Ceramic composite card

Abstract

The utility model provides a ceramic composite card, and belongs to the technical field of card manufacturing. Comprising a card body which comprises a front card and a back card; the groove milling area is located on the front card and located on the side, close to the back card, of the front card; the coil is arranged in the milling groove area; the module is arranged on the card body and is used for transmitting or receiving signals; the chip hole is formed in the front card and is used for placing the fixing module; and the square slotted hole is positioned on one side, close to each other, of the back card and the front card. According to the utility model, through the arrangement of the square slotted hole, a corresponding groove is difficult to mill during groove milling due to the hard and brittle performance of a ceramic material, the square slotted hole with a slightly larger size and a depth of 0.2 mm is milled at a corresponding position of the back ceramic chip in advance, then the square slotted hole is filled with the PVC sheet material, and then the PVC at the position is milled by CNC (computer numerical control); the groove with the same shape as the encapsulating compound can be obtained, so that no seam is generated between the front card and the back card, and the bottom of the module can be completely attached to the back card.

Description

TECHNICAL FIELD

[0001] The utility model relates to card making technical field, especially a kind of ceramic composite card. BACKGROUND

[0002] With the continuous improvement of people's living standards, in addition to the increasing demand for function and security of intelligent card used in daily life, the demand for its beauty also increases. Adding ceramic material as card body surface in the production process of intelligent card can not only greatly improve the service life of intelligent card, but also improve the weight of intelligent card, improve the overall hand feeling and reflect the noble identity of card holder.

[0003] In the prior art, the ceramic card process is to first insert the coil, then encapsulate the module (including chip) after the entire ceramic card is made, and finally perform card reading test, which can cause reading failure to be detected only after the completion of the intelligent card. Meanwhile, there is a circular bubble-shaped protrusion on the back of the module due to the existence of encapsulation glue, which affects the height of the module on the ceramic surface. Therefore, the present application provides a ceramic composite card to meet the demand. SUMMARY

[0004] The technical problem to be solved by the utility model is to provide a ceramic composite card to solve the problem that the existing ceramic card process is to first insert the coil, then encapsulate the module (including chip) after the entire ceramic card is made, and finally perform card reading test, which can cause reading failure to be detected only after the completion of the intelligent card. Meanwhile, there is a circular bubble-shaped protrusion on the back of the module due to the existence of encapsulation glue, which affects the height of the module on the ceramic surface.

[0005] To solve the above technical problems, the utility model provides the following technical scheme: a ceramic composite card, comprising: a card body, the card body includes a front card and a back card; a milled groove area located on the front card and close to the back card; a coil installed in the milled groove area; a module installed on the card body for transmitting or receiving signals; a chip hole located on the front card for placing and fixing the module; a square groove hole located on the side close to the front card of the back card; and a filling layer located in the square groove hole and configured to be milled when the module is fixed in the chip hole according to the shape of the side of the module away from the front card.

[0006] Preferably, the front card is made of ceramic material.

[0007] Preferably, the back card is made of ceramic material.

[0008] Preferably, the depth of the square groove hole is between 0.1 and 0.3 mm.

[0009] Preferably, the module is mounted in the chip hole, and the module is arranged such that the top end face is lower than the top end face of the front card.

[0010] Compared with the prior art, the utility model has at least the following beneficial effects:

[0011] 1. In the above-mentioned scheme, the square groove hole is set, and the ceramic material is hard and brittle due to its own performance. It is difficult to mill the corresponding groove when milling the groove. The utility model mills a square groove hole with a slightly larger size at the corresponding position of the back ceramic sheet in advance, the groove depth is 0.2mm, and then the PVC sheet is used to fill it. After that, the PVC at this position is milled by CNC. The groove with the same shape as the encapsulation glue can be obtained, so that the joint between the front card and the back card will not be generated.

[0012] 2. Compared with the existing material of the smart card, the utility model breaks the tradition of using PVC material for the card body, adopts high-end ceramic material to make the appearance of the card more stable and noble, improves the environmental protection problem caused by the use of traditional PVC material, and greatly improves the service life of the smart card. The utility model is suitable for all physical properties and card body requirements of the current smart card production, including adapting to magnetic stripe reading and writing, chip packaging, hot stamping holographic mark and subsequent processing.

[0013] 3. In the utility model, the coil and the module are connected first, and the whole formed by the two is read and inspected first. After the inspection is qualified, it is packaged into the card body, which effectively improves the problem of high smart card reading failure. BRIEF DESCRIPTION OF DRAWINGS

[0014] And the drawings constituting part of the specification show embodiments of the present disclosure, and together with the specification, further serve to explain the principles of the present disclosure, and enable a person skilled in the relevant art to implement and use the present disclosure.

[0015] Fig. 1 is a structural schematic view of the utility model;

[0016] Fig. 2 is an explosion view of the utility model;

[0017] Fig. 3 is a sectional view of part of the components in the utility model.

[0018] [REFERENCE SIGNS]

[0019] 1, card body; 2, front card; 3, back card; 4, milling groove area; 5, module; 6, chip hole; 7, square groove hole; 8, filling layer; 9, coil.

[0020] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiments of this utility model. However, this is only for illustrative purposes and is not intended to limit this utility model to the specific structure, device and environment. According to specific needs, those skilled in the art can adjust or modify these devices and environments, and such adjustments or modifications are still included in the scope of the appended claims. Detailed Implementation

[0021] The ceramic composite card provided by this utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art can also use other alternative methods to implement some known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit this utility model.

[0022] Example 1: As Figs. 1-3 As shown, an embodiment of this utility model provides a ceramic composite card, comprising: a card body 1, the card body 1 including a front card 2 and a back card 3; a milled groove area 4, located on the front card 2 and on the side of the front card 2 close to the back card 3; a coil 9, installed in the milled groove area 4; a module 5, installed on the card body 1, for transmitting or receiving signals; a chip hole 6, located on the front card 2, for placing and fixing the module 5; a square slot hole 7, located on the side of the back card 3 and the front card 2 close to each other; and a filling layer 8, located in the square slot hole 7, and configured such that when the module 5 is fixed in the chip hole 6, the filling layer 8 is milled according to the shape of the side of the module 5 away from the front card 2.

[0023] In this process, coil 9 and module 5 are pre-connected and undergo overall quality inspection. Then, the quality-inspected coil 9 and module 5 are packaged into card body 1. This process can improve the low yield problem of traditional packaging processes.

[0024] Both the front card 2 and the back card 3 are made of ceramic.

[0025] The depth of the square slot 7 ranges from 0.1mm to 0.3mm, with 0.2mm being a common value.

[0026] like Fig. 2 As shown, module 5 is installed in chip hole 6, and module 5 is configured such that its top end face is lower than the top end face of front card 2; this is to alleviate wear on module 5.

[0027] Embodiment two: based on embodiment one, the utility model also relates to another half ceramic structure ceramic card body 1, namely the front card 2 is ceramic material, the back card 3 is thin wood sheet, carbon fiber, leather, cloth, paper, glass, sapphire, electroplated metal patch, PVC, PC, PET and other materials, because of the back card 3 material, the card body 1 will form an edge mark corresponding with the milling groove area 4 on the back card 3 after forming.

[0028] The mark has influence on the appearance and use of the ceramic card body 1, and three solutions are provided.

[0029] Solution one: the shape of the middle milling groove area 4 can be changed, and the ceramic sheet is subjected to laser etching or electroplated lines, so that the gap generated by the etching lines or the electroplated lines is fused with each other to form an attractive pattern, which will show the pattern designed by us after the whole card is completed and pressed.

[0030] Solution two: when welding the module 5 and the coil on the front card 2, the milling groove area 4 and the chip hole 6 are milled on the front card 2, the module 5 is welded at the chip hole 6, the coil is welded on the milling groove area 4, and then the reading test is carried out, the insulating layer (the insulating layer is generally made of 0.015-0.075mm acrylic or PET film) is installed on the milling groove surface of the front card 2 to prevent the coil from affecting the back card 3.

[0031] Solution three: a step is milled on the edge of the milling groove area 4 of the front card 2, and a corresponding step is also milled on the PVC edge of the coil layer 9, so that the two are overlapped, and finally the front card 2 and the back card 3 are spliced by pressing process, which can effectively improve the mark formed by the gap between the milling groove area 4 and the coil layer 9 on the surface of the back card 3.

[0032] The utility model covers any substitution, modification, equivalent method and scheme within the essence and range of the utility model. In order to make the public have thorough understanding of the utility model, the specific details are explained in detail in the above preferred embodiment of the utility model, and the utility model can also be completely understood without the description of these details for the person skilled in the art. In addition, in order to avoid unnecessary confusion to the essence of the utility model, the well-known methods, processes, flows, elements and circuits are not described in detail.

[0033] The above is only the preferred embodiment of the utility model, and it should be pointed out that for ordinary skilled person in the art, without departing from the principle of the utility model, a number of improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection range of the utility model.

Claims

1. A ceramic composite card, characterized by, The application relates to a card body (1) comprising a front card (2) and a back card (3); a milling groove area (4) is arranged on the front card (2) and is located on the side of the front card (2) close to the back card (3); a coil (9) is arranged in the milling groove area (4); a module (5) is arranged on the card body (1) and is used for transmitting or receiving signals; a chip hole (6) is arranged on the front card (2) and is used for fixing the module (5); a square groove hole (7) is arranged on the side of the back card (3) close to the front card (2); a filling layer (8) is arranged in the square groove hole (7) and is arranged to be milled according to the shape of the side of the module (5) away from the front card (2) after the module (5) is fixed in the chip hole (6). The front card (2) is made of ceramic material. The back card (3) is made of ceramic material. The depth of the square groove hole (7) is 0.1-0.3 mm. The module (5) is arranged in the chip hole (6), and the top end surface of the module (5) is arranged to be lower than the top end surface of the front card (2). ​ ​ ​ 2. The ceramic composite card of claim 1, wherein, ​ 3. The ceramic composite card of claim 1, wherein, ​ 4. The ceramic composite card of claim 1, wherein, ​ 5. The ceramic composite card of claim 1, wherein, ​

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