Touch panel structure
By adopting a three-dimensional arrangement structure in the touch panel, the problem of large area occupied by the lead wire area is solved, and the edge of the touch panel is narrowed.
Patent Information
- Application Number
- CN202423048658.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-12-11
AI Technical Summary
The lead area of existing touch panels occupies a large area, making it difficult to narrow the edges.
A three-dimensional arrangement structure is adopted, by forming a first circuit pattern layer and an insulating layer on the substrate, forming a second circuit pattern layer on the insulating layer, a first lead extending from the touch electrode on the side of the substrate reference surface, and a second lead extending through the raised surface of the insulating layer to the setting surface, forming a vertically arranged lead structure.
This effectively reduces the area of the lead wire region, thereby narrowing the edge of the touch panel.
Smart Images
Figure CN223526696U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of touch panel, and in particular to a touch panel structure with a three-dimensional lead arrangement structure to reduce the lead area. BACKGROUND
[0002] The existing touch panel includes a light-transmissive electrode area and a lead area adjacent to the electrode area. A user's finger touches the electrode area to change the resistance or capacitance between the electrodes of the electrode area, so as to determine the position of the finger touch. The plurality of leads of the lead area are electrically connected with the electrodes of the electrode area to drive the electrodes or generate a detection signal. The plurality of leads of the existing lead area are arranged on the same plane. Since the leads cannot be connected, the leads must have a certain distance, which leads to a considerable area occupied by the lead area, which is not conducive to the current trend of reducing or narrowing the edge of the touch panel as much as possible. CONTENT OF THE INVENTION
[0003] The embodiment of the present application provides a touch panel structure, which solves the problem that the lead area of the existing touch panel occupies a considerable area and is not conducive to narrowing the edge.
[0004] In order to solve the above technical problems, the present application is implemented as follows:
[0005] The touch panel structure of the embodiment of the present application includes a substrate, a first circuit pattern layer, an insulating layer and a second circuit pattern layer. The substrate has a reference surface. The first circuit pattern layer is formed on the reference surface of the substrate. The first circuit pattern layer includes a touch electrode area and a first lead area adjacent to the touch electrode area. The touch electrode area is provided with a plurality of touch electrodes. The first lead area is provided with at least one first lead. The at least one first lead is electrically connected with the at least one touch electrode. The insulating layer is formed on the reference surface of the substrate. The insulating layer includes a first setting area. The first setting area covers at least part of the first lead area. The top of the first setting area has a first setting surface and a first lifting surface. The first side of the first lifting surface is close to or connected to the first setting surface. The second side of the first lifting surface is close to or connected to the first circuit pattern layer. The height of the first side relative to the reference surface is greater than the height of the second side relative to the reference surface. The second circuit pattern layer is formed on the insulating layer. The second circuit pattern layer includes a second lead area. The second lead area is provided with at least one second lead. The at least one second lead extends from the at least one touch electrode of the first circuit pattern layer, passes through the first lifting surface and reaches the first setting surface.
[0006] The touch panel structure of the present application forms a first circuit pattern layer on a substrate and sets an insulating layer on the substrate, a second circuit pattern layer is formed on the top of the insulating layer, a first lead wire of the first circuit pattern layer extends laterally from a touch electrode on the reference surface of the substrate, a second lead wire of the second circuit pattern layer extends through the first raised surface to the first set surface via the touch electrode, so that the first lead wire and the second lead wire form a vertically arranged three-dimensional arrangement structure, thereby reducing the area of the lead wire area to realize the narrowing of the edge of the touch panel. BRIEF DESCRIPTION OF DRAWINGS
[0007] The accompanying drawings, which are included to provide a further understanding of the present application, constitute a part of the present application and illustrate embodiments of the present application and the description thereof serve to explain the present application and do not limit the present application in any way. In the drawings:
[0008] Figure 1 is a top view of a substrate and a first circuit pattern layer of a touch panel structure of an embodiment of the present application;
[0009] Figure 2 is a top view of a substrate, a first circuit pattern layer, an insulating layer and a second circuit pattern layer of a touch panel structure of an embodiment of the present application;
[0010] Figure 3 is Figure 2 a sectional view along the line A-A;
[0011] Figure 4 is Figure 2 a sectional view along the line B-B;
[0012] Figure 5 is Figure 2 a sectional view along the line C-C. DETAILED DESCRIPTION
[0013] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.
[0014] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 , wherein Figure 1 is a top view of a substrate and a first circuit pattern layer of a touch panel structure of an embodiment of the present application, Figure 2is a top view of a substrate, a first circuit pattern layer, an insulating layer, and a second circuit pattern layer of a touch panel structure according to an embodiment of the present application, Figure 3 is Figure 2 is a sectional view along the line A-A, Figure 4 is Figure 2 is a sectional view along the line B-B, Figure 5 is Figure 2 is a sectional view along the line C-C. As shown in the figure, the touch panel structure 1 according to the embodiment includes a substrate 10, a first circuit pattern layer 20, an insulating layer 30, and a second circuit pattern layer 40. The substrate 10 according to the embodiment is a glass substrate, so that light emitted by a backlight source can penetrate. An upper surface of the substrate 10 serves as a reference surface 11 on which the first circuit pattern layer 20, the insulating layer 30, and the second circuit pattern layer 40 are disposed. The first circuit pattern layer 20 is formed on the reference surface 11.
[0015] The first circuit pattern layer 20 can be a circuit formed on the substrate 10 by exposure, development, etching, and the like. The first circuit pattern layer 20 includes a touch electrode area 21 disposed at the center of the reference surface 11, a first lead area 22 adjacent to the touch electrode area 21, a third lead area 23 disposed opposite to the first lead area 22, and an electrical connection area 24 disposed at the edge of the reference surface 11. The touch electrode area 21 is provided with a plurality of touch electrodes 211, the first lead area 22 is provided with a plurality of first leads 221, the third lead area 23 is disposed on opposite sides of the touch electrode area 21 from the first lead area 22, the third lead area 23 is provided with a plurality of third leads 231, and the electrical connection area 24 is provided with a plurality of conductive foils 241. One end of each of the first leads 221 is connected to one of the touch electrodes 211, and the other end of each of the first leads 221 is connected to one of the conductive foils 241, so that the touch electrodes 211, the first leads 221, and the conductive foils 241 are electrically connected. One end of each of the third leads 231 is connected to one of the touch electrodes 211, and the other end of each of the third leads 231 is connected to one of the conductive foils 241, so that the touch electrodes 211, the third leads 231, and the conductive foils 241 are electrically connected.
[0016] The contact positions of the first leads 221 with the touch electrodes 211 and the contact positions of the third leads 231 with the touch electrodes 211 are staggered, so that signals transmitted by the first leads 221 and signals transmitted by the third leads 231 do not easily interfere with each other.
[0017] The conductive foils 241 can be solder pads or gold finger structures, and are used to form electrical connections with conductive foils of a flexible circuit board by soldering or to form electrical connections by abutting against terminals of an electrical connector inserted into the electrical connections.
[0018] The insulating layer 30 is a convex structure protruding from the reference surface 11, formed by coating an insulating resin on the reference surface 11 of the substrate 10 and curing. The insulating layer 30 includes a first disposed region 31, a second disposed region 32, and a third disposed region 33. The first disposed region 31 corresponds to the first lead region 22 of the first circuit pattern layer 20. The second disposed region 32 corresponds to the third lead region 23 of the first circuit pattern layer 20. The third disposed region 33 is located between the first disposed region 31 and the second disposed region 32 and adjacent to the first disposed region 31 and the second disposed region 32.
[0019] The second circuit pattern layer 40 can be a circuit formed on the top of the insulating layer 30 by exposure, development, etching, and the like. The second circuit pattern layer 40 includes a second lead region 41, a fourth lead region 42, and a fifth lead region 43. The second lead region 41 is provided with a plurality of second leads 411. The fourth lead region 42 is provided with a plurality of fourth leads 421. The fifth lead region 43 is provided with a plurality of fifth leads 431. The second lead region 41 corresponds to the first lead region 22 of the first circuit pattern layer 20. The fourth lead region 42 corresponds to the third lead region 23 of the first circuit pattern layer 20.
[0020] The first disposed region 31 covers at least part of the first lead region 22. The top of the first disposed region 31 has a first disposed surface 311, a first raised surface 312, and a first lowered surface 313. The first raised surface 312 corresponds to the touch electrode region 21 of the first circuit pattern layer 20. The first lowered surface 313 corresponds to the electrical connection region 24 of the first circuit pattern layer 20.
[0021] The first side 312a of the first raised surface 312 is close to or connected to the first disposed surface 311. The second side 312b of the first raised surface 312 is close to or connected to the first circuit pattern layer 20. The height of the first side 312a relative to the reference surface 11 is greater than the height of the second side 312b relative to the reference surface 11. In the present embodiment, the first raised surface 312, the first disposed surface 311, and the reference surface 11 form a discontinuous surface structure, but the present application is not limited thereto. In other embodiments, the first raised surface can also form a continuous surface structure with the first disposed surface and the reference surface. In the present embodiment, the first raised surface 312 is a bevel surface, but the present application is not limited thereto. In other embodiments, the first raised surface can also be a stepped surface or an arc surface.
[0022] The third side 313a of the first descending surface 313 is close to or connected to the first setting surface 311, and the fourth side 313b of the first descending surface 313 is close to or connected to the electric connection area 24 of the first circuit pattern layer 20. The height of the third side 313a relative to the reference surface 11 is greater than the height of the fourth side 313b relative to the reference surface 11. The first descending surface 313 of the present embodiment is a structure of forming a discontinuous surface with the first setting surface 311 and the reference surface 11, but the present application is not limited thereto. In other embodiments, the first descending surface can also be a structure of forming a continuous surface with the first setting surface and the reference surface. The first descending surface 313 of the present embodiment is a bevel, but the present application is not limited thereto. In other embodiments, the first descending surface can also be a stepped surface or an arc surface.
[0023] The second lead 411 extends from the touch electrode 211 of the first circuit pattern layer 20 to the first setting surface 311 through the first lifting surface 312, and the second lead 411 extends from the first setting surface 311 to the conductive foil 241 through the first descending surface 313.
[0024] The second setting area 32 covers at least part of the third lead area 231. The top of the second setting area 32 has a second setting surface 321, a second lifting surface 322, and a second descending surface 323. The second lifting surface 322 corresponds to the touch electrode area 21 of the first circuit pattern layer 20, and the second descending surface 323 corresponds to the electric connection area 24 of the first circuit pattern layer 20. One side of the second lifting surface 322 is close to or connected to the second setting surface 321, and the other side of the second lifting surface 322 is close to or connected to the touch electrode area 21 of the first circuit pattern layer 20. One side of the second descending surface 323 is close to or connected to the second setting surface 321, and the other side of the second descending surface 323 is close to or connected to the electric connection area 24 of the first circuit pattern layer 20. The second lifting surface 322 can be a structure of forming a continuous surface or a discontinuous surface with the first setting surface 311 and the reference surface 11. The second lifting surface 322 can be a bevel, a stepped surface, or an arc surface. The second descending surface 323 can be a structure of forming a continuous surface or a discontinuous surface with the first setting surface 311 and the reference surface 11. The second descending surface 323 can be a bevel, a stepped surface, or an arc surface.
[0025] The fourth lead 421 extends from the touch electrode 211 of the first circuit pattern layer 20 to the second setting surface 321 through the second lifting surface 322, and the fourth lead 421 extends from the second setting surface 321 to the conductive foil 241 through the second descending surface 323.
[0026] The third setting area 33 includes a third setting surface 331, a third lifting surface 332, and a third descending surface 333. One side of the third lifting surface 332 is connected to or close to the touch electrode area 21 of the first circuit pattern layer 20, and the other side of the third lifting surface 332 is connected to or close to the third setting surface 331. One side of the third descending surface 333 is close to or connected to the third setting surface 331, and the other side of the third descending surface 333 is close to or connected to the electric connection area 24 of the first circuit pattern layer 20. In the embodiment, the third lifting surface 332 is perpendicular to the third setting surface 331, and the third descending surface 333 is a bevel surface, a stepped surface, or an arc surface.
[0027] The fifth lead 431 extends from the touch electrode 211 of the first circuit pattern layer 20, through the third lifting surface 332 to the third setting surface 331, and from the third setting surface 331, through the third descending surface 333 to be electrically connected to the conductive foil of the electric connection area 24.
[0028] In the embodiment, the first setting surface 311, the second setting surface 321, and the third setting surface 331 have the same height, i.e., the first setting surface 311, the second setting surface 321, and the third setting surface 331 are flush top surfaces.
[0029] Although the touch panel structure in the embodiment includes only one insulating layer, the present application is not limited thereto. In other embodiments, the touch panel structure can include multiple insulating layers, and each insulating layer has a top surface on which a lead is arranged, and the lead is connected to the touch electrode and the conductive foil via lifting surfaces and descending surfaces of different heights.
[0030] The touch panel structure of the present application forms a first circuit pattern layer on a substrate, and an insulating layer is arranged on the substrate. A second circuit pattern layer is formed on the top surface of the insulating layer. A first lead of the first circuit pattern layer extends laterally from the touch electrode on the reference surface of the substrate. A second lead of the second circuit pattern layer extends through the first lifting surface to the first setting surface via the touch electrode. Thus, the first lead and the second lead form a vertically arranged three-dimensional arrangement structure, thereby reducing the area of the lead area and achieving the narrowing of the edge of the touch panel.
[0031] It should be noted that the terms "comprising", "including", or any other variant thereof are intended to cover a non-exclusive inclusion, such that processes, methods, articles, or apparatuses that comprise a list of elements do not include only those elements, but can also include other elements not expressly listed or inherent to such processes, methods, articles, or apparatuses. Without more limitations, an element defined by the statement "comprising a" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.
[0032] The embodiments of the present application are described above with reference to the accompanying drawings, but the present application is not limited to the specific embodiments described above, and the specific embodiments described above are merely illustrative, but not restrictive, and a person of ordinary skill in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims.
Claims
1. A touch panel structure characterized by ,including: a substrate having a reference surface; a first circuit pattern layer formed on the reference surface of the substrate, the first circuit pattern layer including a touch electrode region in which a plurality of touch electrodes are disposed and a first lead region adjacent to the touch electrode region, the first lead region in which at least one first lead is disposed, the at least one first lead being electrically connected to the at least one touch electrode; an insulating layer formed on the reference surface of the substrate, a top of the insulating layer having a predetermined height with respect to the reference surface, the insulating layer including a first disposition region covering at least a portion of the first lead region, a top of the first disposition region having a first disposition surface and a first raised surface; a second circuit pattern layer formed on the insulating layer, the second circuit pattern layer including a second lead region in which at least one second lead is disposed, the at least one second lead extending from the at least one touch electrode of the first circuit pattern layer through the first raised surface to the first disposition surface.
2. The touch panel structure according to claim 1, wherein the first circuit pattern layer further including an electrical connection region including a plurality of conductive foils, the at least one first lead being electrically connected to the at least one conductive foil, the top of the first disposition region further having a first lowered surface through which the at least one second lead extends to be electrically connected to the at least one conductive foil.
3. The touch panel structure according to claim 2, wherein a first side of the first raised surface being adjacent to or connected to the first disposition surface, a second side of the first raised surface being adjacent to or connected to the first circuit pattern layer, the first side having a height with respect to the reference surface that is greater than a height of the second side with respect to the reference surface, a third side of the first lowered surface being adjacent to or connected to the first disposition surface, a fourth side of the first lowered surface being adjacent to or connected to the electrical connection region of the first circuit pattern layer, the third side having a height with respect to the reference surface that is greater than a height of the fourth side with respect to the reference surface.
4. The touch panel structure of claim 2, wherein the first circuit pattern layer further including a third lead region disposed on opposite sides of the touch electrode region from the first lead region, the third lead region in which at least one third lead is disposed, the at least one third lead being electrically connected to the at least one touch electrode and the at least one conductive foil, the at least one third lead being staggered with respect to the at least one first lead.
5. The touch panel structure of claim 4, wherein the insulating layer further including a second disposition region covering at least a portion of the third lead region, a top of the second disposition region having a second disposition surface and a second raised surface, one side of the second raised surface being adjacent to or connected to the second disposition surface, another side of the second raised surface being adjacent to or connected to the first circuit pattern layer, the second circuit pattern layer including a fourth lead region in which at least one fourth lead is disposed, the at least one fourth lead extending from the at least one touch electrode of the first circuit pattern layer through the second raised surface to the second disposition surface.
6. The touch panel structure of claim 5, wherein the at least one fourth lead being staggered with respect to the at least one second lead.
7. The touch panel structure of claim 5, wherein , the top of the second setting area further has a second descending surface, and at least one fourth lead wire extends from the second setting surface through the second descending surface to electrically connect with the at least one conductive foil.
8. The touch panel structure of claim 2, wherein , the first ascending surface is a slope, a stepped surface or an arc surface, and the first descending surface is a slope, a stepped surface or an arc surface.
9. The touch panel structure of claim 5, wherein , the insulating layer further comprises a third setting area adjacent to the first setting area and the second setting area, the third setting area comprises a third setting surface, a third ascending surface and a third descending surface, and the second circuit pattern layer comprises at least one fifth lead wire, the at least one fifth lead wire extends from the at least one touch electrode of the first circuit pattern layer through the third ascending surface to the third setting surface and extends from the third setting surface through the third descending surface to electrically connect with the at least one conductive foil.
10. The touch panel structure of claim 9, wherein , the third ascending surface is perpendicular to the third setting surface, and the third descending surface is a slope, a stepped surface or an arc surface.