Joint structure and keyboard using same

Abstract

The utility model provides a joint structure which comprises a first substrate, a circuit layer, a push switch and a second substrate. The circuit layer is disposed on the first substrate. The push switch is arranged on the circuit layer. The push switch has a first engaging portion. The second substrate is disposed on the first substrate. The second substrate is provided with an opening for the push switch to pass through. The second substrate has a second bonding portion. The first engaging portion and the second engaging portion are configured to engage with each other to form an annular portion surrounding the periphery of the opening.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of joint structure and a kind of keyboard applied to joint structure. BACKGROUND

[0002] With the wide use of computer (whether desktop or notebook), various accessories are continuously developed and optimized. Take keyboard as an example, the design of joint structure is necessary to avoid the damage of internal membrane circuit layer by water. The common practice at present is to press the membrane circuit layer water glue to the bottom plate, and use waterproof glue coated around each opening to prevent water. However, such practice leads to the cost cannot be reduced, and the process can be more complicated. SUMMARY

[0003] One aspect of the utility model provides a kind of joint structure, including first substrate, circuit layer, press switch and second substrate. Circuit layer is arranged on first substrate. Press switch is arranged on circuit layer. Press switch has first joint part. Second substrate is arranged on circuit layer. Second substrate has opening to pass through press switch. Second substrate has second joint part. First joint part and second joint part are configured to be mutually jointed to form sealing structure around opening periphery, or form annular part around opening periphery.

[0004] Wherein, the material of press switch can be deformable material.

[0005] Wherein, the material of second substrate can be plastic material.

[0006] Wherein, first joint part can include skirt around the entire edge of press switch, and second joint part can include groove around the entire opening corresponding to skirt.

[0007] Wherein, press switch and second substrate can be configured to press switch when skirt and groove are jointed, part of the side wall of groove is pressed into press switch, so that press switch is locally deformed to tightly cover the part of side wall to achieve sealing.

[0008] Wherein, circuit layer can be without broken hole at corresponding press switch.

[0009] Wherein, first substrate can have first assembly structure, second substrate can have second assembly structure, first assembly structure and second assembly structure can be configured to be mutually assembled, and joint structure can further include encapsulant to form sealing structure at the assembly of first assembly structure and second assembly structure.

[0010] The utility model discloses a keyboard, including support board, thin film circuit layer, a plurality of elastomers, bottom plate, a plurality of support structures and a plurality of keycaps. Thin film circuit layer sets up on support board. Elastomer sets up on thin film circuit layer. Bottom plate sets up on thin film circuit layer. Bottom plate has a plurality of openings for elastomer to pass through. Bottom plate includes a plurality of fixed structures. Support structure is correspondingly set up on the outside of elastomer respectively and is fixed on bottom plate through fixed structure. Keycap is correspondingly set up above elastomer and support structure respectively and is connected support structure respectively.

[0011] Wherein, the material of the bottom plate can be plastic material.

[0012] Wherein, the elastomer can have a first engaging portion, the bottom plate can have a second engaging portion, the first engaging portion and the second engaging portion are configured to engage with each other to form a sealing structure around the opening periphery, or form an annular portion surrounding the opening periphery.

[0013] Wherein, the first engaging portion can include a skirt surrounding the entire edge of the elastomer protruding towards the bottom plate, and the second engaging portion can include a groove surrounding the entire opening corresponding to the skirt.

[0014] Wherein, the elastomer and the bottom plate can be configured such that when the skirt engages with the groove, part of the sidewall of the groove is pressed into the elastomer, causing the elastomer to locally deform to tightly cover the part of the sidewall to achieve sealing.

[0015] Wherein, the thin film circuit layer can have no breakage hole at the corresponding elastomer.

[0016] Wherein, the support plate can have a plurality of openings, the thin film circuit layer can have a plurality of openings, the bottom plate can have a plurality of assembly members protruding towards the support plate, each assembly member can be configured to pass through the corresponding opening of the support plate and the opening of the thin film circuit layer, and the keyboard can further include a plurality of packaging members disposed on the lower side of the support plate to wrap the corresponding assembly member to form a sealing structure on the lower side of the support plate.

[0017] Wherein, the keyboard can further include an upper cover and a lower cover. The upper cover is disposed above the bottom plate and exposes the keycaps. The lower cover is disposed below the support plate and combined with the upper cover.

[0018] Wherein, the assembly member of the bottom plate can be a sleeve, and the upper cover can include a plurality of columns disposed on the lower side thereof, respectively disposed in the sleeve and wrapped by the corresponding assembly member.

[0019] The utility model discloses a keyboard, including a first substrate, a second substrate, a circuit layer, an elastomer piece, a key cap and a support structure. The first substrate has a first substrate outer side and includes a first substrate engaging portion. The second substrate includes a second substrate engaging portion, wherein the second substrate engaging portion corresponds to the first substrate engaging portion. The circuit layer is disposed between the first substrate and the second substrate. The elastomer piece is disposed on the circuit layer. The key cap is disposed on the second substrate. The support structure is disposed between the key cap and the second substrate. The first substrate has a first substrate outer side, and a distance between the first substrate engaging portion and the first substrate outer side has a spacing.

[0020] Wherein, the distance between the first substrate engaging portion and the first substrate outer side is greater than the distance between the support structure and the first substrate outer side.

[0021] Wherein, the first substrate further includes a third substrate engaging portion, and the distance between the third substrate engaging portion and the first substrate outer side is less than the distance between the first substrate engaging portion and the first substrate outer side.

[0022] Wherein, the second substrate has a substrate inner side opposite the first substrate outer side, wherein the third substrate engaging portion is connected to the first substrate outer side, the second substrate further includes a fourth substrate engaging portion connected to the substrate inner side, and the third substrate engaging portion engages the fourth substrate engaging portion.

[0023] Wherein, the elastomer piece includes a connecting layer and an elastomer. The elastomer is connected to the connecting layer. The second substrate includes a pressing portion that presses the elastomer, and the second substrate has a lower surface that presses the connecting layer.

[0024] Wherein, the elastomer piece includes a connecting layer and an elastomer. The elastomer is connected to the connecting layer, and the connecting layer and the elastomer are integrally formed. The first substrate has a resting portion corresponding to the elastomer and protruding relative to the upper surface of the first substrate.

[0025] The utility model discloses a keyboard, including a first substrate, a second substrate, a circuit layer, an elastomer piece, a key cap and a support structure. The first substrate has a recess and a resting portion, and the resting portion protrudes relative to a groove bottom surface of the recess. The circuit layer is disposed between the first substrate and the second substrate. The elastomer is disposed above the circuit layer. The key cap is disposed above the second substrate. The support structure connects the key cap and the second substrate. The elastomer and the resting portion overlap in a direction of the key cap.

[0026] Wherein, the first substrate has a first substrate outer side and includes a first substrate engaging portion, the second substrate includes a second substrate engaging portion, and the distance between the first substrate engaging portion and the first substrate outer side is greater than the distance between the support structure and the first substrate outer side.

[0027] The first substrate further comprises a third substrate clamping portion, and the second substrate further comprises a fourth substrate clamping portion.

[0028] The elastic body is connected to the connecting layer, and the connecting layer and the elastic body are in an integral forming structure.

[0029] The elastic body is connected to the connecting layer, and the connecting layer and the elastic body are in an integral forming structure.

[0030] The first substrate further comprises a first fixing portion, and the second substrate further comprises a second fixing portion.

[0031] The second substrate has a lower surface, and the second fixing portion protrudes relative to the lower surface.

[0032] The second substrate further comprises a first positioning column, and the circuit layer and the elastic body each have a positioning hole.

[0033] The second substrate comprises a plate member, and the plate member comprises the second substrate clamping portion.

[0034] The second substrate comprises a plate member and an upper cover.

[0035] The waterproof design of the utility model is optimized, and waterproof glue is not needed to achieve the waterproof purpose, so that the process can be simplified and the cost can be reduced.

[0036] In order to have a better understanding of the above and other aspects of the utility model, the following embodiments are described in detail below. DRAWINGS

[0037] Figure 1A is a perspective view of the joint structure of the utility model from top to bottom;

[0038] Figure 1B is a perspective view of the joint structure from below to above according to the present application;

[0039] Figure 1C is a cross-sectional view of the joint structure according to the present application;

[0040] Figure 2A is a perspective view of the keyboard from above to below according to the present application;

[0041] Figure 2B is a perspective view of a single key having the joint structure according to the present application from above to below in the keyboard according to the present application;

[0042] Figure 2C is a perspective view of a single key having the joint structure according to the present application from below to above in the keyboard according to the present application;

[0043] Figure 2D is a cross-sectional view of a single key having the joint structure according to the present application in the keyboard according to the present application;

[0044] Figure 3 a schematic view of a keyboard according to another embodiment of the present application is depicted.

[0045] Figure 4A and 4B a schematic view of a keyboard according to another embodiment of the present application is depicted. Figure 3

[0046] Figure 4C and 4D a schematic view of a pre-assembly module of a keyboard according to another embodiment of the present application is depicted. Figure 3

[0047] Figure 5A a cross-sectional view of a keyboard according to another embodiment of the present application along direction 5A-5A' is depicted. Figure 3

[0048] a cross-sectional view of a keyboard according to another embodiment of the present application along direction 5B-5B' is depicted. Figure 5B Figure 3 a cross-sectional view of a keyboard according to another embodiment of the present application along direction 5C-5C' is depicted.

[0049] Figure 5C Figure 3 a cross-sectional view of a keyboard according to another embodiment of the present application along direction 5D-5D' is depicted.

[0050] Figure 5D a cross-sectional view of a keyboard according to another embodiment of the present application along direction 5E-5E' is depicted. Figure 3

[0051] a cross-sectional view of a keyboard according to another embodiment of the present application along direction 5F-5F' is depicted. Figure 5E Figure 3 a cross-sectional view of a keyboard according to another embodiment of the present application along direction 5G-5G' is depicted.

[0052] Figure 5F ​​​​​Fig. 4 illustrates a cross-sectional view of the keyboard of Fig. 1 along direction 5A-5A'. Figure 3 Fig. 5 illustrates a cross-sectional view of the keyboard of Fig. 1 along direction 5B-5B'.

[0053] Figure 5G Fig. 6 illustrates a cross-sectional view of the keyboard of Fig. 1 along direction 5C-5C'. Figure 3 Fig. 7 illustrates a cross-sectional view of the keyboard of Fig. 1 along direction 5D-5D'.

[0054] Figure 5H Fig. 8 illustrates a cross-sectional view of the keyboard of Fig. 1 along direction 5E-5E'. Figure 3 Fig. 9 illustrates a cross-sectional view of the keyboard of Fig. 1 along direction 5F-5F'.

[0055] Figures 6A-6E Fig. 10 illustrates an assembly process diagram of the keyboard of Fig. 1. Figure 3 Fig. 11 illustrates a perspective view of the keyboard of Fig. 1.

[0056] Figure 7 Fig. 12 illustrates a perspective view of the keyboard according to another embodiment of the present application.

[0057] Figure 8A Fig. 13 illustrates an exploded view of the keyboard of Fig. 12 from different perspectives. 8B Fig. 14 illustrates a cross-sectional view of the keyboard of Fig. 12 along direction 9-9'. Figure 7 Fig. 15 illustrates an assembly process diagram of the keyboard of Fig. 12.

[0058] Figure 9 Fig. 16 illustrates a perspective view of the keyboard of Fig. 4. Fig. 17 illustrates a cross-sectional view of the keyboard of Fig. 4 along direction 9-9'.

[0059] Figures 10A-10E Fig. 18 illustrates an assembly process diagram of the keyboard of Fig. 4. DETAILED DESCRIPTION

[0060] The technical content of the embodiments of the present application will be described more clearly and completely below. In the present application, if the terms "first", "second", etc. are mentioned, they are only used for the purpose of description and convenience, and cannot be understood as indicating or implying relative importance or manufacturing and assembling sequence, nor can they be understood as implying the number of the technical features described. The shape and structure of the components in the drawings are only used for illustration and understanding, and cannot be understood as limiting the present application. Moreover, the size ratio of the components in the drawings can not be drawn in proportion. In order to avoid obscuring the focus, the embodiments and the drawings can not provide all the details. Some components and / or symbols can be omitted in some drawings. It can be understood that the described embodiments are only a part of the embodiments of the present application, and do not represent all possible embodiments. The elements, structures, features, etc. in one embodiment can be applied to another embodiment or combined with another embodiment, and are not repeated here.

[0061] The present application provides a kind of joint structure. See Figures 1A-1C It shows the specific details of an exemplary joint structure 100 of the present application, wherein, Figure 1A It is the perspective view of joint structure 100 from top to bottom,Figure 1B is a perspective view of the joint structure 100 from the bottom up, Figure 1C is a cross-sectional view of the joint structure 100.

[0062] As shown in Figures 1A-1C , the joint structure 100 comprises a first substrate 110, a circuit layer 120, a press switch 130 and a second substrate 140. The circuit layer 120 is disposed on the first substrate 110. The press switch 130 is disposed on the circuit layer 120. The press switch 130 has a first joint portion 132. The second substrate 140 is disposed on the circuit layer 120. The second substrate 140 has an opening O for the press switch 130 to pass through. The second substrate 140 has a second joint portion 142. The first joint portion 132 and the second joint portion 142 are configured to joint with each other to form a sealing structure around the opening O, wherein the sealing structure is an annular portion surrounding the periphery of the opening O.

[0063] According to some embodiments, the first substrate 110 can be selected to have a material that can provide good supportability. For example, the material of the first substrate 110 can be a metal material, such as iron. The circuit layer 120 can be selected to have a suitable circuit board as needed, and details thereof are not shown here to avoid the drawing being too complex. The circuit layer 120 can be free of a broken hole at a position corresponding to the press switch 130. The press switch 130 can be selected to have a material that is easy to process to form a complex shape having a main body for pressing and the first joint portion 132. Further, for sealing effect, the material of the press switch 130 can be a deformable material, such as rubber. The second substrate 140 can be selected to have a material that is easy to process to form a complex shape of the second joint portion 142. For example, the material of the second substrate 140 can be a plastic material, such as ABS (acrylonitrile butadiene styrene) resin and PC (polycarbonate). However, it can be understood that these selections are only illustrative, and the present application is not limited thereto.

[0064] According to some embodiments, the first joint portion 132 can comprise a skirt protruding towards the second substrate 140 and surrounding the entire edge of the press switch 130, and the second joint portion 142 can comprise a groove corresponding to the skirt and surrounding the entire opening O. Further, the press switch 130 and the second substrate 140 can be configured such that when the skirt is jointed with the groove, a part of the sidewall 142S of the groove is pressed into the press switch 130, so that the press switch 130 is locally deformed to tightly cover the part of the sidewall 142S to achieve sealing.

[0065] According to some embodiments, the first substrate 110 can have a first assembly structure 112, the second substrate 140 can have a second assembly structure 144, and the first assembly structure 112 and the second assembly structure 144 can be configured to assemble with each other. For example, the first assembly structure 112 can be an opening, and the second assembly structure 144 can be a protruding assembly configured to be disposed in the opening. In this case, the circuit layer 120 can have a corresponding third assembly structure 122, i.e., an opening, for the second assembly structure 144 to pass through.

[0066] The joint structure 100 can further include a sealing member 150 to form a sealing structure at the assembly of the first assembly structure 112 and the second assembly structure 144. The sealing member 150 is, for example, a bump formed by hot melt glue, but is not limited thereto.

[0067] According to some embodiments, the joint structure 100 can further include a structure configured to be combined with other components of a product to which the joint structure 100 is applied. In Figures 1A-1C For example, the second substrate 140 also has a joint structure (or a hinge portion) 146, but such an assembly structure configured to be combined with other components of a product to which the joint structure 100 is applied can also not or only be provided on the second substrate 140. The joint structure 146 can include one or more single or multiple types of suitable joint structures, such as a hook and / or a clamp, etc., but is not limited thereto.

[0068] It can be understood that the details of the joint structure 100 described above are only illustrative. As long as the effect is not affected, the joint structure of the present application can omit, add, integrate part of the components, or make other adjustments. For example, although the joint structure 100 is illustrated as having certain structural features in the keyboard 200 in order to cooperate with the keyboard 200 to be described later, the joint structure of the present application can have structural features required in other types of keyboards. Moreover, if the joint structure of the present application is applied in other fields, the joint structure of the present application can correspondingly have structural features required in the application products in those fields.

[0069] The present application also provides a keyboard applying the joint structure of the present application. Please see Figures 2A-2C which shows the specific details of an exemplary keyboard 200 of the present application, wherein, Figure 2A is a perspective view of the keyboard 200 from top to bottom, Figure 2B is a perspective view of a single key having the joint structure of the present application in the keyboard 200 from top to bottom, Figure 2C is a perspective view of a single key having the joint structure of the present application in the keyboard 200 from bottom to top, Figure 2D is a cross-sectional view of a single key having the joint structure of the present application in the keyboard 200.

[0070] The keyboard 200 comprises a support plate 210, a thin film circuit layer 220, a plurality of elastic bodies 230 and a bottom plate 240, a plurality of support structures 250 and a plurality of keycaps 260. Specifically, the thin film circuit layer 220 is disposed on the support plate 210. The elastic bodies 230 are disposed on the thin film circuit layer 220. The bottom plate 240 is disposed on the thin film circuit layer 220. The bottom plate 240 has a plurality of openings O for the elastic bodies 230 to pass through. The bottom plate 240 comprises a plurality of fixing structures 246. The support structures 250 are respectively correspondingly disposed on the outer sides of the elastic bodies 230 and are fixed on the bottom plate 240 through the fixing structures 246. The keycaps 260 are respectively correspondingly disposed above the elastic bodies 230 and the support structures 250 and are respectively correspondingly connected to the support structures 250.

[0071] According to some embodiments, the material of the support plate 210 can be metal material, such as iron. The thin film circuit layer 220 can have suitable circuit configuration as needed, and details thereof are not shown here in order to avoid too complex figures. The material of the elastic bodies 230 can be deformable material, such as rubber. The material of the bottom plate 240 can not be metal material used in traditional keyboards, but plastic material, such as ABS (acrylonitrile-butadiene-styrene) resin and PC (polycarbonate), but not limited thereto. The plurality of fixing structures 246 can comprise one or more single or multiple types of suitable combination structures, such as hooks and / or clamps, etc. The support structures 250 are, for example, scissor leg structures, but not limited thereto.

[0072] It is worth noting that in traditional keyboards, the support plate, the thin film circuit layer and the bottom plate are in the order of support plate, bottom plate, thin film circuit layer from bottom to top, and the elastic bodies and the fixing structures corresponding to the support structures connected to the keycaps are disposed on the bottom plate. Therefore, the thin film circuit layer needs to be correspondingly made with complex openings for the elastic bodies and the fixing structures to pass through. In the keyboard 200 of the present application, the order is support plate 210, thin film circuit layer 220, bottom plate 240, and the elastic bodies 230 are adhered to the thin film circuit layer 220. Therefore, the thin film circuit layer 220 can have no broken holes at the corresponding elastic bodies 230. And because the bottom plate 240 is above the thin film circuit layer 220, the thin film circuit layer 220 also does not need openings for the fixing structures 246 to pass through. Reducing these openings for the elastic bodies and the fixing structures to pass through can reduce the possibility of water leakage. At the same time, the structure of the thin film circuit layer 220 can be greatly simplified, not only increasing the flexibility of circuit design, but also reducing costs.

[0073] Further, the support plate 210, the thin film circuit layer 220, the plurality of elastic bodies 230 and the bottom plate 240 can respectively apply the structural features of the first substrate 110, the circuit layer 120, the press switch 130 and the second substrate 140 of the combination structure 100 mentioned above.

[0074] The elastomer 230 can have a first engaging portion 232, and the bottom plate 240 can have a second engaging portion 242, which are configured to engage with each other to form a sealing structure around the opening. According to some embodiments, the first engaging portion 232 can include a skirt protruding from the elastomer 230 around the entire edge of the elastomer 230 towards the bottom plate 240, and the second engaging portion 242 can include a groove around the entire opening O corresponding to the skirt. Further, the elastomer 230 and the bottom plate 240 can be configured such that when the skirt engages with the groove, a portion of the sidewall of the groove presses into the elastomer 230, causing the elastomer 230 to locally deform to tightly cover the portion of the sidewall to achieve sealing. Due to such a snap-sealing design, no additional waterproof glue is needed, thus simplifying the process and reducing the cost. Moreover, the elastomer 230 is adhered to the thin-film circuit layer 220, and the bottom plate 240 presses the elastomer 230 from above, which is conducive to the fixation of the elastomer 230.

[0075] According to some embodiments, the support plate 210 can have a plurality of openings O1, the thin-film circuit layer 220 can have a plurality of openings O2, and the bottom plate 240 can have a plurality of assembly members 244 protruding from the bottom plate 240 towards the support plate 210, each of which can be configured to pass through the corresponding opening O1 of the support plate 210 and the opening O2 of the thin-film circuit layer 220.

[0076] The keyboard 200 can further include a plurality of encapsulants 290 arranged on the lower side of the support plate 210 to respectively wrap the corresponding assembly members 244 to form a sealing structure on the lower side of the support plate 210. The encapsulants 290 are, for example, protrusions formed by hot melt glue, but are not limited thereto.

[0077] According to some embodiments, the keyboard 200 can further include an upper cover 270 and a lower cover 280. The upper cover 270 is arranged above the bottom plate 240 and exposes the keycaps 260. In further embodiments, the assembly members 244 of the bottom plate 240 can be sleeves, and the upper cover 270 can include a plurality of columns 272, such as hot melt columns, arranged on the lower side thereof, which are respectively arranged in the sleeves and wrapped by the corresponding encapsulants 290. Such a sleeve design, in combination with the use of the encapsulants 290, helps to further prevent water vapor from entering. The lower cover 280 is arranged below the support plate 210 in combination with the upper cover 270.

[0078] It can be understood that the keyboard 200 is only illustrative, and the engaging structure of the present application can omit, add, integrate part of the components, or make other adjustments, as long as the effect of the present application is not affected. For example, not all of the keycaps 262 below the keys can have openings O1, openings O2 and assembly members 244 for the assembly of the support plate 210 and the bottom plate 240, and there is no need for the corresponding encapsulants 290 to seal them, or some of these structures below the keys are notFigures 2B-2C The design is generally symmetrical with the center as the reference point, but this will not affect the waterproof effect.

[0079] The aforementioned utility model has presented several embodiments to illustrate the optimization of waterproof design. By forming a tightly joined sealing structure, such as a groove and a skirt, between the substrate above the circuit layer (e.g., the thin-film circuit layer in a keyboard) and the push switch (e.g., the elastomer in a keyboard), waterproofing can be achieved without the use of additional waterproof adhesive. Furthermore, at the assembly structure between the substrate above the circuit layer (e.g., the thin-film circuit layer in a keyboard) and the substrate below it (e.g., the support plate in a keyboard), encapsulation components can be designed and installed to assist in sealing, preventing moisture from entering through the assembly structure. Therefore, the waterproof design according to this utility model simplifies the process and reduces costs. The concept of the joining structure of this utility model can be applied to fields such as keyboards that require waterproof protection for the circuit layer. Especially when applied to keyboards, because the component order is changed to support plate, thin-film circuit layer, and base plate arranged from bottom to top, and the elastomer is adhered to the thin-film circuit layer, the thin-film circuit layer can be free of holes at the corresponding elastomer and fixing structure, reducing the possibility of leakage and significantly simplifying the structure, which is beneficial for further cost reduction.

[0080] Please refer to Figures 3-5H , Figure 3 A schematic diagram of a keyboard 300 according to another embodiment of the present invention is shown. Figure 4A and 4B Draw Figure 3 Exploded views of the keyboard 300 from different perspectives. Figure 4C and 4D Draw Figure 3 The pre-assembled AM module of the keyboard 300 is shown in exploded views from different perspectives. Figure 5A Draw Figure 3 A cross-sectional view of the keyboard 300 along direction 5A-5A'. Figure 5B Draw Figure 3 A cross-sectional view of the keyboard 300 along direction 5B-5B'. Figure 5C Draw Figure 3 A cross-sectional view of the keyboard 300 along the direction 5C-5C'. Figure 5D Draw Figure 3 A cross-sectional view of the keyboard 300 along direction 5D-5D'. Figure 5E Draw Figure 3 A cross-sectional view of the keyboard 300 along the direction 5E-5E'. Figure 5F Draw Figure 3 A cross-sectional view of the keyboard 300 along direction 5F-5F'. Figure 5G Draw Figure 3 A cross-sectional view of the keyboard 300 along the direction 5G-5G', andFigure 5H Draw Figure 3 A cross-sectional view of the keyboard along the direction 5H-5H'.

[0081] like Figures 3-4B As shown in Figure 5B, the keyboard 300 includes a first substrate (or lower cover) 310, a second substrate S2, a circuit layer 320, an elastic member 330, and at least one support structure 350. The first substrate 310 has a first substrate outer surface 310s1 and includes at least one first substrate engaging portion 311. The second substrate S2 includes at least one second substrate engaging portion 341, which corresponds to the first substrate engaging portion 311. The circuit layer 320 is disposed between the first substrate 310 and the second substrate S2. The elastic member 330 is disposed on the circuit layer 320. Keycaps 360 are disposed on the second substrate S2. The support structure 350 is disposed between the keycaps 360 and the second substrate S2. A gap exists between the first substrate engaging portion 311 and the first substrate outer surface 310s1. In this embodiment, the distance H1 between the first substrate engaging portion 311 and the outer side surface 310s1 of the first substrate is greater than the distance H2 between the support structure 350 (e.g., the support structure closest to the outer side surface 310s1 of the first substrate) and the outer side surface 310s1 of the first substrate.

[0082] like Figure 5B As shown, the first substrate engaging portion 311 and the second substrate engaging portion 341 can engage with each other to fix the relative positions of the first substrate 310 and the second substrate S2. In this embodiment, the first substrate engaging portion 311 and the second substrate engaging portion 341 are, for example, mutually cooperating hooks. For example, the first substrate engaging portion 311 includes a first protruding post 3111 and a first hook 3112, wherein the first hook 3112 is connected to the first protruding post 3111 and protrudes relative to the side surface 3111s of the first protruding post 3111 towards the second substrate engaging portion 341 (e.g., along the -Y axis direction). The second substrate engaging portion 341 includes a second protruding post 3411 and a second hook 3412, wherein the second hook 3412 is connected to the second protruding post 3411 and protrudes relative to the side surface 3411s of the second protruding post 3411 towards the first substrate engaging portion 311 (e.g., along the +Y axis direction). When the first latch 3112 and the second latch 3412 engage, the displacement freedom of the first substrate 310 and the second substrate S2 along the Z-axis can be constrained. In addition, due to the engagement design of the first substrate engagement portion 311 and the second substrate engagement portion 341, the number of locking screws used to lock the first substrate 310 and the second substrate S2 can be reduced, thereby increasing the assembly speed of the first substrate 310 and the second substrate S2.

[0083] like Figure 5BAs shown, the circuit layer 320 has at least one positioning hole 320a1, and the elastomer member 330 has at least one positioning hole 331a1. The second substrate engaging portion 341 can be buckled with the first substrate engaging portion 311 after passing through the positioning hole 331a1 of the elastomer member 330 and the positioning hole 320a1 of the circuit layer 320. Through the positioning of the positioning hole 320a1, the positioning hole 331a1 and the second substrate engaging portion 341, the plate member 340, the elastomer member 330 and the circuit layer 320 can be quickly assembled.

[0084] As shown in FIGS. 4A and 4B, the second substrate S2 includes a plate member 340 and a cover 370. In another embodiment, one of the plate member 340 and the cover 370 of the second substrate S2 can be changed into a component of the same order as the second substrate S2. The plate member 340 is arranged between the cover 370 and the first substrate 310. In the present embodiment, the plate member 340 includes the aforementioned first substrate engaging portion 341, but the present embodiment is not limited thereto. Figure 3 4A As shown in FIGS. 4A and 4B, the second substrate S2 includes a plate member 340 and a cover 370. In another embodiment, one of the plate member 340 and the cover 370 of the second substrate S2 can be changed into a component of the same order as the second substrate S2. The plate member 340 is arranged between the cover 370 and the first substrate 310. In the present embodiment, the plate member 340 includes the aforementioned first substrate engaging portion 341, but the present embodiment is not limited thereto.

[0085] As shown in FIGS. 4A and 4B, the second substrate S2 includes a plate member 340 and a cover 370. In another embodiment, one of the plate member 340 and the cover 370 of the second substrate S2 can be changed into a component of the same order as the second substrate S2. The plate member 340 is arranged between the cover 370 and the first substrate 310. In the present embodiment, the plate member 340 includes the aforementioned first substrate engaging portion 341, but the present embodiment is not limited thereto. Figure 5B As shown in FIGS. 4A and 4B, the second substrate S2 includes a plate member 340 and a cover 370. In another embodiment, one of the plate member 340 and the cover 370 of the second substrate S2 can be changed into a component of the same order as the second substrate S2. The plate member 340 is arranged between the cover 370 and the first substrate 310. In the present embodiment, the plate member 340 includes the aforementioned first substrate engaging portion 341, but the present embodiment is not limited thereto.

[0086] As shown in FIGS. 4A and 4B, the second substrate S2 includes a plate member 340 and a cover 370. In another embodiment, one of the plate member 340 and the cover 370 of the second substrate S2 can be changed into a component of the same order as the second substrate S2. The plate member 340 is arranged between the cover 370 and the first substrate 310. In the present embodiment, the plate member 340 includes the aforementioned first substrate engaging portion 341, but the present embodiment is not limited thereto. Figures 4A-4B As shown in FIGS. 4A and 4B, the second substrate S2 includes a plate member 340 and a cover 370. In another embodiment, one of the plate member 340 and the cover 370 of the second substrate S2 can be changed into a component of the same order as the second substrate S2. The plate member 340 is arranged between the cover 370 and the first substrate 310. In the present embodiment, the plate member 340 includes the aforementioned first substrate engaging portion 341, but the present embodiment is not limited thereto.

[0087] ​As shown in FIG. 3A, the first substrate 310 includes a first substrate body 312 and a first substrate cover 314. The first substrate body 312 includes a first substrate top surface 312t and a first substrate bottom surface 312b. The first substrate cover 314 is connected to the first substrate top surface 312t and extends in a direction away from the first substrate top surface 312t (e.g., in the -Y axis direction). The first substrate cover 314 includes a first cover body 314a and a first cover side 314s. The first cover side 314s is connected to the first cover body 314a and extends in a direction away from the first cover body 314a (e.g., in the -X axis direction). The first cover side 314s has a first substrate outer side surface 310s1 and a first substrate inner side surface 310s2. The first substrate inner side surface 310s2 is connected to the first substrate outer side surface 310s1 and extends in a direction away from the first substrate outer side surface 310s1 (e.g., in the -X axis direction). The first substrate inner side surface 310s2 is connected to the first substrate top surface 312t and extends in a direction away from the first substrate top surface 312t (e.g., in the -Y axis direction). Figure 5D As shown in FIG. 3B, the second substrate S2 includes a second substrate body 320 and a second substrate cover 330. The second substrate body 320 includes a second substrate top surface 320t and a second substrate bottom surface 320b. The second substrate cover 330 is connected to the second substrate top surface 320t and extends in a direction away from the second substrate top surface 320t (e.g., in the -Y axis direction). The second substrate cover 330 includes a second cover body 330a and a second cover side 330s. The second cover side 330s is connected to the second cover body 330a and extends in a direction away from the second cover body 330a (e.g., in the -X axis direction). The second cover side 330s has a second substrate outer side surface 320s1 and a second substrate inner side surface 320s2. The second substrate inner side surface 320s2 is connected to the second substrate outer side surface 320s1 and extends in a direction away from the second substrate outer side surface 320s1 (e.g., in the -X axis direction). The second substrate inner side surface 320s2 is connected to the second substrate top surface 320t and extends in a direction away from the second substrate top surface 320t (e.g., in the -Y axis direction). 5F As shown in FIG. 3B, the second substrate S2 includes a second substrate body 320 and a second substrate cover 330. The second substrate body 320 includes a second substrate top surface 320t and a second substrate bottom surface 320b. The second substrate cover 330 is connected to the second substrate top surface 320t and extends in a direction away from the second substrate top surface 320t (e.g., in the -Y axis direction). The second substrate cover 330 includes a second cover body 330a and a second cover side 330s. The second cover side 330s is connected to the second cover body 330a and extends in a direction away from the second cover body 330a (e.g., in the -X axis direction). The second cover side 330s has a second substrate outer side surface 320s1 and a second substrate inner side surface 320s2. The second substrate inner side surface 320s2 is connected to the second substrate outer side surface 320s1 and extends in a direction away from the second substrate outer side surface 320s1 (e.g., in the -X axis direction). The second substrate inner side surface 320s2 is connected to the second substrate top surface 320t and extends in a direction away from the second substrate top surface 320t (e.g., in the -Y axis direction).

[0088] As shown in FIG. 3B, the second substrate S2 includes a second substrate body 320 and a second substrate cover 330. The second substrate body 320 includes a second substrate top surface 320t and a second substrate bottom surface 320b. The second substrate cover 330 is connected to the second substrate top surface 320t and extends in a direction away from the second substrate top surface 320t (e.g., in the -Y axis direction). The second substrate cover 330 includes a second cover body 330a and a second cover side 330s. The second cover side 330s is connected to the second cover body 330a and extends in a direction away from the second cover body 330a (e.g., in the -X axis direction). The second cover side 330s has a second substrate outer side surface 320s1 and a second substrate inner side surface 320s2. The second substrate inner side surface 320s2 is connected to the second substrate outer side surface 320s1 and extends in a direction away from the second substrate outer side surface 320s1 (e.g., in the -X axis direction). The second substrate inner side surface 320s2 is connected to the second substrate top surface 320t and extends in a direction away from the second substrate top surface 320t (e.g., in the -Y axis direction).

[0089] As shown in FIG. 3B, the second substrate S2 includes a second substrate body 320 and a second substrate cover 330. The second substrate body 320 includes a second substrate top surface 320t and a second substrate bottom surface 320b. The second substrate cover 330 is connected to the second substrate top surface 320t and extends in a direction away from the second substrate top surface 320t (e.g., in the -Y axis direction). The second substrate cover 330 includes a second cover body 330a and a second cover side 330s. The second cover side 330s is connected to the second cover body 330a and extends in a direction away from the second cover body 330a (e.g., in the -X axis direction). The second cover side 330s has a second substrate outer side surface 320s1 and a second substrate inner side surface 320s2. The second substrate inner side surface 320s2 is connected to the second substrate outer side surface 320s1 and extends in a direction away from the second substrate outer side surface 320s1 (e.g., in the -X axis direction). The second substrate inner side surface 320s2 is connected to the second substrate top surface 320t and extends in a direction away from the second substrate top surface 320t (e.g., in the -Y axis direction). Figure 4A , 4BAs shown in Figures 5C and 5E, the first substrate 310 further includes at least one first fixing portion 314, and the plate member 340 of the second substrate S2 further includes at least one second fixing portion 340E. The first fixing portion 314 and the second fixing portion 340E can abut against each other. The keyboard 300 also includes at least one fixing member 380, which can fix the relative position between the first fixing portion 314 and the second fixing portion 340E. For example, the first fixing portion 314 is connected to the upper surface 312u of the first substrate body 312 and protrudes relative to the upper surface 312u in the direction of the second fixing portion 340E (e.g., in the +Z axis). The second fixing portion 340E is connected to the lower surface 342b of the second substrate body 342 and protrudes relative to the lower surface 342b in the direction of the first fixing portion 314 (e.g., in the -Z axis). Furthermore, the second fixing part 340E can pass through the positioning hole 320a2 of the circuit layer 320 and the positioning hole 331a2 of the elastic member 330 to mate with the first fixing part 314. Through the limiting design of the second fixing part 340E, the positioning hole 320a2 and the positioning hole 331a2, the relative positional relationship of the second substrate S2, the circuit layer 320 and the elastic member 330 can be determined, which helps with the positioning during assembly.

[0090] like Figure 4A , 4B As shown in Figures 5C and 5E, the first fixing part 314 has a through hole 314a, and the second fixing part 340E has a screw hole 340E1. The fixing member 380, for example, is a screw that can pass through the through hole 314a and be screwed into the screw hole 340E1, forcing the end face 314e of the first fixing part 314 to abut against the end face 340Eb of the second fixing part 340E, thereby fixing the relative position between the first fixing part 314 (or the first substrate 310) and the second fixing part 340E (or the second substrate S2). When the first fixing part 314 and the second fixing part 340E abut against each other, the circuit layer 320 and the elastic member 330 can be pressed between the plate 340 and the first substrate 310.

[0091] like Figure 5C and 5E As shown, the two second fixing portions 340E may have different lengths (e.g., along the Z-axis), and the two first fixing portions 314 may also have different lengths. The length of the second fixing portion 340E and / or the length of the first fixing portion 314 may be determined depending on the internal space of the keyboard 300, as long as they can abut against each other. This novel embodiment does not limit the length of the second fixing portion 340E and / or the length of the first fixing portion 314.

[0092] like Figure 4A and 5AAs shown, circuit layer 320 is, for example, a flexible circuit layer. In one embodiment, circuit layer 320 is, for example, a thin-film switch circuit layer. Circuit layer 320 includes a first portion 320A and a second portion 320B, with the second portion 320B connected to the first portion 320A. The second portion 320B overlaps with the first portion 320A; for example, the first portion 320A and the second portion 320B are foldable such that the second portion 320B at least partially overlaps with the first portion 320A. The first portion 320A of circuit layer 320 may include a first insulating layer 321, a second insulating layer 322, a spacer layer 323, at least one first circuit layer 324, and at least one second circuit layer 325, wherein the spacer layer 323 is disposed between the first insulating layer 321 and the second insulating layer 322 to separate the first circuit layer 324 disposed on the first insulating layer 321 and the second circuit layer 325 disposed on the second insulating layer 322. The second portion 320B may be electrically connected to a processor (not shown). When the first line layer 324 and the second line layer 325 come into contact, a loop is formed to transmit a trigger signal (not shown) to the processor (not shown) through the second part 320B, and the processor executes the corresponding function accordingly.

[0093] like Figure 5A As shown, the elastomer 330 includes a connecting layer 331 and at least one elastomer 332. The elastomer 332 is disposed on the connecting layer 331. In one embodiment, the connecting layer 331 and the elastomer 332 are, for example, integrally formed. In terms of manufacturing process, the connecting layer 331 and the elastomer 332 can be integrally formed using injection molding technology. In terms of material, the elastomer 330 is, for example, made of rubber. Furthermore, each elastomer 332 has, for example, a trigger portion 3321, which is a protrusion extending toward the switch of the circuit layer 320 (the portion of the first circuit layer 324 and the second circuit layer 325 located directly below the trigger portion 3321). When the elastomer 330 deforms (e.g., is pressed by the keycap 360) and the trigger portion 3321 presses down on the circuit layer 320, the first circuit layer 324 and the second circuit layer 325 are forced to contact and conduct (forming a circuit).

[0094] like Figures 4A-4BAs shown in FIGS. 5A and 5B, when the elastic body 332 triggers the circuit layer 320, the elastic body 332 can be stopped by the first substrate 310, thereby increasing the triggering reliability. For example, the first substrate 310 has a recess 310r and at least one first abutting portion 315. The first abutting portion 315 corresponds to the elastic body 332 and protrudes relative to the upper surface of the first substrate 310. For example, the first abutting portion 315 is disposed on the groove bottom surface 310r1 (e.g., the upper surface of the first substrate 310) of the recess 310r and protrudes relative to the groove bottom surface 310r1 of the recess 310r. The elastic body 332 of the elastic body member 330 overlaps the first abutting portion 315 in the direction of the keycap 360, for example, in the direction of movement of the keycap 360 (e.g., in the Z-axis direction). The top surface 315u of the first abutting portion 315 can be in contact with or coplanar with the bottom surface 320b of the connection layer 332. When the elastic body 332 triggers the circuit layer 320, the elastic body 332 can be stopped by the first abutting portion 315, thereby increasing the triggering reliability. The first abutting portion 315 includes a hollow column 3151 and an abutting column 3152 located in the hollow column 3151. The abutting column 3152 can be connected to the inner side wall of the hollow column 3151 or can not be connected to the inner side wall of the hollow column 3151. The elastic body 332 overlaps the abutting column 3152 in the direction of movement of the keycap 360 (e.g., in the Z-axis direction). Thus, when the triggering portion 3321 of the elastic body 332 presses against the circuit layer 320, the triggering portion 3321 can be stopped by the abutting column 3152, so that the first circuit layer 324 and the second circuit layer 325 accurately contact each other when the keycap 360 is lowered to a predetermined position, thereby increasing the triggering reliability (if the abutting column 3152 is not provided, the first circuit layer 324 and the second circuit layer 325 can be late in contacting each other). In addition, in an embodiment, the abutting column 3152 has, for example, a cross shape, and the cross shape of the abutting column 3152 overlaps the elastic body 332 in the direction of movement of the keycap 360 (e.g., in the Z-axis direction).

[0095] As Figure 4C and 4DAs shown, the sheet 340 includes, for example, a sheet body 340A and at least one pivot portion 340B. The pivot portion 340B is partially embedded within the sheet body 340A, and a portion protrudes from the sheet body 340A to pivotally connect to the support structure 350. The pivot portion 340B and the sheet body 340A are, for example, integrally formed. In terms of manufacturing process, the pivot portion 340B and the sheet body 340A can be formed using insert molding technology. Specifically, the pivot portion 340B can be placed in a mold (not shown), and then the sheet material can be injected into the mold to form the sheet body 340A, wherein the sheet body 340A covers a portion of the pivot portion 340B. In terms of material, the sheet body 340A and / or the pivot portion 340B are, for example, made of an insulating material, such as plastic. In another embodiment, one of the plate body 340A and the pivot portion 340B may be made of an insulating material (e.g., plastic), while the other of the plate body 340A and the pivot portion 340B may be made of a conductive material (e.g., metal). Furthermore, the plate body 340A has at least one through hole 340a, which allows the elastic element 332 of the elastic element 330 to pass through. The through hole 340a overlaps with the keycap 360 (or support structure 350) along the Z-axis, such that the elastic element 332 passing through the through hole 340a can be directly opposite the keycap 360.

[0096] like Figure 4C and 5A As shown, the plate 340 of the second substrate S2 includes at least one pressing portion 340C, which is connected to the plate body 340A and protrudes relative to the lower surface 340Ab of the plate body 340A. The pressing portion 340C is located at the edge of the plate body 340A. The pressing portion 340C can press against the first substrate 310 to prevent external impurities (e.g., liquid) from penetrating the interior of the plate 340 and the first substrate 310 through the portion between the pressing portion 340C and the first substrate 310.

[0097] like Figure 4B and 5A As shown, the plate 340 of the second substrate S2 includes at least one pressing portion 340D, which can press against the elastomer 332 or the connecting layer 331 to press the elastomer 330 against the circuit layer 320 and the first substrate 310. The pressing portion 340D can surround the elastomer 332, for example, around the elastomer 332 in a full circumference (i.e., 360 degrees). In one embodiment, from Figure 5A Viewed from above (e.g., along the Z-axis), the pressing portion 340D may have a ring-shaped structure, such as an open ring or a closed ring. By pressing the pressing portion 340D against the elastomer 330, external impurities (e.g., liquids) can be prevented from contaminating the circuit layer 320 located below the elastomer 330 through the portion between the pressing portion 340D and the elastomer 330. In one embodiment, the pressing portion 340D has the same or similar structure as the aforementioned second joint portion 142.

[0098] like Figure 5A As shown, the second substrate S2 can press against the elastic member 330. For example, the plate 340 of the second substrate S2 can press against the connecting layer 331 of the elastic member 330, thus preventing external impurities (e.g., liquids) from penetrating the circuit layer 320 located below it through the portion between the plate 340 and the elastic member 330. For example, the connecting layer 331 of the elastic member 330 has an upper surface 331u and a lower surface 340Ab of the plate body 340A of the plate 340. The upper surface 331u and the lower surface 340Ab of the elastic member 330 are in contact with each other, which can prevent external impurities (e.g., liquids) from penetrating the circuit layer 320 located below it through the portion between the upper surface 331u and the lower surface 340Ab. In one embodiment, the lower surface 340Ab and the upper surface 331u are, for example, planes, so that when the plate 340 is placed on the elastic member 330... The upper surface 331u and the lower surface 340Ab can have maximum contact area, which increases the resistance to external impurities (e.g., liquids) penetrating the circuit layer 320 located below through the portion between the upper surface 331u and the lower surface 340Ab. In one embodiment, the portion where the upper surface 331u and the lower surface 340Ab overlap along the Z-axis can be in full or most contact. The connecting layer 331 of the elastomer 330 presses against the lower surface 340Ab of the second substrate S2 and the upper surface 320u of the circuit layer 320. In this embodiment, the pressing of the upper and lower interlayers around the elastomer 330 provides the aforementioned bonding structure function.

[0099] In summary, a closed space (or sealed space) can be formed between the board 340 and the first substrate 310, wherein the circuit layer 320 can be located in this closed space to prevent external impurities (e.g., liquids) from contaminating the circuit layer 320 through the area between the board 340 and the first substrate 310.

[0100] like Figure 4C and 4DThe support structure 350 is shown as a lifting mechanism, such as a scissor mechanism, for example. However, the present application is not limited to this. The support structure 350 can connect the keycap 360 and the second substrate S2. For example, the support structure 350 can connect the keycap 360 and the pivot portion 340B of the plate member 340 of the second substrate S2. When the plate body 340A is manufactured, at least one support structure 350 can be assembled in the plate member 340, and then the keycap 360 can be assembled on the support structure 350 to form a pre-assembled module AM. In addition, the support structure 350 includes a first pivot member 351 and a second pivot member 352 that are pivotally connected to each other. The first pivot member 351 can be referred to as an "outer scissor", and the second pivot member 352 can be referred to as an "inner scissor". The first pivot member 351 includes at least one first pivot portion 3511 and at least one second pivot portion 3512, and the second pivot member 352 includes at least one first pivot portion 3521 and at least one second pivot portion 3522. Figure 4D The first pivot portion 3511 of the first pivot member 351 and the first pivot portion 3521 of the second pivot member 352 can be pivotally connected to the pivot portion 340B of the plate member 340 (the pivot portion 340B is shown in Figure 4C ). The second pivot portion 3512 of the first pivot member 351 and the second pivot portion 3522 of the second pivot member 352 can be pivotally connected to the keycap 360.

[0101] As shown in Figure 4D , the keycap 360 includes a cap body 361 and at least one pivot portion 362. The pivot portion 362 is disposed on the lower surface 361b of the cap body 361. The pivot portion 362 can be pivotally connected to the support structure 350 described above, for example, the pivot portion 362 can be pivotally connected to the second pivot portion 3512 of the first pivot member 351 and the second pivot portion 3522 of the second pivot member 352. In an embodiment, the cap body 361 and the pivot portion 362 are, for example, an integrally formed structure. For example, the cap body 361 and the pivot portion 362 can be integrally formed by injection molding technology. In terms of material, the cap body 361 and the pivot portion 362 can be made of plastic, for example.

[0102] As shown in Figure 5DAs shown, the upper cover 370 further comprises at least one first positioning post 373, which can pass through the board member 340, the elastic member 330 and the first portion 320A of the circuit layer 320, and abut against the second portion 320B of the circuit layer 320. For example, the first positioning post 373 is connected to the lower surface 3721b of the top plate 3721 and protrudes in the direction of the first substrate 310 (or the circuit layer 320) (for example, in the -Z axis direction) relative to the lower surface 3721b, and the board member 340, the first portion 320A of the circuit layer 320 and the connecting layer 331 of the elastic member 330 respectively have positioning holes 340a1, 320a3 and 331a3, and the first positioning post 373 can pass through the positioning holes 340a1 of the board member 340, the positioning holes 331a3 of the elastic member 330 and the positioning holes 320a3 of the first portion 320A of the circuit layer 320, and abut against the second portion 320B of the circuit layer 320. In another embodiment, the first positioning post 373 can not abut against the second portion 320B of the circuit layer 320, but can limit (for example, stop) the second portion 320B of the circuit layer 320. In addition, through the positioning relationship of the first positioning post 373 and the positioning holes 340a1, 320a3 and 331a3, the board member 340, the elastic member 330, the circuit layer 320 and the upper cover 370 can be quickly assembled.

[0103] As shown, Figure 4A and 5F As shown, the upper cover 370 further comprises at least one second positioning post 374, which can pass through the board member 340, the elastic member 330 and the first portion 320A of the circuit layer 320, and abut against the first substrate 310. For example, the second positioning post 374 is connected to the lower surface 3721b of the top plate 3721 and protrudes in the direction of the first substrate 310 (for example, in the -Z axis direction) relative to the lower surface 3721b, and the board member 340, the first portion 320A of the circuit layer 320 and the connecting layer 331 of the elastic member 330 respectively have positioning holes 340a2, 320a4 and 331a4, and the second positioning post 374 can pass through the positioning holes 340a2 of the board member 340, the positioning holes 320a4 of the first portion 320A of the circuit layer 320 and the positioning holes 331a4 of the elastic member 330. The first substrate 310 further comprises at least one second abutting portion 316, which protrudes relative to the upper surface 312u of the first substrate body 312, and the second positioning post 374 can abut against the second abutting portion 316. In an embodiment, the second abutting portion 316 is, for example, a rib, which can be in the form of a long strip. In an embodiment, at least one of the plurality of second abutting portions 316 can be connected to at least one of the first abutting portions 315. In another embodiment, at least one of the plurality of second abutting portions 316 can not be connected to the first abutting portions 315.

[0104] As shown, Figure 5HAs shown, the upper cover 370 further comprises at least one third fixing portion 375, and the first substrate 310 further comprises at least one fourth fixing portion 317, wherein the third fixing portion 375 and the fourth fixing portion 317 abut each other. The keyboard 300 further comprises at least one fixing member 385, which can fix the relative position between the third fixing portion 375 and the fourth fixing portion 317. For example, the first fixing portion 314 is connected to the upper surface 312u of the first substrate body 312 and protrudes in the direction of the fourth fixing portion 317 (for example, in the +Z axis direction) relative to the upper surface 312u. The fourth fixing portion 317 is connected to the lower surface 3721b of the top plate 3721 of the cover body 372 of the upper cover 370 and protrudes in the direction of the third fixing portion 375 (for example, in the -Z axis direction) relative to the lower surface 3721b. The fourth fixing portion 317 has a through hole 317a, the third fixing portion 375 has a threaded hole 3751, and the fixing member 385, for example, is a screw, which can pass through the through hole 317a and be screwed into the threaded hole 3751, forcing the end surface 375e of the third fixing portion 375 to abut the end surface 317e of the fourth fixing portion 317, so as to fix the relative position between the third fixing portion 375 (or the second substrate S2) and the fourth fixing portion 317 (or the first substrate 310). In addition, two of the plurality of third fixing portions 375 can have different lengths (for example, along the Z axis direction), and two of the plurality of fourth fixing portions 317 can also have different lengths. The length of the third fixing portion 375 and / or the length of the fourth fixing portion 317 can be determined according to the internal space condition of the keyboard 300, as long as they can abut each other. The present embodiment does not limit the length of the third fixing portion 375 and / or the length of the fourth fixing portion 317.

[0105] Please refer to Figures 6A-6E , which shows Figure 3 the assembly process diagram of the keyboard 300.

[0106] As shown in Figure 6A , the upper cover 370 is provided, and the first positioning column 373, the second positioning column 374 and the third fixing portion 375 of the upper cover 370 are upward.

[0107] As shown in Figure 6B , the upper cover 370 is assembled with the pre-assembled module AM. For example, the pre-assembled module AM is placed on the upper cover 370, wherein the second fixing portion 340E and the second substrate clamping portion 341 of the plate member 340 of the pre-assembled module AM are upward. The first positioning column 373 of the upper cover 370 passes through the positioning hole 340a1 of the plate member 340 of the pre-assembled module AM, and the second positioning column 374 of the upper cover 370 passes through the positioning hole 340a2 of the pre-assembled module AM. Through the alignment of the positioning column and the positioning hole, the upper cover 370 and the pre-assembled module AM can be quickly and accurately assembled.

[0108] As shown in Figure 6CAs shown, the elastomeric component 330 is assembled with the pre-assembled module AM. For example, the elastomeric component 330 is placed on the pre-assembled module AM, and the second substrate engaging portion 341 of the pre-assembled module AM ​​passes through the positioning hole 331a1, the second fixing portion 340E of the pre-assembled module AM ​​passes through the positioning hole 331a2, the first positioning post 373 passes through the positioning hole 331a3, and the second positioning post 374 passes through the positioning hole 331a4. By aligning the positioning posts with the positioning holes, the elastomeric component 330 and the pre-assembled module AM ​​can be assembled quickly and accurately.

[0109] like Figure 6D As shown, the circuit layer 320 and the elastic member 330 are assembled. For example, the circuit layer 320 is placed on the circuit layer 320, with the second portion 320B facing upwards. The second substrate engaging portion 341 passes through the positioning hole 320a1, the second fixing portion 340E passes through the positioning hole 320a2, and the first positioning post 373 passes through the positioning hole 320a3 of the first portion 320A of the circuit layer 320 (not shown). Figure 5D The first positioning post 373 and the second positioning post 374 pass through the positioning hole 320a4, wherein the first positioning post 373 ( Figure 6D (Drawn as dashed line) After passing through the positioning hole 320a3 of the first part 320A of the circuit layer 320, it may or may not abut against the second part 320B of the circuit layer 320.

[0110] like Figure 6E As shown, the first substrate 310 and the top cover 370 are assembled. For example, Figure 6D The fourth substrate engaging portion 371 of the top cover 370 and the third substrate engaging portion 313 of the first substrate 310 (shown in) Figure 5D ) card combination, and Figure 6D The second substrate engaging portion 341 of the upper cover 370 and the first substrate engaging portion 311 of the first substrate 310 (shown in) Figure 5B The first substrate 310 and the upper cover 370 are engaged to fix their relative positions.

[0111] Then, the fastener 380 can be used to pass through the first fixing part 314 of the first substrate 310 (shown in the diagram). Figure 5C The second fixing part 340E is fixed to the second substrate S2, and the fourth fixing part 317 (shown in the figure) passes through the first substrate 310 using a fastener 385. Figure 5H It is fixed to the third fixing part 375 of the upper cover 370 to fix the relative position between the first substrate 310 and the upper cover 370.

[0112] As can be seen above, the assembly process of the keyboard 300 in this embodiment does not require a hot-melt process. The first substrate 310 and the top cover 370 (or the second substrate S2) can be assembled by snapping and screwing.

[0113] Please refer toFigures 7-9 , Figure 7 A schematic diagram of a keyboard 400 according to another embodiment of the present invention is shown. Figure 8A and 8B Draw Figure 7 The keyboard 400 is exploded from different perspectives, and Figure 9 The diagram shows a cross-sectional view of the keyboard 400 along direction 9-9' in Figure 4.

[0114] like Figure 7 and 8A As shown in Figure 8B, the keyboard 400 includes a first substrate 310, a second substrate S2', a circuit layer 320, an elastic member 330, and at least one support structure 350. The first substrate 310 has a first substrate outer surface 310s1 and includes at least one first substrate engaging portion 311. The second substrate S2' includes at least one second substrate engaging portion 471. The circuit layer 320 is disposed between the first substrate 310 and the second substrate S2'. The elastic member 330 is disposed on the circuit layer 320. Keycaps 360 are disposed on the second substrate S2'. The support structure 350 connects the keycaps 360 and the second substrate S2'. The distance H1 between the first substrate engaging portion 311 and the first substrate outer surface 310s1 is greater than the distance H2 between the support structure 350 (e.g., the support structure closest to the first substrate outer surface 310s1) and the first substrate outer surface 310s1.

[0115] The second substrate S2' includes the same or similar technical features as the aforementioned second substrate S2, with at least one difference in that the second substrate S2' includes a plate 440 and a top cover 470, wherein the plate 440 has a different structure from the plate 340 of the second substrate S2 and the top cover 470 has a different structure from the top cover 370 of the second substrate S2.

[0116] like Figures 8A-8B As shown in Figure 9, the upper cover 470 includes the same or similar technical features as the plate 370, with at least one difference: the upper cover 470 further includes at least one second substrate engaging portion 471, while the second substrate engaging portion 341 of the plate 340 of the second substrate S2' can be omitted. Thus, the first substrate 310 and the second substrate S2' can be engaged with each other by the first substrate engaging portion 311 and the second substrate engaging portion 471 of the upper cover 470.

[0117] like Figure 9As shown, the second substrate engaging portion 471 includes a second protruding post 4711 and a second hook 4712. The second protruding post 4711 is connected to the lower surface 3721b of the top plate 3721 and protrudes towards the first substrate 310 relative to the lower surface 3721b. The second hook 4712 is connected to the second protruding post 4711 and protrudes towards the first substrate engaging portion 311 relative to the side surface 4711s of the second protruding post 4711 (e.g., along the +Y axis). When the first hook 3112 of the first substrate engaging portion 311 engages with the second hook 4712, the displacement freedom of the first substrate 310 and the second substrate S2' along the Z axis can be constrained. Furthermore, due to the engaging design of the first substrate engaging portion 311 and the second substrate engaging portion 471, the number of locking screws used to lock the first substrate 310 and the second substrate S2' can be reduced, thereby increasing the assembly speed of the first substrate 310 and the second substrate S2'.

[0118] like Figure 9 As shown, the circuit layer 320 has at least one positioning hole 320a1, and the elastic member 330 has at least one positioning hole 331a1. The plate 440' of the second substrate S2' also includes a second substrate body 342 and at least one positioning hole 440a1, with the positioning hole 440a1 penetrating through the second substrate body 342. The second substrate engaging portion 471 can engage with the first substrate engaging portion 311 after passing through the positioning holes 440a1, 320a1, 331a1 of the elastic member 330, and 320a1 of the circuit layer 320. Through the positioning of the positioning holes 440a1, 320a1, 331a1, and the second substrate engaging portion 471, the plate 440, the elastic member 330, and the circuit layer 320 can be quickly assembled.

[0119] The remaining structure of the plate 440 of the second substrate S2' is similar to or the same as that of the plate 340 of the second substrate S2, and the remaining structure of the upper cover 470 of the second substrate S2' is similar to or the same as that of the upper cover 470 of the second substrate S2, which will not be described in detail here.

[0120] Please refer to Figures 10A-10E The diagram in Figure 4 illustrates the assembly process of the keyboard 400.

[0121] like Figure 10A As shown, a top cover 470 is provided, with the first positioning post 373, the second positioning post 374, the third fixing part 375, and the second substrate engaging part 471 of the top cover 470 facing upwards.

[0122] like Figure 10BAs shown, the top cover 470 and the pre-assembled module AM ​​are assembled. For example, the pre-assembled module AM ​​is placed on the top cover 470, with the second fixing portion 340E of the plate 440 of the pre-assembled module AM ​​facing upwards. The first positioning post 373 of the top cover 370 passes through the positioning hole 340a1 of the plate 440 of the pre-assembled module AM, the second positioning post 374 of the top cover 370 passes through the positioning hole 340a2 of the pre-assembled module AM, and the second substrate engaging portion 471 of the top cover 470 passes through the positioning hole 440a1 of the plate 440 of the pre-assembled module AM. By aligning the positioning posts and positioning holes, the top cover 470 and the pre-assembled module AM ​​can be assembled quickly and accurately.

[0123] like Figure 10C As shown, the elastomeric component 330 is assembled with the pre-assembled module AM. For example, the elastomeric component 330 is placed on the pre-assembled module AM, and the second substrate engaging portion 471 of the top cover 470 passes through the positioning hole 331a1, the second fixing portion 340E of the pre-assembled module AM ​​passes through the positioning hole 331a2, the first positioning post 373 passes through the positioning hole 331a3, and the second positioning post 374 passes through the positioning hole 331a4. By aligning the positioning posts with the positioning holes, the elastomeric component 330 and the pre-assembled module AM ​​can be assembled quickly and accurately.

[0124] like Figure 10D As shown, the circuit layer 320 and the elastic member 330 are assembled. For example, the circuit layer 320 is placed on the circuit layer 320, with the second portion 320B facing upwards. The second substrate engaging portion 471 of the top cover 470 passes through the positioning hole 320a1, the second fixing portion 340E passes through the positioning hole 320a2, and the first positioning post 373 passes through the positioning hole 320a3 of the first portion 320A of the circuit layer 320 (shown in the diagram). Figure 5D The first positioning post 373 and the second positioning post 374 pass through the positioning hole 320a4, wherein the first positioning post 373 ( Figure 10D (Drawn as dashed line) After passing through the positioning hole 320a3 of the first part 320A of the circuit layer 320, it may or may not abut against the second part 320B of the circuit layer 320.

[0125] like Figure 10E As shown, the first substrate 310 and the top cover 470 are assembled. For example, Figure 10D The fourth substrate engaging portion 371 of the upper cover 470 and the third substrate engaging portion 313 of the first substrate 310 (shown in) Figure 5D ) card combination, and Figure 10D The second substrate engaging portion 471 of the upper cover 470 and the first substrate engaging portion 311 of the first substrate 310 (shown in) Figure 5B The first substrate 310 and the upper cover 470 are engaged to fix their relative positions.

[0126] Then, the fixing member 380 can pass through the first fixing portion 314 (illustrated in FIG. 4) of the first substrate 310 and be fixed to the second fixing portion 340E of the second substrate S2, and the fixing member 385 can pass through the fourth fixing portion 317 (illustrated in FIG. 4) of the first substrate 310 and be fixed to the third fixing portion 375 of the upper cover 470, so as to fix the relative position between the first substrate 310 and the upper cover 470. Figure 5C ) of the first substrate 310 and be fixed to the third fixing portion 375 of the upper cover 470, so as to fix the relative position between the first substrate 310 and the upper cover 470. Figure 5H

[0127] As known from the above, in the assembling process of the keyboard 400 of the present embodiment, the hot melt process can not be needed, and the first substrate 310 and the upper cover 470 (or the second substrate S2') can be assembled by buckling and screwing.

[0128] Of course, the present application can have other various embodiments, and those skilled in the art can make various corresponding changes and modifications according to the present application without departing from the spirit and essence of the present application. However, these corresponding changes and modifications shall belong to the protection scope of the claims of the present application.​

Claims

1. A bonded structure, comprising: Comprising: a first substrate; a circuit layer disposed on the first substrate; a press switch disposed on the circuit layer, the press switch having a first engaging portion; and a second substrate disposed on the circuit layer, the second substrate having an opening for the press switch to pass through, the second substrate having a second engaging portion: wherein the first engaging portion and the second engaging portion are configured to engage with each other to form a ring portion surrounding a periphery of the opening.

2. The bonded structure of Claim 1, wherein, The press switch is made of a deformable material.

3. The bonded structure of Claim 1, wherein, The second substrate is made of a plastic material.

4. The bonded structure of Claim 1, wherein, The first engaging portion includes a skirt protruding from the second substrate and surrounding an entire edge of the press switch, and the second engaging portion includes a groove corresponding to the skirt and surrounding an entire opening.

5. The bonded structure of Claim 4, wherein, The press switch and the second substrate are configured such that when the skirt engages with the groove, a portion of a sidewall of the groove is pressed into the press switch, so that the press switch is locally deformed to tightly cover the portion of the sidewall to achieve sealing.

6. The bonded structure of Claim 1, wherein, The circuit layer is free of a break hole corresponding to the press switch.

7. The bonded structure of Claim 1, wherein, The first substrate has a first assembly structure, the second substrate has a second assembly structure, the first assembly structure and the second assembly structure are configured to be assembled with each other, and the engaging structure further includes a sealant to form a sealing structure at the assembly of the first assembly structure and the second assembly structure.

8. A keyboard, characterized by Comprising: a support plate; a thin film circuit layer disposed on the support plate; a plurality of elastic bodies disposed on the thin film circuit layer; a bottom plate disposed on the thin film circuit layer, the bottom plate having a plurality of openings for the elastic bodies to pass through, the bottom plate including a plurality of fixing structures: a plurality of support structures respectively disposed on the outside of the elastic bodies and fixed to the bottom plate through the fixing structures; and a plurality of keycaps respectively disposed above the elastic bodies and the support structures and respectively connected to the support structures.

9. The keyboard of claim 8, wherein, The bottom plate is made of a plastic material.

10. The keyboard of claim 8, wherein, The elastic body has a first engaging portion, and the bottom plate has a second engaging portion, the first engaging portion and the second engaging portion are configured to engage with each other to form a ring portion surrounding a periphery of the opening.

11. The keyboard of claim 10, wherein, The first engaging portion includes a skirt protruding from the bottom plate and surrounding an entire edge of the elastic body, and the second engaging portion includes a groove corresponding to the skirt and surrounding an entire opening.

12. The keyboard of claim 11, wherein, The elastic body and the bottom plate are configured such that when the skirt engages with the groove, a portion of a sidewall of the groove is pressed into the elastic body, so that the elastic body is locally deformed to tightly cover the portion of the sidewall to achieve sealing.

13. The keyboard of claim 8, wherein, The thin film circuit layer is free of a break hole corresponding to the elastic body.

14. The keyboard of claim 8, wherein, The support plate has a plurality of openings, the thin film circuit layer has a plurality of openings, the bottom plate has a plurality of assembly members protruding from the support plate, each of the assembly members is configured to pass through the opening of the support plate and the opening of the thin film circuit layer, and the keyboard further includes a plurality of sealants disposed under the support plate to wrap the corresponding assembly members to form a sealing structure under the support plate.

15. The keyboard of claim 14, wherein, Further comprising: an upper cover disposed above the bottom plate and exposing the keycaps; and ​ A lower cover is disposed below the support plate and combined with the upper cover.

16. The keyboard of claim 15, wherein, The assembly of the bottom plate is a sleeve, and the upper cover includes a plurality of columns disposed on the lower side thereof, respectively disposed in the sleeve and wrapped by the corresponding package.

17. A keyboard, characterized by Comprising: A first substrate including a first substrate engaging portion; A second substrate including a second substrate engaging portion corresponding to the first substrate engaging portion; A circuit layer disposed between the first substrate and the second substrate; An elastic member disposed on the circuit layer; A keycap disposed on the second substrate; A support structure disposed between the keycap and the second substrate; The first substrate has a first substrate outer side surface, and a distance between the first substrate engaging portion and the first substrate outer side surface is greater than a distance between the support structure and the first substrate outer side surface.

18. The keyboard of claim 17, wherein, The first substrate engaging portion is farther from the first substrate outer side surface than the support structure.

19. The keyboard of claim 17, wherein, The first substrate further includes a third substrate engaging portion, and the third substrate engaging portion is closer to the first substrate outer side surface than the first substrate engaging portion.

20. The keyboard of claim 19, wherein, The second substrate has a substrate inner side surface opposite the first substrate outer side surface, and the third substrate engaging portion is connected to the first substrate outer side surface, and the second substrate further includes a fourth substrate engaging portion connected to the substrate inner side surface, and the third substrate engaging portion engages the fourth substrate engaging portion.

21. The keyboard of claim 17, wherein, The elastic member includes: A connecting layer; and An elastic body connected to the connecting layer; The second substrate includes a pressing portion pressing the elastic body, and the second substrate has a lower surface pressing the connecting layer.

22. The keyboard of claim 17, wherein, The elastic member includes: A connecting layer; and An elastic body connected to the connecting layer, and the connecting layer and the elastic body are integrally formed; The first substrate has a resting portion corresponding to the elastic body and protruding relative to the upper surface of the first substrate.

23. A keyboard, characterized by Comprising: A first substrate having a recess and a resting portion protruding relative to a groove bottom surface of the recess; A second substrate; A circuit layer disposed between the first substrate and the second substrate; An elastic member disposed above the circuit layer; A keycap disposed above the second substrate; A support structure connecting the keycap and the second substrate; The elastic member and the resting portion overlap in a direction of the keycap.

24. The keyboard of claim 23, wherein, The first substrate has a first substrate outer side surface and includes a first substrate engaging portion, the second substrate includes a second substrate engaging portion, and a distance between the first substrate engaging portion and the first substrate outer side surface is greater than a distance between the support structure and the first substrate outer side surface.

25. The keyboard of claim 24, wherein, The first substrate further includes a third substrate engaging portion, and the second substrate further includes a fourth substrate engaging portion, and a distance between the third substrate engaging portion and the first substrate outer side surface is less than a distance between the support structure and the first substrate outer side surface.

26. The keyboard of claim 23, wherein, The elastic member includes: A connecting layer; and An elastic body connected to the connecting layer, and the connecting layer and the elastic body are integrally formed; The abutting portion is corresponding to the elastic body, and a top surface of the abutting portion is coplanar with a bottom surface of the connecting layer.

27. The keyboard of claim 23, wherein, The elastic body member includes: a connecting layer; and an elastic body connected to the connecting layer, the connecting layer and the elastic body being an integral structure; wherein the connecting layer is pressed between a lower surface of the second substrate and an upper surface of the circuit layer.

28. The keyboard of any one of claims 17 to 27, wherein, The first substrate further includes a first fixing portion, and the second substrate further includes a second fixing portion, the first fixing portion and the second fixing portion abutting each other; the keyboard further includes a fixing member, the fixing member fixing the relative position between the first fixing portion and the second fixing portion.

29. The keyboard of claim 28, wherein, The second substrate has a lower surface, the second fixing portion protruding relative to the lower surface, and the second fixing portion penetrating the circuit layer and the elastic body member.

30. The keyboard of any one of claims 17 to 27, wherein, The second substrate further includes a first positioning column, the circuit layer and the elastic body member each having a positioning hole, the first positioning column penetrating the positioning hole of the circuit layer and the positioning hole of the elastic body member.

31. The keyboard of any one of claims 17 to 27, wherein, The second substrate includes: a plate member including the second substrate engaging portion; wherein the second substrate engaging portion engages the first substrate engaging portion through the elastic body member and the circuit layer.

32. The keyboard of any one of claims 17 to 27, wherein, The second substrate includes: a plate member; and an upper cover including the second substrate engaging portion, the plate member being arranged between the upper cover and the first substrate; wherein the second substrate engaging portion engages the first substrate engaging portion through the plate member, the elastic body member and the circuit layer.

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