Liquid heater

Abstract

The liquid heater comprises a glass cup body and a detection assembly arranged on the side wall of the periphery of the glass cup body, the detection assembly is arranged in the height direction of the glass cup body and comprises a PCB substrate, and a patch type temperature sensor is arranged on the side, away from the glass cup body, of the PCB substrate. A first capacitance pole piece is arranged on the side, facing the glass cup body, of the PCB substrate, the area of the first capacitance pole piece is larger than that of the temperature sensor, and the first capacitance pole piece is located between the temperature sensor and the glass cup body and used for transferring heat to the temperature sensor. The liquid heater is used for solving the technical problems that in order to avoid lengthening a heat transfer path, the temperature sensor and the capacitor pole piece are arranged on the side, away from the glass cup body, of the PCB substrate, but the heat transfer capacity of the surface of the PCB substrate cannot be improved, and the response speed of the temperature sensor cannot be improved in the prior art.

Description

Technical Field

[0001] This utility model relates to the technical field of liquid heaters, and more specifically, to a liquid heater. Background Technology

[0002] Liquid heaters are typically designed to make it easier for people to boil water, brew tea, or prepare other beverages. To ensure safe use and provide convenient functionality, liquid heaters need to sense and detect the state of the beverage, preventing foam from overflowing during the boiling process. Therefore, multiple sensors can be installed on the lid of the liquid heater to monitor the beverage's state.

[0003] Common sensors used in liquid heaters include water level sensors, temperature sensors, or overflow prevention sensors.

[0004] For example, existing technology CN202222200376.X installs a water level sensor on the side wall of the kettle body. Specifically, a through hole is provided in the side wall of the kettle body, and the sensor passes through the through hole to detect the water level. A handle is also used to conceal the sensor's wiring, improving the aesthetics of the liquid heater.

[0005] For example, prior art CN200920224720.0 also discloses an anti-overflow electric kettle, which has an anti-overflow electrode installed on the side wall of the kettle body. When an overflow signal is detected at the detection end of the anti-overflow electrode, the anti-overflow electrode controls the heating component through a conductive element.

[0006] For example, prior art CN202121643473.5 also discloses an electric kettle in which the temperature measuring component is located on the outer surface of the glass body and is usually disposed in the mounting space between the handle and the glass body. In this way, the temperature measuring component can be fixed by the pressure of the inside of the handle and the outer wall of the glass body, so that it fits tightly against the glass body and measures the temperature accurately.

[0007] In practical applications, liquid heaters often require the simultaneous installation of a temperature sensor and an anti-overflow electrode (or water level electrode), which work in conjunction with each other. For example, during heating, an increase in temperature may cause the liquid to expand or boil. The anti-overflow sensor and the temperature sensor work together. After the temperature sensor detects that the beverage is boiling or close to boiling, the anti-overflow sensor begins to detect an overflow signal to prevent the beverage from spilling.

[0008] However, the installation process requires the separate installation of each sensor, making it cumbersome. Therefore, existing technology CN202322941952.0 proposes a PCB detection board for liquid level detection. This PCB utilizes capacitors to simultaneously detect liquid level and overflow signals. A control chip is also mounted on the underside of the PCB detection board, and the capacitors are electrically connected to the control chip. When the capacitors detect that the current slurry volume has reached a preset anti-overflow detection level, the control chip transmits a signal to the main control device. The main control device then performs corresponding operations according to the program settings, such as stopping the motor or heating to prevent overflow. However, this solution does not integrate a temperature sensor, requiring a separate temperature sensor to be installed on the cup body or heating structure.

[0009] Furthermore, in prior art 201810944307.5, a heating rod is provided on the outer wall of the heating chamber. A temperature sensor is installed on the outer wall of the base of the heating rod to measure the water temperature near the bottom plate of the heating chamber. Two heat-conducting plates are vertically mounted on the side surface of the heating rod. These heat-conducting plates not only conduct heat, transferring the heat generated by the heating rod to the water in the heating chamber, but also serve as the first electrode plate (equivalent to a capacitor electrode) of the capacitance measurement circuit. This achieves the integration of the electrode plate (for measuring water level) and the temperature sensor into the heating rod.

[0010] However, in existing technologies, the capacitor electrode needs to be close to the detection container to maintain accuracy. The temperature sensor, avoiding the capacitor electrode, is positioned on the outer wall of the base. This results in a greater distance between the temperature sensor and the heating chamber (equivalent to a water tank), requiring heat to pass through the base to reach the sensor, thus reducing the sensor's response speed and measurement accuracy. In particular, for liquid heaters, both the temperature sensor and the capacitor electrode are often mounted on a PCB substrate. The PCB substrate has low thermal conductivity and lacks a thermally conductive structure, further reducing temperature response speed and measurement accuracy. Utility Model Content

[0011] The purpose of this invention is to provide a liquid heater to solve the technical problem in the prior art where, in order to avoid lengthening the heat transfer path, the temperature sensor and the first capacitor electrode are placed on the side of the PCB substrate away from the glass body, but this cannot improve the heat transfer capacity of the PCB substrate surface, and thus cannot further improve the response speed of the temperature sensor.

[0012] This application provides a liquid heater, including a glass cup and a detection component disposed on the outer peripheral sidewall of the glass cup. The detection component is disposed along the height direction of the glass cup and includes a PCB substrate. The PCB substrate has a patch-type temperature sensor on the side away from the glass cup and a first capacitor electrode on the side facing the glass cup. The area of ​​the first capacitor electrode is larger than the area of ​​the temperature sensor, and the first capacitor electrode is located between the temperature sensor and the glass cup for heat transfer to the temperature sensor.

[0013] Furthermore, both the aforementioned first capacitor electrode and the aforementioned temperature sensor are single units.

[0014] Furthermore, the PCB substrate has a sampling circuit and a grounding circuit on the side away from the glass body. Both the sampling circuit and the grounding circuit are connected to the temperature sensor. The area of ​​the sampling circuit is smaller than the area of ​​the grounding circuit.

[0015] Furthermore, the aforementioned PCB substrate has a grounded conductive copper foil on the side away from the glass body, and the conductive copper foil covers the back of the PCB substrate area where the first capacitor electrode is located to form a grounding circuit.

[0016] Furthermore, the PCB substrate is also provided with a second capacitor electrode. The first capacitor electrode and the second capacitor electrode are arranged side by side on the PCB substrate, and the area of ​​the first sub-electrode is larger than the area of ​​the second sub-electrode.

[0017] Furthermore, the detection component also includes a control chip, which is located on the side of the PCB substrate away from the glass body, and the temperature sensor and the first capacitor electrode are located below the control chip.

[0018] Furthermore, the aforementioned detection component also includes an anti-overflow electrode, which is disposed on the side of the PCB substrate facing the glass body, and the temperature sensor and the first capacitor electrode are located below the anti-overflow electrode.

[0019] Furthermore, the aforementioned PCB substrate is a flexible PCB, and the aforementioned temperature sensor is biased in the width direction of the PCB substrate.

[0020] Furthermore, the aforementioned PCB substrate is a rigid PCB, and the aforementioned temperature sensor is centrally located in the width direction of the PCB substrate.

[0021] Furthermore, the aforementioned first capacitor electrode completely covers the back side of the PCB substrate area where the temperature sensor is located.

[0022] Compared with the prior art, the embodiments of this utility model have at least the following advantages or beneficial effects:

[0023] The first capacitor electrode is disposed on the side of the PCB substrate facing the glass cup, and the first capacitor electrode is located between the temperature sensor and the glass cup. The first capacitor electrode enhances the thermal conductivity of the PCB substrate surface, thereby improving the response speed of the temperature sensor.

[0024] Meanwhile, the first capacitor electrode and the temperature sensor are located on different sides of the PCB substrate, which avoids interference between the first capacitor electrode and the temperature sensor, and also reduces the distance between the first capacitor electrode and the glass body, thus ensuring the detection sensitivity of the first capacitor electrode. Attached Figure Description

[0025] Figure 1 This is a schematic diagram showing the positional relationship between the temperature sensor, the first capacitor electrode, the PCB substrate, and the glass cup in this application.

[0026] Figure 2 This is a schematic diagram of the connection between the grounding circuit and the temperature sensor in this application.

[0027] Figure 3 This is a schematic diagram of the structure when the first capacitor electrode and the second capacitor electrode of this application are distributed on the same horizontal line.

[0028] Figure 4 This is a schematic diagram showing the positional relationship between the temperature sensor, control chip, and anti-overflow electrode on the PCB substrate of this application.

[0029] Figure 5 This is a schematic diagram of the structure when the temperature sensor of this application is located on the left side of the control chip.

[0030] Figure label:

[0031] 1-Glass cup body, 2-PCB substrate, 201-Control chip, 202-Anti-overflow electrode, 3-Temperature sensor, 301-Grounding circuit, 302-Sampling circuit, 401-First capacitor electrode, 402-Second capacitor electrode. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] The liquid heater includes a glass container 1 and a detection component disposed on the glass container 1. The detection component typically needs to detect at least the water level and temperature to determine the operating status of the liquid heater and prevent it from drying out. Therefore, liquid heaters often include multiple independent sensors.

[0034] To reduce installation steps, those skilled in the art desire to integrate multiple sensors onto a single component, thus integrating multiple sensors onto a PCB. In this invention, the detection assembly includes a PCB substrate 2, a first capacitor electrode 401, and a temperature sensor 3, thereby achieving both temperature detection and water level (foam) detection. The PCB substrate 2 is a printed circuit board, typically made of insulating material. The surface of the PCB substrate 2 is coated with copper foil. In practical use, the first capacitor electrode 401 and conductive paths can be formed by etching the copper foil. Lead material is applied to the ends of the conductive paths to form solder pads, facilitating the connection of electronic components such as the temperature sensor 3. In this invention, the first capacitor electrode 401 and the temperature sensor 3 are integrated onto the PCB substrate 2, eliminating the need for separate installation of the first capacitor electrode 401 and the temperature sensor 3, thus improving the installation efficiency of the detection assembly.

[0035] The material of the PCB substrate 2 affects the installation method of the detection component. When the PCB substrate 2 is a flexible PCB, it is relatively fragile and easily bent, making it difficult to position using rigid components. Therefore, the detection component is often directly glued to the glass cup 1. When the PCB substrate 2 is a rigid PCB, it is thicker but difficult to fit snugly against the glass cup 1. Therefore, it is generally fixed by pressing the inside of the handle against the outer wall of the glass cup 1, or by using a bracket.

[0036] For scenarios where the sensor is directly mounted on the PCB substrate 2, a surface-mount temperature sensor 3 is preferred. This is because the surface-mount temperature sensor 3 is smaller in size and can be soldered to the pads on the PCB substrate 2 during installation. Although the surface-mount temperature sensor 3 is already quite compact in size and thickness, it still has a certain thickness. To prevent the PCB substrate 2 from warping or damaging the temperature sensor 3, the temperature sensor 3 is located on the side of the PCB substrate 2 facing away from the glass cup 1.

[0037] For the flexible PCB substrate 2, the PCB substrate 2 is relatively soft. In order to avoid the temperature sensor 3 being located between the PCB substrate 2 and the glass cup 1, causing the PCB substrate 2 to bend or lift, the temperature sensor 3 is located on the side of the PCB substrate 2 away from the glass cup 1.

[0038] For a rigid PCB substrate 2, a mounting bracket or a handle is required to attach the PCB substrate 2 to the glass cup 1. If the temperature sensor 3 is located on the side of the PCB substrate 2 facing the glass cup 1, the force between the glass cup 1 and the sensing end of the temperature sensor 3 is difficult to control, which can easily lead to the crushing and damage of the temperature sensor 3. Therefore, the temperature sensor 3 is located on the side of the PCB substrate 2 away from the glass cup 1.

[0039] When the temperature sensor 3 is placed on the side of the PCB substrate 2 away from the glass cup 1, the temperature sensor 3 can only detect the temperature of the glass cup 1 through the PCB substrate 2, which affects the response speed of the temperature sensor 3.

[0040] To improve the response speed of the temperature sensor 3, existing technologies place the sensor and electronic components on the same side of the temperature sensor 3 as much as possible, thereby reducing the number of layers through which heat is transferred from the glass cup 1 to the temperature sensor 3. However, this method still has limited effect on improving the thermal conductivity of the PCB substrate 2 surface, resulting in a limited improvement in the response speed of the temperature sensor 3.

[0041] However, the inventors discovered that the difficulty in improving the response speed of the temperature sensor 3 lies in the poor thermal conductivity of the PCB substrate 2, especially along its surface. Additionally, the small area of ​​the temperature sensor 3 results in a small area that can detect the temperature of the PCB substrate 2, meaning the temperature sensor 3 can only detect localized temperatures at specific locations. If the water level in the glass 1 is lower than the detection area of ​​the temperature sensor 3, the heat from the liquid needs to be transferred along the glass 1 to the PCB substrate 2, and then horizontally or vertically along the PCB substrate 2 to the detection area before the temperature sensor 3 can detect it. This further reduces the response speed of the temperature sensor 3, making it difficult to meet the needs of scenarios requiring a rapid response, such as detecting dry burning.

[0042] Unlike existing technologies, this invention places the first capacitor electrode 401 on the side of the PCB substrate 2 facing the glass cup 1 (i.e., the first capacitor electrode 401 is located between the PCB substrate 2 and the glass cup 1). The first capacitor electrode 401 enhances the thermal conductivity of the PCB substrate 2 surface, especially the thermal conductivity of the PCB substrate 2 at the location of the temperature sensor 3, thereby improving the response speed of the temperature sensor 3.

[0043] Specifically, the first capacitor electrode 401 measures the liquid level and foam height inside the glass cup 1 by detecting changes in capacitance. The detection sensitivity of the first capacitor electrode 401 is affected by its own position; the closer the first capacitor electrode 401 is to the glass cup 1, the higher its detection sensitivity.

[0044] Therefore, in this embodiment, as Figure 1As shown, the first capacitor electrode 401 is located on the side of the PCB substrate 2 facing the glass cup 1. The first capacitor electrode 401 and the temperature sensor 3 are located on different sides of the PCB substrate 2 to avoid interference between the first capacitor electrode 401 and the temperature sensor 3, and also to reduce the distance between the first capacitor electrode 401 and the glass cup 1, thus ensuring the detection sensitivity of the first capacitor electrode 401.

[0045] More importantly, in this embodiment, the first capacitor electrode 401 covers the PCB substrate 2 between the temperature sensor 3 and the glass cup 1. This allows heat from the glass cup 1 to be transferred to the temperature sensor 3 on the back of the PCB substrate 2 via the first capacitor electrode 401, helping to distribute and transfer heat more evenly on the PCB substrate 2 and improving the response speed and detection accuracy of the temperature sensor 3. Specifically, the rigid PCB substrate 2 typically uses FR-4 (glass fiber reinforced epoxy resin), whose thermal conductivity is usually between 0.25 W / m·K and 0.35 W / m·K, indicating poor thermal conductivity. The flexible PCB substrate 2 typically uses polyimide (PI) film as the substrate, and sometimes polyester (PET) film, with a thermal conductivity of approximately 0.15 W / m·K to 0.3 W / m·K. The thermal conductivity of copper foil is 363 W / m·K to 384 W / m·K. Therefore, the first capacitor electrode 401 is located between the temperature sensor 3 and the glass cup 1, which helps to distribute and transfer heat more evenly to the detection area.

[0046] For the flexible PCB substrate 2, the first capacitor electrode 401 is located between the temperature sensor 3 and the glass cup 1, which increases the thickness and rigidity of the PCB substrate 2, especially enhances the strength of the PCB substrate 2 at the temperature difference sensor, and reduces the risk of damage to the temperature difference sensor due to bending.

[0047] Furthermore, in order to ensure the heat conduction area and heat conduction effect of the first capacitor electrode 401, the area of ​​the first capacitor electrode 401 is larger than the area of ​​the temperature sensor 3.

[0048] In actual use, the glass cup body 1 is mostly an arc-shaped outer peripheral wall, which leads to different installation methods between the PCB substrate 2 made of different materials and the glass cup body 1.

[0049] When the PCB substrate 2 is a rigid PCB, it is usually flat and cannot completely fit the outer periphery of the glass cup 1 in the width direction. In order to make the PCB substrate 2 as uniform as possible, it is preferable that the center of the PCB substrate 2 in the width direction fits into the glass cup 1. Therefore, the temperature sensor 3 is centrally located in the width direction of the PCB substrate 2 to reduce the distance of heat transfer along the surface of the PCB substrate 2 and ensure the response speed of the temperature sensor 3.

[0050] When the PCB substrate 2 is a flexible PCB, the PCB substrate 2 can be attached to the glass cup 1 in the width direction. In order to reduce the probability of damage to the temperature sensor 3, the temperature sensor 3 is biased in the width direction of the PCB substrate 2 to reduce the stress on the temperature sensor 3.

[0051] In use, regardless of whether the first capacitor electrode 401 completely covers the back side of the PCB substrate 2 area where the temperature sensor 3 is located, the first capacitor electrode 401 can improve the response speed of the temperature sensor 3. To further improve the response speed of the temperature sensor 3, it is preferable that the first capacitor electrode 401 completely covers the back side of the PCB substrate 2 area where the temperature sensor 3 is located.

[0052] In use, there may be one or more first capacitor electrodes 401. When there is only one first capacitor electrode 401, it may be completely (or partially) located between the temperature sensor 3 and the glass cup 1, that is, the first capacitor electrode 401, the temperature sensor 3, the PCB substrate 2, and the glass cup 1 are located on the same horizontal plane. When there are multiple first capacitor electrodes 401, gaps are provided between them to prevent interference between them, and these gaps are also located between the temperature sensor 3 and the glass cup 1.

[0053] In practical use, the larger the area of ​​the first capacitor electrode 401, the more susceptible it is to interference from environmental capacitance and electromagnetic interference. Therefore, in practical use, it can be as follows: Figure 2 As shown, the PCB substrate 2 has a grounded conductive copper foil on the side facing away from the glass body 1. This conductive copper foil covers the back of the PCB substrate 2 area where the first capacitor electrode 401 is located, forming a grounding circuit 301. Therefore, external interference needs to pass through the grounding circuit 301 and the PCB before affecting the first capacitor electrode 401. The grounding circuit 301 reduces the interference received by the first capacitor electrode 401. The grounding circuit 301 can be a single piece of conductive copper foil, or it can be a serpentine or grid-like layout formed by the conductive copper foil. This increases the length and coverage area of ​​the grounding circuit 301, improving the anti-interference capability of the first capacitor electrode 401.

[0054] The first capacitor electrode 401 is also susceptible to electromagnetic interference from the circuits on the PCB substrate 2. According to Ampere's law, when current flows through a circuit, a magnetic field is generated around it, thus causing electromagnetic interference to the first capacitor electrode 401. In this embodiment, although the first capacitor electrode 401 is located between the temperature sensor 3 and the glass cup 1, the current flowing through the temperature sensor 3 is very small, and it is separated from the first capacitor electrode 401 by the PCB substrate 2, so it cannot have a significant impact on the first capacitor electrode 401.

[0055] To achieve the highest possible accuracy, the circuit layout of the PCB substrate 2 can be further optimized. The PCB substrate 2 has a sampling circuit 302 and a grounding circuit 301 on the side facing away from the glass cup 1. The sampling circuit 302 is connected to the temperature sensor 3. Those skilled in the art will understand that when measuring temperature, current flows through the voltage divider resistor and then inputs voltage and current to the temperature sensor 3 through the sampling circuit 302. The resistance value of the temperature sensor 3 varies at different temperatures. By detecting the voltage flowing through the voltage divider resistor using the sampling circuit 302, the resistance value of the temperature sensor 3 and the detected temperature value can be determined. The grounding circuit 301 is connected to the temperature sensor 3 to ground it, providing a reference potential for the temperature sensor 3. Furthermore, the grounding circuit 301 can cover the back of the area of ​​the PCB substrate 2 where the first capacitor electrode 401 is located, serving both as shielding and connecting the temperature sensor 3. Additionally, separating the sampling circuit 302 and the grounding circuit 301 can reduce electromagnetic interference between them. Furthermore, the area of ​​the sampling circuit 302 is smaller than the area of ​​the grounding circuit 301, allowing for an increase in the area of ​​the grounding circuit 301.

[0056] To further improve the detection accuracy of the first capacitor electrode 401, the PCB substrate 2 is also provided with a second capacitor electrode 402, with the first capacitor electrode 401 and the second capacitor electrode 402 arranged side by side on the PCB substrate 2. In actual use, the arrangement of the first capacitor electrode 401 and the second capacitor electrode 402 can be designed according to the usage requirements.

[0057] When the focus is on measuring changes in water level, the first capacitor electrode 401 and the second capacitor electrode 402 can be arranged on the same vertical line. The longitudinally arranged capacitor electrodes provide finer resolution in the vertical direction, thus enabling more accurate water level measurement.

[0058] When the focus is on improving detection accuracy, such as Figure 3 As shown, the first capacitor electrode 401 and the second capacitor electrode 402 can be distributed along the same horizontal line, achieving a horizontally parallel arrangement. The horizontally parallel arrangement of the sub-electrodes provides a wider detection range, thereby improving the accuracy of water level detection on a horizontal plane. When horizontally arranged, each individual capacitor electrode can also be vertically positioned. Vertical positioning can cover a larger range of liquid level heights, providing stable detection results even at low or high liquid levels.

[0059] In actual use, in order to further increase the area of ​​the first capacitor electrode 401 located between the temperature sensor 3 and the glass body 1, the area of ​​the first capacitor electrode 401 is larger than the area of ​​the second capacitor electrode 402.

[0060] In practical applications, the detection assembly formed on the PCB substrate 2 by the temperature sensor 3 and the first capacitor electrode 401 can be a detection board integrating the control chip 201 and / or the anti-overflow electrode 202, or it can be a separate detection accessory.

[0061] When the detection component also includes a control chip 201, the control chip 201 protrudes from the PCB substrate 2. To prevent the PCB substrate 2 from tilting and causing the first capacitor electrode 401 to move away from the glass cup 1, the control chip 201 can be positioned on the side of the PCB substrate 2 away from the glass cup 1. Figure 4 As shown, further, in order to detect whether the liquid heater is dry-burning, the first capacitor plate 401 of the temperature sensor 3 needs to be installed on the lower side of the glass cup 1 as much as possible. Therefore, the temperature sensor 3 and the first capacitor plate 401 are located on the lower side of the control chip 201 to prevent the control chip 201 from occupying the lower space of the glass cup 1.

[0062] like Figure 5 As shown, if the installation space for the liquid heater is small, the size of the PCB substrate 2 needs to be reduced as much as possible. To further reduce the size of the PCB substrate 2, the temperature sensor 3 can be placed on the left or right side of the control chip 201, thereby extending the first capacitor plate 401 to the rear area of ​​the PCB substrate 2 where the control chip 201 is located.

[0063] The detection assembly also includes an anti-overflow electrode 202. The anti-overflow electrode 202 detects changes in the liquid and foam inside the glass cup 1 by detecting changes in the capacitance value. To improve detection accuracy, the anti-overflow electrode 202 needs to be closer to the glass cup 1; therefore, the anti-overflow electrode 202 is located on the side of the PCB substrate 2 facing the glass cup 1. To prevent the anti-overflow electrode 202 from occupying the lower space of the glass cup 1, the temperature sensor 3 and the first capacitor electrode 401 are located below the anti-overflow electrode 202.

[0064] When the detection component consists only of a single detection accessory, the PCB substrate 2 only has a temperature sensor 3 and a first capacitor electrode 401. In this case, the detection component can be electrically connected to a coupler or to the circuit board inside the bottom cover via a long wire or hardware component.

[0065] During use, the first capacitor electrode 401 can be located below the lowest water level line of the glass cup 1 to detect whether there is water below the lowest water level line, thereby detecting whether the liquid heater is dry-burning. Furthermore, the temperature sensor 3 can also be completely located below the lowest water level line to detect the temperature of the glass cup 1 below the lowest water level line, thereby assisting in detecting whether the liquid heater is dry-burning.

[0066] Furthermore, it should be noted that the liquid heater of this utility model is not limited to the food processing machine with an integrated motor and cup body disclosed in the embodiments of this utility model. It can also be a soy milk maker with the motor mounted on top, a blender with a separate cup body and base, and a hand-washable food processing machine that can automatically discharge and clean itself. Moreover, the liquid heater of this utility model can also be applied to heating appliances that can perform boiling operations, rice paste making, etc., such as health pots and health cookers.

[0067] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A liquid heater, comprising a glass cup body and a detection component disposed on the outer peripheral sidewall of the glass cup body, the detection component being disposed along the height direction of the glass cup body, characterized in that: The detection component includes a PCB substrate. The PCB substrate has a patch-type temperature sensor on the side away from the glass body. The PCB substrate has a first capacitor electrode on the side facing the glass body. The area of ​​the first capacitor electrode is larger than the area of ​​the temperature sensor, and the first capacitor electrode is located between the temperature sensor and the glass body for heat transfer to the temperature sensor.

2. A liquid heater according to claim 1, characterized in that: There is one first capacitor electrode and one temperature sensor.

3. A liquid heater according to claim 1, characterized in that: The PCB substrate has a sampling circuit and a grounding circuit on the side away from the glass body. Both the sampling circuit and the grounding circuit are connected to the temperature sensor. The area of ​​the sampling circuit is smaller than the area of ​​the grounding circuit.

4. A liquid heater according to claim 1, characterized in that: The PCB substrate has a grounded conductive copper foil on the side away from the glass body. The conductive copper foil covers the back of the PCB substrate area where the first capacitor electrode is located to form a grounding circuit.

5. A liquid heater according to claim 1, characterized in that: The PCB substrate is further provided with a second capacitor electrode. The first capacitor electrode and the second capacitor electrode are arranged side by side on the PCB substrate, and the area of ​​the first sub-electrode is larger than the area of ​​the second sub-electrode.

6. A liquid heater according to claim 1, characterized in that: The detection component also includes a control chip, which is located on the side of the PCB substrate away from the glass body, and the temperature sensor and the first capacitor electrode are located below the control chip.

7. A liquid heater according to claim 1, characterized in that: The detection component also includes an anti-overflow electrode, which is disposed on the side of the PCB substrate facing the glass body, and the temperature sensor and the first capacitor electrode are located below the anti-overflow electrode.

8. A liquid heater according to claim 1, characterized in that: The PCB substrate is a flexible PCB, and the temperature sensor is biased in the width direction of the PCB substrate.

9. A liquid heater according to claim 1, characterized in that: The PCB substrate is a rigid PCB, and the temperature sensor is centrally located in the width direction of the PCB substrate.

10. A liquid heater according to claim 1, characterized in that: The first capacitor electrode completely covers the back side of the PCB substrate area where the temperature sensor is located.

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