Ultrasonic cleaning device for semiconductor

Abstract

The utility model discloses an ultrasonic cleaning device for semiconductors, which relates to the technical field of ultrasonic cleaning and comprises a box body, an ultrasonic cleaning tank, an overflow baffle and an overflow weir plate, an overflow tank is formed at the top of the box body between the overflow weir plate and the overflow baffle, and a partition bin is arranged on the inner wall of the box body. According to the ultrasonic cleaning device, the stainless steel ultrasonic vibration plate is hidden in the ultrasonic cleaning tank body, a dirt layer on the surface of an object is peeled off through impact force generated by ultrasonic cavitation, and the object is cleaned through the ultrasonic vibration plate; according to the invention, dust particles, impurity metal ions and the like on the surface of a workpiece can be effectively removed, the cleaning speed is very high, the working efficiency is greatly improved, the NPP material is adopted, and no mechanical damage or chemical corrosion is caused to the workpiece in the cleaning process, so that the method is suitable for precise cleaning and pure physical cleaning modes of semiconductor parts; and no environmental pollution is generated.

Description

TECHNICAL FIELD

[0001] The utility model relates to ultrasonic cleaning technical field especially relates to a semiconductor is with ultrasonic cleaning device. BACKGROUND

[0002] With the continuous development of semiconductor manufacturing technology, new materials and processes emerge in an endless stream, ultrasonic cleaning technology can flexibly adapt to the cleaning needs of different materials and processes, and provides a reliable cleaning solution for semiconductor manufacturing, with the development of industry 4.0, ultrasonic cleaning equipment will move towards intelligentization and automation, through the introduction of advanced control system and sensor technology, the intelligent monitoring and adjustment of equipment can be realized, and the production efficiency and cleaning quality are improved.

[0003] Cleanliness is an important control factor of the production environment in the semiconductor production process, prevents the influence of particulate matter such as dust and impurities on the semiconductor production process, ensures the stability and reliability of the product, and the cleanliness level standard of the clean room is crucial to the semiconductor industry, the cleanliness level standard of the semiconductor hundred-level and thousand-level clean room respectively stipulates that the number of particles with a diameter greater than 0.5 microns in each cubic foot of air shall not exceed 100 and 1000; The establishment of these standards is to ensure the cleanliness of the semiconductor production environment, so as to ensure the quality of semiconductor products, and the production environment with high cleanliness can effectively prevent the influence of particulate matter such as dust and impurities on the semiconductor production process, and ensure the performance stability and reliability of the product.

[0004] Compared with some chemical cleaning methods, ultrasonic cleaning technology uses water-based cleaning agent and does not produce harmful waste, which has high environmental protection, and at the same time, the energy consumption of ultrasonic cleaning equipment is relatively low, which can effectively reduce energy consumption, however, the existing ultrasonic cleaning technology has the following problems and defects:

[0005] 1), the existing clean room cleans aluminum parts, the ultrasonic vibration plate is made of stainless steel material, and the aluminum parts are cleaned in the ultrasonic vibration plate in the ultrapure water, the metal ions cross-contaminate, and the performance and cleanliness of the workpiece are affected;

[0006] 2), after ultrapure water cleaning, the workpiece surface residual nickel, chromium and other ions cannot be effectively reduced, which affects the cleanliness of semiconductor parts;

[0007] 3), the existing workpiece surface dust particles are difficult to remove completely in normal ultrapure water, which cannot meet the control requirements of the semiconductor industry on cleanliness;

[0008] Therefore, the utility model provides a kind of semiconductor ultrasonic cleaning device. Utility model content

[0009] The utility model provides a kind of ultrasonic cleaning device for semiconductor, solve the problem presented in the above background art.

[0010] To achieve the above object, the utility model discloses the following technical solutions: an ultrasonic cleaning device for semiconductor, including box and the fixed seat of box bottom installation, the ultrasonic cleaning tank is arranged on the box, and the overflow baffle of rectangular setting is installed on the top outer side of box, the top edge of the ultrasonic cleaning tank is installed with overflow weir plate, the overflow weir plate is the structure of U, and one face is fixed with overflow baffle between the overflow weir plate and overflow baffle, overflow groove is formed in the top of box between the overflow weir plate and overflow baffle;

[0011] The inner wall of the box is provided with a partition compartment, a plurality of reinforcing partitions are arranged at equal intervals in the partition compartment, and an ultrasonic vibration plate is installed between every two reinforcing partitions in the partition compartment through an ultrasonic vibration plate fixing frame.

[0012] As a further technical solution of the utility model, the bottom of the overflow groove is communicated with an overflow water drain pipe, one end of the overflow water drain pipe extends to the bottom of the overflow groove, and the other end extends to the outside of the box.

[0013] As a further technical solution of the utility model, the top end of the overflow weir plate is sawtooth-shaped.

[0014] As a further technical solution of the utility model, the upper end and the lower end of one side of the box are respectively provided with a partition compartment overflow drain pipe and a partition compartment sewage pipe, one end of the partition compartment overflow drain pipe extends to the upper end of the partition compartment, and one end of the partition compartment sewage pipe extends to the bottom end of the partition compartment.

[0015] As a further technical solution of the utility model, the inside of the partition compartment and the ultrasonic cleaning tank is filled with ultrapure water, and the ultrasonic water in the partition compartment submerges the upper end of the ultrasonic vibration plate and is located below the pipe opening of the partition compartment overflow drain pipe.

[0016] As a further technical solution of the utility model, the bottom of the box is further provided with a cleaning tank sewage pipe extending to the bottom end of the ultrasonic cleaning tank, and the ultrasonic cleaning tank is made of NPP material.

[0017] The utility model provides an ultrasonic cleaning device for semiconductor, which has the following advantages compared with the prior art:

[0018] 1. The ultrasonic cleaning device for semiconductor, which hides the stainless steel ultrasonic vibration plate in the ultrasonic cleaning tank, adopts NPP material, and strips the dirt layer on the surface of the object through the impact force generated by the ultrasonic cavitation effect, so that the dust particles and impurity metal ions on the surface of the workpiece can be effectively removed, the cleanliness requirement of the workpiece of the customer is met, and the management and control standard of the semiconductor parts is met.

[0019] 2. The ultrasonic cleaning device for semiconductor, which can quickly strip dirt, impurities and the like due to the high-frequency vibration and acoustic energy of the ultrasonic cleaning device, so that the cleaning speed is very fast, the work efficiency can be greatly improved, and the workpiece is not mechanically damaged and chemically corroded during the cleaning process, so that the ultrasonic cleaning device is suitable for precision cleaning of semiconductor parts, and the ultrasonic cleaning device adopts a pure physical cleaning method, only ultrapure water is in the tank, and no chemical agent is needed, so that no environmental pollution is caused, and the ultrasonic cleaning device has the advantages of energy saving. BRIEF DESCRIPTION OF DRAWINGS

[0020] Fig. 1 Fig. 1 is a top view of the ultrasonic cleaning device for semiconductor;

[0021] Fig. 2 Fig. 2 is a side sectional view of the ultrasonic cleaning device for semiconductor;

[0022] Fig. 3 Fig. 3 is an installation schematic view of the ultrasonic vibration plate in the partition compartment in the ultrasonic cleaning device for semiconductor.

[0023] In the figure, 1 is a box body, 2 is an ultrasonic cleaning tank, 21 is a cleaning tank sewage pipe, 3 is an overflow weir plate, 4 is an overflow baffle, 41 is an overflow tank, 42 is an overflow water discharge pipe, 5 is a partition compartment, 51 is a reinforcing partition plate, 52 is an ultrasonic vibration plate, 53 is a partition compartment cover plate, 54 is a partition compartment overflow discharge pipe, 55 is a partition compartment sewage pipe, and 56 is an ultrasonic vibration plate fixing frame. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0025] Please refer to Figs. 1-3The utility model provides a kind of semiconductor ultrasonic cleaning device technical scheme: a kind of semiconductor ultrasonic cleaning device, including box 1 and the fixed seat of box 1 bottom installation, box 1 is provided with ultrasonic cleaning tank 2, the bottom of box 1 is also provided with the cleaning tank blow-off pipe 21 extending to the inside bottom end of ultrasonic cleaning tank 2, there is valve on cleaning tank blow-off pipe 21, it is convenient for cleaning tank blow-off pipe 21 to discharge sewage when washing, ultrasonic cleaning tank 2 uses NPP material, without any mechanical damage to workpiece in ultrasonic cleaning process, also without chemical corrosion to workpiece, suitable for the precision cleaning of semiconductor parts.

[0026] Overflow baffle 4 is installed on the top outer side of box 1, overflow weir plate 3 is installed at the top edge of ultrasonic cleaning tank 2, the top of overflow weir plate 3 is sawtooth-shaped, overflow weir plate 3 is U-shaped structure, its two ends are fixed with one face of overflow baffle 4, overflow weir plate 3 and overflow baffle 4 form overflow groove 41 at the top of box 1, overflow water discharge pipe 42 is communicated at the bottom of overflow groove 41, one end of overflow water discharge pipe 42 extends to the inside bottom of overflow groove 41, the other end extends to the outside of box 1, overflow weir plate 3 and overflow baffle 4 form overflow groove 41, when the liquid of ultrasonic cleaning tank 2 is more or ultrasonic cleaning operation, workpiece is put into ultrasonic cleaning tank 2, and the excess liquid will overflow to overflow groove 41 along the sawtooth top of overflow weir plate 3 to be collected uniformly, and then discharged to the outside by overflow water discharge pipe 42 for recycling.

[0027] The inner wall of box 1 is provided with partition bin 5, a plurality of reinforcing partitions 51 are arranged at equal intervals in partition bin 5, ultrasonic vibration plate 52 is installed in partition bin 5 between every two reinforcing partitions 51 through ultrasonic vibration plate fixing frame 56, partition bin cover plate 53 is installed at the top of box 1 corresponding to partition bin 5, ultrasonic vibration plate 52 is fixed in partition bin 5 by ultrasonic vibration plate fixing frame 56, and hidden by partition bin cover plate 53, so that stainless steel ultrasonic vibration plate 52 can be hidden in ultrasonic cleaning tank 2 (i.e. the inner wall of box 1), and the imported NPP material is used in ultrasonic cleaning tank 2, to avoid the existing dust-free room cleaning aluminum parts, ultrasonic vibration plate 52 is made of stainless steel material, and the aluminum parts are cleaned in the process, ultrasonic vibration plate 52 occurs cavitation in ultrapure water, metal ions cross contamination, and affect the performance and cleanliness of workpiece.

[0028] The side face upper end and the side face lower end of the box body 1 are respectively provided with a partition bin overflow drain pipe 54 and a partition bin sewage drain pipe 55, one end of the partition bin overflow drain pipe 54 extends to the inside upper end of the partition bin 5, one end of the partition bin sewage drain pipe 55 extends to the inside bottom end of the partition bin 5, the inside of the partition bin 5 and the inside of the ultrasonic cleaning tank 2 are both provided with ultrapure water, the electric conductivity of the ultrapure water is greater than or equal to 2MΩ, the ultrasonic water in the inside of the partition bin 5 submerges the upper end of the ultrasonic vibration plate 52 and is located below the pipe opening of the partition bin overflow drain pipe 54, the purpose is that when the ultrapure water in the partition bin 5 is added, the ultrapure water can be automatically drained through the partition bin overflow drain pipe 54, and the partition bin sewage drain pipe 55 is used for discharging sewage when the inside of the partition bin 5 is cleaned, it needs to be explained that the partition bin sewage drain pipe 55 and the partition bin overflow drain pipe 54 are both provided with valves, which are not shown in the figure, and are convenient to control.

[0029] The working principle of the utility model is: the ultrasonic cleaning device of the design is used in cooperation with the ultrapure water hot water cleaning equipment, ultrapure water is used in the whole cleaning process, when used, the workpiece is placed into the ultrasonic cleaning tank 2 to perform ultrasonic cleaning, the ultrasonic cleaning separates the dirt layer on the surface of the object through the impact force generated by ultrasonic cavitation, can effectively remove the dust particles and impurity metal ions on the surface of the workpiece, wherein, the ultrasonic time setting generally has 1min~5 min, 5 min~10 min, 15 min~30 min, etc., the smaller the part, the shorter the time setting, if the part needs a long time of ultrasonic operation, it needs to rotate once every 5 min (rotate 90 degrees or 180 degrees), some parts need to be turned over, so that the other side also performs ultrasonic operation.

[0030] After the ultrasonic cleaning is completed, the workpiece is cleaned by using the ultrapure water hot water, the hot water temperature of the ultrapure water hot water cleaning equipment is set to 40 degrees ± 5, and the time is set to 120 seconds, after the ultrapure water hot water washing, blow drying and drying can be performed.

[0031] The above only describes the preferred embodiments of the utility model, it should be pointed out that, for ordinary skilled person in the art, without departing from the principle of the utility model, a number of improvements and refinements can be made, these improvements and refinements should also be regarded as the protection scope of the utility model. The structures, devices and operation methods not specifically described and explained in the utility model are implemented according to the conventional means in the field, without special description and limitation.

Claims

1. An ultrasonic cleaning device for semiconductor, comprising a box (1) and a fixing base installed at the bottom of the box (1), characterized in that, The box (1) is provided with an ultrasonic cleaning tank (2), and a rectangular overflow baffle (4) is installed on the top outer side of the box (1), an overflow weir plate (3) is installed at the top edge of the ultrasonic cleaning tank (2), the overflow weir plate (3) is a concave structure, both ends of which are fixed to one face of the overflow baffle (4), and an overflow groove (41) is formed between the overflow weir plate (3) and the overflow baffle (4) at the top of the box (1). The inner wall of the box (1) is provided with a partition bin (5), a plurality of reinforcing partitions (51) are arranged at equal intervals in the partition bin (5), an ultrasonic vibration plate (52) is installed between every two reinforcing partitions (51) in the partition bin (5) through an ultrasonic vibration plate fixing frame (56), and a partition bin cover plate (53) is installed at the top of the box (1) corresponding to the partition bin (5).

2. The ultrasonic cleaning apparatus for semiconductor according to claim 1, wherein The bottom of the overflow groove (41) is communicated with an overflow water drain pipe (42), one end of the overflow water drain pipe (42) extends to the bottom of the overflow groove (41), and the other end extends to the outside of the box (1).

3. The ultrasonic cleaning apparatus for semiconductor according to claim 1, wherein The top of the overflow weir plate (3) is sawtooth-shaped.

4. The ultrasonic cleaning apparatus for semiconductor according to claim 1, wherein The upper end and the lower end of one side of the box (1) are respectively provided with a partition bin overflow drain pipe (54) and a partition bin sewage pipe (55), one end of the partition bin overflow drain pipe (54) extends to the upper end of the inside of the partition bin (5), and one end of the partition bin sewage pipe (55) extends to the bottom end of the inside of the partition bin (5).

5. The ultrasonic cleaning apparatus for semiconductor use according to claim 4, wherein The inside of the partition bin (5) and the ultrasonic cleaning tank (2) are both filled with ultrapure water, the ultrasonic water in the partition bin (5) submerges the upper end of the ultrasonic vibration plate (52) and is located below the pipe opening of the partition bin overflow drain pipe (54).

6. The ultrasonic cleaning apparatus for semiconductor use according to claim 1, wherein The bottom of the box (1) is further provided with a cleaning tank sewage pipe (21) extending to the bottom end of the inside of the ultrasonic cleaning tank (2), and the ultrasonic cleaning tank (2) is made of NPP material.

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