014] Figure 2 THREE-DIMENSIONAL VIEW OF THE EMBODIMENT OF THE PRESENT INVENTION Figure 2 ​

[0015] Figure 3 for Figure 2 A magnified view of a section at point A in the middle;

[0016] Figure 4 This is a top view of an embodiment of the present utility model;

[0017] Figure 5 for Figure 4 Sectional view AA in the middle;

[0018] Figure 6 for Figure 4 Sectional view BB in the middle;

[0019] Figure 7 This is a partial schematic diagram of an embodiment of the present utility model;

[0020] Figure 8 This is a schematic diagram of the reaction vessel and lifting mechanism in an embodiment of the present invention. Figure 1 ;

[0021] Figure 9 This is a partial schematic diagram of the reaction vessel and lifting mechanism in an embodiment of the present invention. Figure 1 ;

[0022] Figure 10 This is a partial schematic diagram of the reaction vessel and lifting mechanism in an embodiment of the present invention. Figure 2 ;

[0023] In the diagram: 1-Machine housing, 2-Reaction vessel, 3-Silicon wafer / glass sheet adsorption and rotation assembly, 301-Suction cup, 3011-Suction hole, 302-Rotating component, 303-Hollow shaft servo motor, 304-Hollow shaft, 3041-Suction pipe, 4-Lifting mechanism, 401-Cylinder mounting plate, 402-Motor fixing plate, 403-Slider, 404-Guide rail, 405-Push plate, 406-Cylinder, 407-Cylinder reinforcing plate, 5-Spherical cover fixing seat, 6-Hemispherical cover, 7-Spray cleaning nozzle, 8-Dry plate positioning plate. Detailed Implementation

[0024] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0025] Example: Figures 1-10 As shown in this embodiment, a developing machine cleaning device is provided, including a machine base housing 1 and a reaction dish 2 disposed on the machine base housing. The reaction dish is provided with a liftable silicon wafer / glass sheet adsorption and rotation assembly 3. The silicon wafer / glass sheet adsorption and rotation assembly is liftable relative to the reaction dish. When the silicon wafer / glass sheet adsorption and rotation assembly descends, the silicon wafer or glass sheet comes into contact with and is immersed in a quantitative developing solution in the reaction dish to complete the developing and etching work. When the silicon wafer / glass sheet adsorption and rotation assembly rises, the silicon wafer or glass sheet is removed from the developing solution.

[0026] When working: (1) open the hemispherical cover on the machine shell, place the silicon wafer on the suction cup, start the vacuum pump, the negative pressure generated by the vacuum pump adsorbs and fixes the silicon wafer on the suction cup, and closes the hemispherical cover; (2) the developing solution enters from the liquid inlet of the reaction dish and realizes quantitative; (3) after the quantitative input of the developing solution in the liquid immersion dish is completed, the cylinder of the lifting mechanism drives the hollow shaft servo motor and the motor fixed plate to move downward, the silicon wafer on the suction cup is also moved downward, so that the silicon wafer is soaked in the quantitative developing solution in the reaction dish for a period of time, and the soaking time can be 3-4 seconds or other required time; when the silicon wafer is soaked, the hollow shaft servo motor drives the suction cup and the silicon wafer on the suction cup to rotate slowly, so that the silicon wafer and the developing solution have relative flow, and uniform contact of the silicon wafer and the developing solution is ensured; (4) after the developing work is completed, the cylinder of the lifting mechanism drives the hollow shaft servo motor and the motor fixed plate to move upward, the silicon wafer on the suction cup is also moved upward, so that the silicon wafer on the suction cup moves out of the developing solution; (5) the developing solution in the reaction dish is discharged through the liquid outlet, the hollow shaft servo motor drives the silicon wafer on the suction cup to rotate at high speed, and the developing solution on the silicon wafer is centrifuged and dried; the spray cleaning nozzle on the hemispherical cover sprays pure water uniformly downward on the silicon wafer, and the silicon wafer is cleaned; after cleaning, the hollow shaft servo motor continues to drive the silicon wafer on the suction cup to rotate at high speed, and the water on the silicon wafer is spun dry; (6) finally, the hemispherical cover is opened, the vacuum pump is closed, and the silicon wafer is taken out.

[0027] In the embodiment of the utility model, the silicon wafer glass piece adsorption rotating assembly 3 includes suction cup 301, rotating part 302 and hollow shaft servo motor 303 which are sequentially arranged from top to bottom, the suction cup has suction hole 3011 for adsorbing silicon wafer, hollow shaft 304 of the hollow shaft servo motor is internally provided with suction pipeline 3041, upper end of the suction pipeline is connected with the suction hole of the suction cup, lower end of the suction pipeline is connected with vacuum pump arranged outside through vacuum pump pipeline, the hollow shaft servo motor is used for driving rotating part and suction cup to rotate, hollow shaft of the hollow shaft servo motor penetrates through the reaction dish and is fixed with the rotating part, the suction cup is fixed on the rotating part, of course, the connecting part of the rotating shaft and the reaction dish is provided with sealing structure, such as sealing ring, to ensure the sealing property of the reaction dish.

[0028] In the embodiment of the utility model, the silicon wafer glass piece adsorption rotating assembly is provided below with lifting mechanism 4 for driving it to lift, the lifting mechanism 4 includes cylinder mounting plate 401 arranged at the bottom of the reaction dish, the cylinder mounting plate is internally provided with motor fixed plate 402, the motor fixed plate is used for installing the hollow shaft servo motor of the silicon wafer glass piece adsorption rotating assembly, the motor fixed plate is provided with sliding block 403 on both outer sides, is used for cooperating with guide rail 404 arranged on both inner sides of the cylinder mounting plate, and the sliding block and the guide rail are slidingly matched.

[0029] The push plate 405 is fixed below the motor fixing plate, the cylinder 406 is installed below the cylinder installing plate, and the telescopic end of the cylinder penetrates the cylinder installing plate and is connected with the lower part of the push plate upward.

[0030] In the embodiment of the utility model, in order to strengthen the stability of cylinder installing plate, the front and rear parts of cylinder installing plate are provided with cylinder reinforcing plate 407;Cylinder reinforcing plate upper part is fixed with reaction dish bottom, and cylinder reinforcing plate side part is fixed with cylinder installing plate.

[0031] In the embodiment of the utility model, the reaction dish is provided with a ball cover fixing seat 5, the ball cover fixing seat is provided with a hemispherical cover body 6, and the hemispherical cover body is provided with a spray cleaning nozzle 7 in the middle part;The spray cleaning nozzle penetrates the middle part of the hemispherical cover body, and the nozzle is downward, and the spray cleaning nozzle is connected with an external pure water source through a pipeline.

[0032] The spray cleaning nozzle is opposite to the upper part of the silicon wafer, after the silicon wafer completes the developing work, the hollow shaft servo motor of the silicon wafer glass piece adsorption rotating assembly drives the chuck and the silicon wafer to rotate, and the silicon wafer is spun dry, then the spray cleaning nozzle sprays pure water to the silicon wafer, the water sprayed by the spray cleaning nozzle is in mist state, and then the chuck and the silicon wafer are driven to rotate again by the hollow shaft servo motor, and the moisture on the silicon wafer is spun dry by centrifugal force.

[0033] The hemispherical cover body is fixed with the ball cover fixing seat, the ball cover fixing seat is movably connected to the machine table shell, one end of the ball cover fixing seat is hinged to the machine table shell, the other end of the hemispherical cover body is connected to the machine table shell through a lock, and the lock can be controlled to close or open the hemispherical cover body.

[0034] In the embodiment of the utility model, the reaction dish is provided with a liquid inlet and a liquid outlet;The liquid inlet can be connected with a liquid inlet pipeline, and the liquid outlet can be connected with a liquid outlet pipeline, a valve can be arranged on the liquid inlet pipeline and the liquid outlet pipeline, the liquid inlet pipeline can be connected with an external developing liquid source, and the developing liquid is quantitatively input into the reaction dish.

[0035] In the embodiment of the utility model, the reaction dish is provided with a dry plate positioning plate 8.

[0036] Any technical scheme disclosed in the utility model except otherwise stated, if it discloses a numerical range, the disclosed numerical range is a preferred numerical range, and any person skilled in the art should understand that the preferred numerical range is only one of many implementable numbers with obvious technical effect or representative number. Because there are many numbers, it is impossible to enumerate, therefore, the utility model discloses only part of the numbers to illustrate the technical scheme of the utility model, and the enumerated numbers should not constitute the limitation to the protection scope of the utility model.

[0037] Meanwhile, if the above-mentioned utility model discloses or involves mutually fixed connecting parts or structural members, then, except for another declaration, the fixed connection can be understood as: the fixed connection of detachable (for example, the connection of bolt or screw), and also can be understood as: the fixed connection of undetachable (for example, riveting, welding), of course, the mutually fixed connection can be replaced by integral structure (for example, the integral forming manufacturing of using casting process) (except for obviously unable to adopt integral forming process).

[0038] In addition, the meaning of the term used for indicating the position relationship or shape in any technical solution disclosed by the above-mentioned utility model includes the approximate, similar or close state or shape, except for another declaration.

[0039] Any component provided by the utility model can be assembled by multiple separate components, or can be a separate component manufactured by integral forming process.

[0040] Finally, it should be explained that: the above examples are only used to illustrate the technical solutions of the utility model and not to limit them; although the utility model has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that: the specific embodiments of the utility model can still be modified or some technical features can be replaced by equivalents; without departing from the spirit of the technical solutions of the utility model, they should be covered in the technical solution range of the utility model claimed to be protected.

Claims

1. A processor for a developing apparatus, characterized by comprising: The device comprises a machine shell and a reaction dish arranged on the machine shell, and a silicon wafer or glass sheet suction and rotation assembly arranged in the reaction dish.

2. A processor according to claim 1, wherein The silicon wafer or glass sheet suction and rotation assembly comprises a suction disc, a rotating part and a hollow shaft servo motor arranged in sequence from top to bottom, the suction disc is provided with suction holes for suctioning silicon wafers, the hollow shaft of the hollow shaft servo motor is internally provided with a suction duct, the upper end of the suction duct is connected with the suction holes of the suction disc, the lower end of the suction duct is connected with a vacuum pump arranged outside through a vacuum pump pipeline, and the hollow shaft servo motor is used to drive the rotating part and the suction disc to rotate.

3. A processor according to claim 1, wherein the processor is configured to: A lifting mechanism is arranged below the silicon wafer or glass sheet suction and rotation assembly to drive the lifting of the silicon wafer or glass sheet suction and rotation assembly, the lifting mechanism comprises a cylinder mounting plate arranged at the bottom of the reaction dish, the cylinder mounting plate is internally provided with a motor fixing plate, the motor fixing plate is used to mount the hollow shaft servo motor of the silicon wafer or glass sheet suction and rotation assembly, and sliding blocks are arranged on the two outer sides of the motor fixing plate to cooperate with guide rails arranged on the two inner sides of the cylinder mounting plate.

4. A processor according to claim 3, wherein the processor is configured to: A push plate is fixed below the motor fixing plate, a cylinder is mounted below the cylinder mounting plate, and the extension end of the cylinder is connected with the push plate through the cylinder mounting plate.

5. A processor according to claim 3, wherein the processor is configured to perform the steps of: Front and rear cylinder reinforcing plates are arranged on the cylinder mounting plate. ​ 6. A processor according to claim 1, wherein A ball cover fixing seat is arranged above the reaction dish, a hemispherical cover body is arranged on the ball cover fixing seat, and a spraying and cleaning nozzle is arranged in the middle of the hemispherical cover body.

7. A processor according to claim 1, wherein Liquid inlets and outlets are arranged on the reaction dish.

8. A processor according to claim 1, wherein, A dry plate positioning plate is arranged on the upper portion of the reaction dish.

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