Chip fixing seat of vehicle-mounted camera module

Abstract

The utility model discloses a chip fixing seat of a vehicle-mounted camera module, which comprises a fixing seat used for installation and fixation and a chip mainboard fixedly arranged on the fixing seat, a heat dissipation seat is embedded and fixed in the fixing seat, a heat conduction sheet of the heat dissipation seat is attached to the bottom surface of the chip mainboard for heat dissipation, and two sides of the bottom of the fixing seat are respectively provided with a closing-in air duct and a straight air duct. The flow rate of gas in the closing-up air channel is larger than that of gas in the straight air channel, and high-speed gas in the closing-up air channel generates a siphon effect on the straight air channel, so that the gas in the straight air channel flows to the closing-up air channel from the air channel in the heat dissipation fin block, and the flow rate of the gas on the fin surface of the heat dissipation fin block of the heat dissipation base is effectively increased. The heat dissipation efficiency of the heat dissipation base on the chip mainboard is improved, and then the imaging quality of the vehicle-mounted module is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of automobile parts especially relates to a chip fixing seat of vehicle-mounted camera module. BACKGROUND

[0002] With the prevalence of new four automotives and intelligent driving concepts, the vehicle-mounted sensing sensor market is developing rapidly. The vehicle-mounted camera, which is compared with the eyes of automatic driving, will become a new blue ocean industry in the industry. As the core sensing equipment in the field of automatic driving of automobiles, the heat dissipation of vehicle-mounted chips during long-term operation with the vehicle seriously affects the imaging quality of vehicle-mounted cameras. SUMMARY

[0003] The utility model discloses a chip fixing seat of vehicle-mounted camera module to solve the above-mentioned technical problem.

[0004] In order to realize the above-mentioned purpose, the utility model discloses a chip fixing seat of vehicle-mounted camera module, including the fixed seat for installation and the chip mainboard fixedly arranged on it, the heat dissipation seat is embedded and fixed in the fixed seat, the heat conduction sheet of heat dissipation seat is bonded and radiates with the bottom surface of chip mainboard, the bottom of fixed seat is provided with the straight air duct and the close mouthed air duct respectively.

[0005] Further, the upper surface center of the fixed seat is provided with a fixed cavity, the chip mainboard is fixedly arranged in the fixed cavity, the lower surface center of the fixed seat is provided with a heat dissipation cavity, the heat dissipation seat is fixedly arranged in the heat dissipation cavity, the heat dissipation cavity of the fixed seat is provided with the straight air duct and the close mouthed air duct respectively, the caliber of the air inlet of the two ends of the close mouthed air duct and the straight air duct is same, and the internal air duct caliber of the close mouthed air duct is only half of the straight air duct.

[0006] Further, the main body of the chip mainboard is a PCB plate body, the upper surface center of the PCB plate body is embedded with glass, the lower surface center of the PCB plate body is embedded with a chip, the bottom surface of the chip is flush with the lower surface of the PCB plate body, the lower surface of the PCB plate body is provided with a copper exposure area, and the bottom surface of the chip and the copper exposure area are bonded and radiate with the heat dissipation seat.

[0007] Further, the top of the heat dissipation seat is a heat conduction sheet, the heat conduction sheet is fixedly arranged on the bottom surface of the fixed cavity of the fixed seat, the heat conduction sheet is bonded and radiates with the copper exposure area of the chip mainboard and the bottom surface of the chip, the lower part of the heat dissipation seat is a heat dissipation fin block, the heat dissipation fin block is clamped and fixed in the heat dissipation cavity of the fixed seat, and the internal air duct of the heat dissipation fin block is perpendicular to the close mouthed air duct and the straight air duct of the fixed seat.

[0008] The utility model has the advantages of the following:

[0009] The internal air duct of the heat dissipation fin block is perpendicular to the converging air duct and the straight air duct of the fixing seat, when the vehicle is running, the air flow synchronously enters the converging air duct and the straight air duct, the caliber of the air inlet at the two ends of the converging air duct and the straight air duct is the same, the air inlet amount of the converging air duct and the straight air duct is the same, the caliber of the converging air duct is only half of the caliber of the straight air duct, the fluid section of the air flow in the converging air duct is smaller than the fluid section of the straight air duct, the air flow speed in the converging air duct is greater than the air flow speed in the straight air duct, the high-speed air flow in the converging air duct generates a siphon effect on the straight air duct, so that the air flow in the straight air duct flows from the air duct inside the heat dissipation fin block to the converging air duct, effectively promoting the air flow speed of the air flow on the fin surface of the heat dissipation fin block of the heat dissipation seat, improving the heat dissipation efficiency of the heat dissipation seat on the chip mainboard, and further improving the imaging quality of the vehicle-mounted module. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 It is a whole structure schematic view of the utility model;

[0011] Figure 2 It is a whole cross section view of the utility model;

[0012] Figure 3 It is a whole air duct schematic view of the utility model;

[0013] Figure 4 It is a front surface schematic view of the chip mainboard of the utility model;

[0014] Figure 5 It is a back surface schematic view of the chip mainboard of the utility model;

[0015] Figure 6 It is a structure schematic view of the fixing seat of the utility model;

[0016] Figure 7 It is a structure schematic view of the heat dissipation seat of the utility model.

[0017] In Figures 1 to 7 , the correspondence between the component name or line and the drawing number is as follows: chip mainboard 1, PCB plate body 11, glass 12, chip 13, copper exposure area 14, fixing seat 2, fixing cavity 21, heat dissipation cavity 22, converging air duct 23, straight air duct 24, heat dissipation seat 3, heat conduction fin 31, heat dissipation fin block 32. PREFERRED EMBODIMENT

[0018] Please refer to Figures 1 to 7 ;

[0019] The embodiment provides a chip fixing seat of a vehicle-mounted camera module, which comprises a fixing seat 2 used for mounting and fixing and a chip mainboard 1 fixedly arranged on the fixing seat 2, the fixing seat 2 is embedded with a heat dissipation seat 3, the heat conduction fin 31 of the heat dissipation seat 3 is attached to the bottom surface of the chip mainboard 1 for heat dissipation, and converging air ducts 23 and straight air ducts 24 are arranged on the bottom of the fixing seat 2.

[0020] Preferably, the upper surface of the fixed seat 2 is provided with a fixed cavity 21 in the center, and the chip mainboard 1 is fixedly arranged in the fixed cavity 21. The lower surface of the fixed seat 2 is provided with a heat dissipation cavity 22 in the center, and the heat dissipation seat 3 is fixedly arranged in the heat dissipation cavity 22. The heat dissipation cavity 22 of the fixed seat 2 is provided with a closed air duct 23 and a straight air duct 24 on both sides respectively. The caliber of the air inlet at both ends of the closed air duct 23 and the straight air duct 24 is the same. The caliber of the internal air duct of the closed air duct 23 is only half of that of the straight air duct 24.

[0021] Preferably, the main body of the chip mainboard 1 is a PCB plate body 11. The PCB plate body 11 is embedded with a glass 12 in the center of the upper surface, and is embedded with a chip 13 in the center of the lower surface. The bottom surface of the chip 13 is flush with the lower surface of the PCB plate body 11. The lower surface of the PCB plate body 11 is provided with a copper exposure area 14. The copper exposure area 14 and the bottom surface of the chip 13 are in thermal contact with the heat dissipation seat 3.

[0022] In specific embodiments, the chip 13 cannot meet the high requirements of imaging by traditional BGA or CSP technology. Instead, the bare chip is packaged by Flip Chip, so that the imaging quality of the camera module is more superior. By using a bare chip, the risk of chip 13 pollution needs to be overcome. By using Flip Chip packaging and a protective cover, the pollution risk of the chip 13 is reduced. The cover layer on the chip 13 is made of high-transparency glass 12 to minimize the risk of poor imaging quality caused by physical media. By using Flip Chip packaging, the risk of poor heat dissipation needs to be improved. The heat dissipation sheet 31 is in thermal contact with the copper exposure area 14 of the chip mainboard 1 and the bottom surface of the chip 13 to increase the heat dissipation performance of the module.

[0023] Preferably, the top of the heat dissipation seat 3 is a heat dissipation sheet 31, which is fixedly arranged on the bottom surface of the fixed cavity 21 of the fixed seat 2. The heat dissipation sheet 31 is in thermal contact with the copper exposure area 14 of the chip mainboard 1 and the bottom surface of the chip 13. The bottom of the heat dissipation seat 3 is a heat dissipation fin block 32, which is clamped and fixed in the heat dissipation cavity 22 of the fixed seat 2. The internal air duct of the heat dissipation fin block 32 is perpendicular to the closed air duct 23 and the straight air duct 24 of the fixed seat 2.

[0024] In the use of the novel, when the vehicle is running, the air flow synchronously enters the converging air duct 23 and the straight air duct 24, the diameters of the two ends of the converging air duct 23 and the straight air duct 24 are the same, the air inlet amount of the converging air duct 23 and the straight air duct 24 is the same, the internal air duct diameter of the converging air duct 23 is only half of the straight air duct 24, the fluid cross section of the air flow in the converging air duct 23 is smaller than the fluid cross section of the straight air duct 24, the air flow speed in the converging air duct 23 is greater than the air flow speed in the straight air duct 24, the high-speed air in the converging air duct 23 generates a siphon effect on the straight air duct 24, so that the air in the straight air duct 24 flows from the air duct inside the heat dissipation fin block 32 to the converging air duct 23, effectively promoting the air flow speed of the fin surface of the heat dissipation fin block 32 of the heat dissipation seat 3, improving the heat dissipation efficiency of the heat dissipation seat 3 on the chip mainboard 1, and further improving the imaging quality of the vehicle-mounted module.

[0025] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A chip fixing seat of a vehicle-mounted camera module, comprising a fixing seat (2) for installation and fixation and a chip mainboard (1) fixedly arranged thereon, and a heat dissipation seat (3) is fixedly embedded in the fixing seat (2), characterized in that: The heat-conducting sheet (31) of the heat-dissipating seat (3) is attached to the bottom surface of the chip mainboard (1) for heat dissipation, and the bottom of the fixing seat (2) is provided with a closed air duct (23) and a straight air duct (24) respectively.

2. The chip fixing seat of the vehicle-mounted camera module according to claim 1, characterized in that: The upper surface of the fixing seat (2) is provided with a fixing cavity (21) in the center, the chip mainboard (1) is fixedly arranged in the fixing cavity (21), the lower surface of the fixing seat (2) is provided with a heat-dissipating cavity (22) in the center, the heat-dissipating seat (3) is fixedly arranged in the heat-dissipating cavity (22), the heat-dissipating cavity (22) of the fixing seat (2) is respectively provided with the closed air duct (23) and the straight air duct (24) on both sides, the diameters of the air inlets at both ends of the closed air duct (23) and the straight air duct (24) are the same, and the internal air duct diameter of the closed air duct (23) is only half of that of the straight air duct (24).

3. The chip fixing seat of the vehicle-mounted camera module according to claim 2, characterized in that: The main body of the chip mainboard (1) is a PCB plate body (11), the upper surface of the PCB plate body (11) is embedded with a glass (12) in the center, the lower surface of the PCB plate body (11) is embedded with a chip (13) in the center, the bottom surface of the chip (13) is flush with the lower surface of the PCB plate body (11), the lower surface of the PCB plate body (11) is provided with a copper exposure area (14) around, and the bottom surface of the chip (13) and the copper exposure area (14) are attached to the heat-dissipating seat (3) for heat conduction.

4. The chip fixing seat of the vehicle-mounted camera module according to claim 3, characterized in that: The top of the heat-dissipating seat (3) is a heat-conducting sheet (31), the heat-conducting sheet (31) is fixedly arranged at the bottom surface of the fixing cavity (21) of the fixing seat (2), the heat-conducting sheet (31) is attached to the copper exposure area (14) of the chip mainboard (1) and the bottom surface of the chip (13) for heat conduction, the lower part of the heat-dissipating seat (3) is a heat-dissipating fin block (32), the heat-dissipating fin block (32) is clamped and fixed in the heat-dissipating cavity (22) of the fixing seat (2), and the internal air duct of the heat-dissipating fin block (32) is perpendicular to the closed air duct (23) and the straight air duct (24) of the fixing seat (2).

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